JP2009146932A - Substrate transfer apparatus, substrate transfer method, and vacuum processing apparatus - Google Patents

Substrate transfer apparatus, substrate transfer method, and vacuum processing apparatus Download PDF

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JP2009146932A
JP2009146932A JP2007319573A JP2007319573A JP2009146932A JP 2009146932 A JP2009146932 A JP 2009146932A JP 2007319573 A JP2007319573 A JP 2007319573A JP 2007319573 A JP2007319573 A JP 2007319573A JP 2009146932 A JP2009146932 A JP 2009146932A
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substrate
frame
carrier
suction
state
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Yoshihiro Toyama
佳宏 遠山
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Ulvac Inc
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Ulvac Inc
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Priority to JP2007319573A priority Critical patent/JP2009146932A/en
Priority to PCT/JP2008/072323 priority patent/WO2009075261A1/en
Priority to CN2008801206771A priority patent/CN101889339B/en
Priority to KR1020107011326A priority patent/KR20100085128A/en
Priority to TW97148248A priority patent/TW200935547A/en
Publication of JP2009146932A publication Critical patent/JP2009146932A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/068—Stacking or destacking devices; Means for preventing damage to stacked sheets, e.g. spaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/02—Controlled or contamination-free environments or clean space conditions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B65G2249/045—Details of suction cups suction cups

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate transfer apparatus, a substrate transfer method, and a vacuum processing apparatus for reducing the weight of a carrier for carrying substrates in an upright position. <P>SOLUTION: The substrate transfer apparatus includes a transfer mechanism 22 equipped with a frame 37 having a rectangular frame body, extending horizontally, and being supported turnably on a turning shaft L, in parallel with the frame body; a plurality of suction pads 46 provided on the frame 37 for sucking substrates W; and a driving portion 35 for making the frame 37 turn between a horizontal state and a vertical state; and a controller for controlling the transfer mechanism 22. The transfer mechanism 22 makes substrates W subjected to suction by the frame 37 in the horizontal state, makes the frame 37 turn, and makes substrates W in the carrier 23 stored in an upright state. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、基板搬送装置、基板搬送方法及び前記基板搬送装置を備えた真空処理装置に関するものである。   The present invention relates to a substrate transfer apparatus, a substrate transfer method, and a vacuum processing apparatus including the substrate transfer apparatus.

従来、液晶ディスプレイ等のフラットパネルディスプレイに用いられる大型ガラス基板に対して、スパッタリングによって薄膜を成膜する等の真空処理を施す真空処理装置がある。近年、このような真空処理装置として、生産効率を向上させるため、複数の真空処理室へ基板を順次搬送して連続的に処理する所謂インライン式の真空処理装置が多く採用されている。そして、例えば特許文献１には、各真空処理室と、該各真空処理室に基板を垂直に立てた状態で搬送する矩形枠状のキャリヤとを備えた真空処理装置が開示されている。このように、キャリヤが基板を垂直に立てた状態で真空処理室に搬送することで、基板が大型化した場合でも真空処理装置の設置スペースの増大を抑えつつ、多数のキャリヤを配置することが可能になり、生産効率の向上が図られている。
特開２００６−１１４６７５号公報 2. Description of the Related Art Conventionally, there is a vacuum processing apparatus that performs vacuum processing such as forming a thin film by sputtering on a large glass substrate used in a flat panel display such as a liquid crystal display. In recent years, as such a vacuum processing apparatus, in order to improve the production efficiency, a so-called in-line type vacuum processing apparatus that sequentially conveys substrates to a plurality of vacuum processing chambers and continuously processes them has been adopted. For example, Patent Document 1 discloses a vacuum processing apparatus including each vacuum processing chamber and a rectangular frame-shaped carrier that conveys the substrate in a state where the substrate is vertically set in each vacuum processing chamber. In this way, by transferring the carrier to the vacuum processing chamber with the substrate standing vertically, a large number of carriers can be arranged while suppressing an increase in the installation space of the vacuum processing apparatus even when the substrate is enlarged. It is possible to improve production efficiency.
JP 2006-114675 A

ところで、上記特許文献１では、キャリヤに基板を受け渡す際に、搬送ロボットが所定位置にストックされた処理前の基板を取り込み、該基板を水平に倒れた状態（水平状態）のキャリヤ上に載置する。そして、キャリヤに基板を保持させた後に、該キャリヤを回動させる回動機構により直立させることで、基板が垂直に立った状態（垂直状態）でキャリヤに保持されるようになっている。つまり、上記従来の構成ではキャリヤが水平状態と垂直状態との間で回動することになる。このため、キャリヤが回動する際の撓みを低減するためにキャリヤを構成する部材を厚くしてその剛性を高くする必要があり、キャリヤの重量が増大するという問題がある。その結果、各キャリヤの製造コストが増大するとともに、キャリヤを回動させる際や真空処理室に搬送する際に必要な電力が増大することで基板の生産コストが増大してしまうという問題があった。   By the way, in Patent Document 1, when a substrate is delivered to the carrier, the transfer robot takes in the substrate before processing stocked at a predetermined position, and the substrate is placed on the carrier in a state where the substrate is tilted horizontally (horizontal state). Put. Then, after the substrate is held by the carrier, the substrate is held upright by a rotating mechanism that rotates the carrier, so that the substrate is held in a vertical state (vertical state). In other words, in the conventional configuration, the carrier rotates between the horizontal state and the vertical state. For this reason, in order to reduce the bending at the time of rotation of the carrier, it is necessary to increase the rigidity by increasing the thickness of the members constituting the carrier, which increases the weight of the carrier. As a result, the manufacturing cost of each carrier increases, and there is a problem that the production cost of the substrate increases due to an increase in electric power required for rotating the carrier or transporting it to the vacuum processing chamber. .

本発明は、こうした実情に鑑みてなされたものであって、その目的は、基板を垂直に立てた状態で搬送するキャリヤの軽量化を図ることができる基板搬送装置、基板搬送方法及び真空処理装置を提供することにある。   The present invention has been made in view of such circumstances, and an object of the present invention is to provide a substrate transport apparatus, a substrate transport method, and a vacuum processing apparatus that can reduce the weight of a carrier that transports a substrate in a vertical state. Is to provide.

上記課題を解決するために、請求項１に記載の発明は、平板状の基板を垂直に立てた状態で搬送するキャリヤに、水平に倒れた状態で搬送される基板を受け渡す基板搬送装置であって、矩形状の枠体を有し、水平方向に沿って伸び前記枠体と平行な回動軸に回動可能に支持されたフレームと、前記フレームに配設され前記基板を吸着する複数の吸着パッドと、前記フレームを、水平状態と垂直状態との間で回動させる駆動部と、を有する移載機構と、前記移載機構を制御する制御装置と、を備え、前記移載機構は、水平状態の前記フレームにて前記基板を吸着させ、前記フレームを回動させて垂直に立った状態の前記キャリヤに前記基板を収容するようにした。   In order to solve the above-mentioned problem, the invention according to claim 1 is a substrate transport apparatus that delivers a substrate transported in a horizontally tilted state to a carrier that transports a flat substrate in a vertically standing state. A frame having a rectangular frame and extending in a horizontal direction and rotatably supported on a rotation shaft parallel to the frame, and a plurality of frames disposed on the frame and adsorbing the substrate A transfer mechanism having a suction pad, a drive unit for rotating the frame between a horizontal state and a vertical state, and a control device for controlling the transfer mechanism, the transfer mechanism Is configured such that the substrate is adsorbed by the frame in a horizontal state, and the substrate is accommodated in the carrier in a vertical state by rotating the frame.

同構成によれば、移載機構は、水平状態で搬送された基板を水平状態のフレームにて吸着させ、フレーム回動させて垂直に立った状態のキャリヤに基板を収容する。従って、キャリヤに基板を受け渡す際に、キャリヤを水平状態と垂直状態との間で回動させないため、キャリヤを構成する部材を厚くしてその剛性を高くする必要がなくなり、キャリヤの軽量化を図ることができる。その結果、各キャリヤの製造コストの低減が可能になるとともに、キャリヤを搬送する際に必要な電力を低減することが可能になり、基板の生産コストの低減を図ることができる。また、基板のみを回動させるため、従来のように基板を保持したキャリヤを回動させる場合に比べ、基板を水平に倒れた状態から垂直に立った状態にする際に必要な電力を効果的に低減でき、基板の生産コストの低減を図ることができる。なお、垂直とは、完全に垂直な状態だけでなく垂直に近い状態をも含み、水平とは完全に水平な状態だけでなく水平に近い状態も含む。   According to this configuration, the transfer mechanism sucks the substrate transported in the horizontal state with the frame in the horizontal state, and accommodates the substrate in the carrier in the vertical state by rotating the frame. Therefore, when the substrate is delivered to the carrier, the carrier is not rotated between the horizontal state and the vertical state, so that it is not necessary to increase the rigidity of the member constituting the carrier, thereby reducing the weight of the carrier. Can be planned. As a result, the manufacturing cost of each carrier can be reduced, and the electric power required for transporting the carrier can be reduced, so that the production cost of the substrate can be reduced. In addition, since only the substrate is rotated, the power required for changing the substrate from the horizontal position to the vertical position is more effective than when the carrier holding the substrate is rotated as in the prior art. The production cost of the substrate can be reduced. Note that the vertical includes not only a completely vertical state but also a state close to vertical, and the horizontal includes not only a completely horizontal state but also a state close to horizontal.

請求項２に記載の発明は、請求項１に記載の基板搬送装置において、前記移載機構は、前記キャリヤに垂直に立った状態で載置された前記基板を垂直状態の前記フレームにて吸着させ、前記フレームを回動させて垂直に立った状態の前記キャリヤから前記基板を受け取るようにした。同構成によれば、キャリヤに垂直に立った状態で載置された基板を垂直状態のフレームにて吸着させ、フレームを回動させて垂直に立った状態のキャリヤから基板を受け取るため、キャリヤを軽量化することができる。その結果、各キャリヤの製造コストの低減が可能になるとともに、キャリヤを搬送する際に必要な電力を低減することが可能になり、基板の生産コストを低減できる。また、基板のみを回動させるため、従来のように基板を保持したキャリヤを回動させる場合に比べ、基板を水平に倒れた状態から垂直に立った状態にする際に必要な電力を効果的に低減でき、基板の生産コストの低減を図ることができる。   According to a second aspect of the present invention, in the substrate transfer apparatus according to the first aspect, the transfer mechanism sucks the substrate placed in a vertical position on the carrier by the frame in the vertical state. The frame is rotated so that the substrate is received from the carrier standing in a vertical position. According to this configuration, the substrate placed in a vertical position on the carrier is adsorbed by the vertical frame, and the frame is rotated to receive the substrate from the vertical standing carrier. The weight can be reduced. As a result, the manufacturing cost of each carrier can be reduced, and the power required for transporting the carrier can be reduced, thereby reducing the production cost of the substrate. In addition, since only the substrate is rotated, the power required for changing the substrate from the horizontal position to the vertical position is more effective than when the carrier holding the substrate is rotated as in the prior art. The production cost of the substrate can be reduced.

請求項３に記載の発明は、請求項１又は２に記載の基板搬送装置において、前記枠体の内側に配置され、外部から倒れた状態で搬送される前記基板を受け取り前記フレーム上に搬送する搬送部を備え、前記駆動部は、前記フレームを上下方向に移動可能に構成され、前記移載機構は、前記基板が搬送される際に、該基板が搬送される搬送ラインよりも下方に前記フレームを移動させ、前記フレームを前記搬送ラインよりも上方に移動させて前記基板を吸着させ、前記フレームを回動させて垂直に立った状態の前記キャリヤに前記基板を収容する。同構成によれば、例えばローラコンベヤ等により外部から倒れた状態で搬送される基板が、フレームを構成する枠体の内側に配置された搬送部（例えば、ローラコンベヤ）によりフレーム上に搬送される。そのため、従来のように、搬送ロボットが外部から搬送された処理前の基板を取り込み、フレーム上に搬送する場合に比べ、搬送ロボットを配置するスペースが必要なくなり、省スペース化できる。   According to a third aspect of the present invention, in the substrate transfer apparatus according to the first or second aspect, the substrate disposed inside the frame body and transported in a state of falling from the outside is received and transported onto the frame. A transport unit; and the drive unit is configured to move the frame in a vertical direction. The transfer mechanism is configured to move the substrate below the transport line on which the substrate is transported when the substrate is transported. The frame is moved, the frame is moved above the transfer line to attract the substrate, and the frame is rotated to accommodate the substrate in the carrier in a vertical state. According to this configuration, for example, a substrate that is transported from the outside by a roller conveyor or the like is transported onto the frame by a transport unit (for example, a roller conveyor) disposed inside the frame constituting the frame. . Therefore, as compared with the conventional case where the transfer robot takes in a substrate before processing transferred from the outside and transfers it onto the frame, a space for disposing the transfer robot is not required, and the space can be saved.

請求項４に記載の発明は、請求項１〜３のうちの何れか一項に記載の基板搬送装置において、前記フレームには、前記基板に対する複数の吸着領域が設定されるとともに、前記各吸着領域には少なくとも１つの吸着パッドが含まれ、前記各吸着領域に含まれる前記吸着パッドには同時に負圧が供給され、前記各吸着領域は供給される負圧が互いに独立して制御可能に構成されてなる。同構成によれば、各吸着領域は供給される負圧が互いに独立して制御可能に構成されているため、基板の撓みや基板の破損に起因して基板に密着できない吸着パッドがある吸着領域があっても、各吸着パッドが基板に密着した吸着領域では基板を吸着することができる。そのため、基板の撓みが大きい場合などに、基板の一部を吸着できないために、基板全体がフレーム上に保持できなくなることを低減できる。   According to a fourth aspect of the present invention, in the substrate transfer apparatus according to any one of the first to third aspects, a plurality of suction areas for the substrate are set in the frame, and each suction is performed. The area includes at least one suction pad, and negative pressure is simultaneously supplied to the suction pads included in each suction area, and the negative pressure supplied to each suction area can be controlled independently of each other. Being done. According to the same configuration, each suction region is configured such that the negative pressure supplied can be controlled independently of each other, so that there is a suction region that has a suction pad that cannot be adhered to the substrate due to substrate bending or substrate damage. Even if there is, the substrate can be adsorbed in the adsorbing region where each adsorbing pad is in close contact with the substrate. Therefore, it is possible to reduce the case where the entire substrate cannot be held on the frame because a part of the substrate cannot be adsorbed when the substrate is largely bent.

