JP2010129699A - ダイシング・ダイボンドフィルム及び半導体装置の製造方法 - Google Patents
ダイシング・ダイボンドフィルム及び半導体装置の製造方法 Download PDFInfo
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Abstract
半導体ウエハが薄型・大型であっても、粘着剤層とダイ接着層を容易に剥離でき、剥離後は再接着せず、ピックアップ性が良好なダイシング・ダイボンドフィルムを提供する。
【解決手段】
ダイシング・ダイボンドフィルムは、ダイシングフィルムにおける粘着剤層が、ガス発生剤をベースポリマー100重量部に対して10〜200重量部の割合で含有し、且つベースポリマーが下記のアクリル系ポリマーAである。
アクリルポリマーA:アルキル基の炭素数が6〜10のアクリル酸アルキルエステル50重量%以上と、ヒドロキシル基含有モノマー1重量%〜30重量%を含み且つカルボキシル基含有モノマーを含まないモノマー組成物によるアクリル系ポリマー
【選択図】 図1
Description
ダイシングフィルムは、粘着剤層が、ガス発生剤をベースポリマー100重量部に対して10〜200重量部の割合で含有し、且つベースポリマーが下記のアクリル系ポリマーAである粘着剤層であり、
アクリルポリマーA:CH2=CHCOOR(式中、Rは炭素数が6〜10のアルキル基である)で表されるアクリル酸エステル50重量%以上と、ヒドロキシル基含有モノマー1重量%〜30重量%を含み且つカルボキシル基含有モノマーを含まないモノマー組成物によるアクリル系ポリマー
ダイボンドフィルムは、ダイ接着層により形成されていることを特徴とするダイシング・ダイボンドフィルムである。
本発明のダイシング・ダイボンドフィルムは、基材上に粘着剤層を有するダイシングフィルムと、前記粘着剤層上に設けられたダイボンドフィルムとを有しており、ダイシングフィルムは、基材上の少なくとも片面に、ガス発生剤を含有している粘着剤層が設けられた構成を有している。
粘着剤層は、ガス発生剤をベースポリマー100重量部に対して10〜200重量部の割合で含有しているとともに、ベースポリマーが下記のアクリル系ポリマーAである粘着剤層である。
(ガス発生剤)
ガス発生剤としては、ガス発生手段により、分解や反応などが生じてガス成分を発生させることができるガス発生剤であれば特に制限されず、公知のガス発生剤の中から適宜選択して用いることができる。ガス発生手段としては、ガスを発生させるための手段であれば特に制限されず、例えば、外部からの刺激等が挙げられる。具体的には、ガス発生手段としては、例えば、光、熱、超音波などが挙げられ、好ましくは光、熱であり、特に光が好適である。ガス発生手段の光としては、赤外線、可視光線、紫外線、X線の他、γ線、α線、β線、中性子線、電子線などの電離性放射線などを利用することができる。光としては、活性エネルギー線が好ましく、特に紫外線を好適に用いることができる。従って、本発明では、ガス発生剤としては、光によりガスを発生する光照射型ガス発生剤が好ましく、更に好ましくは活性エネルギー線によりガスを発生する活性エネルギー線照射型ガス発生剤であり、特に紫外線によりガスを発生する紫外線照射型ガス発生剤を好適に用いることができる。
粘着剤層を形成するための粘着剤では、ベースポリマーとして、下記のアクリル系ポリマーAが用いられている。
アクリルポリマーAは、粘着剤のベースポリマー又はポリマー主成分として用いられている。アクリルポリマーAは、主モノマー成分として、化学式CH2=CHCOOR(式中、Rは炭素数6〜10のアルキル基である)で表されるアクリル酸アルキルエステル(「アクリル酸C6−10アルキルエステル」と称する場合がある)が用いられている。なお、アクリル酸アルキルエステルにおいて、アルキル基の炭素数が6未満のアクリル酸アルキルエステルを主モノマー成分として用いると、剥離力が大きくなり過ぎてピックアップ性が低下する場合がある。一方、アルキル基の炭素数が10を超えるアクリル酸アルキルエステルを主モノマー成分として用いると、ダイボンドフィルムとの接着性又は密着性が低下し、その結果、ダイシングの際にチップ飛びが発生する場合がある。
