KR20080103353A - 반도체 패키지 검사 시스템 - Google Patents
반도체 패키지 검사 시스템 Download PDFInfo
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- KR20080103353A KR20080103353A KR1020070050524A KR20070050524A KR20080103353A KR 20080103353 A KR20080103353 A KR 20080103353A KR 1020070050524 A KR1020070050524 A KR 1020070050524A KR 20070050524 A KR20070050524 A KR 20070050524A KR 20080103353 A KR20080103353 A KR 20080103353A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/342—Sorting according to other particular properties according to optical properties, e.g. colour
- B07C5/3422—Sorting according to other particular properties according to optical properties, e.g. colour using video scanning devices, e.g. TV-cameras
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
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- Testing Of Individual Semiconductor Devices (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
Description
Claims (7)
- 본체(1)와,검사를 수행하기 위한 반도체 패키지가 수납된 트레이를 제 1 이송레일(11)로 공급하도록 본체(1) 전방에 구비된 로딩부(10)와,상기 제 1 이송레일(11)에 구비되어 반도체 패키지의 제 1면에 대한 비전 검사를 수행하는 제 1 비전검사부(12)와,상기 제 1 이송레일(11) 일측에 구비되는 제 2 이송레일(12)과,상기 제 2 이송레일(12) 상에 구비되어 반도체 패키지의 제 2면에 대하여 컬러 카메라를 이용하여 2D 검사하는 제 2 비전검사부(14)와,상기 제 2 비전검사부(14)에서 비전 검사된 트레이를 상기 제 2 이송레일(12) 일측의 제 3 이송레일(15)로 이동시키는 트레이 이송수단(16)과,상기 제 3 이송레일(15) 상에 구비되며 반도체 패키지의 제 2면에 대하여 라인 스캔 카메라를 이용하여 2D 검사하는 제 3 비전검사부(17)와,상기 제 3 비전검사부(17) 일측에 구비되며 양품 반도체 소자가 수납된 트레이가 적재되는 언로딩부(10)와,상기 언로딩부(10) 후방에 구비되는 언로딩레일(21)과,상기 언로딩레일(21) 일측에 구비되는 버퍼레일(31)과,상기 언로딩레일(21)과 상기 버퍼레일(31)에 각각 구비되며 반도체 패키지의 제 1면에 대하여 라인 스캔 카메라를 이용하여 2D 검사하는 제 4 비전검사부(22) 와,상기 제 1 이송레일(11) 상의 트레이를 제 2 이송레일(12) 상에 반전시켜 이송하며 상기 제 3 이송레일(15) 상의 트레이를 반전시켜 상기 언로딩레일(21) 또는 버퍼레일(31)로 이송하는 반전수단(50)과,상기 언로딩부(10) 일측에 구비되어 불량품 반도체 소자가 불량 타입별로 분류되어 수납되는 다수의 리젝트부(40; 40a, 40b)와,상기 다수의 리젝트부(40; 40a, 40b)와 언로딩부(10) 사이를 이동하면서 비전 검사가 완료된 반도체 패키지를 분류하는 분류기(60)를 포함하여 구성되는 것을 특징으로 하는 반도체 패키지의 검사 시스템.
- 제 1항에 있어서,상기 제 1 비전검사부(12)는;반도체 패키지의 제 1면에 대한 3D 검사를 수행하는 3D 비전검사부(12a)와,상기 반도체 패키지의 제 1면에 대하여 컬러 카메라를 이용하여 2D 검사를 수행하는 2D 검사부(12b)로 구성됨을 특징으로 하는 반도체 패키지의 검사 시스템.
- 제 1항에 있어서,상기 제 3 이송레일(15)과 상기 언로딩레일(21) 사이에는 전방에 공트레이부(70)가 구비된 공트레이 공급 레일(71)이 더 구비됨을 특징으로 하는 반도체 패키지의 검사 시스템.
- 제 1항 내지 제 3항 중 어느 한 항에 있어서,상기 제 1 비전검사부(12) 및 제 2 비전검사부(14)의 전단에는 각각 클리닝장치(80)가 구비됨을 특징으로 하는 반도체 패키지의 검사 시스템.
- 제 4항에 있어서,상기 클리닝장치(80)는;반도체 패키지 표면 밀착을 통해 클리닝 하는 브러시클리닝모듈(81)과,상기 브러시클리닝모듈(81)의 양측에 구비되어 에어 분사 및 진공 흡입을 실시하는 에어클리닝모듈(82)을 포함하여 구성되는 것을 특징으로 하는 반도체 패키지의 검사 시스템.
- 제 4항에 있어서,상기 에어클리닝모듈(82)은 이온 공급을 통해 정전기를 제거하기 위한 이온화 장치를 더 포함함을 특징으로 하는 반도체 패키지의 검사 시스템.
- 제 6항에 있어서,상기 클리닝장치(80)는;상기 브러시클리닝모듈(81)과 상기 에어클리닝모듈(82)이 장착되는 클리닝모듈 몸체(80a)와,상기 클리닝모듈 몸체(80a)의 좌우 방향 이동을 안내하기 위한 가이드부(80b)와,상기 클리닝모듈 몸체(80a)에 일측이 고정되는 타이밍 벨트(80c)와,상기 가이드부(80b)의 양측에 고정되어 상기 타이밍 벨트(80c)를 구동시켜 상기 클리닝모듈 몸체(80a)를 좌우로 이동시키는 풀리(80d), 및상기 클리닝모듈 몸체(80a)의 하부에 구비되어 트레이에 수납된 반도체 패키지를 진공 흡착 패드(83)를 이용하여 흡착한 후 승강시키는 승강 장치(84)를 더 구비함을 특징으로 하는 반도체 패키지의 검사 시스템.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070050524A KR100873670B1 (ko) | 2007-05-23 | 2007-05-23 | 반도체 패키지 검사 시스템 |
PCT/KR2008/002866 WO2008143471A1 (en) | 2007-05-23 | 2008-05-22 | Semiconductor package inspecting system |
TW097119135A TW200905772A (en) | 2007-05-23 | 2008-05-23 | System for inspection of semiconductor package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070050524A KR100873670B1 (ko) | 2007-05-23 | 2007-05-23 | 반도체 패키지 검사 시스템 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20080103353A true KR20080103353A (ko) | 2008-11-27 |
KR100873670B1 KR100873670B1 (ko) | 2008-12-12 |
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Application Number | Title | Priority Date | Filing Date |
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KR1020070050524A KR100873670B1 (ko) | 2007-05-23 | 2007-05-23 | 반도체 패키지 검사 시스템 |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR100873670B1 (ko) |
TW (1) | TW200905772A (ko) |
WO (1) | WO2008143471A1 (ko) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101275862B1 (ko) * | 2011-10-12 | 2013-06-17 | 한미반도체 주식회사 | 반도체 제조 시스템 및 이의 제어방법 |
KR101420312B1 (ko) * | 2012-11-26 | 2014-07-17 | 성우세미텍 주식회사 | 인쇄회로기판 검사장치 |
KR101442483B1 (ko) * | 2013-01-10 | 2014-09-24 | 주식회사 미르기술 | Led 패키지 비전 검사 및 분류 시스템 |
KR101601614B1 (ko) * | 2015-11-30 | 2016-03-08 | 최혜정 | 반도체 소자 외관 검사장치 |
KR20190095035A (ko) * | 2018-02-06 | 2019-08-14 | (주) 인텍플러스 | 반도체 소자 외관 검사장치 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101133188B1 (ko) * | 2009-03-27 | 2012-04-09 | (주)제이티 | 소자소팅장치 및 그 방법 |
SG169317A1 (en) * | 2009-09-03 | 2011-03-30 | Jt Corp | Sorting apparatus for semiconductor device |
IT1400547B1 (it) * | 2010-06-17 | 2013-06-11 | Unione Srl | Impianto di selezione pile e metodo che utilizza l'impianto. |
CN111239159A (zh) * | 2020-03-16 | 2020-06-05 | 科为升视觉技术(苏州)有限公司 | 封装基板视觉检测***及方法 |
CN115602583B (zh) * | 2022-11-29 | 2023-03-14 | 苏州锐杰微科技集团有限公司 | 一种用于芯片的线键球栅阵列封装生产线 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100385876B1 (ko) * | 2000-12-20 | 2003-06-02 | 한미반도체 주식회사 | 반도체 패키지장치 절단용 핸들러 시스템 |
US7987968B2 (en) * | 2004-04-13 | 2011-08-02 | Tdk Corporation | Chip component carrying method and system, and visual inspection method and system |
KR100745380B1 (ko) * | 2006-05-09 | 2007-08-02 | 에이티아이 주식회사 | 플립 칩 - 볼 그리드 어레이 평면 및 입체 검사장치 |
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2007
- 2007-05-23 KR KR1020070050524A patent/KR100873670B1/ko active IP Right Grant
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2008
- 2008-05-22 WO PCT/KR2008/002866 patent/WO2008143471A1/en active Application Filing
- 2008-05-23 TW TW097119135A patent/TW200905772A/zh unknown
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101275862B1 (ko) * | 2011-10-12 | 2013-06-17 | 한미반도체 주식회사 | 반도체 제조 시스템 및 이의 제어방법 |
KR101420312B1 (ko) * | 2012-11-26 | 2014-07-17 | 성우세미텍 주식회사 | 인쇄회로기판 검사장치 |
KR101442483B1 (ko) * | 2013-01-10 | 2014-09-24 | 주식회사 미르기술 | Led 패키지 비전 검사 및 분류 시스템 |
KR101601614B1 (ko) * | 2015-11-30 | 2016-03-08 | 최혜정 | 반도체 소자 외관 검사장치 |
KR20190095035A (ko) * | 2018-02-06 | 2019-08-14 | (주) 인텍플러스 | 반도체 소자 외관 검사장치 |
Also Published As
Publication number | Publication date |
---|---|
WO2008143471A1 (en) | 2008-11-27 |
KR100873670B1 (ko) | 2008-12-12 |
TW200905772A (en) | 2009-02-01 |
TWI373815B (ko) | 2012-10-01 |
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