請求項５に記載の発明は、請求項４に記載の基板搬送装置において、前記吸着領域毎に前記吸着パッドに負圧を供給する管路と前記各管路が接続される共通の負圧源と、前記各管路を開閉するバルブと、前記各管路内の圧力を測定する真空センサと、を備え、前記制御装置は、前記吸着パッドによる前記基板の吸着開始後、所定時間内に前記管路内の圧力が所定値以下にならない場合には、該管路を閉じるように前記バルブを制御する。同構成によれば、吸着パッドによる基板の吸着開始後、所定時間内に管路内の圧力が所定値以下にならない場合には、該管路を閉じるようにバルブが制御される。そのため、基板の撓みや基板の破損に起因して基板に密着できない吸着パッドがある吸着領域があっても、各吸着パッドが基板に密着した吸着領域では基板を吸着することができる。従って、基板の撓みが大きい場合などに、基板の一部を吸着できないために、基板全体がフレーム上に基板を保持できなくなることを低減できる。   According to a fifth aspect of the present invention, in the substrate transfer apparatus according to the fourth aspect of the present invention, a common negative pressure source in which a pipe that supplies negative pressure to the suction pad and the pipes are connected to each suction area And a valve that opens and closes each of the pipelines, and a vacuum sensor that measures the pressure in each of the pipelines, and the control device is configured to start the adsorption of the substrate by the adsorption pad within a predetermined time. When the pressure in the pipeline does not become a predetermined value or less, the valve is controlled to close the pipeline. According to this configuration, the valve is controlled so as to close the pipe line when the pressure in the pipe line does not become a predetermined value or less within a predetermined time after the suction of the substrate by the suction pad is started. Therefore, even if there is a suction area where there is a suction pad that cannot be brought into close contact with the substrate due to bending of the substrate or damage to the substrate, it is possible to suck the substrate in the suction area where each suction pad is in close contact with the substrate. Accordingly, it is possible to reduce a situation where the entire substrate cannot be held on the frame because a part of the substrate cannot be adsorbed when the substrate is largely bent.

請求項６に記載の発明は、請求項４又は５に記載の基板搬送装置において、前記吸着パッドは、前記フレームに矩形枠状に配列され、前記吸着領域は、立てた状態の前記フレームにおける、上辺部の上側主吸着領域と、下辺部の下側主吸着領域と、右側辺部の右側補吸着領域と、左側辺部の左側補吸着領域とを備え、前記上側主吸着領域及び下側主吸着領域は、それぞれ少なくとも２つ以上の分割領域とから構成された。吸着パッドをフレームに矩形枠状に配列することで、基板の外周縁が吸着されるため該基板の撓みを低減できるとともに、例えばフレームに碁盤目状に吸着パッドを設ける場合に比べ、吸着パッドの数を削減できる。この場合、フレームが垂直状態になると、上辺部及び下辺部に基板の重量の大部分が作用し、上辺部及び下辺部（上側主吸着領域及び下側主吸着領域）に設けられた吸着パッドにより基板が吸着されフレーム上に保持される。そのため、基板の撓みが大きい場合等に上側主吸着領域及び下側主吸着領域に設けられた吸着パッドが基板を吸着できないと、フレーム上に基板を保持することが困難になる。この点、同構成によれば、上側及び下側主吸着領域をそれぞれ２つ以上の分割領域としているため、例えば上側主吸着領域を構成する分割領域のうちの１つで基板を吸着できなくとも、その他の分割領域で基板を吸着できる場合には、フレーム上に基板を保持することが可能になる。そのため、吸着パッドの数を削減できるとともに、基板の撓みが大きい場合などに、基板の一部を吸着できないために、基板全体がフレーム上に基板を保持できなくなることをさらに低減できる。   According to a sixth aspect of the present invention, in the substrate transfer apparatus according to the fourth or fifth aspect, the suction pads are arranged in a rectangular frame shape on the frame, and the suction area is in the frame in a standing state. An upper main adsorption region on the upper side, a lower main adsorption region on the lower side, a right supplemental adsorption region on the right side, and a left supplemental adsorption region on the left side, the upper main adsorption region and the lower main adsorption region Each adsorption region was composed of at least two or more divided regions. By arranging the suction pads in a rectangular frame shape on the frame, the outer peripheral edge of the substrate is sucked, so that the bending of the substrate can be reduced and, for example, compared to the case where the suction pads are arranged in a grid pattern on the frame, The number can be reduced. In this case, when the frame is in a vertical state, most of the weight of the substrate acts on the upper side and the lower side, and the suction pads provided on the upper side and the lower side (upper main suction region and lower main suction region) The substrate is sucked and held on the frame. Therefore, it is difficult to hold the substrate on the frame if the suction pads provided in the upper main suction region and the lower main suction region cannot suck the substrate when the substrate is largely bent. In this regard, according to the same configuration, since the upper and lower main suction regions are each divided into two or more divided regions, for example, even if the substrate cannot be sucked by one of the divided regions constituting the upper main suction region. When the substrate can be adsorbed in other divided regions, the substrate can be held on the frame. Therefore, it is possible to reduce the number of suction pads and to further reduce the possibility that the entire substrate cannot be held on the frame because a part of the substrate cannot be sucked when the substrate is largely bent.

請求項７に記載の発明は、請求項２〜６のうちの何れか一項に記載の基板搬送装置において、前記駆動部は、前記フレームを上下方向、及び前記移載機構と前記キャリヤとを結ぶ直線に沿った前後方向に移動可能に構成され、前記移載機構は、前記フレームが前記キャリヤに収容された前記基板を受け取る際に、前記フレームの回動軸が前記移載機構と前記キャリヤとの間、且つ前記キャリヤにおける前記基板の下端が載置される載置面よりも下側に位置した状態で、前記フレームにて前記基板を吸着させ、前記フレームを回動させて垂直に立った状態の前記キャリヤから前記基板を受け取るようにした。同構成によれば、フレームの回動軸が移載機構とキャリヤとの間、且つ載置面よりも下側に位置するため、フレームを回動させるのみで、フレームが載置面よりも上方に移動すると同時に、基板における該基板が吸着される吸着面の反対側面よりも吸着面側に移動側に移動する。従って、フレームを載置面よりも上方に移動させると同時に、反対側面よりも吸着面側に移動させるといった複雑な制御を行わずとも、基板が載置面等に接触して破損することを防止できる。   According to a seventh aspect of the present invention, in the substrate transfer apparatus according to any one of the second to sixth aspects, the drive unit moves the frame up and down, and the transfer mechanism and the carrier. The transfer mechanism is configured to be movable in the front-rear direction along a straight line to be connected. When the frame receives the substrate accommodated in the carrier, the rotation shaft of the frame is configured to move the transfer mechanism and the carrier. And the lower end of the substrate in the carrier is positioned below the placement surface on which the carrier is placed, the substrate is attracted by the frame, and the frame is rotated to stand vertically. The substrate is received from the carrier in a heated state. According to this configuration, since the rotation axis of the frame is located between the transfer mechanism and the carrier and below the placement surface, the frame is positioned above the placement surface simply by rotating the frame. At the same time, the substrate moves to the moving side to the suction surface side rather than the side surface opposite to the suction surface to which the substrate is sucked. Therefore, it is possible to prevent the substrate from coming into contact with the mounting surface and being damaged without performing complicated control such as moving the frame above the mounting surface and simultaneously moving the frame to the suction surface side from the opposite side surface. it can.

請求項８に記載の発明は、請求項１〜７のうちの何れか一項に記載の基板搬送装置において、前記キャリヤにおける前記基板の下端が載置される載置面の高さを検出する位置センサを備え、前記駆動部は、前記フレームを上下方向に移動可能に構成され、前記移載機構は、前記基板を前記キャリヤに収容する際に、前記位置センサの検出結果に基づき前記フレームを上下方向に移動させ、前記基板の下端が前記載置面と接触しないようにする。同構成によれば、位置センサの検出結果に基づいてフレームを上下方向に移動させ、基板の下端が載置面と接触しないようにする。そのため、均質な薄膜を形成する等の目的から基板を加熱され、キャリヤが熱膨張して載置面の位置が異なる場合であっても、基板を破損させることなくキャリヤに受け渡すことができる。   The invention according to claim 8 is the substrate transfer apparatus according to any one of claims 1 to 7, wherein the height of the mounting surface on which the lower end of the substrate on the carrier is mounted is detected. A position sensor; and the drive unit is configured to move the frame in a vertical direction, and the transfer mechanism moves the frame based on a detection result of the position sensor when the substrate is accommodated in the carrier. The substrate is moved in the vertical direction so that the lower end of the substrate does not contact the mounting surface. According to this configuration, the frame is moved in the vertical direction based on the detection result of the position sensor so that the lower end of the substrate does not contact the placement surface. Therefore, even when the substrate is heated for the purpose of forming a homogeneous thin film and the carrier is thermally expanded and the position of the mounting surface is different, it can be delivered to the carrier without damaging the substrate.

請求項９に記載の発明は、平板状の基板を垂直に立てた状態で搬送するキャリヤに、水平に倒れた状態で搬送される前記基板を受け渡す基板搬送方法であって、前記基板を吸着する吸着パッドを備える水平状態のフレームにて前記基板を吸着し、前記フレームを回動して垂直に立った状態の前記キャリヤに前記基板を収容するようにした。   The invention according to claim 9 is a substrate transport method for delivering the substrate that is transported in a state of being tilted horizontally to a carrier that transports the flat substrate in a vertically standing state, and attracts the substrate. The substrate is sucked by a horizontal frame provided with a suction pad, and the substrate is accommodated in the carrier in a vertical state by rotating the frame.

同構成によれば、キャリヤの軽量化を図ることができるため、各キャリヤの製造コストの低減が可能になるとともに、キャリヤを搬送する際に必要な電力を低減することが可能になり、基板の生産コストの低減を図ることができる。また、基板を水平に倒れた状態から垂直に立った状態にする際に必要な電力を効果的に低減でき、基板の生産コストの低減を図ることができる。   According to this configuration, since the weight of the carrier can be reduced, the manufacturing cost of each carrier can be reduced, and the power required for transporting the carrier can be reduced. The production cost can be reduced. In addition, it is possible to effectively reduce the electric power required to change the substrate from a horizontally tilted state to a vertically standing state, and to reduce the production cost of the substrate.

請求項１０に記載の発明は、請求項９に記載の基板搬送方法において、前記キャリヤに垂直に立った状態で載置された前記基板を垂直状態の前記フレームにて吸着し、前記フレームを回動して前記キャリヤから前記基板を受け取るようにした。同構成によれば、キャリヤを軽量化することができるため、各キャリヤの製造コストの低減が可能になるとともに、キャリヤを搬送する際に必要な電力を低減することが可能になり、基板の生産コストを低減できる。また、基板を水平に倒れた状態から垂直に立った状態にする際に必要な電力を効果的に低減でき、基板の生産コストの低減を図ることができる。   According to a tenth aspect of the present invention, in the substrate transfer method according to the ninth aspect, the substrate placed in a vertical position on the carrier is adsorbed by the vertical frame, and the frame is rotated. And moved to receive the substrate from the carrier. According to this configuration, since the weight of the carrier can be reduced, the manufacturing cost of each carrier can be reduced, and the electric power required for transporting the carrier can be reduced. Cost can be reduced. In addition, it is possible to effectively reduce the electric power required for changing the substrate from the horizontally tilted state to the vertically standing state, and to reduce the production cost of the substrate.

請求項１１に記載の発明は、請求項９又は１０に記載の基板搬送方法において、前記基板を吸着する際に、前記吸着パッドによる前記基板の吸着開始後、所定時間内に、前記フレームに設定され少なくとも１つの吸着パッドを含む複数の吸着領域毎に設けられた管路内の圧力が所定値以下にならない場合には、該管路に設けられたバルブを閉じるようにした。同構成によれば、基板に密着できない吸着パッドがある吸着領域があっても、各吸着パッドが基板に密着した吸着領域では基板を吸着することができる。従って、基板Ｗの撓みが大きい場合などに、基板の一部を吸着できないために、基板全体がフレーム上に保持できなくなることを低減できる。   According to an eleventh aspect of the present invention, in the substrate transfer method according to the ninth or tenth aspect, when the substrate is sucked, the frame is set within a predetermined time after the suction of the substrate by the suction pad is started. When the pressure in the pipe line provided for each of the plurality of suction areas including at least one suction pad does not become a predetermined value or less, the valve provided in the pipe line is closed. According to this configuration, even if there is a suction region where there is a suction pad that cannot be in close contact with the substrate, the substrate can be suctioned in the suction region where each suction pad is in close contact with the substrate. Accordingly, it is possible to reduce the case where the entire substrate cannot be held on the frame because a part of the substrate cannot be adsorbed when the substrate W is largely bent.

請求項１２に記載の発明は、請求項１０又は１１に記載の基板搬送方法において、前記フレームが前記キャリヤに収容された前記基板を受け取る際に、前記フレームの回動軸が該フレームを有する移載機構と前記キャリヤとの間、且つ前記キャリヤにおける前記基板の下端が載置される載置面よりも下側に位置した状態で、前記フレームにて前記基板を吸着し、前記フレームを回動して前記キャリヤから前記基板を受け取るようにした。同構成によれば、フレームの回動軸が移載機構とキャリヤとの間、且つ載置面よりも下側に位置するため、フレームを回動させるのみで、フレームが載置面よりも上方に移動すると同時に、基板における該基板が吸着される吸着面の反対側面よりも吸着面側に移動側に移動する。従って、フレームを載置面よりも上方に移動させると同時に、反対側面よりも吸着面側に移動させるといった複雑な制御を行わずとも、基板が載置面等に接触して破損することを防止できる。   According to a twelfth aspect of the present invention, in the substrate transfer method according to the tenth or eleventh aspect, when the frame receives the substrate accommodated in the carrier, a rotation shaft of the frame includes the frame. In a state where the lower end of the substrate in the carrier is positioned below the mounting surface between the mounting mechanism and the carrier, the substrate is adsorbed by the frame and the frame is rotated. The substrate is received from the carrier. According to this configuration, since the rotation axis of the frame is located between the transfer mechanism and the carrier and below the placement surface, the frame is positioned above the placement surface simply by rotating the frame. At the same time, the substrate moves to the moving side to the suction surface side rather than the side surface opposite to the suction surface to which the substrate is sucked. Therefore, it is possible to prevent the substrate from coming into contact with the mounting surface and being damaged without performing complicated control such as moving the frame above the mounting surface and simultaneously moving the frame to the suction surface side from the opposite side surface. it can.