本発明では、粘着剤層のゲル分率は90重量%以上であることが望ましく、更に好ましくは94重量%以上である。粘着剤層のゲル分率が90重量%未満であると、ピックアップ性が低下したり、ダイボンドフィルム付き半導体チップに対し、糊残りが発生する場合がある。
粘着剤層から約0.1gをサンプリングして精秤し(試料の重量)、これをメッシュ状シートで包んだ後、約50mlの酢酸エチル中に室温で1週間浸漬させた。その後、溶剤不溶分(メッシュ状シートの内容物)を酢酸エチルから取り出し、80℃で約2時間乾燥して、該溶剤不溶分を秤量し(浸漬・乾燥後の重量)、下記式(1)よりゲル分率(重量%)を算出した。
(弾性率)
粘着剤層は、弾性率(温度:23℃、引張速度:50mm/min、チャック間距離:10mm)が、5MPa以上であることが望ましく、更に好ましくは6MPa以上である。なお、粘着剤層の弾性率(温度:23℃、引張速度:50mm/min、チャック間距離:10mm)の上限は、特に制限されないが、例えば、50MPa以下であってもよく、好ましくは40MPa以下、更に好ましくは35MPa以下である。このように、粘着剤層の弾性率(温度:23℃、引張速度:50mm/min、チャック間距離:10mm)が5MPa以上であると、ダイシングフィルムにガス発生手段を施してガス発生剤からガスを発生させ、ダイシングフィルムとダイ接着層が剥離した時に、活性エネルギー線硬化型粘着剤層がダイ接着層と再接着してしまうのを有効に防止する事ができる。
ダイ接着層を積層する前のダイシングフィルム(粘着シート)の粘着剤層のみを分離し、JIS Z 8703に記載されている試験場所(23±2℃,50±5%RH)の環境下にて、引張試験機(商品名「オートグラフ AG−IS」島津製作所社製)を用いて、チャック間距離:10mm、試験速度(引張速度):50mm/minにて引張試験を行い、得られた応力−歪み曲線の低歪み領域部分の接線の傾きより弾性率(初期弾性率)を求めた。
γL=γL d+γL p (2b)
(1+cosθ)γL=2(γS dγL d)1/2+2(γS pγL p)1/2 (2c)
ただし、式(2a)〜(2c)中の各記号は、それぞれ以下の通りである。
・γS:粘着剤層の表面自由エネルギー(mJ/m2)
・γS d:粘着剤層の表面自由エネルギーにおける分散成分(mJ/m2)
・γS p:粘着剤層の表面自由エネルギーにおける極性成分(mJ/m2)
・γL:水又はヨウ化メチレンの表面自由エネルギー(mJ/m2)
・γL d:水又はヨウ化メチレンの表面自由エネルギーにおける分散成分(mJ/m2)
・γL p:水又はヨウ化メチレンの表面自由エネルギーにおける極性成分(mJ/m2)
また、粘着剤層の表面に対する水およびヨウ化メチレンの接触角の測定は、JIS Z 8703に記載されている試験場所(温度:23±2℃,湿度:50±5%RH)の環境下において、粘着剤層表面に、約1μLの水(蒸留水)またはヨウ化メチレンの液滴を滴下し、表面接触角計「CA−X」(FACE社製)を用いて、滴下30秒後に3点法より接触角を測定した。
本発明では、基材と粘着剤層の間に中間層が設けられていても良い。このような中間層としては、密着力の向上を目的とした下塗り剤のコーティング層などが挙げられる。また、下塗り剤のコーティング層以外の中間層としては、例えば、被着物(半導体ウェハなど)への接着面積の増大を目的とした層、接着力の向上を目的とした層、被着物(半導体ウェハなど)の表面形状に良好に追従させることを目的とした層などが挙げられる。
