JP2010503240A - トレーハンドリング機及びそれを用いた半導体素子検査方法 - Google Patents
トレーハンドリング機及びそれを用いた半導体素子検査方法 Download PDFInfo
- Publication number
- JP2010503240A JP2010503240A JP2009528178A JP2009528178A JP2010503240A JP 2010503240 A JP2010503240 A JP 2010503240A JP 2009528178 A JP2009528178 A JP 2009528178A JP 2009528178 A JP2009528178 A JP 2009528178A JP 2010503240 A JP2010503240 A JP 2010503240A
- Authority
- JP
- Japan
- Prior art keywords
- tray
- workpiece
- storing
- handling machine
- loading unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 79
- 238000007689 inspection Methods 0.000 title claims abstract description 66
- 238000000034 method Methods 0.000 title claims abstract description 31
- 230000002950 deficient Effects 0.000 claims description 12
- 230000007246 mechanism Effects 0.000 claims description 6
- 230000008878 coupling Effects 0.000 claims description 4
- 238000010168 coupling process Methods 0.000 claims description 4
- 238000005859 coupling reaction Methods 0.000 claims description 4
- 238000001514 detection method Methods 0.000 claims description 4
- 230000008569 process Effects 0.000 description 10
- 230000007547 defect Effects 0.000 description 8
- 230000003028 elevating effect Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000036316 preload Effects 0.000 description 2
- 230000032258 transport Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67715—Changing the direction of the conveying path
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/14—Wafer cassette transporting
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
【解決手段】ワークを収納したトレーを反転させる反転装置と、本体の上部を往復移動しながらワークを収納したトレーをピックアップして各部に移送する移載装置とを備えてトレーを移送及び反転させるトレーハンドリング機において、反転装置が移載装置の下端に一体に設けられていることを特徴とするトレーハンドリング機。
【選択図】図3
Description
したがって、半導体素子のマーキング及び全体的な外観を検査するためには、他の検査機で他の検査作業を進行する必要があるという不便さがあった。
本発明の一実施例を用いて当業者が容易に理解して再現できる程度まで、以下に詳細に説明する。
ここで、前述した各部の役割と作用は、既に公知であるので、これらに対する具体的な説明は省略する。
また、トレーピックアップ手段51は、トレーローディングユニット6の反転時に妨害になり得るため、反転時に妨害を与えないように上昇するように設計されているのが好ましい。
そうすると、このトレーは、上面が上部に向かうように下部スライディングカバー63にローディングされるが、このトレーをトレーピックアップ手段51を用いて上部スライディングカバー62にローディングするようになっている。
したがって、添付する特許請求の範囲に係る技術的内容は、本発明の真なる範囲に属する修正及び変更を含んでいる。
Claims (12)
- ワークを収納したトレーを反転させる反転装置と、本体の上部を往復移動しながらワークを収納したトレーをピックアップして各部に移送する移載装置とを備え、前記トレーを移送及び反転させるトレーハンドリング機において、
前記反転装置が、前記移載装置の下端に一体に設けられていることを特徴とするトレーハンドリング機。 - 前記移載装置が、前記ワークを収納したトレーに対応する空トレーと、前記ワークを収納したトレー及び空トレーを定着させるトレーローディングユニットとを備えているとともに、
前記反転装置が、前記トレーローディングユニットの片側または両側に設けられて、前記トレーローディングユニットを回転させてワークを収納したトレーに収納されたワークを空トレーに再び収納させることでワークの両面を反転させるように設計されていることを特徴とする請求項1に記載のトレーハンドリング機。 - 前記移載装置が、前記ワークを収納したトレーをピックアップしてトレーローディングユニットにローディングするトレーピックアップ手段と、前記トレーピックアップ手段を昇降させる第1昇降手段とをさらに備えていることを特徴とする請求項2に記載のトレーハンドリング機。
- 前記トレーローディングユニットが、メーンボディーと、該メーンボディーの上部に前方および後方に一対で設けられて前記空トレーをローディングさせる上部スライディングカバーと、前記メーンボディーの下部に前方および後方に一対で設けられて前記ワークを収納したトレーをローディングさせる下部スライディングカバーと、前記メーンボディーの内側に前後進自在に設けられて前記空トレー及びワークを収納したトレーを固定する固定部材とを備えていることを特徴とする請求項3に記載のトレーハンドリング機。
- 前記トレーローディングユニットが、前記メーンボディーの上端に設けられて前記空トレーのローディング可否を感知する空トレー感知センサーと、前記メーンボディーの下端に設けられて前記ワークを収納したトレーのローディング可否を感知するトレー感知センサーとをさらに備えていることを特徴とする請求項4に記載のトレーハンドリング機。