請求項１３に記載の発明は、請求項９〜１２のうちの何れか一項に記載の基板搬送方法において、前記基板を前記キャリヤに収容する際に、前記キャリヤにおける前記基板の下端が載置される載置面の上下方向における高さを検出し、検出結果に基づき前記フレームを上下方向に移動して、前記基板の下端が前記載置面と接触しないようにした。同構成によれば、均質な薄膜を形成する等の目的から基板を加熱され、キャリヤが熱膨張して載置面の位置が異なる場合であっても、基板を破損させることなくキャリヤに受け渡すことができる。   A thirteenth aspect of the present invention is the substrate transfer method according to any one of the ninth to twelfth aspects, wherein the lower end of the substrate in the carrier is placed when the substrate is accommodated in the carrier. The height in the vertical direction of the mounting surface is detected, and the frame is moved in the vertical direction based on the detection result so that the lower end of the substrate does not contact the mounting surface. According to this configuration, even when the substrate is heated for the purpose of forming a homogeneous thin film and the carrier is thermally expanded and the position of the mounting surface is different, the substrate is delivered to the carrier without damaging it. be able to.

請求項１４に記載の発明は、平板状の基板を真空処理する真空処理室と、前記真空処理室に前記基板を垂直に立てた状態で搬送するキャリヤと、前記キャリヤに水平に倒れた状態で搬送される前記基板を受け渡す基板搬送装置を備えた真空処理装置であって、前記基板搬送装置は、矩形状の枠体を有し、水平方向に沿って伸び前記枠体と平行な回動軸に回動可能に支持されたフレームと、前記フレームに矩形枠状に配設され前記基板を吸着する複数の吸着パッドと、前記フレームを、水平状態と垂直状態との間で回動させる駆動部と、前記駆動部及び前記各吸着パッドを制御する制御装置と、を有する移載機構を備え、前記移載機構は、水平状態の前記フレームにて前記基板を吸着させ、前記フレームを回動させて垂直に立った状態の前記キャリヤに前記基板を収容するようにした。   According to a fourteenth aspect of the present invention, there is provided a vacuum processing chamber that vacuum-processes a flat substrate, a carrier that transports the substrate in a vertical state in the vacuum processing chamber, and a state in which the substrate is tilted horizontally to the carrier. A vacuum processing apparatus including a substrate transfer device that delivers the substrate to be transferred, the substrate transfer device having a rectangular frame, and extending along a horizontal direction and rotating in parallel with the frame A frame rotatably supported by a shaft, a plurality of suction pads arranged in a rectangular frame shape on the frame and sucking the substrate, and a drive for rotating the frame between a horizontal state and a vertical state And a transfer device having a control unit for controlling the drive unit and each suction pad. The transfer mechanism sucks the substrate with the frame in a horizontal state and rotates the frame. Let the key stand vertically And adapted to receive the substrate to the rear.

同構成によれば、キャリヤの軽量化を図ることができるため、各キャリヤの製造コストの低減が可能になるとともに、キャリヤを搬送する際に必要な電力を低減することが可能になり、基板の生産コストの低減を図ることができる。また、基板を水平に倒れた状態から垂直に立った状態にする際に必要な電力を効果的に低減でき、基板の生産コストの低減を図ることができる。   According to this configuration, since the weight of the carrier can be reduced, the manufacturing cost of each carrier can be reduced, and the power required for transporting the carrier can be reduced. The production cost can be reduced. In addition, it is possible to effectively reduce the electric power required to change the substrate from a horizontally tilted state to a vertically standing state, and to reduce the production cost of the substrate.

本発明によれば、基板を垂直に立てた状態で搬送するキャリヤの軽量化を図ることが可能な基板搬送装置、基板搬送方法及び真空処理装置を提供することができる。   According to the present invention, it is possible to provide a substrate transport apparatus, a substrate transport method, and a vacuum processing apparatus that can reduce the weight of a carrier that transports a substrate in a vertical state.

以下、本発明を複数の真空処理室へ基板を順次搬送して連続的に処理する、所謂インライン式の真空処理装置として具体化した一実施形態を図面に従って説明する。
図１に示す真空処理装置１は、液晶ディスプレイ等のフラットパネルディスプレイに用いられる大型ガラス基板（例えば、一辺が２ｍ以上）に対して、スパッタリング等により所定の薄膜を成膜する等の真空処理を行うようになっている。 Hereinafter, an embodiment in which the present invention is embodied as a so-called in-line type vacuum processing apparatus that sequentially conveys substrates to a plurality of vacuum processing chambers and processes them successively will be described with reference to the drawings.
The vacuum processing apparatus 1 shown in FIG. 1 performs vacuum processing such as forming a predetermined thin film by sputtering or the like on a large glass substrate (for example, 2 m or more on one side) used for a flat panel display such as a liquid crystal display. To do.

具体的には、真空処理装置１は基板搬送装置１１を備え、該基板搬送装置１１はキャリヤ（図１において図示略）との間で平板状の基板（図３参照）の受け渡し及び受け取りを行うようになっている。キャリヤは、搬送路１２に沿って搬送され（図１において右回り）、基板搬送装置１１から回転機構１３ａを介して予備室１４ａ、真空処理室１５，１６，１７及び予備室１４ｂの順に基板を搬送し、回転機構１３ｂ介して基板搬送装置１１まで戻って来るようになっている。予備室１４ａでは、室内を真空排気して高真空化した後にキャリヤを真空処理室１５内に搬出し、予備室１４ｂでは、室内を大気開放して大気圧化になった後に、キャリヤを搬出するようになっている。また、各真空処理室１５〜１７では、基板に加熱やスパッタリング等の真空処理が施されるようになっている。さらに、真空処理装置１は、制御装置１８を備え、該制御装置１８は、基板搬送装置１１、キャリヤ、搬送路１２、回転機構１３ａ，１３ｂ、予備室１４ａ，１４ｂ及び真空処理室１５〜１７の動作を制御するようになっている。そして、真空処理装置１は、ガラス基板製造ラインの上流側から搬送された処理前の基板に対して所定の真空処理を施し、処理後の基板をガラス基板製造ラインの下流側に搬出するようになっている。   Specifically, the vacuum processing apparatus 1 includes a substrate transfer device 11, and the substrate transfer device 11 transfers and receives a flat substrate (see FIG. 3) with a carrier (not shown in FIG. 1). It is like that. The carrier is transported along the transport path 12 (clockwise in FIG. 1), and the substrate is transferred from the substrate transport device 11 through the rotating mechanism 13a in the order of the spare chamber 14a, the vacuum processing chambers 15, 16, 17 and the spare chamber 14b. It is transported and returned to the substrate transport device 11 via the rotation mechanism 13b. In the spare chamber 14a, the inside of the chamber is evacuated to a high vacuum and then the carrier is carried out into the vacuum processing chamber 15. In the spare chamber 14b, after the chamber is opened to the atmosphere and the pressure is increased to atmospheric pressure, the carrier is carried out. It is like that. In each of the vacuum processing chambers 15 to 17, the substrate is subjected to vacuum processing such as heating and sputtering. Further, the vacuum processing apparatus 1 includes a control device 18, which controls the substrate transport device 11, the carrier, the transport path 12, the rotation mechanisms 13 a and 13 b, the spare chambers 14 a and 14 b, and the vacuum processing chambers 15 to 17. It is designed to control the operation. And the vacuum processing apparatus 1 performs predetermined vacuum processing with respect to the board | substrate before the process conveyed from the upstream of the glass substrate manufacturing line, and carries out the board | substrate after a process downstream of a glass substrate manufacturing line. It has become.

図２は基板搬送装置１１の概略構成図を示す。基板搬送装置１１は、ガラス基板製造ラインの上流側から基板を搬送する上流側コンベヤ２１から、該基板を受け取るロード用の移載機構２２を備えている。移載機構２２は搬送路１２と対向して配置されるとともに、キャリヤ２３に基板を受け渡すようになっている。なお、上流側コンベヤ２１は、ローラコンベヤにより構成されている。また、基板搬送装置１１は、搬送路１２に沿って移載機構２２と並置されるとともにテスト基板が収容されたダミーカセット２４と、搬送路１２に沿ってダミーカセット２４と並置されるとともにロード用の移載機構２２と同様に構成されたアンロード用の移載機構２５とを備えている。なお、ダミーカセット２４は、移載機構２２，２５との間にテスト基板を搬送するローラコンベヤを備えている。移載機構２５の搬送路１２の反対側には、処理後の基板を移載機構２５から受け取り、ガラス基板製造ラインの下流側に搬送する下流側コンベヤ２６が配置されている。つまり、本実施形態では、真空処理装置１は基板がロード用の移載機構２２によりキャリヤ２３に受け渡され、アンロード用の移載機構２５によりキャリヤ２３から取り外される、所謂ワンスルータイプの真空処理装置として構成されている。そして、上流側コンベヤ２１、移載機構２２、キャリヤ２３、ダミーカセット２４、移載機構２５及び下流側コンベヤ２６は、制御装置１８に接続され、その動作が制御されるようになっている。なお、下流側コンベヤ２６は、ローラコンベヤにより構成されている。また、ダミーカセット２４に収容されたテスト基板は、真空処理室１５〜１７での成膜条件を変更した場合や、装置の立ち上げ時などに、所望の成膜がなされるかを確認するため等に用いられる。   FIG. 2 is a schematic configuration diagram of the substrate transfer apparatus 11. The substrate transport apparatus 11 includes a loading transfer mechanism 22 that receives a substrate from an upstream conveyor 21 that transports the substrate from the upstream side of the glass substrate production line. The transfer mechanism 22 is arranged to face the transport path 12 and delivers the substrate to the carrier 23. The upstream conveyor 21 is configured by a roller conveyor. In addition, the substrate transport device 11 is juxtaposed with the transfer mechanism 22 along the transport path 12, and is disposed side by side with the dummy cassette 24 containing the test substrate, along with the dummy cassette 24 along the transport path 12 and for loading. And an unloading transfer mechanism 25 configured in the same manner as the transfer mechanism 22. The dummy cassette 24 includes a roller conveyor that conveys the test substrate between the transfer mechanisms 22 and 25. A downstream conveyor 26 that receives the processed substrate from the transfer mechanism 25 and transports it to the downstream side of the glass substrate production line is arranged on the opposite side of the transfer path 12 of the transfer mechanism 25. That is, in this embodiment, the vacuum processing apparatus 1 is a so-called one-through type vacuum processing in which the substrate is transferred to the carrier 23 by the loading transfer mechanism 22 and removed from the carrier 23 by the unloading transfer mechanism 25. It is configured as a device. The upstream conveyor 21, the transfer mechanism 22, the carrier 23, the dummy cassette 24, the transfer mechanism 25, and the downstream conveyor 26 are connected to the control device 18, and their operations are controlled. The downstream conveyor 26 is configured by a roller conveyor. In addition, the test substrate accommodated in the dummy cassette 24 is used to confirm whether a desired film is formed when the film forming conditions in the vacuum processing chambers 15 to 17 are changed or when the apparatus is started up. Used for etc.

図３はロード用の移載機構２２及びキャリヤ２３の概略構成を示す。なお、説明の便宜上、第１及び第２搬送部４７，４８、リフトピン５２及びアライメントピン５６については、図示を省略する。また、アンロード用の移載機構２５については、ロード用の移載機構２２と同様に構成されているため説明を省略する。移載機構２２を構成する筐体３１は、四角形状の底板３２上に複数の支持棒３３が立設されるとともに、該支持棒３３の上端に平板状の天板３４が設けられ、側面が開口した直方体状に形成されている。底板３２上に配置された駆動部３５には、支持部材３６を介してフレーム３７が天板３４の上方に位置するように設けられている。支持部材３６及びフレーム３７は、駆動部３５により水平方向（紙面垂直方向）に沿って延びる回動軸Ｌ周りに水平に倒れた状態（以下、水平状態という）と垂直に立った状態（以下、垂直状態という）との間で回動するようになっている。また、支持部材３６及びフレーム３７は、フレーム３７とキャリヤ２３とを結ぶ直線に沿った前後方向（図３において左右方向、以下ｙ方向という）及び上下方向（図３において上下方向、以下ｚ方向という）に移動するようになっている。回動軸Ｌは、支持部材３６上に配置され、回動軸Ｌを中心として反フレーム３７側が駆動部３５により回動されることで、フレーム３７が回動するようになっている。駆動部３５は、制御装置１８に接続され、フレーム３７のｙ方向及びｚ方向の移動及び回動軸Ｌを中心とした回動が制御されている。なお、駆動部３５は、例えばモータにより中空シャフトを回転させることでボールねじを直線運動させるボールねじ機構等を組み合わせて構成されている。   FIG. 3 shows a schematic configuration of the loading transfer mechanism 22 and the carrier 23. For convenience of explanation, illustration of the first and second transport units 47 and 48, the lift pin 52, and the alignment pin 56 is omitted. The unloading transfer mechanism 25 is configured in the same manner as the loading transfer mechanism 22, and thus the description thereof is omitted. The housing 31 constituting the transfer mechanism 22 has a plurality of support bars 33 erected on a rectangular bottom plate 32, and a flat top plate 34 is provided on the upper end of the support bar 33, and the side surface is It is formed in an open rectangular parallelepiped shape. A drive unit 35 disposed on the bottom plate 32 is provided with a frame 37 located above the top plate 34 via a support member 36. The support member 36 and the frame 37 are vertically tilted around the rotation axis L extending along the horizontal direction (perpendicular to the plane of the paper) by the driving unit 35 (hereinafter referred to as a horizontal state) and vertically standing (hereinafter referred to as a horizontal state). It is designed to rotate between (vertical state). Further, the support member 36 and the frame 37 have a front-rear direction (horizontal direction in FIG. 3, hereinafter referred to as y direction) and a vertical direction (in FIG. 3, vertical direction, hereinafter referred to as z direction) along a straight line connecting the frame 37 and the carrier 23. ) To move to. The rotation axis L is disposed on the support member 36, and the frame 37 is rotated by rotating the counter frame 37 side about the rotation axis L by the drive unit 35. The drive unit 35 is connected to the control device 18, and the movement of the frame 37 in the y direction and the z direction and the rotation about the rotation axis L are controlled. In addition, the drive part 35 is comprised combining the ball screw mechanism etc. which linearly move a ball screw by rotating a hollow shaft with a motor, for example.