本発明に係るダイシングフィルム(粘着シート)の基材としては、特に限定されないが、光により粘着剤層に含有されるガス発生剤からガスを発生させる場合、光(特に紫外線)を透過又は通過するものであることが好ましい。また、基材は、ダイシング・ダイボンドフィルムの強度母体となるものである。基材としては、強度母体となる光(活性エネルギー線など)透過性を有していれば特に制限されないが、例えば、低密度ポリエチレン、直鎖状ポリエチレン、中密度ポリエチレン、高密度ポリエチレン、超低密度ポリエチレン、ランダム共重合ポリプロピレン、ブロック共重合ポリプロピレン、ホモポリプロレン、ポリブテン、ポリメチルペンテン等のポリオレフィン、エチレン−酢酸ビニル共重合体、アイオノマー樹脂、エチレン−(メタ)アクリル酸共重合体、エチレン−(メタ)アクリル酸エステル(ランダム、交互)共重合体、エチレン−ブテン共重合体、エチレン−ヘキセン共重合体、アクリル系樹脂、ポリウレタン、ポリエチレンテレフタレート、ポリエチレンナフタレート等のポリエステル、ポリカーボネート、ポリイミド、ポリエーテルエーテルケトン、ポリイミド、ポリエーテルイミド、ポリアミド、全芳香族ポリアミド、ポリフェニルスルフイド、アラミド(紙)、ガラス、ガラスクロス、フッ素樹脂、ポリ塩化ビニル、ポリ塩化ビニリデン、ABS(アクリロニトリル−ブタジエン−スチレン共重合体)、セルロース系樹脂、シリコーン樹脂、金属(箔)、紙等が挙げられる。また基材の材料としては、前記樹脂の架橋体等のポリマーも用いることができる。
本発明では、ダイボンドフィルムは、ダイ接着層により形成されている。ダイ接着層は、該ダイ接着層上に圧着されている半導体ウエハの加工(例えば、チップ状に切断する切断加工など)の際には、半導体ウエハに密着して支持し、半導体ウエハの加工体(例えば、チップ状に切断加工される半導体チップなど)をマウントする際には、該半導体ウエハの加工体と、各種キャリアとの接着層として作用する機能を有していることが重要である。特に、ダイ接着層としては、半導体ウエハの加工(例えば、切断加工などの加工)の際に、切断片を飛散させない接着性を有していることが重要である。
本発明のダイシング・ダイボンドフィルムの製造方法について、ダイシング・ダイボンドフィルム10を例にして説明する。先ず、基材1aは、従来公知の製膜方法により製膜することができる。当該製膜方法としては、例えばカレンダー製膜法、有機溶媒中でのキャスティング法、密閉系でのインフレーション押出法、Tダイ押出法、共押出し法、ドライラミネート法等が例示できる。
半導体ウエハ(半導体ウェハ)としては、公知乃至慣用の半導体ウエハであれば特に制限されず、各種素材の半導体ウエハから適宜選択して用いることができる。本発明では、半導体ウエハとしては、シリコンウエハを好適に用いることができる。
本発明の半導体装置の製造方法は、前記ダイシング・ダイボンドフィルムを用いた半導体装置の製造方法であれば特に制限されない。例えば、本発明のダイシング・ダイボンドフィルムを、ダイボンドフィルム(ダイ接着層)上に任意に設けられたセパレータを適宜に剥離して、次の様に使用することにより、半導体装置を製造することができる。なお、以下では、図3を参照しながらダイシング・ダイボンドフィルム11を用いた場合を例にして説明する。先ず、ダイシング・ダイボンドフィルム11におけるダイ接着層(ダイボンドフィルム)31上に半導体ウェハ4を圧着し、これを接着保持させて固定する(マウント工程)。本工程は、圧着ロール等の押圧手段により押圧しながら行う。
<ダイシングフィルムの作製>
冷却管、窒素導入管、温度計および撹拌装置を備えた反応容器に、アクリル酸2−エチルヘキシル(「2EHA」と称する場合がある):95部、アクリル酸−2−ヒドロキシエチル(「HEA」と称する場合がある):5部、過酸化ベンゾイル:0.2部、及びトルエン:65部を入れ、窒素雰囲気下にて61℃にて6時間重合処理をしてアクリル系ポリマーXを得た。
アクリル酸エチル−メチルメタクリレートを主成分とするアクリル酸エステル系ポリマー(商品名「パラクロンW−197CM」根上工業株式会社製):100部に対して、エポキシ樹脂1(商品名「エピコート1004」ジャパンエポキシレジン(JER)株式会社製):59部、エポキシ樹脂2(商品名「エピコート827」ジャパンエポキシレジン(JER)株式会社製):53部、フェノール樹脂(商品名「ミレックスXLC−4L」三井化学株式会社製):121部、球状シリカ(商品名「SO−25R」株式会社アドマテックス製):222部をメチルエチルケトンに溶解して、固形分の濃度が23.6重量%となる接着剤組成物の溶液を調製した。
各実施例2〜5については、ダイシングフィルムを、表1に示す組成及び含有量(粘着剤のベースポリマーの組成、架橋剤の含有量、ガス発生剤の含有量など)によるダイシングフィルムに変更したこと以外は、実施例1と同様にしてダイシング・ダイボンドフィルムを作製した。
実施例9に関しては、ベースポリマーの組成、架橋剤、ガス発生剤の量を表1に記載した通りに変更したことに加えて、テルペンフェノール系樹脂(商品名「PR−12603」住友ベークライト株式会社製):20部を加えたこと以外は、実施例1と同様にしてダイシング・ダイボンドフィルムを作製した。
各比較例1〜3については、ダイシングフィルムを、表1に示す組成及び含有量(粘着剤のベースポリマーの組成、架橋剤の含有量、ガス発生剤の含有量など)によるダイシングフィルムに変更したこと以外は、実施例1と同様にしてダイシング・ダイボンドフィルムを作製した。
BA:アクリル酸n−ブチル
AA:アクリル酸
HEA:2−ヒドロキシエチルアクリレート
スミライト:テルペンフェノール系樹脂(商品名「PR−12603」住友ベークライト株式会社製)
架橋剤:イソシアネート系架橋剤(商品名「コロネートL」日本ポリウレタン工業株式会社製)
ガス発生剤:商品名「VAm−100」和光純薬工業株式会社製
(評価)
実施例1〜6及び比較例1〜3に係るダイシング・ダイボンドフィルムについて、ダイシングフィルム中の粘着剤層のゲル分率、ダイシングフィルム中の粘着剤層に関する弾性率、ダイシングフィルム中の粘着剤層に関するガラス転移温度、ダイシングフィルム中の粘着剤層の表面自由エネルギー、再接着防止性、ピックアップ性を、下記の評価又は測定方法により評価又は測定した。評価又は測定結果は表1に併記した。
ダイシングフィルムの粘着剤層から約0.1gをサンプリングして精秤し(試料の重量)、これをメッシュ状シートで包んだ後、約50mlの酢酸エチル中に室温で1週間浸漬させた。その後、溶剤不溶分(メッシュ状シートの内容物)を酢酸エチルから取り出し、80℃で約2時間乾燥して、該溶剤不溶分を秤量し(浸漬・乾燥後の重量)、下記式(1)よりゲル分率(重量%)を算出した。
<ダイシングフィルムの粘着剤層の弾性率の測定方法>
ダイ接着層を積層する前のダイシングフィルム(粘着シート)の粘着剤層のみを分離し、JIS Z 8703に記載されている試験場所(23±2℃,50±5%RH)の環境下にて、引張試験機(商品名「オートグラフ AG−IS」島津製作所社製)を用いて、チャック間距離:10mm、試験速度(引張速度):50mm/minにて引張試験を行い、得られた応力−歪み曲線の低歪み領域部分の接線の傾きより弾性率(初期弾性率)を求めた。
ダイシングフィルム(粘着シート)の粘着剤層として、ガス発生剤を含有していないこと以外は同様の粘着剤層(サンプル)を作製し、動的粘弾性測定装置(商品名「ARES」、レオメトリック社製)を用いて、サンプル厚さ:約1.5mmで、φ7.9mmパラレルプレート[素材:ステンレス(SUS316)]の治具を用い、剪断モードにて、周波数1Hz、昇温速度5℃/分にて測定した。得られた剪断損失弾性率G″のスペクトルにおいて、高弾性率から低弾性率へと急激に変化し始める温度を、ベースポリマーのガラス転移温度(Tg;℃)とする。
JIS Z 8703に記載されている試験場所(温度:23±2℃,湿度:50±5%RH)の環境下において、ダイ接着層を積層する前のダイシングフィルム(粘着シート)の粘着剤層の表面に、約1μLの水(蒸留水)またはヨウ化メチレンの液滴を滴下し、表面接触角計「CA−X」(FACE社製)を用いて、滴下30秒後に3点法より接触角[θ(rad)]を測定した。得られた2つの接触角と、水、ヨウ化メチレンの表面自由エネルギー値として文献より既知である値と、下記の式(2a)〜(2c)とを利用して得られる二つの式を連立一次方程式として解くことにより、ダイシングフィルム中の粘着剤層の表面自由エネルギー(γS)を算出した。
γL=γL d+γL p (2b)
(1+cosθ)γL=2(γS dγL d)1/2+2(γS pγL p)1/2 (2c)
ただし、式(2a)〜(2c)中の各記号は、それぞれ以下の通りである。
・γS:粘着剤層の表面自由エネルギー(mJ/m2)
・γS d:粘着剤層の表面自由エネルギーにおける分散成分(mJ/m2)
・γS p:粘着剤層の表面自由エネルギーにおける極性成分(mJ/m2)
・γL:水又はヨウ化メチレンの表面自由エネルギー(mJ/m2)
・γL d:水又はヨウ化メチレンの表面自由エネルギーにおける分散成分(mJ/m2)
・γL p:水又はヨウ化メチレンの表面自由エネルギーにおける極性成分(mJ/m2)
・水(蒸留水)の表面自由エネルギー値として既知である値:[分散成分(γL d):21.8(mJ/m2)、極性成分(γL p):51.0(mJ/m2)]
・ヨウ化メチレンの表面自由エネルギー値として既知である値:[分散成分(γL d):49.5(mJ/m2)、極性成分(γL p):1.3(mJ/m2)]
<再接着防止性の評価方法>
ダイ接着層を積層する前のダイシングフィルム(粘着シート)を、3cm角に切り出し、JIS Z 8703に記載されている試験場所(23±2℃,50±5%RH)の環境下にて、2Kgローラーを用いてスライドガラスに圧着した。次いで紫外線(UV)照射装置:商品名「UM−810」(日東精機株式会社製)を用いて、紫外線照射積算光量:1000mJ/cm2の条件で、ダイシングフィルムの基材側より紫外線(波長:365nm)を照射した。紫外線照射1分後と5分後において、ダイシングフィルムがスライドガラスから剥離できたものを○、照射1分後では剥離できるが5分後では剥離できないものを△、照射1分後と5分後の両方ともに剥離できないものを×として評価した。
実施例及び比較例のそれぞれのダイシング・ダイボンドフィルムを用いて、以下の要領で、実際に半導体ウェハのダイシングを行った後に剥離性の評価を行い、各ダイシング・ダイボンドフィルムのピックアップ性能を評価とした。
研削装置:商品名「DFG−8560」ディスコ社製
半導体ウェハ:8インチ径(厚さ0.6mmから0.025mmに裏面研削)
(貼り合わせ条件)
貼り付け装置:商品名「MA−3000II」日東精機株式会社製
貼り付け速度計:10mm/min
貼り付け圧力:0.15MPa
貼り付け時のステージ温度:40℃
(ダイシング条件)
ダイシング装置:商品名「DFD−6361」ディスコ社製
ダイシングリング:「2−8−1」(ディスコ社製)
ダイシング速度:30mm/sec
ダイシングブレード:
Z1;ディスコ社製「NBC−ZH226J27HAAA」
ダイシングブレード回転数:
Z1;30,000rpm
カット方式:シングルステップカット
ウェハチップサイズ:10.0mm角
次に、紫外線(UV)照射装置としての商品名「UM−810」(日東精機株式会社製)を用いて、紫外線照射積算光量:1000mJ/cm2にて紫外線(波長:365nm)をダイシング・ダイボンドフィルムに、ダイシングフィルムの基材側より照射した。照射開始から1分後、ダイシング・ダイボンドフィルムを空中で上下が反対になるように反転させ、ダイシングされた半導体チップが下側になるようにして、ダイシングフィルムからダイボンドフィルム付きチップを自然落下により剥離させた。その後、400個の半導体チップに対して、ダイシングフィルムからダイボンドフィルム付きの半導体チップが自然落下した個数を数え、落下した半導体チップの割合(剥離率;%)を算出し、ピックアップ性を評価した。従って、ピックアップ性は、落下した半導体チップの割合が100%に近いほど良好である。
1a 基材
1b 粘着剤層
2 ダイシングフィルム
3,31 ダイ接着層(ダイボンドフィルム)
4 半導体ウェハ
5 半導体チップ
6 被着体
7 ボンディングワイヤー
8 封止樹脂
9 スペーサ
Claims (5)
- 基材上に粘着剤層を有するダイシングフィルムと、前記粘着剤層上に設けられたダイボンドフィルムとを有するダイシング・ダイボンドフィルムであって、
ダイシングフィルムは、粘着剤層が、ガス発生剤をベースポリマー100重量部に対して10〜200重量部の割合で含有し、且つベースポリマーが下記のアクリル系ポリマーAである粘着剤層であり、
アクリルポリマーA:CH2=CHCOOR(式中、Rは炭素数が6〜10のアルキル基である)で表されるアクリル酸エステル50重量%以上と、ヒドロキシル基含有モノマー1重量%〜30重量%を含み且つカルボキシル基含有モノマーを含まないモノマー組成物によるアクリル系ポリマー
ダイボンドフィルムは、ダイ接着層により形成されていることを特徴とするダイシング・ダイボンドフィルム。 - ガス発生剤が、光によりガスを発生する光照射型ガス発生剤であることを特徴とする請求項1記載のダイシング・ダイボンドフィルム。
- 前記ダイシングフィルムの粘着剤層が、ゲル分率が90重量%以上であることを特徴とする請求項1又は2記載のダイシング・ダイボンドフィルム。
- 前記ダイシングフィルムの粘着剤層が、弾性率(温度:23℃、引張速度:50mm/min、チャック間距離:10mm)が、5MPa以上であることを特徴とする請求項1〜3の何れか1項に記載のダイシング・ダイボンドフィルム。
- ダイシング・ダイボンドフィルムを用いた半導体装置の製造方法であって、ダイシング・ダイボンドフィルムとして、請求項1〜4の何れか1項に記載のダイシング・ダイボンドフィルムを用いたことを特徴とする半導体装置の製造方法。
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010126598A (ja) * | 2008-11-26 | 2010-06-10 | Nitto Denko Corp | ダイシング・ダイボンドフィルム及び半導体装置の製造方法 |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004186280A (ja) * | 2002-11-29 | 2004-07-02 | Sekisui Chem Co Ltd | ウエハ貼着用粘着シート及び半導体装置の製造方法 |
JP2004228539A (ja) * | 2002-11-29 | 2004-08-12 | Sekisui Chem Co Ltd | Icチップの製造方法 |
JP2006210433A (ja) * | 2005-01-25 | 2006-08-10 | Sekisui Chem Co Ltd | ウエハ貼着用粘着シート及び半導体の製造方法 |
JP2008150500A (ja) * | 2006-12-18 | 2008-07-03 | Denki Kagaku Kogyo Kk | 粘着剤、粘着シート、電子部品固定用粘着シート、多層粘着シート、及び電子部品の製造方法。 |
JP2008211224A (ja) * | 2008-03-17 | 2008-09-11 | Sumitomo Bakelite Co Ltd | ダイシングシート機能付きダイアタッチフィルム及びそれを用いた半導体装置の製造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4961804A (en) * | 1983-08-03 | 1990-10-09 | Investment Holding Corporation | Carrier film with conductive adhesive for dicing of semiconductor wafers and dicing method employing same |
JP4275522B2 (ja) * | 2003-12-26 | 2009-06-10 | 日東電工株式会社 | ダイシング・ダイボンドフィルム |
JP4443962B2 (ja) * | 2004-03-17 | 2010-03-31 | 日東電工株式会社 | ダイシング・ダイボンドフィルム |
KR100773634B1 (ko) * | 2006-10-26 | 2007-11-05 | 제일모직주식회사 | 아크릴 바인더 수지조성물를 포함하는 광경화형 점착조성물및 이를 이용한 점착테이프 |
JP2010053346A (ja) * | 2008-07-31 | 2010-03-11 | Nitto Denko Corp | 再剥離型粘着剤及び再剥離型粘着シート |
JP4810565B2 (ja) * | 2008-11-26 | 2011-11-09 | 日東電工株式会社 | ダイシング・ダイボンドフィルム及び半導体装置の製造方法 |
-
2008
- 2008-11-26 JP JP2008301556A patent/JP2010129699A/ja active Pending
-
2009
- 2009-11-25 US US12/625,735 patent/US20100129988A1/en not_active Abandoned
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004186280A (ja) * | 2002-11-29 | 2004-07-02 | Sekisui Chem Co Ltd | ウエハ貼着用粘着シート及び半導体装置の製造方法 |
JP2004228539A (ja) * | 2002-11-29 | 2004-08-12 | Sekisui Chem Co Ltd | Icチップの製造方法 |
JP2006210433A (ja) * | 2005-01-25 | 2006-08-10 | Sekisui Chem Co Ltd | ウエハ貼着用粘着シート及び半導体の製造方法 |
JP2008150500A (ja) * | 2006-12-18 | 2008-07-03 | Denki Kagaku Kogyo Kk | 粘着剤、粘着シート、電子部品固定用粘着シート、多層粘着シート、及び電子部品の製造方法。 |
JP2008211224A (ja) * | 2008-03-17 | 2008-09-11 | Sumitomo Bakelite Co Ltd | ダイシングシート機能付きダイアタッチフィルム及びそれを用いた半導体装置の製造方法 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010126598A (ja) * | 2008-11-26 | 2010-06-10 | Nitto Denko Corp | ダイシング・ダイボンドフィルム及び半導体装置の製造方法 |
JP2010153774A (ja) * | 2008-11-26 | 2010-07-08 | Nitto Denko Corp | ダイシング・ダイボンドフィルム及び半導体装置の製造方法 |
KR101781645B1 (ko) * | 2011-04-20 | 2017-09-25 | 닛토덴코 가부시키가이샤 | 전기 화학 디바이스용 점착 테이프 |
JP6890216B1 (ja) * | 2019-12-20 | 2021-06-18 | 日東電工株式会社 | 粘着シート |
WO2021124856A1 (ja) * | 2019-12-20 | 2021-06-24 | 日東電工株式会社 | 粘着シート |
TWI758015B (zh) * | 2019-12-20 | 2022-03-11 | 日商日東電工股份有限公司 | 黏著片材及電子零件之處理方法 |
JP6873354B1 (ja) * | 2019-12-27 | 2021-05-19 | 日東電工株式会社 | 粘着シート |
WO2021131518A1 (ja) * | 2019-12-27 | 2021-07-01 | 日東電工株式会社 | 粘着シート |
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