- 前記トレーローディングユニットが、前記下部スライディングカバーをクランピングするクランピング機構をさらに備えていることを特徴とする請求項4に記載のトレーハンドリング機。
- 前記移載装置が、前記トレーローディングユニットを昇降させて前記ワークを収納したトレーと空トレーとの結合を迅速にする第2昇降手段をさらに備えていることを特徴とする請求項2乃至請求項6のいずれかに記載のトレーハンドリング機。
- 前記ワークを収納したトレーをトレーローディングユニットにローディングさせるために昇降するエレベーターが、前記本体の後端にさらに設けられていることを特徴とする請求項5に記載のトレーハンドリング機。
- 空トレー、ワークを収納したトレーをローディングさせる下部スライディングカバー、前記空トレーをローディングさせる上部スライディングカバー、及び、前記ワークを収納したトレー及び空トレーを固定する固定部材を有するトレーローディングユニットと、トレーピックアップ手段と、前記トレーローディングユニットを回転させる反転装置とを有して本体の上部で往復移動しながらトレーを各コンベアに移送する移載装置を備えるトレーハンドリング機を用いて、検査を完了した半導体素子を検査結果に基づいて良品と不良品とに区分して仕分けするトレーハンドリング機を用いた半導体素子検査方法において、
前記ワークを収納したトレーを本体の後端に移送する工程(S20)と、
前記本体の後端に移送されたワークを収納したトレーを移載装置でピックアップして前記ワークを収納したトレーをトレーローディングユニットに設置された空トレーと結合させる工程(S40)と、
前記移載装置を後続するトレーコンベアに移送しながらトレーローディングユニットを回転させることでワークを収納したトレーに収納された半導体素子を空トレーに再び収納させて半導体素子を反転させる工程(S50)とを有していることを特徴とするトレーハンドリング機を用いた半導体素子検査方法。 - 前記ワークを収納したトレーをピックアップして空トレーと結合させる工程(S40)が、前記トレーピックアップ手段を下降させる工程(S414)と、前記ワークを収納したトレーをピックアップする工程(S412)と、該工程(S412)でピックアップされたトレーを上昇させて下部スライディングカバーにローディングする工程(S413)と、前記下部スライディングカバーをクランピングする工程(S414)とを有していることを特徴とする請求項9に記載のトレーハンドリング機を用いた半導体素子検査方法。
- 前記ワークを収納したトレーをピックアップして空トレーと結合させる工程(S40)が、前記トレーピックアップ手段とトレーローディングユニットとを同時に下降させて前記トレーとトレーローディングユニットとの間の距離を高速で狭める工程(S421)と、前記トレーピックアップ手段を用いてワークを収納したトレーをピックアップする工程(S422)と、該工程(S422)でピックアップされたトレーを上昇させて下部スライディングカバーにローディングする工程(S423)と、前記下部スライディングカバーをクランピングする工程(S424)とを有していることを特徴とする請求項9に記載のトレーハンドリング機を用いた半導体素子検査方法。
- 前記本体の後端に移送されたワークを収納したトレーをピックアップする前にワークを収納したトレーをエレベーターを用いて上昇させる工程(S30)をさらに有していることを特徴とする請求項9乃至請求項11のいずれかに記載のトレーハンドリング機を用いた半導体素子検査方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060088480A KR100775054B1 (ko) | 2006-09-13 | 2006-09-13 | 트레이 핸들링 장치 및 그를 이용한 반도체 소자 검사 방법 |
KR10-2006-0088480 | 2006-09-13 | ||
PCT/KR2007/004399 WO2008032983A1 (en) | 2006-09-13 | 2007-09-12 | Tray handling apparatus and semiconductor device inspecting method using the same |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010503240A true JP2010503240A (ja) | 2010-01-28 |
JP4916551B2 JP4916551B2 (ja) | 2012-04-11 |
Family
ID=39061561
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009528178A Active JP4916551B2 (ja) | 2006-09-13 | 2007-09-12 | トレーハンドリング機及びそれを用いた半導体素子検査方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8056698B2 (ja) |
JP (1) | JP4916551B2 (ja) |
KR (1) | KR100775054B1 (ja) |
WO (1) | WO2008032983A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20160040002A (ko) * | 2014-10-02 | 2016-04-12 | (주)제이티 | 소자핸들러 |
KR20170000932A (ko) * | 2015-06-25 | 2017-01-04 | 세메스 주식회사 | 커스터머 트레이 로딩 유닛 |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7878336B2 (en) * | 2008-09-09 | 2011-02-01 | Cheng Mei Instrument Technology Co., Ltd. | System and method for inspection of chips on tray |
SG171498A1 (en) * | 2009-12-01 | 2011-06-29 | Rokko Systems Pte Ltd | Method and apparatus for improved sorting of diced substrates |
US8462206B1 (en) * | 2010-02-25 | 2013-06-11 | Amazon Technologies, Inc. | Image acquisition system |
KR101042936B1 (ko) | 2010-11-10 | 2011-06-20 | 강우테크 주식회사 | 테스트 트레이를 이용한 엘이디 테스트방법 |