図４に示すように、フレーム３７は、垂直に立った状態で上側に位置する上側枠４１及び下側に位置する下側枠４２と、これらの両端で該上側枠４１と該下側枠４２を連結する右側枠４３（図４において右側）及び左側枠４４（図４において左側）とからなる枠体を有している。また、本実施形態では、フレーム３７は、右側枠４３と左側枠４４と平行に配置され上側枠４１と下側枠４２とを連結する複数本（本実施形態では、４本）の棹部４５を備えて柵状に形成されている。さらに、上側枠４１、下側枠４２、右側枠及び左側枠４４には、複数の吸着パッド４６が設けられている。吸着パッド４６は、制御装置１８に接続され、基板Ｗを吸着するようになっている。   As shown in FIG. 4, the frame 37 includes an upper frame 41 positioned on the upper side and a lower frame 42 positioned on the lower side in a vertically standing state, and the upper frame 41 and the lower frame 42 at both ends thereof. And a right frame 43 (right side in FIG. 4) and a left frame 44 (left side in FIG. 4). In the present embodiment, the frame 37 is arranged in parallel with the right frame 43 and the left frame 44 and has a plurality of (four in this embodiment) flange portions 45 that connect the upper frame 41 and the lower frame 42. It is formed with a fence shape. Further, the upper frame 41, the lower frame 42, the right frame and the left frame 44 are provided with a plurality of suction pads 46. The suction pad 46 is connected to the control device 18 and sucks the substrate W.

フレーム３７上には、上流側コンベヤ２１により上側枠４１から下側枠４２（図４において上側から下側）に向かって基板Ｗが搬送されるとともに、ダミーカセット２４から左側枠４４から右側枠４３（図４において左側から右側）に向かってテスト基板が搬送されるようになっている。フレーム３７の枠体の内側には、上流側コンベヤ２１から搬送された基板Ｗを該フレーム３７上に搬送する第１搬送部４７がそれぞれ設けられるとともに、ダミーカセット２４から搬送された基板Ｗを搬送する第２搬送部４８がそれぞれ設けられている。本実施形態では、第１及び第２搬送部４７，４８によって搬送手段が構成される。第１搬送部４７は、ｙ方向（図４において上下方向）に沿って転動可能なローラがｙ方向に複数に配置され、基板をｙ方向に沿って搬送可能なローラコンベヤからなる。なお、各第１搬送部４７は、右側枠４３、棹部４５及び左側枠４４間に配置され、左右方向（図４において左右方向、以下ｘ方向という）に略等間隔となるようになっている。また、第２搬送部４８は、ｘ方向に沿って転動可能なローラがｘ方向に複数に配置され、基板をｘ方向に沿って搬送可能なローラコンベヤからなる。なお、各第２搬送部４８は、上側枠４１及び下側枠４２間に複数配置されｙ方向に略等間隔となるようになっている。   On the frame 37, the upstream conveyor 21 transports the substrate W from the upper frame 41 toward the lower frame 42 (from the upper side to the lower side in FIG. 4), and from the dummy cassette 24 to the right frame 43 from the left frame 44. The test board is transported from the left side to the right side in FIG. Inside the frame body of the frame 37, a first transport unit 47 is provided for transporting the substrate W transported from the upstream conveyor 21 onto the frame 37, and transports the substrate W transported from the dummy cassette 24. A second transport unit 48 is provided. In the present embodiment, the first and second transport units 47 and 48 constitute a transport unit. The first transport unit 47 includes a roller conveyor in which a plurality of rollers that can roll along the y direction (vertical direction in FIG. 4) are arranged in the y direction, and the substrate can be transported along the y direction. Each first transport unit 47 is disposed between the right frame 43, the collar unit 45, and the left frame 44 so as to be substantially equidistant in the left-right direction (the left-right direction in FIG. 4 and hereinafter referred to as the x direction). Yes. The second transport unit 48 includes a roller conveyor in which a plurality of rollers that can roll along the x direction are arranged in the x direction and the substrate can be transported along the x direction. Note that a plurality of the second transport sections 48 are arranged between the upper frame 41 and the lower frame 42 and are substantially equally spaced in the y direction.

さらに、図５に示すように、本実施形態では、各第１搬送部４７は筐体３１の天板３４上にそのベース４９が固定されてｚ方向に移動不能に設けられている。また、各第２搬送部４８は、筐体３１の天板３４上に固定された第１アクチュエータ５０にそのベース５１が固定されてｚ方向に移動可能に設けられている。さらに、第１搬送部４７、第２搬送部４８及び第１アクチュエータ５０は、制御装置１８に接続され、その動作が制御されるようになっている。なお、本実施形態では、第１搬送部４７は、ベース４９上に立設された柱状の支持部材に支持されるとともに、第２搬送部４８は、ベース５１上に立設された柱状の支持部材に支持されている。そして、ベース５１は、各第２搬送部４８を連結する碁盤目状に形成されるとともに、第１搬送部４７を支持する支持部材間に配置されることで、第１搬送部４７に干渉することなくｚ方向に移動可能に設けられている。また、第１アクチュエータ５０は、駆動部３５と同様に、モータやボールねじ等から構成されている。   Further, as shown in FIG. 5, in the present embodiment, each first transport portion 47 is provided on the top plate 34 of the housing 31 with its base 49 fixed and immovable in the z direction. Further, each of the second transport sections 48 is provided so that the base 51 is fixed to the first actuator 50 fixed on the top plate 34 of the housing 31 and is movable in the z direction. Furthermore, the 1st conveyance part 47, the 2nd conveyance part 48, and the 1st actuator 50 are connected to the control apparatus 18, and the operation | movement is controlled. In the present embodiment, the first transport unit 47 is supported by a columnar support member erected on the base 49, and the second transport unit 48 is erected on the base 51. It is supported by the member. The base 51 is formed in a grid shape that connects the second transport units 48 and is disposed between the support members that support the first transport unit 47, thereby interfering with the first transport unit 47. Without being moved in the z direction. Further, the first actuator 50 is configured by a motor, a ball screw or the like, like the drive unit 35.

また、図４に示すように、フレーム３７の枠体の内側には、フレーム３７上に搬送された基板Ｗを持ち上げる針状のリフトピン５２が設けられている。リフトピン５２は、隣り合うリフトピン５２との間隔が略等間隔となるように碁盤目状に配置されている。図５に示すように、各リフトピン５２は、筐体３１の天板３４上に固定された第２アクチュエータ５３にそのベース５４が固定され、各リフトピン５２がｚ方向に同時に移動可能に設けられている。また、天板３４の外周縁には第３アクチュエータ５５を介してフレーム３７の外側に配置されるアライメントピン５６が複数（本実施形態では、各辺に２個ずつ）設けられている（図４参照）。第３アクチュエータ５５は、アライメントピン５６をｚ方向及びｘ方向又はｙ方向に移動可能に構成されている。そして、上側枠４１及び下側枠４２の外側に設けられたアライメントピン５６は、ｚ方向及びｙ方向に移動可能に設けられるとともに、右側枠４３及び左側枠４４の外側に設けられたアライメントピン５６は、ｚ方向及びｘ方向に移動可能に設けられている。また、第２及び第３アクチュエータ５５は、制御装置１８に接続され、その動作が制御されるようになっている。なお、本実施形態では、リフトピン５２は、ベース５４上に支持されるとともに、ベース５４は、各アライメントピン５６を連結する碁盤目状に形成されている。そして、ベース５４は、第１搬送部４７を支持する支持部材間及び第２搬送部４８を支持する支持部材間に配置されることで、第１及び第２搬送部４７，４８に干渉することなくｚ方向に移動可能に設けられている。一方、各アライメントピン５６はそれぞれ独立に移動可能になっている。また、第２及び第３アクチュエータ５３，５５は、駆動部３５と同様に、モータやボールねじ等から構成されている。   Further, as shown in FIG. 4, needle-like lift pins 52 that lift the substrate W transported on the frame 37 are provided inside the frame body of the frame 37. The lift pins 52 are arranged in a grid pattern so that the intervals between the adjacent lift pins 52 are substantially equal. As shown in FIG. 5, each lift pin 52 has a base 54 fixed to a second actuator 53 fixed on the top plate 34 of the housing 31, and each lift pin 52 is provided so as to be simultaneously movable in the z direction. Yes. A plurality of alignment pins 56 (two in each embodiment in this embodiment) are provided on the outer peripheral edge of the top plate 34 via the third actuator 55 (in this embodiment, two on each side) (see FIG. 4). reference). The third actuator 55 is configured to be able to move the alignment pin 56 in the z direction and the x direction or the y direction. The alignment pins 56 provided outside the upper frame 41 and the lower frame 42 are provided so as to be movable in the z direction and the y direction, and are provided outside the right frame 43 and the left frame 44. Are movably provided in the z-direction and the x-direction. The second and third actuators 55 are connected to the control device 18 so that their operations are controlled. In the present embodiment, the lift pins 52 are supported on the base 54, and the base 54 is formed in a grid pattern that connects the alignment pins 56. The base 54 is disposed between the support members that support the first transport unit 47 and between the support members that support the second transport unit 48, thereby interfering with the first and second transport units 47 and 48. Without being moved in the z direction. On the other hand, each alignment pin 56 can move independently. The second and third actuators 53 and 55 are configured by a motor, a ball screw, or the like, like the drive unit 35.

図３に示すように、キャリヤ２３は、垂直状態のフレーム３７と対向するように搬送路１２を搬送されるようになっている。図６に示すように、キャリヤ２３は矩形枠状に形成されるとともに、その内周縁６１は外周縁６２よりも肉薄に形成され、移載機構２２との対向する対向面には四角枠状の凹部６３が形成されている。凹部６３の両側辺部及び下辺部には、内周縁６１の幅よりも小さい厚みに形成された基板受け６４が固着されるとともに、基板Ｗが下辺部に設けられた基板受け６４の上端面（載置面６５）上に載置されるようになっている。本実施形態では、基板Ｗは、載置面６５に載置されてキャリヤ２３内に収容されるようになっている。また、基板受け６４は、べスペル（登録商標）等の樹脂材料からなる。   As shown in FIG. 3, the carrier 23 is transported along the transport path 12 so as to face the frame 37 in the vertical state. As shown in FIG. 6, the carrier 23 is formed in a rectangular frame shape, and its inner peripheral edge 61 is thinner than the outer peripheral edge 62, and a rectangular frame shape is formed on the opposing surface facing the transfer mechanism 22. A recess 63 is formed. A substrate receiver 64 formed with a thickness smaller than the width of the inner peripheral edge 61 is fixed to both side portions and the lower side portion of the recess 63, and an upper end surface of the substrate receiver 64 provided on the lower side portion ( It is mounted on the mounting surface 65). In the present embodiment, the substrate W is placed on the placement surface 65 and accommodated in the carrier 23. The substrate receiver 64 is made of a resin material such as Vespel (registered trademark).

キャリヤ２３には、載置面６５に載置された基板Ｗを係止して、キャリヤ２３に基板Ｗを保持可能なクランプ６６が設けられている。具体的には、各クランプ６６は、キャリヤ２３の各辺における外周縁６２にその基端部が取着されるとともに、その先端部が内周端よりも内側に突出するようになっている。そして、各クランプ６６は、キャリヤ２３と平行に倒れた状態とキャリヤ２３に対して垂直に立った状態との間で回動可能に取着されている。さらに、キャリヤ２３の下部には、突起部６７が形成されている。そして、キャリヤ２３は、突起部６７が搬送路１２に設けられた挟持機構（図示略）に挟持されることで、移載機構２２とのｘ方向における位置合わせが行われるようになっている。   The carrier 23 is provided with a clamp 66 that can hold the substrate W placed on the placement surface 65 and hold the substrate W on the carrier 23. Specifically, each clamp 66 has a base end portion attached to an outer peripheral edge 62 on each side of the carrier 23, and a tip end portion projecting inward from the inner peripheral end. Each clamp 66 is attached so as to be able to rotate between a state where the clamp 66 falls parallel to the carrier 23 and a state where the clamp 66 stands perpendicular to the carrier 23. Further, a protrusion 67 is formed at the lower portion of the carrier 23. The carrier 23 is positioned in the x direction with the transfer mechanism 22 by the protrusion 67 being sandwiched by a sandwiching mechanism (not shown) provided in the transport path 12.

図３に示すように、移載機構２２とキャリヤ２３との間には、載置面６５のｚ方向における位置を検出する光電センサ６８が設けられている。位置センサとしての光電センサ６８は、制御装置１８により制御され、載置面６５の位置を該制御装置１８に出力する。なお、光電センサ６８は、複数の投光素子と受光素子とからなる光軸を直線状に配置して１ユニットとした多光軸光電センサが用いられ、投光素子から投光されてキャリヤ２３及び基板受け６４で反射した光を受光素子が受光するようになっている。そして、各受光素子の受光量の変化を検出することで、基板受け６４のｚ方向における位置変化を検出するようになっている。   As shown in FIG. 3, a photoelectric sensor 68 that detects the position of the placement surface 65 in the z direction is provided between the transfer mechanism 22 and the carrier 23. The photoelectric sensor 68 as a position sensor is controlled by the control device 18 and outputs the position of the placement surface 65 to the control device 18. The photoelectric sensor 68 is a multi-optical axis photoelectric sensor in which the optical axes composed of a plurality of light projecting elements and light receiving elements are linearly arranged to form one unit. The light receiving element receives light reflected by the substrate receiver 64. A change in the position of the substrate receiver 64 in the z direction is detected by detecting a change in the amount of light received by each light receiving element.

