JP2009147349A - プリント回路基板用の優先的接地及びビア延出構造 - Google Patents
プリント回路基板用の優先的接地及びビア延出構造 Download PDFInfo
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- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
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- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
- H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
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- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
- H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
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- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6605—High-frequency electrical connections
- H01L2223/6627—Waveguides, e.g. microstrip line, strip line, coplanar line
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1903—Structure including wave guides
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/044—Details of backplane or midplane for mounting orthogonal PCBs
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09236—Parallel layout
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09609—Via grid, i.e. two-dimensional array of vias or holes in a single plane
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09636—Details of adjacent, not connected vias
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09718—Clearance holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
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Abstract
【解決手段】ビア401〜404の配置又は回路トレース420延出構造のどちらかを使用する。ビア401〜404の配置では、差動信号ペア420のビア401,402及び関連する接地ビア403,404は、繰返しパターンで互いに隣接して配設される。各ペアの差動信号ビア401,402は隣接した差動信号ペア420の関連する接地405aよりも関連する接地ビアに近付いて一定間隔で配設され、差異信号ビア401,402はそれらの関連する接地ビア403,404に、電気的に連結される。回路トレース420延出構造は差動信号ビア401,402の回路トレース420の延出部を含み、トレースが導電トレースの伝送部に接触し結合する通路を辿(たど)る。
【選択図】図10A
Description
図6は、本明細書において「5ダイ(5-die )」ビアパターンと呼ぶものが形成された他の回路基板200を示す。このパターンは、単一の介在接地ビア205の両側に配設された2対の差動信号ビア202、204を有する。そのような差動信号ビアの各ペアは、2個の別個のビア202a、202bと、204a、204bとを有する。そのような各差動ペアの2個のビアは、通常、(図7で左下から右上に延在するように示された)第1の軸L1の方向に位置合せされている。このパターンは、第1の軸L1と交わる方向に沿って繰返される。差動信号ビア202a−b、204a−bは、通常、これらのビアから回路基板200の他の箇所に至る導電トレースを有し、接地ビア205は、通常、回路基板205内の内側面に配設され、図6には示されていない接地面層に接続されている。
また、トレースがビアから出て回路基板上の伝送経路を構成する領域内の伝送線路のインピーダンスを制御することが望ましい。それらの延出部で問題が起こる。従来、導電トレースペアの間隔を差動信号ビアのペア間に延在する中心線に対して対称的な構成で維持しようとすることは知られていた。これを図14に示す。ここで、一対の差動信号ビアの2個のビア501、502が距離Dだけ互いに離されている。一対の導電トレース503が、ビア501、502に接続されそこから出ている。それらの延出経路は、最初、トレースが均一な間隔DDだけ離れるまで、トレースの延出部504に沿って2個のビア501を分ける中心線Cの方に斜めに延在する。これらの延出部503は、長さが短いため、その延在範囲では互いに交差することはなく、中心線Cの両側に互いに平行に延在する対応する細長い部分505につながっている。2個のビア501、502とその関連したトレース503は、それらを支持する回路基板500の信号伝送線路を画定する。単一ペアの差動信号ビアの場合は、2本のトレースの必要な間隔、形状及び長さが対称的に維持され、それにより、延出部の変動が絶対的最小に維持される。回路トレースの形状と対称性を維持することによって、この領域のインピーダンスを制御することができる。しかしながら、特に、差動信号ビア対が高密度で又は接近して設けられている回路基板の領域では、ビアから対称パターンでトレースを引出すことができるとは限らない。
Claims (7)
- 差動信号用途に使用される改良された回路基板であって、回路基板が、該回路基板を通して差動信号を伝えるために使用される一対のめっきされたビアを備え、前記回路基板が、さらに、前記ビアから出て前記ビアから離れた前記回路基板の位置まで延在する一対の導電トレースを更に含み、改良点が、
トレースが延出部及び伝送部を備え、トレース延出部が前記ビアからあらかじめ選択された距離だけ延在し、前記トレース延出部の幅が、前記伝送部の対応する幅よりも広いことである改良された回路基板。 - 前記2個の差動信号ビアが、第1の軸に沿って位置合せされ、前記トレース延出部が、それぞれ、前記2個のビアから第2の軸に沿って前記第1の軸に対して直交する方向に延在する、請求項1に記載の回路基板。
- 前記トレースの前記伝送部が、前記第1の軸から離間し前記第2の軸に対してほぼ直交する第3の軸に沿って延在する、請求項2に記載の回路基板。
- 前記トレース延出部が、それぞれ、前記第2の軸から外れる曲がり部を含む、請求項2に記載の回路基板。
- 前記トレース延出部が、大きな接続導電部によって前記ビアに接続されている、請求項1に記載の回路基板。
- 2個の別個の接地ビアを更に含み、前記2個の接地ビアが、前記第1の軸と交差する仮想線に沿って位置合せされている、請求項1に記載の回路基板。
- 接地基準面を更に含み、接地基準面が、前記差動信号ビアを包囲する開口部を含み、前記接地基準面が前記接地ビアに接続されている、請求項6に記載の回路基板。
Applications Claiming Priority (2)
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US54452204P | 2004-02-13 | 2004-02-13 | |
US60/544,522 | 2004-02-13 |
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JP2006553286A Division JP4350132B2 (ja) | 2004-02-13 | 2005-02-14 | 回路基板 |
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JP2009147349A true JP2009147349A (ja) | 2009-07-02 |
JP4880666B2 JP4880666B2 (ja) | 2012-02-22 |
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JP2006553286A Expired - Fee Related JP4350132B2 (ja) | 2004-02-13 | 2005-02-14 | 回路基板 |
JP2008327793A Expired - Fee Related JP4880666B2 (ja) | 2004-02-13 | 2008-12-24 | 回路基板 |
JP2008327816A Expired - Fee Related JP4772856B2 (ja) | 2004-02-13 | 2008-12-24 | 回路基板 |
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US (1) | US20050201065A1 (ja) |
EP (1) | EP1714531A2 (ja) |
JP (3) | JP4350132B2 (ja) |
KR (1) | KR100839307B1 (ja) |
CN (4) | CN101553085B (ja) |
SG (1) | SG135185A1 (ja) |
WO (1) | WO2005081595A2 (ja) |
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Also Published As
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JP4880666B2 (ja) | 2012-02-22 |
CN101626659A (zh) | 2010-01-13 |
CN1943286A (zh) | 2007-04-04 |
CN1943286B (zh) | 2012-01-04 |
JP2009100003A (ja) | 2009-05-07 |
JP4350132B2 (ja) | 2009-10-21 |
WO2005081595A2 (en) | 2005-09-01 |
US20050201065A1 (en) | 2005-09-15 |
KR20060118605A (ko) | 2006-11-23 |
KR100839307B1 (ko) | 2008-06-17 |
CN1918952A (zh) | 2007-02-21 |
CN101553085B (zh) | 2011-04-20 |
WO2005081595A3 (en) | 2005-12-15 |
CN100512594C (zh) | 2009-07-08 |
JP4772856B2 (ja) | 2011-09-14 |
JP2007522678A (ja) | 2007-08-09 |
CN101553085A (zh) | 2009-10-07 |
EP1714531A2 (en) | 2006-10-25 |
SG135185A1 (en) | 2007-09-28 |
CN101626659B (zh) | 2011-04-20 |
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