US20130200915A1 (en) * | 2012-02-06 | 2013-08-08 | Peter G. Panagas | Test System with Test Trays and Automated Test Tray Handling |
CN203237742U (zh) * | 2012-11-28 | 2013-10-16 | 富鼎电子科技(嘉善)有限公司 | 翻面机 |
CN103496601B (zh) * | 2013-09-29 | 2016-06-01 | 上海德科电子仪表有限公司 | 自动翻转机及其翻转方法 |
US9969565B1 (en) * | 2017-04-27 | 2018-05-15 | R.A Jones & Co. | Pick and place apparatus for orientation and hole healing application |
TWI613136B (zh) * | 2017-05-05 | 2018-02-01 | 電子元件載具及其應用之作業分類設備 | |
TWI615338B (zh) * | 2017-06-03 | 2018-02-21 | 電子元件載具裝置及其應用之作業分類設備 | |
KR101770161B1 (ko) | 2017-07-07 | 2017-09-05 | 김기현 | 트레이 이송장치 |
CN111498458B (zh) * | 2020-04-29 | 2021-07-30 | 上海世禹精密机械有限公司 | 一种半导体托盘装载芯片清洗工艺前后的循环翻转倒料自动化*** |
CN111554602B (zh) * | 2020-04-29 | 2022-03-04 | 上海世禹精密机械有限公司 | 一种托盘装载芯片的翻转倒料装置 |
KR102568005B1 (ko) * | 2020-05-08 | 2023-08-28 | (주)에이피텍 | 테스트 공정 모듈화 인라인 시스템 |
CN113049596A (zh) * | 2021-03-05 | 2021-06-29 | 广州得尔塔影像技术有限公司 | 外观检查设备 |
CN114669489A (zh) * | 2022-03-23 | 2022-06-28 | 烟台聚通智能设备有限公司 | 一种新型托盘分选检测机构 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63137938A (ja) * | 1986-12-01 | 1988-06-09 | Yokohama Rubber Co Ltd:The | ゴム組成物 |
JPH06163660A (ja) * | 1992-11-20 | 1994-06-10 | Mitsubishi Electric Corp | 半導体装置の外観検査装置 |
JPH09131684A (ja) * | 1995-11-08 | 1997-05-20 | Nippon Telegr & Teleph Corp <Ntt> | 薄片保持用ヘッド |
JP2002164361A (ja) * | 2000-11-29 | 2002-06-07 | Mitsubishi Electric Corp | 半導体製造装置および半導体製造方法 |
KR20060087850A (ko) * | 2005-01-31 | 2006-08-03 | (주) 인텍플러스 | 반도체 소자 검사장치 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4232777A (en) * | 1978-09-05 | 1980-11-11 | Stewart Engineering & Equipment Company | Pan inverting apparatus and method |
US4344727A (en) * | 1980-09-22 | 1982-08-17 | St. Regis Paper Company | Method and apparatus for stacking and collating articles |
FR2639907B1 (fr) * | 1988-12-02 | 1991-06-14 | Sala Jaime Marti | Procede d'alimentation automatique d'une ligne d'embouteillage. ensemble et dispositif pour sa mise en oeuvr |
JP2785598B2 (ja) * | 1992-08-04 | 1998-08-13 | 日本電気株式会社 | 薄板搬送における表裏反転機構 |
US5588796A (en) * | 1994-04-18 | 1996-12-31 | Atg Cygnet Inc. | Apparatus and method for handling information storage media |
US5975278A (en) * | 1996-10-17 | 1999-11-02 | Omega Design Corporation | Cam actuated bottle unscrambler system |
US5888043A (en) * | 1997-02-05 | 1999-03-30 | Jatcko; Joseph D. | Device for lifting, moving, inverting and releasing heavy loads |
US6139243A (en) * | 1997-07-09 | 2000-10-31 | Systemation Engineering | Method and system for flipping a tray of parts |
KR100312860B1 (ko) * | 1999-04-26 | 2001-11-03 | 정문술 | 번인 테스터 소팅 핸들러용 트레이 트랜스퍼 기능을 갖는 소팅 픽커 |
JP3753917B2 (ja) * | 2000-03-17 | 2006-03-08 | 茨木精機株式会社 | 包装体の整列搬出方法及びその装置 |
JP2003039601A (ja) | 2001-08-01 | 2003-02-13 | Panac Co Ltd | 再剥離性部材 |
KR100663646B1 (ko) * | 2005-05-23 | 2007-01-03 | 삼성전자주식회사 | 반도체소자 테스트장치 및 이를 이용한 반도체소자의 반전방법 |
KR100724150B1 (ko) * | 2005-09-21 | 2007-06-04 | 에이엠티 주식회사 | 모듈 아이씨(ic)의 외관검사 방법 및 그 장치 |
US7794194B2 (en) * | 2007-09-14 | 2010-09-14 | Seagate Technology Llc | Pick and place work piece flipper |