図７に示すように、フレーム３７に設けられた吸着パッド４６は、上側枠４１及び下側枠４２にそれぞれ１２個ずつ設けられるとともに、右側枠４３及び左側枠４４にそれぞれ５個ずつ設けられ、フレーム３７に矩形枠状に配列されている。本実施形態では、フレーム３７には、基板Ｗに対する複数の吸着領域が設定され、各吸着領域には少なくとも１つの吸着パッド４６が含まれている。吸着領域に含まれる各吸着パッド４６には、同時に負圧が供給されるとともに、各吸着領域は供給される負圧が互いに独立して制御可能に構成されている。   As shown in FIG. 7, twelve suction pads 46 provided on the frame 37 are provided on the upper frame 41 and the lower frame 42, respectively, and five suction pads 46 are provided on the right frame 43 and the left frame 44, respectively. The frames 37 are arranged in a rectangular frame shape. In the present embodiment, the frame 37 has a plurality of suction areas for the substrate W, and each suction area includes at least one suction pad 46. A negative pressure is simultaneously supplied to each suction pad 46 included in the suction region, and the negative pressure supplied to each suction region can be controlled independently of each other.

具体的には、フレーム３７には、垂直状態のフレーム３７における、上側枠４１部分（上辺部）の上側主吸着領域７１、下側枠４２部分（下辺部）の下側主吸着領域７２と、右側枠４３部分（右側辺部）の右側補吸着領域７３及び左側枠４４部分（左側辺部）の左側補吸着領域７４とが設定されている。さらに、上側主吸着領域７１は中央位置で分割されて、分割領域としての第１上側主吸着領域７５と第２上側主吸着領域７６とから構成されている。また、下側主吸着領域７２は中央位置で分割されて、分割領域としての第１下側主吸着領域７７と第２下側主吸着領域７８とから構成されている。即ち、本実施形態では、フレーム３７には６つの吸着領域が設定されている。そして、フレーム３７内には、各吸着領域に含まれる吸着パッド４６に負圧を供給するための６本の管路７９ａ〜７９ｆが延設されるとともに、各管路７９ａ〜７９ｆはフレーム３７外に配設された６つのバルブ８０ａ〜８０ｆを介して共通の負圧源８１に接続されている。これにより、吸着領域は供給される負圧が互いに独立して制御され、吸着領域毎に基板Ｗを吸着可能になっている。また、各管路７９ａ〜７９ｆには、それぞれ真空センサ８２ａ〜８２ｆが設けられ、各管路７９ａ〜７９ｆ内の圧力が計測されるようになっている。バルブ８０ａ〜８０ｆ、負圧源８１及び真空センサ８２ａ〜８２ｆは、制御装置１８に接続され、その動作が制御されるようになっている。   Specifically, the frame 37 includes an upper main suction region 71 of the upper frame 41 portion (upper side portion), a lower main suction region 72 of the lower frame 42 portion (lower side portion) of the frame 37 in a vertical state, A right supplemental adsorption region 73 in the right frame 43 part (right side part) and a left supplemental adsorption region 74 in the left frame part 44 (left side part) are set. Further, the upper main adsorption area 71 is divided at the center position, and is composed of a first upper main adsorption area 75 and a second upper main adsorption area 76 as divided areas. The lower main adsorption region 72 is divided at a central position, and is composed of a first lower main adsorption region 77 and a second lower main adsorption region 78 as divided regions. That is, in this embodiment, six suction areas are set in the frame 37. In the frame 37, six pipe lines 79 a to 79 f for supplying a negative pressure to the suction pads 46 included in each suction area are extended, and the pipe lines 79 a to 79 f are outside the frame 37. Are connected to a common negative pressure source 81 via six valves 80a to 80f arranged in the above. As a result, the negative pressure supplied to the suction region is controlled independently of each other, and the substrate W can be sucked for each suction region. In addition, vacuum sensors 82a to 82f are provided in the pipe lines 79a to 79f, respectively, and the pressures in the pipe lines 79a to 79f are measured. The valves 80a to 80f, the negative pressure source 81, and the vacuum sensors 82a to 82f are connected to the control device 18, and their operations are controlled.

なお、本実施形態では、少なくとも、第１上側主吸着領域７５及び第２上側主吸着領域７６の何れか一方と第１下側主吸着領域７７及び第２下側主吸着領域７８の何れか一方とにより基板Ｗが吸着された場合には、基板Ｗがフレーム３７から落下することなく保持可能になっている。   In the present embodiment, at least one of the first upper main adsorption region 75 and the second upper main adsorption region 76 and one of the first lower main adsorption region 77 and the second lower main adsorption region 78 are used. Thus, when the substrate W is adsorbed, the substrate W can be held without dropping from the frame 37.

図８に示すように、吸着パッド４６は、負圧が供給される出力管９１と、出力管９１の先端に取着される蛇腹状のパッド部９２と、パッド部９２の基板Ｗとの当接部に取着されるアタッチメント９３とを備えている。アタッチメント９３は、ＰＥＥＫ（ポリエーテルエーテルケトン；Poly Ether Ether Ketone）等からなる樹脂材料により形成されている。本実施形態では、吸着パッド４６は、出力管９１がその軸方向に沿って移動可能な、所謂バッファ付きの吸着パッドとして構成されている。具体的には、中空状の第１シャフト９４と、第１シャフト９４内に挿入される中空状の第２シャフト９５とを備え、第１シャフト９４の内周には径方向内側に向かってフランジ部９６が延設されている。そして、フランジ部９６と第２シャフト９５との間にコイルばね９７を介して、第２シャフト９５が第１シャフト９４内に挿入されている。このような構成により、吸着パッド４６は、フレーム３７に対して該フレーム３７と直交する方向に移動可能になっている。なお、第１シャフト９４と第２シャフト９５との間には、シール材（図示略）が介在されることで出力管９１内の気密が保たれるとともに、第１シャフト９４から第２シャフト９５が飛び出さないように構成されている。   As shown in FIG. 8, the suction pad 46 includes an output tube 91 to which negative pressure is supplied, a bellows-like pad portion 92 attached to the tip of the output tube 91, and a substrate W of the pad portion 92. And an attachment 93 attached to the contact portion. The attachment 93 is formed of a resin material made of PEEK (Poly Ether Ether Ketone) or the like. In the present embodiment, the suction pad 46 is configured as a so-called buffered suction pad in which the output tube 91 can move along its axial direction. Specifically, a hollow first shaft 94 and a hollow second shaft 95 inserted into the first shaft 94 are provided, and a flange is formed radially inward on the inner periphery of the first shaft 94. A portion 96 is extended. The second shaft 95 is inserted into the first shaft 94 via a coil spring 97 between the flange portion 96 and the second shaft 95. With this configuration, the suction pad 46 can move in a direction perpendicular to the frame 37 with respect to the frame 37. Note that a sealing material (not shown) is interposed between the first shaft 94 and the second shaft 95 so that the airtightness in the output pipe 91 is maintained, and the first shaft 94 to the second shaft 95 are maintained. Is configured not to pop out.

次に、上流側コンベヤ２１から搬送される基板Ｗのキャリヤ２３への受け渡しについて説明する。
キャリヤ２３への基板Ｗの受け渡しに先立ち、突起部６７が挟持機構に挟持されて、基板Ｗを保持していないキャリヤ２３がロード用の移載機構２２に対して位置合わせされて停止する。このとき、リフトピン５２及びアライメントピン５６は、第１搬送部４７よりも下方に位置している。なお、第２搬送部４８は、上流側コンベヤ２１から搬送される基板Ｗをキャリヤ２３へ受け渡す際には使用されず、第１搬送部４７よりも下方に位置したままであり、図９において省略する。 Next, delivery of the substrate W transferred from the upstream conveyor 21 to the carrier 23 will be described.
Prior to the transfer of the substrate W to the carrier 23, the protrusion 67 is held by the holding mechanism, and the carrier 23 not holding the substrate W is aligned with the loading transfer mechanism 22 and stopped. At this time, the lift pins 52 and the alignment pins 56 are positioned below the first transport unit 47. Note that the second transport unit 48 is not used when the substrate W transported from the upstream conveyor 21 is delivered to the carrier 23, and remains positioned below the first transport unit 47. In FIG. Omitted.

図９（ａ）に示すように、下側枠４２の外側に設けられたアライメントピン５６のみが第１搬送部４７よりも上方に突出し、上流側コンベヤ２１から基板Ｗが第１搬送部４７によってフレーム３７上に搬送される。第１搬送部４７によって搬送された基板Ｗは、下側枠４２の外側に設けられたアライメントピン５６に当接することで停止する。   As shown in FIG. 9A, only the alignment pins 56 provided outside the lower frame 42 protrude upward from the first transport unit 47, and the substrate W is moved from the upstream conveyor 21 by the first transport unit 47. It is conveyed on the frame 37. The substrate W transported by the first transport unit 47 stops when it comes into contact with the alignment pins 56 provided outside the lower frame 42.

次に、図９（ｂ）に示すように、リフトピン５２が第１搬送部４７よりも上方に上昇して基板Ｗを支持するとともに、上側枠４１側、右側枠４３及び左側枠４４の外側に設けられたアライメントピン５６が上昇する。そして、各アライメントピン５６がｘ方向又はｙ方向に移動することで、フレーム３７と基板Ｗとの相対的な位置合わせを行う。   Next, as shown in FIG. 9 (b), the lift pins 52 rise above the first transport unit 47 to support the substrate W, and to the outside of the upper frame 41 side, the right frame 43, and the left frame 44. The provided alignment pin 56 rises. Then, each alignment pin 56 moves in the x direction or the y direction, thereby performing relative alignment between the frame 37 and the substrate W.

次に、フレーム３７と基板Ｗとの相対的な位置合わせが完了すると、図９（ｃ）に示すように、フレーム３７が上昇して吸着パッド４６により基板Ｗを吸着し、リフトピン５２及びアライメントピン５６が下降する。   Next, when the relative alignment between the frame 37 and the substrate W is completed, as shown in FIG. 9C, the frame 37 is lifted to suck the substrate W by the suction pad 46, and the lift pin 52 and the alignment pin. 56 descends.

吸着パッド４６に基板Ｗを吸着する際に、制御装置１８は、基板Ｗを吸着パッド４６による吸着を開始してから所定時間経過後に、圧力が所定値以下になっていない管路７９ａ〜７９ｆのバルブ８０ａ〜８０ｆを閉じ、圧力が所定値以下になった管路が接続された吸着領域の吸着パッド４６のみで基板Ｗを吸着する。そして、制御装置１８は、少なくとも、第１上側主吸着領域７５及び第２上側主吸着領域７６の何れか一方と第１下側主吸着領域７７及び第２下側主吸着領域７８の何れか一方とにより基板Ｗが吸着された場合には、基板Ｗを保持可能と判断し、次の動作を行う。なお、制御装置１８は、基板Ｗの割れなどにより、例えば左側補吸着領域７４のみで基板Ｗが吸着された場合などには、基板Ｗを保持不能と判断して基板Ｗを取り替える。   When adsorbing the substrate W to the suction pad 46, the control device 18 uses the pipes 79a to 79f whose pressures are not lower than a predetermined value after a predetermined time has elapsed since the suction of the substrate W by the suction pad 46 was started. The valves 80a to 80f are closed, and the substrate W is adsorbed only by the adsorbing pad 46 in the adsorbing region to which the pipe line whose pressure has become a predetermined value or less is connected. Then, the control device 18 includes at least one of the first upper main adsorption region 75 and the second upper main adsorption region 76, and one of the first lower main adsorption region 77 and the second lower main adsorption region 78. When the substrate W is attracted by the above, it is determined that the substrate W can be held, and the following operation is performed. Note that the control device 18 replaces the substrate W by determining that the substrate W cannot be held, for example, when the substrate W is adsorbed only in the left supplemental adsorption region 74 due to cracking of the substrate W or the like.

次に、図９（ｄ）に示すように、フレーム３７が支持部材３６の回動軸Ｌを中心にして水平状態から垂直状態に回動する。さらに、フレーム３７が垂直状態のまま、光電センサ６８により検出された載置面６５の高さに基づいてｚ方向及びｙ方向に移動し、基板Ｗの下端が載置面６５と接触しないようにしてキャリヤ２３の凹部６３内に基板Ｗを移動させる。なお、本実施形態では、載置面６５よりも所定距離Ｈ（本実施形態では、２ｍｍ）上方となる位置に基板Ｗを移動させる。   Next, as shown in FIG. 9 (d), the frame 37 rotates from the horizontal state to the vertical state around the rotation axis L of the support member 36. Further, the frame 37 moves in the z direction and the y direction based on the height of the mounting surface 65 detected by the photoelectric sensor 68 while keeping the frame 37 in a vertical state so that the lower end of the substrate W does not come into contact with the mounting surface 65. Then, the substrate W is moved into the recess 63 of the carrier 23. In the present embodiment, the substrate W is moved to a position above the placement surface 65 by a predetermined distance H (2 mm in the present embodiment).

そして、クランプ６６がキャリヤ２３と平行になるように倒れて基板Ｗを係止した後、吸着パッド４６による真空吸着を解除すると、図９（ｅ）に示すように、基板Ｗが自然落下して基板受け６４上に載置され、キャリヤ２３に基板Ｗが受け渡される。   Then, after the clamp 66 is tilted so as to be parallel to the carrier 23 and the substrate W is locked, when the vacuum suction by the suction pad 46 is released, the substrate W naturally falls as shown in FIG. The substrate W is placed on the substrate receiver 64, and the substrate W is delivered to the carrier 23.

なお、ダミーカセット２４からテスト基板が移載機構２２上に搬送される場合には、第２搬送部４８が第１搬送部４７よりも上方に位置するとともに、右側枠４３よりも外側に位置するアライメントピン５６が第２搬送部４８よりも上方に位置した状態で、テスト基板が第２搬送部４８上に搬送される。その後、フレーム３７とテスト基板との相対的な位置合わせ等の処理は、上流側コンベヤ２１から基板Ｗが搬入された場合と同様である。   When the test substrate is transported from the dummy cassette 24 onto the transfer mechanism 22, the second transport unit 48 is positioned above the first transport unit 47 and positioned outside the right frame 43. With the alignment pins 56 positioned above the second transport unit 48, the test substrate is transported onto the second transport unit 48. Thereafter, processing such as relative alignment between the frame 37 and the test substrate is the same as the case where the substrate W is carried in from the upstream conveyor 21.

次に、真空処理された基板Ｗのキャリヤ２３からの受け取りについて説明する。なお、アンロード用の移載機構２５に、ロード用の移載機構２２と同様の符号を付して説明する。   Next, reception of the vacuum-processed substrate W from the carrier 23 will be described. The unload transfer mechanism 25 will be described with the same reference numerals as the load transfer mechanism 22.

キャリヤ２３からの基板Ｗの受け取りに先立ち、突起部６７が挟持機構に挟持されて、真空処理された基板Ｗを搬送するキャリヤ２３がアンロード用の移載機構２５に対して位置合わせされて停止する。このとき、リフトピン５２及びアライメントピン５６は、第１搬送部４７よりも下方に位置している。なお、第２搬送部４８は、下流側コンベヤ２６に基板Ｗを搬出する際には、使用されず、第１搬送部４７よりも下方に位置したままである。   Prior to receiving the substrate W from the carrier 23, the protrusion 67 is held by the holding mechanism, and the carrier 23 carrying the vacuum-processed substrate W is aligned with the transfer mechanism 25 for unloading and stopped. To do. At this time, the lift pins 52 and the alignment pins 56 are positioned below the first transport unit 47. The second transport unit 48 is not used when the substrate W is carried out to the downstream conveyor 26 and remains positioned below the first transport unit 47.

この状態で、図１０（ａ）に示すように、フレーム３７が垂直に立ち上がり、回動軸Ｌが移載機構２２とキャリヤ２３との間、且つ載置面６５よりも下側に位置した状態で基板Ｗを吸着パッド４６により吸着する。そして、クランプ６６による基板Ｗの保持が解除されると、回動軸Ｌを支点にしてフレーム３７が回動し、垂直状態から回動して基板Ｗを受け取る。   In this state, as shown in FIG. 10A, the frame 37 stands vertically and the rotation axis L is positioned between the transfer mechanism 22 and the carrier 23 and below the mounting surface 65. Thus, the substrate W is sucked by the suction pad 46. When the holding of the substrate W by the clamp 66 is released, the frame 37 rotates about the rotation axis L, and rotates from the vertical state to receive the substrate W.

吸着パッド４６に基板Ｗを吸着する際に、制御装置１８は、基板Ｗを吸着パッド４６による吸着を開始してから所定時間経過後に、圧力が所定値以下になっていない管路７９ａ〜７９ｆのバルブ８０ａ〜８０ｆを閉じ、圧力が所定値以下になった管路が接続された吸着パッド４６のみで基板Ｗを吸着する。   When adsorbing the substrate W to the suction pad 46, the control device 18 uses the pipes 79a to 79f whose pressures are not lower than a predetermined value after a predetermined time has elapsed since the suction of the substrate W by the suction pad 46 was started. The valves 80a to 80f are closed, and the substrate W is adsorbed only by the adsorbing pad 46 to which the pipe line whose pressure has become a predetermined value or less is connected.

また、基板Ｗを受け取る際に、回動軸Ｌが移載機構２２とキャリヤ２３との間、且つ載置面６５よりも下側に位置するため、フレーム３７が回動することのみで、基板Ｗの上端及び下端が矢印Ｙ１，Ｙ２で示すよう移動する。即ち、基板受け６４よりも上方且つ、基板Ｗにおける該基板Ｗが吸着される吸着面Ｗａの反対側面Ｗｂよりも吸着面Ｗａ側に移動側に移動する。   Further, when the substrate W is received, since the rotation axis L is located between the transfer mechanism 22 and the carrier 23 and below the placement surface 65, the substrate 37 is only rotated. The upper and lower ends of W move as indicated by arrows Y1 and Y2. That is, it moves to the moving side above the substrate receiver 64 and further toward the suction surface Wa side than the side surface Wb of the substrate W opposite to the suction surface Wa on which the substrate W is suctioned.

次に、図１０（ｂ）に示すように、フレーム３７が第１搬送部４７よりも上方で水平状態になり、吸着パッド４６による吸着を解除する。次に、図１０（ｃ）に示すように、リフトピン５２がフレーム３７よりも上方に上昇して基板Ｗを支持するとともに、各アライメントピン５６が基板Ｗと接触しないようにその外側に上昇する。そして、各アライメントピン５６がｘ方向又はｙ方向に移動することで、フレーム３７と基板Ｗとの相対的な位置合わせを行う。   Next, as shown in FIG. 10B, the frame 37 is in a horizontal state above the first transport unit 47, and the suction by the suction pad 46 is released. Next, as shown in FIG. 10C, the lift pins 52 are raised above the frame 37 to support the substrate W, and the alignment pins 56 are raised to the outside so as not to contact the substrate W. Then, each alignment pin 56 moves in the x direction or the y direction, thereby performing relative alignment between the frame 37 and the substrate W.

そして、図１０（ｄ）に示すように、フレーム３７、リフトピン５２及びアライメントピン５６が第１搬送部４７よりも下方に下がり、基板Ｗを第１搬送部４７上に載置する。そして、第１搬送部４７が駆動することで、基板Ｗが下流側コンベヤ２６に搬送される。   10D, the frame 37, the lift pins 52, and the alignment pins 56 are lowered below the first transport unit 47, and the substrate W is placed on the first transport unit 47. And the board | substrate W is conveyed by the downstream conveyor 26 by the 1st conveyance part 47 driving.

従って、キャリヤ２３を水平状態と垂直状態との間で回動させないため、キャリヤ２３を構成する部材を厚くしてその剛性を高くする必要がなくなり、キャリヤ２３の軽量化を図ることができる。   Accordingly, since the carrier 23 is not rotated between the horizontal state and the vertical state, it is not necessary to increase the rigidity of the member constituting the carrier 23 and increase the rigidity thereof, and the weight of the carrier 23 can be reduced.

以上記述したように、本実施形態によれば、以下の作用・効果を奏する。
（１）基板搬送装置１１は、矩形状の枠体を有し、水平方向に沿って伸び枠体と平行な回動軸Ｌに回動可能に支持されたフレーム３７と、フレーム３７に配設され基板Ｗを吸着する複数の吸着パッド４６と、フレーム３７を水平状態と垂直状態との間で回動させる駆動部３５とを有する移載機構２２と、移載機構２２を制御する制御装置１８とを備えた。そして移載機構２２は、水平状態のフレーム３７にて基板Ｗを吸着させ、フレーム３７を回動させて垂直に立った状態のキャリヤ２３に基板Ｗを収容するようにした。従って、キャリヤ２３に基板Ｗを受け渡す際に、キャリヤ２３を水平状態と垂直状態との間で回動させないため、キャリヤ２３を構成する部材を厚くしてその剛性を高くする必要がなくなり、キャリヤ２３の軽量化を図ることができる。その結果、各キャリヤ２３の製造コストの低減が可能になるとともに、キャリヤ２３を搬送する際に必要な電力を低減することが可能になり、基板Ｗの生産コストを低減できる。また、基板Ｗのみを回動させるため、従来のように基板Ｗを保持したキャリヤを回動させる場合に比べ、基板Ｗを水平に倒れた状態から垂直に立った状態にする際に必要な電力を効果的に低減でき、基板Ｗの生産コストの低減を図ることができる。 As described above, according to the present embodiment, the following operations and effects are achieved.
(1) The substrate transfer device 11 has a rectangular frame body, and is disposed on the frame 37 and a frame 37 that is rotatably supported on a rotation axis L parallel to the extending frame body along the horizontal direction. The transfer mechanism 22 having a plurality of suction pads 46 for sucking the substrate W, the drive unit 35 for rotating the frame 37 between the horizontal state and the vertical state, and the control device 18 for controlling the transfer mechanism 22. And equipped with. Then, the transfer mechanism 22 sucks the substrate W with the frame 37 in the horizontal state, and rotates the frame 37 so that the substrate W is accommodated in the carrier 23 in the vertical state. Therefore, when the substrate W is delivered to the carrier 23, the carrier 23 is not rotated between the horizontal state and the vertical state, so that it is not necessary to increase the rigidity of the member constituting the carrier 23 and increase the rigidity thereof. 23 can be reduced in weight. As a result, the manufacturing cost of each carrier 23 can be reduced, and the electric power required for transporting the carrier 23 can be reduced, so that the production cost of the substrate W can be reduced. Further, since only the substrate W is rotated, compared with the conventional case where the carrier holding the substrate W is rotated, the electric power required for changing the substrate W from the horizontally tilted state to the vertically standing state. Can be effectively reduced, and the production cost of the substrate W can be reduced.

（２）移載機構２２は、キャリヤ２３に垂直に立った状態で載置された基板Ｗを垂直状態のフレーム３７にて吸着させ、フレーム３７を回動させて垂直に立った状態のキャリヤ２３から基板Ｗを受け取るようにした。従って、キャリヤから基板を受け取る際に、キャリヤ２３を倒した状態と立った状態との間で回動させないため、キャリヤ２３を構成する部材を厚くしてその剛性を高くする必要がなくなり、キャリヤ２３を軽量化することができる。   (2) The transfer mechanism 22 sucks the substrate W placed in a vertical state on the carrier 23 by the vertical frame 37 and rotates the frame 37 to stand the vertical carrier 23. The substrate W was received from. Therefore, when the substrate is received from the carrier, the carrier 23 is not rotated between the tilted state and the standing state, so that it is not necessary to increase the rigidity of the carrier 23 by increasing the thickness of the members constituting the carrier 23. Can be reduced in weight.

（３）水平状態のフレーム３７の枠体の内側に配置され上流側コンベヤ２１から水平に倒れた状態で搬送される基板Ｗを受け取り、フレーム３７上に搬送する第１搬送部４７を備えた。そのため、従来のように、搬送ロボットが外部から搬送された処理前の基板Ｗを取り込んでフレーム３７上に搬送する場合に比べ、搬送ロボットを配置するスペースが必要なくなり、省スペース化できる。   (3) A first transport unit 47 is provided which receives the substrate W which is disposed inside the frame body of the frame 37 in the horizontal state and is transported in a state of being tilted horizontally from the upstream conveyor 21 and transports the substrate W onto the frame 37. Therefore, as compared with the conventional case where the transfer robot takes in the unprocessed substrate W transferred from the outside and transfers it onto the frame 37, a space for arranging the transfer robot is not required, and the space can be saved.

（４）制御装置１８は、吸着パッド４６による基板Ｗの吸着開始後、所定時間内に管路７９ａ〜７９ｆ内の圧力が所定値以下にならない場合には、該管路に設けられたバルブ８０ａ〜８０ｆを閉じるようした。従って、基板Ｗの撓みや基板Ｗの破損に起因して基板に密着できない吸着パッド４６がある吸着領域があっても、各吸着パッド４６が基板Ｗに密着した吸着領域では基板を吸着することができる。そのため、基板Ｗの撓みが大きい場合などに、基板Ｗの一部を吸着できないために、基板Ｗ全体がフレーム３７上に保持できなくなることを低減できる。   (4) When the pressure in the pipe lines 79a to 79f does not become a predetermined value or less within a predetermined time after the suction of the substrate W by the suction pad 46 is started, the control device 18 controls the valve 80a provided in the pipe line. ~ 80f was closed. Therefore, even if there is a suction area where there is a suction pad 46 that cannot be brought into close contact with the substrate due to bending of the substrate W or damage to the substrate W, the suction area where each suction pad 46 is in close contact with the substrate W can suck the substrate. it can. Therefore, it is possible to reduce a situation where the entire substrate W cannot be held on the frame 37 because a part of the substrate W cannot be adsorbed when the substrate W is largely bent.

（５）吸着パッド４６をフレーム３７に矩形枠状に配列したため、基板Ｗの外周縁が吸着され該基板Ｗの撓みを低減できるとともに、例えばフレーム３７に碁盤目状に吸着パッド４６を設ける場合に比べ、吸着パッド４６の数を削減できる。この場合、フレーム３７が垂直状態になると、上側枠４１及び下側枠４２に基板Ｗの重量の大部分が作用し、上側枠４１及び下側枠４２（上側主吸着領域７１及び下側主吸着領域７２）に設けられた吸着パッド４６により基板Ｗが吸着されフレーム３７上に保持される。そのため、基板Ｗの撓みが大きい場合等に上側主吸着領域７１及び下側主吸着領域７２に設けられた吸着パッド４６が基板Ｗを吸着できないと、フレーム３７上に基板Ｗを保持することが困難になる。この点、本実施形態では、吸着パッド４６は、フレーム３７上に設けられ、フレーム３７には、上側主吸着領域７１、下側主吸着領域７２、右側補吸着領域７３、左側補吸着領域７４とからなる吸着領域が形成されている。さらに、上側主吸着領域７１は、第１上側主吸着領域７５と第２上側主吸着領域７６とから構成されるとともに、下側主吸着領域７２は、第１下側主吸着領域７７と第２下側主吸着領域７８とから構成されている。そのため、例えば第１上側主吸着領域７５で基板Ｗを吸着できなくとも、第２上側主吸着領域７６で基板Ｗを吸着できる場合には、フレーム３７上に基板Ｗを保持することが可能になる。そのため、吸着パッド４６の数を削減できるとともに、基板Ｗの撓みが大きい場合などに、基板のＷ一部を吸着できないために、基板Ｗ全体がフレーム３７上に基板を保持できなくなることをさらに低減できる。   (5) Since the suction pads 46 are arranged in a rectangular frame shape on the frame 37, the outer peripheral edge of the substrate W can be sucked to reduce the bending of the substrate W. For example, when the suction pads 46 are provided on the frame 37 in a grid pattern In comparison, the number of suction pads 46 can be reduced. In this case, when the frame 37 is in the vertical state, most of the weight of the substrate W acts on the upper frame 41 and the lower frame 42, and the upper frame 41 and the lower frame 42 (the upper main suction region 71 and the lower main suction). The substrate W is sucked and held on the frame 37 by the suction pad 46 provided in the region 72). Therefore, it is difficult to hold the substrate W on the frame 37 if the suction pads 46 provided in the upper main suction region 71 and the lower main suction region 72 cannot suck the substrate W when the substrate W is largely bent. become. In this regard, in the present embodiment, the suction pad 46 is provided on the frame 37, and the frame 37 includes an upper main suction region 71, a lower main suction region 72, a right side supplemental suction region 73, and a left side supplemental suction region 74. An adsorption region made of is formed. Further, the upper main adsorption area 71 is composed of a first upper main adsorption area 75 and a second upper main adsorption area 76, and the lower main adsorption area 72 is composed of the first lower main adsorption area 77 and the second main adsorption area 77. The lower main adsorption region 78 is constituted. Therefore, for example, even if the substrate W cannot be adsorbed in the first upper main adsorption region 75, the substrate W can be held on the frame 37 if the substrate W can be adsorbed in the second upper main adsorption region 76. . Therefore, it is possible to reduce the number of suction pads 46 and further reduce that the entire substrate W cannot hold the substrate on the frame 37 because a part of the substrate W cannot be sucked when the deflection of the substrate W is large. it can.

（６）回動軸Ｌが移載機構２２とキャリヤ２３との間、且つ載置面６５よりも下側に位置した状態でフレーム３７にてＷ基板を吸着させ、フレーム３７を回動させて垂直に立った状態のキャリヤ２３から基板Ｗを受け取るようにした。そのため、フレーム３７を回動させるのみで、フレーム３７が載置面６５よりも上方に移動すると同時に、反対側面Ｗｂよりも吸着面Ｗａ側に移動側に移動する。従って、フレーム３７を載置面６５よりも上方に移動させると同時に、反対側面Ｗｂよりも吸着面Ｗａ側に移動させるといった複雑な制御を行わずとも、基板Ｗが載置面６５等に接触して破損することを防止できる。   (6) With the rotation axis L positioned between the transfer mechanism 22 and the carrier 23 and below the placement surface 65, the W substrate is attracted by the frame 37, and the frame 37 is rotated. The substrate W is received from the carrier 23 in a vertically standing state. Therefore, only by rotating the frame 37, the frame 37 moves upward from the placement surface 65, and at the same time, moves from the opposite side Wb to the suction surface Wa side toward the moving side. Therefore, the substrate W is brought into contact with the mounting surface 65 and the like without performing complicated control such as moving the frame 37 above the mounting surface 65 and simultaneously moving the frame 37 to the suction surface Wa side from the opposite side surface Wb. Can be prevented.

（７）フレーム３７が垂直に立った状態のまま、光電センサ６８により検出された載置面６５の位置に基づいてｚ方向及びｙ方向に移動し、基板Ｗの下端が載置面６５と接触しないようにしてキャリヤ２３の凹部６３内に基板Ｗを移動させるようにした。そのため、光電センサ６８の検出結果に基づいてフレーム３７を上下方向に移動させ、基板Ｗの下端が載置面６５と接触しないようにする。そのため、均質な薄膜を形成する等の目的から基板Ｗが加熱され、キャリヤ２３が熱膨張して載置面６５の高さが異なる場合であっても、基板Ｗを破損させることなくキャリヤ２３に受け渡すことができる。   (7) The frame 37 moves in the z direction and the y direction based on the position of the mounting surface 65 detected by the photoelectric sensor 68 while the frame 37 is standing vertically, and the lower end of the substrate W contacts the mounting surface 65. Thus, the substrate W is moved into the recess 63 of the carrier 23. Therefore, the frame 37 is moved in the vertical direction based on the detection result of the photoelectric sensor 68 so that the lower end of the substrate W does not come into contact with the placement surface 65. Therefore, even when the substrate W is heated for the purpose of forming a homogeneous thin film and the carrier 23 is thermally expanded and the height of the mounting surface 65 is different, the substrate 23 is not damaged. Can be handed over.

なお、本実施形態は、以下の態様で実施してもよい。
・本実施形態では、第１搬送部４７、第２搬送部４８及びリフトピン５２をフレームの枠体の内側のみに配置したが、これに限らず、基板Ｗの大きさに応じてフレーム３７の外側に第１搬送部４７、第２搬送部４８及びリフトピン５２をフレーム３７の外側に配置してもよい。これにより、基板Ｗの大きさがフレーム３７よりも大きくなった場合でも、確実にフレーム３７上に搬送することができる。 In addition, you may implement this embodiment in the following aspects.
In the present embodiment, the first transport unit 47, the second transport unit 48, and the lift pins 52 are disposed only inside the frame body of the frame. However, the present invention is not limited thereto, and the outside of the frame 37 according to the size of the substrate W. In addition, the first transport unit 47, the second transport unit 48, and the lift pin 52 may be disposed outside the frame 37. Thereby, even when the size of the substrate W is larger than that of the frame 37, the substrate W can be reliably transferred onto the frame 37.

・本実施形態では、第１搬送部４７を、ベース４９上に立設された柱状の支持部材にて支持するとともに、第２搬送部４８を、ベース５１上に立設された柱状の支持部材にて支持した。そして、ベース５１を、各第２搬送部４８を連結する碁盤目状に形成するとともに、第１搬送部４７を支持する支持部材間に配置することで、第１搬送部４７に干渉することなくｚ方向に移動可能に設けた。しかし、これに限らず、第１搬送部４７に干渉することなくｚ方向に移動可能であれば、どのように第２搬送部４８を設けてもよく、例えば各第２搬送部４８をそれぞれ個別のアクチュエータでｚ方向に移動させるようにしてもよい。同様に、リフトピン５２をベース５４上に支持せず、第１及び第２搬送部４７，４８に干渉することなくｚ方向に移動可能であれば、どのように設けてもよい。   -In this embodiment, while supporting the 1st conveyance part 47 with the column-shaped support member erected on the base 49, the 2nd conveyance part 48 is the column-shaped support member erected on the base 51 Supported by. And while forming the base 51 in the grid shape which connects each 2nd conveyance part 48, it arrange | positions between the supporting members which support the 1st conveyance part 47, without interfering with the 1st conveyance part 47. It was provided so as to be movable in the z direction. However, the present invention is not limited to this, and the second transport unit 48 may be provided in any way as long as it can move in the z direction without interfering with the first transport unit 47. For example, each second transport unit 48 is individually provided. The actuator may be moved in the z direction. Similarly, as long as the lift pin 52 is not supported on the base 54 and can be moved in the z direction without interfering with the first and second transport units 47 and 48, the lift pin 52 may be provided in any manner.

・本実施形態では、第１及び第２搬送部４７，４８をローラコンベヤにより構成したが、これに限らず、例えばベルトコンベヤにより構成してもよい。
・本実施形態では、吸着パッド４６に負圧を供給することで、基板Ｗを真空吸着したが、これに限らず、フレーム３７に静電チャックを設け、静電吸着により基板Ｗを吸着してもよい。 -In this embodiment, although the 1st and 2nd conveyance parts 47 and 48 were comprised by the roller conveyor, you may comprise not only this but a belt conveyor, for example.
In the present embodiment, the substrate W is vacuum-sucked by supplying a negative pressure to the suction pad 46. However, the present invention is not limited to this, and an electrostatic chuck is provided on the frame 37 to suck the substrate W by electrostatic suction. Also good.

・本実施形態では、管路７９ａ〜７９ｆを共通の負圧源８１に接続し、吸着開始してから所定時間経過後に、圧力が所定値以下になっていない管路７９ａ〜７９ｆのバルブ８０ａ〜８０ｆを閉じるようにしたが、これに限らず、各管路７９ａ〜７９ｆをそれぞれ個別の負圧源に接続してもよい。   In this embodiment, the pipe lines 79a to 79f are connected to the common negative pressure source 81, and after a predetermined time has elapsed since the start of adsorption, the valves 80a to 79f of the pipe lines 79a to 79f whose pressures are not less than or equal to a predetermined value. Although 80f was closed, not only this but each pipe line 79a-79f may be connected to each separate negative pressure source.

・本実施形態では、吸着パッド４６を、上側枠４１及び下側枠４２にそれぞれ１２個ずつ設けるとともに、右側枠４３及び左側枠４４にそれぞれ５個ずつ設け、フレーム３７に矩形枠状に配列したが、これに限らず、棹部４５に設け碁盤目状に配列してもよい。   In the present embodiment, twelve suction pads 46 are provided on each of the upper frame 41 and the lower frame 42, and five suction pads 46 are provided on each of the right frame 43 and the left frame 44, and arranged in a rectangular frame shape on the frame 37. However, the present invention is not limited to this, and it may be provided in the collar portion 45 and arranged in a grid pattern.

・本実施形態では、フレーム３７を右側枠４３と左側枠４４と平行に配置され上側枠４１と下側枠４２とを連結する複数本の棹部４５を備えて柵状に形成したが、これに限らず、棹部４５の代わりにＰＥＥＫをコーティングしたワイヤを用いてもよい。これにより、棹部４５を用いる場合に比べフレームを軽量化できる。   In the present embodiment, the frame 37 is provided in parallel with the right frame 43 and the left frame 44 and includes a plurality of flange portions 45 that connect the upper frame 41 and the lower frame 42. However, the wire coated with PEEK may be used instead of the flange 45. Thereby, compared with the case where the collar part 45 is used, a frame can be reduced in weight.

・本実施形態では、フレーム３７により基板Ｗをキャリヤ２３の凹部６３内に移動させる際に、光電センサ６８により検出された載置面６５の高さに基づいてフレーム３７を移動させたが、これに限らない。例えば、フレーム３７とキャリヤ２３とのｚ方向の相対位置は変化させず、アライメントピン５６によりフレーム３７と基板Ｗとの位置合わせを行う際に、光電センサ６８により検出された載置面６５の高さに基づいてその位置合わせを行うようにしてもよい。   In the present embodiment, when the substrate 37 is moved into the recess 63 of the carrier 23 by the frame 37, the frame 37 is moved based on the height of the mounting surface 65 detected by the photoelectric sensor 68. Not limited to. For example, the relative position in the z direction between the frame 37 and the carrier 23 is not changed, and when the alignment between the frame 37 and the substrate W is performed by the alignment pin 56, the height of the mounting surface 65 detected by the photoelectric sensor 68 is increased. The alignment may be performed based on the above.

・本実施形態では、光電センサ６８により載置面６５の高さを直接検出したが、これに限らず、キャリヤ２３の温度を計測する温度センサを設け、検出された温度に応じて熱膨張による載置面６５の位置を推定するようにしてもよい。   -In this embodiment, although the height of the mounting surface 65 was directly detected by the photoelectric sensor 68, it is not restricted to this, The temperature sensor which measures the temperature of the carrier 23 is provided, and it depends on thermal expansion according to the detected temperature. The position of the mounting surface 65 may be estimated.

・本実施形態では、フレーム３７に、第１上側主吸着領域７５、第２上側主吸着領域７６、第１下側主吸着領域７７第２下側主吸着領域７８、右側補吸着領域７３及び左側補吸着領域７４からなる６つの吸着領域を形成したが、これに限らず、吸着領域はどのように形成してもよい。   In the present embodiment, the frame 37 includes the first upper main adsorption region 75, the second upper main adsorption region 76, the first lower main adsorption region 77, the second lower main adsorption region 78, the right supplementary adsorption region 73, and the left side. Although six adsorption regions composed of the complementary adsorption regions 74 are formed, the present invention is not limited to this, and the adsorption regions may be formed in any manner.

・本実施形態では、基板搬送装置１１は、ダミーカセット２４を備えたが、これに限らず、ダミーカセット２４を備えなくてもよい。
・本実施形態では、真空処理装置１はロード用の移載機構２２とアンロード用の移載機構２２と備え、所謂ワンスルータイプの真空処理装置として構成されたが、これに限らず、１つの移載機構によってキャリヤ２３との間の基板Ｗの受け渡し及び受け取りを行う、所謂リターンタイプの真空処理装置として構成してもよい。 In the present embodiment, the substrate transport apparatus 11 includes the dummy cassette 24, but is not limited thereto, and the dummy cassette 24 may not be included.
In the present embodiment, the vacuum processing apparatus 1 includes the loading transfer mechanism 22 and the unloading transfer mechanism 22 and is configured as a so-called one-through type vacuum processing apparatus. You may comprise as what is called a return type vacuum processing apparatus which delivers and receives the board | substrate W between the carriers 23 with a transfer mechanism.

上記実施形態から把握できる技術的思想を以下に記載する。
（イ）平板状の基板を垂直に立てた状態で搬送するキャリヤに水平に倒れた状態で搬送される基板を受け渡す基板搬送装置であって、矩形状の枠体を有し、水平方向に沿って伸び前記枠体と平行な回動軸に回動可能に支持されたフレームと、前記フレームに配設され前記基板を吸着する複数の吸着パッドと、前記フレームを、水平状態と垂直状態との間で回動させる駆動部と、を有し、水平状態の前記フレームにて前記基板を吸着させ、前記フレームを回動させて垂直に立った状態の前記キャリヤに前記基板を収容する移載機構を備えたことを特徴とする基板搬送装置。 The technical idea that can be grasped from the above embodiment will be described below.
(A) A substrate transport device that delivers a substrate transported in a state where it is tilted horizontally to a carrier that transports a flat substrate in a vertically standing state, and has a rectangular frame body in the horizontal direction. A frame that extends along the frame and is rotatably supported by a rotation shaft that is parallel to the frame body, a plurality of suction pads that are disposed on the frame and suck the substrate, and the frame includes a horizontal state and a vertical state. A transfer unit that holds the substrate in the carrier in a state of being vertically held by adsorbing the substrate by the frame in a horizontal state and rotating the frame. A substrate transfer apparatus comprising a mechanism.

真空処理装置の概略構成図。The schematic block diagram of a vacuum processing apparatus. 基板搬送装置の概略構成図。The schematic block diagram of a board | substrate conveyance apparatus. 移載機構の概略構成を示す右側面図。The right view which shows schematic structure of a transfer mechanism. 移載機構の概略構成を示す平面図。The top view which shows schematic structure of a transfer mechanism. 移載機構の概略構成を示す正面図。The front view which shows schematic structure of a transfer mechanism. キャリヤの概略構成を示す正面図。The front view which shows schematic structure of a carrier. フレーム上に形成された吸着領域を示す模式図。The schematic diagram which shows the adsorption | suction area | region formed on the flame | frame. 吸着パッドの概略構成を示す断面図。Sectional drawing which shows schematic structure of a suction pad. （ａ）〜（ｅ）キャリヤへ基板を受け渡す動作を示す動作説明図。(A)-(e) Operation | movement explanatory drawing which shows the operation | movement which delivers a board | substrate to a carrier. （ａ）〜（ｄ）キャリヤから基板を受け取る動作を示す動作説明図。(A)-(d) Operation | movement explanatory drawing which shows the operation | movement which receives a board | substrate from a carrier.

符号の説明Explanation of symbols

１…真空処理装置、１１…基板搬送装置、１５〜１７…真空処理室、１８…制御装置、２２，２５…移載機構、２３…キャリヤ、３５…駆動部、３７…フレーム、４１…上側枠、４２…下側枠、４３…右側枠、４４…左側枠、４６…吸着パッド、６５…載置面、７１…上側主吸着領域、７２…下側主吸着領域、７３…右側補吸着領域、７４…左側補吸着領域、７５…第１上側主吸着領域、７６…第２上側主吸着領域、７７…第１下側主吸着領域、７８…第２下側主吸着領域、７９ａ〜７９ｆ…管路、８０ａ〜８０ｆ…バルブ、８１…負圧源、８２ａ〜８２ｆ…真空センサ、Ｌ…回動軸、Ｗ…基板。   DESCRIPTION OF SYMBOLS 1 ... Vacuum processing apparatus, 11 ... Substrate conveyance apparatus, 15-17 ... Vacuum processing chamber, 18 ... Control apparatus, 22, 25 ... Transfer mechanism, 23 ... Carrier, 35 ... Drive part, 37 ... Frame, 41 ... Upper frame 42 ... lower side frame, 43 ... right side frame, 44 ... left side frame, 46 ... suction pad, 65 ... placement surface, 71 ... upper main suction region, 72 ... lower main suction region, 73 ... right side supplemental suction region, 74 ... Left side complementary adsorption region, 75 ... First upper main adsorption region, 76 ... Second upper main adsorption region, 77 ... First lower main adsorption region, 78 ... Second lower main adsorption region, 79a-79f ... Tube Road, 80a-80f ... valve, 81 ... negative pressure source, 82a-82f ... vacuum sensor, L ... rotating shaft, W ... substrate.

Claims (14)

平板状の基板を垂直に立てた状態で搬送するキャリヤに、水平に倒れた状態で搬送される基板を受け渡す基板搬送装置であって、
矩形状の枠体を有し、水平方向に沿って伸び前記枠体と平行な回動軸に回動可能に支持されたフレームと、
前記フレームに配設され前記基板を吸着する複数の吸着パッドと、
前記フレームを、水平状態と垂直状態との間で回動させる駆動部と、を有する移載機構と、
前記移載機構を制御する制御装置と、を備え、
前記移載機構は、水平状態の前記フレームにて前記基板を吸着させ、前記フレームを回動させて垂直に立った状態の前記キャリヤに前記基板を収容する、
ことを特徴とする基板搬送装置。 A substrate transport device that delivers a substrate transported in a state of falling horizontally to a carrier that transports a flat substrate in a vertically standing state,
A frame having a rectangular frame and extending along a horizontal direction and rotatably supported by a rotation axis parallel to the frame;
A plurality of suction pads disposed on the frame for sucking the substrate;
A transfer mechanism having a drive unit that rotates the frame between a horizontal state and a vertical state;
A control device for controlling the transfer mechanism,
The transfer mechanism sucks the substrate with the frame in a horizontal state, and rotates the frame to accommodate the substrate in the carrier in a vertical state.
A substrate transfer apparatus. 前記移載機構は、前記キャリヤに垂直に立った状態で載置された前記基板を垂直状態の前記フレームにて吸着させ、前記フレームを回動させて垂直に立った状態の前記キャリヤから前記基板を受け取る、
ことを特徴とする請求項１に記載の基板搬送装置。 The transfer mechanism is configured to adsorb the substrate placed in a vertical state on the carrier by the frame in a vertical state and rotate the frame to turn the frame from the carrier in a vertical state to the substrate. Receive
The substrate transfer apparatus according to claim 1. 前記枠体の内側に配置され、外部から倒れた状態で搬送される前記基板を受け取り前記フレーム上に搬送する搬送部を備え、
前記駆動部は、前記フレームを上下方向に移動可能に構成され、
前記移載機構は、前記基板が搬送される際に、該基板が搬送される搬送ラインよりも下方に前記フレームを移動させ、
前記フレームを前記搬送ラインよりも上方に移動させて前記基板を吸着させ、前記フレームを回動させて垂直に立った状態の前記キャリヤに前記基板を収容する、
ことを特徴とする請求項１又は２に記載の基板搬送装置。 It is arranged inside the frame, and includes a transport unit that receives the substrate transported in a state of falling from the outside and transports the substrate onto the frame,
The drive unit is configured to be able to move the frame up and down,
When the substrate is transported, the transfer mechanism moves the frame below a transport line on which the substrate is transported,
Moving the frame above the transfer line to adsorb the substrate, and rotating the frame to accommodate the substrate in the carrier in a vertical position;
The substrate transfer apparatus according to claim 1, wherein: 前記フレームには、前記基板に対する複数の吸着領域が設定されるとともに、前記各吸着領域には少なくとも１つの吸着パッドが含まれ、
前記各吸着領域に含まれる前記吸着パッドには同時に負圧が供給され、前記各吸着領域は供給される負圧が互いに独立して制御可能に構成されてなる、
ことを特徴とする請求項１〜３のうちの何れか一項に記載の基板搬送装置。 The frame includes a plurality of suction areas for the substrate, and each suction area includes at least one suction pad;
A negative pressure is simultaneously supplied to the suction pads included in each suction region, and each suction region is configured such that the negative pressure supplied can be controlled independently of each other.
The board | substrate conveyance apparatus as described in any one of Claims 1-3 characterized by the above-mentioned. 前記吸着領域毎に前記吸着パッドに負圧を供給する管路と
前記各管路が接続される共通の負圧源と、
前記各管路を開閉するバルブと、
前記各管路内の圧力を測定する真空センサと、を備え、
前記制御装置は、前記吸着パッドによる前記基板の吸着開始後、所定時間内に前記管路内の圧力が所定値以下にならない場合には、該管路を閉じるように前記バルブを制御することを特徴とする請求項４に記載の基板搬送装置。 A pipe for supplying negative pressure to the suction pad for each suction area; a common negative pressure source to which the pipes are connected;
A valve for opening and closing each pipe line;
A vacuum sensor for measuring the pressure in each of the pipes,
The control device controls the valve so as to close the pipe line when the pressure in the pipe line does not become a predetermined value or less within a predetermined time after the suction of the substrate by the suction pad is started. The board | substrate conveyance apparatus of Claim 4 characterized by the above-mentioned. 前記吸着パッドは、前記フレームに矩形枠状に配列され、
前記吸着領域は、垂直状態の前記フレームにおける、上辺部の上側主吸着領域と、下辺部の下側主吸着領域と、右側辺部の右側補吸着領域と、左側辺部の左側補吸着領域とを備え、
前記上側主吸着領域及び下側主吸着領域は、それぞれ少なくとも２つ以上の分割領域とから構成された、
ことを特徴とする請求項４又は５に記載の基板搬送装置。 The suction pads are arranged in a rectangular frame shape on the frame,
The suction region includes an upper main suction region on the upper side, a lower main suction region on the lower side, a right supplemental suction region on the right side, and a left supplemental suction region on the left side in the vertical frame. With
Each of the upper main adsorption region and the lower main adsorption region is composed of at least two or more divided regions,
The substrate transfer apparatus according to claim 4 or 5, wherein 前記駆動部は、前記フレームを上下方向、及び前記移載機構と前記キャリヤとを結ぶ直線に沿った前後方向に移動可能に構成され、
前記移載機構は、前記フレームが前記キャリヤに収容された前記基板を受け取る際に、前記フレームの回動軸が前記移載機構と前記キャリヤとの間、且つ前記キャリヤにおける前記基板の下端が載置される載置面よりも下側に位置した状態で、前記フレームにて前記基板を吸着させ、前記フレームを回動させて垂直に立った状態の前記キャリヤから前記基板を受け取る、
ことを特徴とする請求項２〜６のうちの何れか一項に記載の基板搬送装置。 The drive unit is configured to be movable in the vertical direction of the frame and in the front-rear direction along a straight line connecting the transfer mechanism and the carrier,
In the transfer mechanism, when the frame receives the substrate accommodated in the carrier, the rotation shaft of the frame is placed between the transfer mechanism and the carrier, and the lower end of the substrate in the carrier is loaded. The substrate is sucked by the frame in a state of being positioned below the placement surface to be placed, and the substrate is received from the carrier in a state where the frame is rotated to stand vertically.
The board | substrate conveyance apparatus as described in any one of Claims 2-6 characterized by the above-mentioned. 前記キャリヤにおける前記基板の下端が載置される載置面の高さを検出する位置センサを備え、
前記駆動部は、前記フレームを上下方向に移動可能に構成され、
前記移載機構は、前記基板を前記キャリヤに収容する際に、前記位置センサの検出結果に基づき前記フレームを上下方向に移動させ、前記基板の下端が前記載置面と接触しないようにする、
ことを特徴とする請求項１〜７のうちの何れか一項に記載の基板搬送装置。 A position sensor for detecting a height of a mounting surface on which the lower end of the substrate in the carrier is mounted;
The drive unit is configured to be able to move the frame up and down,
The transfer mechanism moves the frame in the vertical direction based on the detection result of the position sensor when the substrate is accommodated in the carrier so that the lower end of the substrate does not come into contact with the mounting surface.
The board | substrate conveyance apparatus as described in any one of Claims 1-7 characterized by the above-mentioned. 平板状の基板を垂直に立てた状態で搬送するキャリヤに、水平に倒れた状態で搬送される前記基板を受け渡す基板搬送方法であって、
前記基板を吸着する吸着パッドを備える水平状態のフレームにて前記基板を吸着し、前記フレームを回動して垂直に立った状態の前記キャリヤに前記基板を収容することを特徴とする基板搬送方法。 A substrate transport method for delivering a substrate that is transported in a state of being tilted horizontally to a carrier that transports a flat substrate in a vertically standing state,
A substrate transfer method comprising: adsorbing the substrate by a horizontal frame having an adsorption pad for adsorbing the substrate; and rotating the frame to accommodate the substrate in a vertical position. . 前記キャリヤに垂直に立った状態で載置された前記基板を垂直状態の前記フレームにて吸着し、前記フレームを回動して前記キャリヤから前記基板を受け取ることを特徴とする請求項９に記載の基板搬送方法。   10. The substrate according to claim 9, wherein the substrate placed in a vertical position on the carrier is adsorbed by the frame in a vertical state, and the frame is rotated to receive the substrate from the carrier. Substrate transfer method. 前記基板を吸着する際に、前記吸着パッドによる前記基板の吸着開始後、所定時間内に、前記フレームに設定され少なくとも１つの吸着パッドを含む複数の吸着領域毎に設けられた管路内の圧力が所定値以下にならない場合には、該管路に設けられたバルブを閉じるようにしたことを特徴とする請求項９又は１０に記載の基板搬送方法。   When adsorbing the substrate, the pressure in the pipe line provided for each of a plurality of adsorption regions set in the frame and including at least one adsorption pad within a predetermined time after the adsorption of the substrate by the adsorption pad is started. 11. The substrate transfer method according to claim 9, wherein a valve provided in the pipe line is closed when the value does not fall below a predetermined value. 前記フレームが前記キャリヤに収容された前記基板を受け取る際に、前記フレームの回動軸が該フレームを有する移載機構と前記キャリヤとの間、且つ前記キャリヤにおける前記基板の下端が載置される載置面よりも下側に位置した状態で、前記フレームにて前記基板を吸着し、前記フレームを回動して前記キャリヤから前記基板を受け取るようにしたことを特徴とする請求項１０又は１１に記載の基板搬送方法。   When the frame receives the substrate accommodated in the carrier, the pivot shaft of the frame is placed between the transfer mechanism having the frame and the carrier, and the lower end of the substrate in the carrier is placed. 12. The substrate according to claim 10, wherein the substrate is sucked by the frame in a state of being located below the mounting surface, and the frame is rotated to receive the substrate from the carrier. The board | substrate conveyance method as described in. 前記基板を前記キャリヤに収容する際に、前記キャリヤにおける前記基板の下端が載置される載置面の上下方向における高さを検出し、検出結果に基づき前記フレームを上下方向に移動して、前記基板の下端が前記載置面と接触しないようにしたことを特徴とする請求項９〜１２のうちの何れか一項に記載の基板搬送方法。   When the substrate is accommodated in the carrier, the height in the vertical direction of the mounting surface on which the lower end of the substrate in the carrier is mounted is detected, the frame is moved in the vertical direction based on the detection result, The substrate transfer method according to any one of claims 9 to 12, wherein a lower end of the substrate does not contact the mounting surface. 平板状の基板を真空処理する真空処理室と、前記真空処理室に前記基板を垂直に立てた状態で搬送するキャリヤと、前記キャリヤに水平に倒れた状態で搬送される前記基板を受け渡す基板搬送装置を備えた真空処理装置であって、
前記基板搬送装置は、
矩形状の枠体を有し、水平方向に沿って伸び前記枠体と平行な回動軸に回動可能に支持されたフレームと、
前記フレームに矩形枠状に配設され前記基板を吸着する複数の吸着パッドと、
前記フレームを、水平状態と垂直状態との間で回動させる駆動部と、
前記駆動部及び前記各吸着パッドを制御する制御装置と、を有する移載機構を備え、
前記移載機構は、水平状態の前記フレームにて前記基板を吸着させ、前記フレームを回動させて垂直に立った状態の前記キャリヤに前記基板を収容する、
ことを特徴とする真空処理装置。 A vacuum processing chamber for vacuum processing a flat substrate, a carrier for transporting the substrate vertically in the vacuum processing chamber, and a substrate for delivering the substrate transported in a state of falling horizontally on the carrier A vacuum processing apparatus provided with a transfer device,
The substrate transfer device includes:
A frame having a rectangular frame and extending along a horizontal direction and rotatably supported by a rotation axis parallel to the frame;
A plurality of suction pads that are disposed in a rectangular frame shape on the frame and suck the substrate;
A drive unit for rotating the frame between a horizontal state and a vertical state;
A transfer mechanism having a control device for controlling the drive unit and the suction pads,
The transfer mechanism sucks the substrate with the frame in a horizontal state, and rotates the frame to accommodate the substrate in the carrier in a vertical state.
A vacuum processing apparatus characterized by that.
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