-
2006
- 2006-09-13 KR KR1020060088480A patent/KR100775054B1/ko active IP Right Grant
-
2007
- 2007-09-12 US US12/440,925 patent/US8056698B2/en active Active
- 2007-09-12 JP JP2009528178A patent/JP4916551B2/ja active Active
- 2007-09-12 WO PCT/KR2007/004399 patent/WO2008032983A1/en active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63137938A (ja) * | 1986-12-01 | 1988-06-09 | Yokohama Rubber Co Ltd:The | ゴム組成物 |
JPH06163660A (ja) * | 1992-11-20 | 1994-06-10 | Mitsubishi Electric Corp | 半導体装置の外観検査装置 |
JPH09131684A (ja) * | 1995-11-08 | 1997-05-20 | Nippon Telegr & Teleph Corp <Ntt> | 薄片保持用ヘッド |
JP2002164361A (ja) * | 2000-11-29 | 2002-06-07 | Mitsubishi Electric Corp | 半導体製造装置および半導体製造方法 |
KR20060087850A (ko) * | 2005-01-31 | 2006-08-03 | (주) 인텍플러스 | 반도체 소자 검사장치 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20160040002A (ko) * | 2014-10-02 | 2016-04-12 | (주)제이티 | 소자핸들러 |
KR102355615B1 (ko) | 2014-10-02 | 2022-01-25 | (주)제이티 | 소자핸들러 |
KR20170000932A (ko) * | 2015-06-25 | 2017-01-04 | 세메스 주식회사 | 커스터머 트레이 로딩 유닛 |
KR102312865B1 (ko) | 2015-06-25 | 2021-10-14 | 세메스 주식회사 | 커스터머 트레이 로딩 유닛 |
Also Published As
Publication number | Publication date |
---|---|
WO2008032983A1 (en) | 2008-03-20 |
KR100775054B1 (ko) | 2007-11-08 |
US20100032262A1 (en) | 2010-02-11 |
US8056698B2 (en) | 2011-11-15 |
JP4916551B2 (ja) | 2012-04-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4916551B2 (ja) | トレーハンドリング機及びそれを用いた半導体素子検査方法 | |
KR100638311B1 (ko) | 반도체 소자 검사장치 및 그를 이용한 반도체 소자의 분류 방법 | |
KR101338181B1 (ko) | 소자검사장치 | |
KR101991757B1 (ko) | 웨이퍼 레벨 패키징을 수행하는 자동화 시스템 | |
TWI767067B (zh) | 半導體材料切割裝置 | |
US20030188997A1 (en) | Semiconductor inspection system and method | |
TWI448680B (zh) | 視覺檢測設備 | |
KR20080103353A (ko) | 반도체 패키지 검사 시스템 | |
US20110038694A1 (en) | Semiconductor die sorter for wafer level packaging | |
TWI486599B (zh) | Led晶片分選設備 | |
TW200524111A (en) | System for processing electronic devices | |
WO2008097012A1 (en) | Vision system of sawing and placement equipment | |
KR101496047B1 (ko) | 반도체 패키지 분류 장치 | |
CN209772785U (zh) | 半导体元件封装缺陷检查机 | |
KR102035413B1 (ko) | 반도체 소자 핸들러 | |
KR20170130792A (ko) | 웨이퍼 레벨 패키징을 수행하는 자동화 시스템 | |
KR100663385B1 (ko) | 반도체 소자의 비전 검사 시스템 | |
KR100196365B1 (ko) | 볼 그리드 어레이의 솔더볼 실장장치 | |
CN111989579A (zh) | 元件处理器 | |
KR200394150Y1 (ko) | 트레이 플리퍼부를 구비하는 반도체 패키지의 비젼인스펙션 장치 | |
KR20110038658A (ko) | 비전검사장치 | |
KR101595840B1 (ko) | 소자검사장치 및 검사방법 | |
KR102675684B1 (ko) | 워크 검사 장치 | |
CN220497003U (zh) | 自动检测设备及生产*** | |
CN218424236U (zh) | 一种芯片测试设备 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20110722 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110906 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20111130 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20111227 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20120124 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150203 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4916551 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |