CN117568757A - Sputtering coating equipment and method for processing metal film ceramic substrate - Google Patents
Sputtering coating equipment and method for processing metal film ceramic substrate Download PDFInfo
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- CN117568757A CN117568757A CN202311261524.1A CN202311261524A CN117568757A CN 117568757 A CN117568757 A CN 117568757A CN 202311261524 A CN202311261524 A CN 202311261524A CN 117568757 A CN117568757 A CN 117568757A
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- belt conveyor
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- 239000000758 substrate Substances 0.000 title claims abstract description 265
- 238000004544 sputter deposition Methods 0.000 title claims abstract description 72
- 238000000576 coating method Methods 0.000 title claims abstract description 59
- 239000011248 coating agent Substances 0.000 title claims abstract description 58
- 239000000919 ceramic Substances 0.000 title claims abstract description 48
- 239000002184 metal Substances 0.000 title claims abstract description 19
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 19
- 238000000034 method Methods 0.000 title claims abstract description 18
- 238000001125 extrusion Methods 0.000 claims abstract description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 25
- 238000007599 discharging Methods 0.000 claims description 11
- 239000010408 film Substances 0.000 claims description 11
- 239000003638 chemical reducing agent Substances 0.000 claims description 10
- 238000001816 cooling Methods 0.000 claims description 8
- 239000013077 target material Substances 0.000 claims description 8
- 230000005540 biological transmission Effects 0.000 claims description 6
- 239000000428 dust Substances 0.000 claims description 5
- 239000007888 film coating Substances 0.000 claims description 5
- 238000009501 film coating Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 239000011104 metalized film Substances 0.000 claims description 4
- 239000003990 capacitor Substances 0.000 claims description 3
- 230000003749 cleanliness Effects 0.000 claims description 3
- 239000012528 membrane Substances 0.000 claims description 3
- 238000000429 assembly Methods 0.000 claims description 2
- 230000000712 assembly Effects 0.000 claims description 2
- 239000010409 thin film Substances 0.000 claims 8
- 239000011195 cermet Substances 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
- 238000005477 sputtering target Methods 0.000 description 6
- 239000002131 composite material Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 241000252254 Catostomidae Species 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G23/00—Driving gear for endless conveyors; Belt- or chain-tensioning arrangements
- B65G23/24—Gearing between driving motor and belt- or chain-engaging elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/82—Rotary or reciprocating members for direct action on articles or materials, e.g. pushers, rakes, shovels
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/021—Cleaning or etching treatments
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
- C23C14/505—Substrate holders for rotation of the substrates
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention relates to a sputtering coating device and a method for processing a metal film ceramic substrate; the sputtering coating equipment for processing the metal film ceramic substrate comprises a double-belt conveyor, wherein the double-belt conveyor is fixed above a frame body, a ceramic substrate feeding assembly is arranged at one end of the double-belt conveyor, a substrate switching assembly is arranged at the other end of the double-belt conveyor, and a substrate pushing assembly is arranged below the substrate switching assembly; along with the continuous rotation of the connecting plate rotating wheel, the substrate is converted into a vertical state from a horizontal state, the bottom of the substrate is clamped in an included angle formed by the connecting plate rotating wheel and the movable arm, when the movable arm rotates to the auxiliary wheel, the inner side surface of the movable arm is parallel to the substrate bearing plane under the extrusion of the auxiliary wheel, at the moment, the substrate instantly and vertically drops onto the supporting plate, and the substrate is adsorbed by the negative pressure sucker, so that the stability of the substrate is ensured; and then the cylinder rod of the pushing cylinder extends out, and the negative pressure sucker with the substrate adsorbed thereon is pushed forward until the substrate is placed in the C-shaped frame.
Description
Technical Field
The invention relates to the technical field of sputter coating, in particular to sputter coating equipment and a sputter coating method for processing a metal film ceramic substrate.
Background
Ceramic substrates refer to special process plates in which copper foil is bonded directly to the surface (single or double sided) of an alumina (Al 2O 3) or aluminum nitride (AlN) ceramic substrate at high temperature. The ultrathin composite substrate has excellent electrical insulation performance, high heat conduction property, excellent soldering property and high adhesion strength, can etch various patterns like a PCB, and has great current carrying capacity. Therefore, ceramic substrates have become a base material for high-power electronic circuit structure technology and interconnection technology.
Chinese patent publication No. CN211112195U discloses a ceramic plate vacuum sputtering coating apparatus, which comprises a vacuum chamber, a revolving work-piece holder, an inner side cylindrical sputtering target, an inner side planar sputtering target, an inner side ion source, an outer side cylindrical sputtering target, an outer side planar sputtering target, and an outer side ion source; the inner and outer ion sources are used for cleaning and auxiliary deposition before coating the surface of the substrate, so that the wettability and the binding force of the coating and the ceramic substrate are effectively improved; the high-efficiency deposition of the composite film can be realized by arranging the inner and outer cylindrical sputtering targets and the inner and outer plane sputtering targets.
The ceramic plate vacuum sputtering coating device in the patent needs to manually place the substrates on the workpiece frame one by one when in use, and the feeding mode occupies a great deal of working time, so that the sputtering coating efficiency of the substrates is reduced.
Disclosure of Invention
Technical problem to be solved
The invention aims to overcome the defects of the prior art, meets the actual needs, and provides sputtering coating equipment and a sputtering coating method for processing a metal film ceramic substrate, which can realize the one-by-one transmission and one-by-one feeding of the substrate, do not need to be manually participated, can rapidly realize the installation of the substrate, and greatly improve the sputtering coating efficiency of the substrate; to solve the technical problems set forth in the background art.
Technical proposal
In order to achieve the purpose of the invention, the technical scheme adopted by the invention is as follows:
the sputtering coating equipment for processing the metal film ceramic substrate comprises a double-belt conveyor fixed above a frame body, wherein one end of the double-belt conveyor is provided with a ceramic substrate feeding assembly, the other end of the double-belt conveyor is provided with a substrate switching assembly, and a substrate pushing assembly is arranged below the substrate switching assembly; the ceramic substrate feeding assembly comprises fixing plates welded on two sides of the double-belt conveyor, two fixing plates are arranged on each side, and a rotating wheel is movably connected to each fixing plate; the two rotating wheels arranged on the same side are in transmission connection through a plate conveying belt, and the rotating wheel close to the end part of the double-belt conveyor is also in matched connection with a driving motor; the top of the rotating wheel connected with the driving motor is also provided with a crank slide block assembly in a matching way, and a slide block in the crank slide block assembly is fixed with the pushing block through a screw; the pushing block is connected in a sliding groove formed in the substrate placing plate in a sliding manner;
the substrate switching assembly comprises two symmetrically arranged connecting plate rotating wheels which are matched and installed on the double-belt conveyor; the connecting plate rotating wheel is provided with a substrate bearing plane, and a movable arm is arranged on the outer side of the substrate bearing plane; the movable arm is movably connected with one end of the driving rod through a rotating shaft; the other end of the driving rod is fixedly connected with the connecting plate rotating wheel; a spring is arranged between the driving rod and the movable arm;
an auxiliary wheel is further arranged on the outer side of the connecting plate rotating wheel and is movably connected to the bracket; the lower end of the bracket is fixed with the double-belt conveyor through bolts; the substrate bearing plane above the connecting plate rotating wheel is flush with the upper surface of the double-belt conveyor when rotating to the upper part of the connecting plate rotating wheel.
As a further technical scheme of the invention, a fixed frame is fixed at the edge above the substrate placing plate, and a notch which is convenient for guiding out a single substrate is reserved between one side of the fixed frame, which is close to the air knife, and the substrate placing plate; the two ends of the fixed frame are welded and fixed with the outer frame, and the outer frame is welded on the fixed plate;
one side of the outer frame far away from the fixed frame is provided with two air knives, the two air knives are symmetrically arranged, one air knife is fixedly connected with the outer frame, and the other air knife is fixedly connected with the double-belt conveyor.
As a further technical scheme of the invention, the substrate pushing assembly comprises a supporting plate, the supporting plate is fixed at the bottom of the double-belt conveyor through two connecting frames, a pushing cylinder is fixedly connected between the two connecting frames through a transverse plate, a fixed frame is fixed on a cylinder rod of the pushing cylinder, a plurality of negative pressure suction cups are arranged on the outer side of the fixed frame, and the negative pressure suction cups are connected with a negative pressure source through air pipes.
As a further technical scheme of the invention, one end of the material double-belt conveyor provided with the substrate switching assembly is also provided with a sputtering coating body, the sputtering coating body is internally provided with a substrate rotating assembly, and the inside of the substrate rotating assembly is sleeved with a positive electrode discharging frame; the bottom of the substrate rotating assembly is connected with an output shaft of a speed reducer in a matching way, and the speed reducer is connected with a servo motor in a matching way; the sputtering coating body is fixed on the case.
As a further technical scheme of the invention, the sputtering coating body comprises an outer barrel which is arranged in a C shape, a plurality of through grooves are annularly arranged on the outer wall of the outer barrel, a circulating water seat is fixed outside each through groove, and a magnet is embedded on the circulating water seat; a plurality of circulating water seats are connected with water cooling pipes in series;
a guard board is connected at the opening end of the outer cylinder in a sliding way, and the lower end of the guard board is connected with sliding tables of two rodless cylinders in a matching way; after the guard plate moves up completely, the outer cylinder can form a closed cavity; the bottom of the outer cylinder is connected with a vacuumizing tube, and the other end of the vacuumizing tube is connected with a vacuum pump in a matching way; the inner side of the outer cylinder is also embedded with a target material, and the top of the outer cylinder is also hinged with a discharging door.
As a further technical scheme of the invention, the upper end of the positive electrode discharge frame arranged in the substrate rotating assembly is provided with a positive electrode conductive post which is embedded and fixed with the top cover of the outer cylinder; the positive electrode conductive post is electrically connected with the sputtering coating control system through a power line; the cathode of the sputtering coating control system is electrically connected with the target material through a lead.
As a further technical scheme of the invention, the sputtering coating control system consists of an autotransformer, a transformer, a rectifier diode and a filter capacitor, and filters and outputs high-voltage direct current after full-bridge rectification.
As a further technical scheme of the invention, the substrate rotating assembly comprises a fixed frame which is arranged in a hexagonal shape, and the bottom of each side surface of the fixed frame is welded with a C-shaped frame; the rear side of the C-shaped frame is hollowed out, and a plurality of substrate locking assemblies are arranged on side lugs on two sides of the C-shaped frame; the bottoms of the C-shaped frames are welded on a rotating frame, and the rotating frame is connected with a speed reducer in a matched mode.
As a further technical scheme of the invention, the substrate locking assembly comprises a C-shaped shell welded on the outer side of the C-shaped frame, a return spring is arranged in the C-shaped shell, and two ends of the return spring are respectively resisted and fixed with the C-shaped shell and the lock tongue; the lock tongue is connected in the through groove on the C-shaped shell in a sliding way.
The application method of the sputtering coating equipment for processing the metal film ceramic substrate comprises the following steps:
firstly, conveying substrates one by one, namely firstly placing the piled substrates in a fixed frame, when a driving motor drives a rotating wheel to rotate, enabling a crank sliding block assembly to act, enabling a pushing block to slide along a sliding groove on a substrate placing plate, pushing out the substrate at the lowest part of the piled substrates, and falling between two plate conveying belts and on a double-belt conveyor, so that single substrates are conveyed, wherein in the conveying process, the substrates pass through two air knives, dust on two sides of the substrates is purged through the air knives, the cleanliness of the substrates is guaranteed, and then the substrates are conveyed one by one;
step two, feeding the substrate, when the substrate is transmitted to the substrate transfer assembly, the substrate bearing plane above the connecting plate rotating wheel is just flush with the upper surface of the double-belt conveyor, the substrate is transmitted to the substrate bearing plane at the moment, the substrate is converted into a vertical state from a horizontal state along with the continuous rotation of the connecting plate rotating wheel, the bottom of the substrate is clamped in an included angle formed by the connecting plate rotating wheel and the movable arm, when the movable arm rotates to the auxiliary wheel, the inner side surface of the movable arm tends to be parallel to the substrate bearing plane due to the extrusion of the auxiliary wheel, the substrate at the moment vertically drops onto the supporting plate instantly, and the substrate is adsorbed by the negative pressure sucker, so that the stability of the substrate is ensured; then, a cylinder rod of the pushing cylinder stretches out, and the negative pressure sucker adsorbed with the substrate is driven by the fixing frame to push forwards until the substrate is placed in the C-shaped frame;
step three, the automatic clamping and fixing of the base plate, when the base plate contacts with the lock tongue, under the action of the top force of the base plate, the lock tongue is forced to compress the reset spring to shrink inwards towards the C-shaped shell, and when the base plate is attached to the C-shaped frame, the lock tongue resets under the top force of the reset spring, so that the locking of the base plate is realized, and falling of the base plate during rotary sputtering coating is avoided;
step four, sputtering coating of the substrate, when all the C-shaped frames are provided with the substrate, the rodless cylinder acts to enable the guard plate to move upwards, so that the outer cylinder forms a sealed container, and at the moment, the vacuum pump vacuumizes the outer cylinder through the vacuumizing tube; after reaching a certain negative pressure value, the sputtering coating control system filters and outputs high-voltage direct current after full-bridge rectification, the anode and the cathode of the sputtering coating control system discharge and generate electrons in a vacuum environment through an anode discharge frame and a target, the concentrated bombardment target is deflected and removed through a magnetic field generated by a magnet, and components on the target are ionized and sputtered on a substrate, so that a very thin metallized film capable of conducting is formed, and finally the sputtering coating of the ceramic substrate is completed; the water cooling pipe and the circulating water seat are subjected to cold water circulation in the film coating process, so that the temperature of the target material and the magnet can be reduced, and the normal temperature of the target material is ensured;
step five, taking out the membrane ceramic substrate; after the ceramic substrate sputtering coating is finished, the rodless cylinder acts to enable the guard plate to move downwards, so that the outer cylinder is vacuumized, then the ceramic substrate is directly pulled out after the discharging door is opened, and the discharging is very simple and convenient.
(3) The beneficial effects are that:
A. according to the invention, the piled substrates are placed in the fixed frame, when the driving motor drives the rotating wheel to rotate, the crank block component acts, the pushing block slides along the sliding groove on the substrate placing plate, the substrate at the lowest part of the piled substrates is pushed out and falls between two plate conveying belts and on the double-belt conveyor, so that a single substrate is conveyed, in the conveying process, the substrate passes through two air knives, dust on two sides of the substrate is purged through the air knives, the cleanness of the substrate is ensured, and then the substrate is conveyed one by one;
B. in the invention, when the substrate is transmitted to the substrate transfer assembly, the substrate bearing plane above the connecting plate rotating wheel is just flush with the upper surface of the double-belt conveyor, the substrate is transmitted to the substrate bearing plane at the moment, the substrate is converted into a vertical state from a horizontal state along with the continuous rotation of the connecting plate rotating wheel, the bottom of the substrate is clamped in an included angle formed by the connecting plate rotating wheel and the movable arm, when the movable arm rotates to the auxiliary wheel, the inner side surface of the movable arm tends to be parallel to the substrate bearing plane due to the extrusion of the auxiliary wheel, and the substrate instantly and vertically drops onto the supporting plate at the moment, so that the substrate is adsorbed by the negative pressure sucker, and the stability of the substrate is ensured; then, a cylinder rod of the pushing cylinder stretches out, and the negative pressure sucker adsorbed with the substrate is driven by the fixing frame to push forwards until the substrate is placed in the C-shaped frame;
C. according to the invention, when the substrate is contacted with the lock tongue, the lock tongue is forced to compress the reset spring under the action of the top force of the substrate and shrink inwards towards the C-shaped shell, and when the substrate is attached to the C-shaped frame, the lock tongue resets under the top force of the reset spring, so that the substrate is locked, and falling is avoided when the sputtering coating is rotated.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a front view of FIG. 1 in accordance with the present invention;
FIG. 3 is a cross-sectional view A-A of FIG. 2 in accordance with the present invention;
FIG. 4 is a schematic view of the rear structure of FIG. 1 according to the present invention;
FIG. 5 is a schematic view of a portion of the structure of FIG. 4 according to the present invention;
FIG. 6 is a schematic view of a sputter-coated body according to the present invention;
FIG. 7 is a schematic view of the bottom structure of FIG. 6 in accordance with the present invention;
FIG. 8 is a schematic view showing the internal structure of a sputter-coated body according to the present invention;
FIG. 9 is a schematic view of a substrate rotating assembly according to the present invention;
FIG. 10 is a schematic view of a positive electrode discharge frame according to the present invention;
FIG. 11 is a schematic view of a dual belt conveyor in accordance with the present invention;
FIG. 12 is an enlarged schematic view of the portion B of FIG. 11 in accordance with the present invention;
FIG. 13 is an enlarged schematic view of the invention at C of FIG. 1;
FIG. 14 is an enlarged schematic view of the invention at D of FIG. 2;
fig. 15 is an enlarged schematic view of fig. 1 at E in the present invention.
In the figure: the device comprises a 1-double-belt conveyor, a 2-ceramic substrate feeding assembly, a 3-frame body, a 4-substrate switching assembly, a 5-substrate pushing assembly, a 6-sputtering coating body, a 7-substrate rotating assembly, an 8-positive electrode discharging frame, a 9-speed reducer, a 10-servo motor, an 11-vacuum pump, a 12-vacuumizing tube, a 13-sputtering coating control system and a 14-machine box;
the device comprises a fixing plate 21, a driving motor 22, a rotating wheel 23, a plate conveying belt 24, a crank block assembly 25, a pushing block 26, a base plate placing plate 27, a fixing frame 28, an outer frame 29 and an air knife 210;
41-of a plate-connecting rotating wheel, 42-of a driving rod, 43-of a movable arm, 44-of a spring, 45-of a bracket and 46-of an auxiliary wheel;
51-supporting plates, 52-negative pressure suckers, 53-connecting frames, 54-fixing frames and 55-pushing cylinders;
61-outer cylinder, 62-target material, 63-magnet, 64-water cooling pipe, 65-guard board, 66-rodless cylinder, 67-top cover and 68-unloading door;
71-fixed frame, 72-C type frame, 73-swivel mount, 74-C shell, 75-return spring, 76-spring bolt.
Detailed Description
Referring to fig. 1-15, a sputtering coating device for processing a metal film ceramic substrate comprises a double-belt conveyor 1 fixed above a frame body 3, wherein a ceramic substrate feeding assembly 2 is arranged at one end of the double-belt conveyor 1, a substrate switching assembly 4 is arranged at the other end of the double-belt conveyor 1, and a substrate pushing assembly 5 is arranged below the substrate switching assembly 4; the ceramic substrate feeding assembly 2 comprises fixing plates 21 welded on two sides of the double-belt conveyor 1, two fixing plates are arranged on each side, and a rotating wheel 23 is movably connected to each fixing plate 21; the two rotating wheels 23 arranged on the same side are in transmission connection through a plate conveying belt 24, and the rotating wheel 23 near the end part of the double-belt conveyor 1 is also in matched connection with a driving motor 22; the top of the rotating wheel 23 connected with the driving motor 22 is also provided with a crank block assembly 25 in a matching way, and a sliding block in the crank block assembly 25 is fixed with a pushing block 26 through a screw; the push block 26 is connected in a sliding groove formed in the substrate placing plate 27 in a sliding manner;
by adopting the above technical scheme, the stacked substrates are placed in the fixed frame 28, when the driving motor 22 drives the rotating wheel 23 to rotate, the crank block assembly 25 acts, and the push block 26 slides along the sliding groove on the substrate placing plate 27, so that the substrate at the lowest position of the stacked substrates is pushed out and falls between the two plate conveying belts 24 and on the double-belt conveyor 1, and the single substrate is conveyed.
The substrate switching component 4 comprises two symmetrically arranged connecting plate rotating wheels 41 which are matched and installed on the double-belt conveyor 1; the connecting plate rotating wheel 41 is provided with a substrate bearing plane, and a movable arm 43 is arranged on the outer side of the substrate bearing plane; the movable arm 43 is movably connected with one end of the driving rod 42 through a rotating shaft; the other end of the driving rod 42 is fixedly connected with the connecting plate rotating wheel 41; a spring 44 is arranged between the driving rod 42 and the movable arm 43; an auxiliary wheel 46 is arranged on the outer side of the connecting plate rotating wheel 41, and the auxiliary wheel 46 is movably connected to the bracket 45; the lower end of the bracket 45 is fixed with the double-belt conveyor 1 through bolts; the substrate bearing plane above the plate rotating wheel 41 is flush with the upper surface of the double-belt conveyor 1 when rotating to the position above the plate rotating wheel 41.
Specifically, the substrate pushing assembly 5 includes a supporting plate 51, the supporting plate 51 is fixed at the bottom of the dual-belt conveyor 1 through two connecting frames 53, a pushing cylinder 55 is fixedly connected between the two connecting frames 53 through a transverse plate, a fixing frame 54 is fixed on a cylinder rod of the pushing cylinder 55, a plurality of negative pressure suction cups 52 are arranged on the outer side of the fixing frame 54, and a plurality of negative pressure suction cups 52 are connected with a negative pressure source through air pipes.
By adopting the technical scheme, when the substrate is transmitted to the substrate transfer assembly 4, the substrate bearing plane above the plate rotating wheel 41 is just flush with the upper surface of the double-belt conveyor 1, the substrate is transmitted to the substrate bearing plane at the moment, the substrate is converted into a vertical state from a horizontal state along with the continuous rotation of the plate rotating wheel 41, the bottom of the substrate is clamped in an included angle formed by the plate rotating wheel 41 and the movable arm 43, when the movable arm 43 rotates to the auxiliary wheel 46, the inner side surface of the movable arm 43 tends to be parallel to the substrate bearing plane due to the extrusion of the auxiliary wheel 46, the substrate at the moment instantly and vertically drops onto the supporting plate 51, and the negative pressure sucker 52 adsorbs the substrate to ensure the stability of the substrate; the rod of the pushing cylinder 55 is extended, and the negative pressure suction cup 52 with the substrate adsorbed thereon is driven by the fixing frame 54 to push forward until the substrate is placed in the C-shaped frame 72.
In this embodiment, a fixing frame 28 is fixed at the edge above the substrate placement plate 27, and a notch for guiding out a single substrate is reserved between one side of the fixing frame 28 close to the air knife 210 and the substrate placement plate 27; the two ends of the fixed frame 28 are welded and fixed with an outer frame 29, and the outer frame 29 is welded on the fixed plate 21;
two air knives 210 are arranged on one side of the outer frame 29 far away from the fixed frame 28, the two air knives 210 are symmetrically arranged, one air knife is fixedly connected with the outer frame 29, and the other air knife is fixedly connected with the double-belt conveyor 1.
Through adopting above-mentioned technical scheme, at the in-process of transmission, the base plate can pass through two air knives 210, sweeps the dust on base plate two sides through air knife 210, guarantees the cleanness of base plate, then carries out the base plate transmission one by one.
In this embodiment, the substrate rotating assembly 7 includes a fixed frame 71 disposed in a hexagonal shape, and a C-shaped frame 72 is welded to the bottom of each side of the fixed frame 71; the rear side of the C-shaped frame 72 is hollowed out, and a plurality of substrate locking components are arranged on side lugs on two sides of the C-shaped frame 72; the bottoms of the plurality of C-shaped frames 72 are welded on a rotating frame 73, and the rotating frame 73 is connected with the speed reducer 9 in a matching way.
Specifically, the substrate locking assembly comprises a C-shaped shell 74 welded on the outer side of the C-shaped frame 72, a return spring 75 is arranged in the C-shaped shell 74, and two ends of the return spring 75 are respectively in resisting fixation with the C-shaped shell 74 and a lock tongue 76; the locking tongue 76 is slidably coupled to the C-shaped housing 74 in a slot.
Through adopting above-mentioned technical scheme, when base plate and spring bolt 76 contact, under the effect of base plate top force, force spring bolt 76 compression reset spring 75 to C type shell 74 internal contraction, when base plate and C type frame 72 are laminated mutually, spring bolt 76 resets under the top force of reset spring 75 to realized the locking to the base plate, avoided appearing dropping in rotatory sputtering coating film.
In this embodiment, one end of the material double-belt conveyor 1 provided with the substrate switching assembly 4 is further provided with a sputter coating body 6, a substrate rotating assembly 7 is arranged in the sputter coating body 6, and a positive electrode discharging frame 8 is sleeved in the substrate rotating assembly 7; the bottom of the substrate rotating assembly 7 is connected with an output shaft of the speed reducer 9 in a matching way, and the speed reducer 9 is connected with the servo motor 10 in a matching way; the sputtering film coating body 6 is fixed on the case 14.
In this embodiment, the sputter-coated body 6 includes an outer cylinder 61 disposed in a C-shape, a plurality of through slots are annularly arranged on an outer wall of the outer cylinder 61, a circulating water seat is fixed outside each through slot, and a magnet 63 is embedded on the circulating water seat; the plurality of circulating water seats are connected with a water cooling pipe 64 in series;
a guard plate 65 is connected at the opening end of the outer cylinder 61 in a sliding way, and the lower end of the guard plate 65 is connected with sliding tables of two rodless air cylinders 66 in a matching way; the guard plate 65 can make the outer cylinder 61 form a closed cavity after being completely moved upwards; the bottom of the outer cylinder 61 is connected with a vacuumizing tube 12, and the other end of the vacuumizing tube 12 is connected with a vacuum pump 11 in a matching way; the inner side of the outer cylinder 61 is also embedded with a target 62, and the top of the outer cylinder 61 is also hinged with a discharge door 68.
In the embodiment, the upper end of the positive electrode discharge frame 8 arranged in the substrate rotating assembly 7 is provided with a positive electrode conductive post which is embedded and fixed with the top cover 67 of the outer cylinder 61; the positive electrode conductive post is electrically connected with the sputtering coating control system 13 through a power line; the negative electrode of the sputtering coating control system 13 is electrically connected with the target 62 through a lead.
Specifically, the sputtering coating control system 13 is composed of an autotransformer, a transformer, a rectifier diode and a filter capacitor, and filters and outputs high-voltage direct current after full-bridge rectification.
By adopting the above technical scheme, after all the C-shaped frames 72 are provided with the substrates, the rodless cylinder 66 acts to move the guard plate 65 upwards, so that the outer cylinder 61 forms a sealed container, and the vacuum pump 11 vacuumizes the outer cylinder 61 through the vacuuming tube 12; after reaching a certain negative pressure value, the sputtering coating control system 13 filters after full bridge rectification and outputs high-voltage direct current, the anode and the cathode of the sputtering coating control system 13 discharge and generate electrons in a vacuum environment through the anode discharge frame 8 and the target 62, the concentrated bombardment target 62 is deflected by a magnetic field generated by the magnet 63, and the components on the target 62 are ionized and sputtered on a substrate, so that a very thin metallized film capable of conducting is formed, and finally the sputtering coating of the ceramic substrate is finished; the water cooling pipe 64 and the circulating water seat perform cold water circulation in the film coating process, so that the temperature of the target 62 and the magnet 63 can be reduced, and the normal temperature of the target 62 is ensured.
The application method of the sputtering coating equipment for processing the metal film ceramic substrate comprises the following steps:
firstly, conveying substrates one by one, firstly placing the piled substrates in a fixed frame 28, when a driving motor 22 drives a rotating wheel 23 to rotate, enabling a crank block assembly 25 to act, enabling a push block 26 to slide along a chute on a substrate placing plate 27, pushing out the substrate at the lowest part of the piled substrates, and falling between two plate conveying belts 24 and on a double-belt conveyor 1, so that single substrates are conveyed, wherein in the conveying process, the substrates pass through two air knives 210, dust on two sides of the substrates is purged through the air knives 210, the cleanliness of the substrates is guaranteed, and then the substrates are conveyed one by one;
step two, feeding the substrate, when the substrate is transmitted to the substrate transfer assembly 4, the substrate bearing plane above the plate rotating wheel 41 is just flush with the upper surface of the double-belt conveyor 1, the substrate is transmitted to the substrate bearing plane at the moment, the substrate is converted into a vertical state from a horizontal state along with the continuous rotation of the plate rotating wheel 41, the bottom of the substrate is clamped in an included angle formed by the plate rotating wheel 41 and the movable arm 43, when the movable arm 43 rotates to the auxiliary wheel 46, the inner side surface of the movable arm 43 tends to be parallel to the substrate bearing plane due to the extrusion of the auxiliary wheel 46, the substrate at the moment instantly and vertically drops onto the supporting plate 51, and the negative pressure sucker 52 adsorbs the substrate to ensure the stability of the substrate; the cylinder rod of the pushing cylinder 55 extends out, and the negative pressure sucker 52 adsorbed with the substrate is driven by the fixing frame 54 to push forwards until the substrate is placed in the C-shaped frame 72;
step three, the automatic clamping and fixing of the substrate, when the substrate contacts with the lock tongue 76, under the action of the top force of the substrate, the lock tongue 76 is forced to compress the reset spring 75 to shrink inwards towards the C-shaped shell 74, and when the substrate is attached to the C-shaped frame 72, the lock tongue 76 resets under the top force of the reset spring 75, so that the locking of the substrate is realized, and falling during rotary sputtering coating is avoided;
step four, sputtering coating of the substrate, when all the C-shaped frames 72 are provided with the substrate, the rodless air cylinder 66 acts to enable the guard plate 65 to move upwards, so that the outer cylinder 61 forms a sealed container, and at the moment, the vacuum pump 11 vacuumizes the outer cylinder 61 through the vacuumizing tube 12; after reaching a certain negative pressure value, the sputtering coating control system 13 filters after full bridge rectification and outputs high-voltage direct current, the anode and the cathode of the sputtering coating control system 13 discharge and generate electrons in a vacuum environment through the anode discharge frame 8 and the target 62, the concentrated bombardment target 62 is deflected by a magnetic field generated by the magnet 63, and the components on the target 62 are ionized and sputtered on a substrate, so that a very thin metallized film capable of conducting is formed, and finally the sputtering coating of the ceramic substrate is finished; the water cooling pipe 64 and the circulating water seat circulate cold water in the film coating process, so that the temperature of the target 62 and the magnet 63 can be reduced, and the normal temperature of the target 62 is ensured;
step five, taking out the membrane ceramic substrate; after the ceramic substrate is subjected to sputtering coating, the rodless air cylinder 66 acts to enable the guard plate 65 to move downwards, the outer cylinder 61 breaks vacuum, and then the ceramic substrate is directly pulled out after the discharging door 68 is opened, so that the discharging is very simple and convenient.
The embodiments of the present invention are disclosed as preferred embodiments, but not limited thereto, and those skilled in the art will readily appreciate from the foregoing description that various extensions and modifications can be made without departing from the spirit of the present invention.
Claims (10)
1. A sputtering coating device for processing a metal film ceramic substrate is characterized in that: the ceramic substrate feeding device comprises a double-belt conveyor (1) fixed above a frame body (3), wherein a ceramic substrate feeding assembly (2) is arranged at one end of the double-belt conveyor (1), a substrate switching assembly (4) is arranged at the other end of the double-belt conveyor (1), and a substrate pushing assembly (5) is arranged below the substrate switching assembly (4); the ceramic substrate feeding assembly (2) comprises fixing plates (21) welded on two sides of the double-belt conveyor (1), two fixing plates are arranged on each side, and a rotating wheel (23) is movably connected to each fixing plate (21); the two rotating wheels (23) arranged on the same side are in transmission connection through a plate conveying belt (24), and the rotating wheel (23) close to the end part of the double-belt conveyor (1) is also in matched connection with a driving motor (22); the top of a rotating wheel (23) connected with the driving motor (22) is also provided with a crank block assembly (25) in a matching way, and a sliding block in the crank block assembly (25) is fixed with a pushing block (26) through a screw; the pushing block (26) is connected in a sliding groove formed in the base plate placing plate (27) in a sliding mode;
the substrate switching assembly (4) comprises two symmetrically arranged connecting plate rotating wheels (41) which are matched and installed on the double-belt conveyor (1); the connecting plate rotating wheel (41) is provided with a substrate bearing plane, and a movable arm (43) is arranged on the outer side of the substrate bearing plane; the movable arm (43) is movably connected with one end of the driving rod (42) through a rotating shaft; the other end of the driving rod (42) is fixedly connected with the connecting plate rotating wheel (41); a spring (44) is arranged between the driving rod (42) and the movable arm (43);
an auxiliary wheel (46) is further arranged on the outer side of the connecting plate rotating wheel (41), and the auxiliary wheel (46) is movably connected to the bracket (45); the lower end of the bracket (45) is fixed with the double-belt conveyor (1) through bolts; the substrate bearing plane above the plate-receiving rotating wheel (41) is flush with the upper surface of the double-belt conveyor (1) when rotating to the position above the plate-receiving rotating wheel (41).
2. The sputter coating apparatus for processing a metal thin film ceramic substrate according to claim 1, wherein: a fixed frame (28) is fixed at the edge above the substrate placing plate (27), and a notch which is convenient for guiding out a single substrate is reserved between one side of the fixed frame (28) close to the air knife (210) and the substrate placing plate (27); the two ends of the fixed frame (28) are welded and fixed with the outer frame (29), and the outer frame (29) is welded on the fixed plate (21);
one side of the outer frame (29) far away from the fixed frame (28) is provided with two air knives (210), the two air knives (210) are symmetrically arranged, one air knife is fixedly connected with the outer frame (29), and the other air knife is fixedly connected with the double-belt conveyor (1).
3. The sputter coating apparatus for processing a metal thin film ceramic substrate according to claim 1, wherein: the substrate pushing assembly (5) comprises a supporting plate (51), the supporting plate (51) is fixed at the bottom of the double-belt conveyor (1) through two connecting frames (53), a pushing cylinder (55) is fixedly connected between the two connecting frames (53) through a transverse plate, a fixing frame (54) is fixed on a cylinder rod of the pushing cylinder (55), a plurality of negative pressure sucking discs (52) are arranged on the outer side of the fixing frame (54), and a plurality of negative pressure sucking discs (52) are connected with a negative pressure source through air pipes.
4. The sputter coating apparatus for processing a metal thin film ceramic substrate according to claim 1, wherein: one end of the material double-belt conveyor (1) provided with the substrate switching assembly (4) is also provided with a sputtering coating body (6), the inside of the sputtering coating body (6) is provided with a substrate rotating assembly (7), and the inside of the substrate rotating assembly (7) is sleeved with a positive electrode discharging frame (8); the bottom of the substrate rotating assembly (7) is connected with an output shaft of the speed reducer (9) in a matched mode, and the speed reducer (9) is connected with the servo motor (10) in a matched mode; the sputtering film plating body (6) is fixed on the case (14).
5. The sputter coating apparatus for processing a metal thin film ceramic substrate as recited in claim 6, wherein: the sputtering coating body (6) comprises an outer cylinder (61) which is arranged in a C shape, a plurality of through grooves are annularly arranged on the outer wall of the outer cylinder (61), a circulating water seat is fixed outside each through groove, and a magnet (63) is embedded on the circulating water seat; a plurality of circulating water seats are connected with water cooling pipes (64) in series;
a guard plate (65) is connected at the opening end of the outer cylinder (61) in a sliding way, and the lower end of the guard plate (65) is connected with a sliding table of two rodless air cylinders (66) in a matching way; after the guard plate (65) moves up completely, the outer cylinder (61) can form a closed cavity; the bottom of the outer cylinder (61) is connected with a vacuumizing tube (12), and the other end of the vacuumizing tube (12) is connected with a vacuum pump (11) in a matching way; the inner side of the outer cylinder (61) is also embedded with a target material (62), and the top of the outer cylinder (61) is also hinged with a discharging door (68).
6. The sputter coating apparatus for processing a metal thin film ceramic substrate as recited in claim 4, wherein: the upper end of the positive electrode discharge frame (8) arranged in the substrate rotating assembly (7) is provided with a positive electrode conductive column which is embedded and fixed with a top cover (67) of the outer cylinder (61); the positive electrode conductive post is electrically connected with the sputtering coating control system (13) through a power line; the cathode of the sputtering coating control system (13) is electrically connected with the target (62) through a lead.
7. The sputter coating apparatus for processing a metal thin film ceramic substrate as recited in claim 6, wherein: the sputtering coating control system (13) consists of an autotransformer, a transformer, a rectifier diode and a filter capacitor, and filters and outputs high-voltage direct current after full-bridge rectification.
8. The sputter coating apparatus for processing a metal thin film ceramic substrate as recited in claim 7, wherein: the substrate rotating assembly (7) comprises a fixed frame (71) which is arranged in a hexagonal shape, and a C-shaped frame (72) is welded at the bottom of each side surface of the fixed frame (71); the rear side of the C-shaped frame (72) is hollowed out, and a plurality of substrate locking assemblies are arranged on side lugs on two sides of the C-shaped frame (72); the bottoms of the C-shaped frames (72) are welded on the rotating frame (73), and the rotating frame (73) is connected with the speed reducer (9) in a matching way.
9. The sputter coating apparatus for processing a metal thin film ceramic substrate as recited in claim 6, wherein: the substrate locking assembly comprises a C-shaped shell (74) welded on the outer side of the C-shaped frame (72), a return spring (75) is arranged in the C-shaped shell (74), and two ends of the return spring (75) are respectively resisted and fixed with the C-shaped shell (74) and the lock tongue (76); the lock tongue (76) is connected in the through groove on the C-shaped shell (74) in a sliding way.
10. A method of using the sputtering coating apparatus for processing a cermet substrate according to any one of claims 1 to 9, characterized in that: the method comprises the following steps:
firstly, conveying the piled substrates one by one in a fixed frame (28), when a driving motor (22) drives a rotating wheel (23) to rotate, enabling a crank sliding block assembly (25) to act, enabling a pushing block (26) to slide along a sliding groove on a substrate placing plate (27), pushing out the substrate at the lowest part of the piled substrates, and falling the substrate between two plate conveying belts (24) and on a double-belt conveyor (1), so that single substrates are conveyed, and in the conveying process, the substrates pass through two air knives (210), dust on two sides of the substrates is purged through the air knives (210), so that the cleanliness of the substrates is ensured, and then conveying the substrates one by one;
step two, feeding the substrate, when the substrate is transmitted to the substrate transfer assembly (4), the substrate bearing plane above the plate rotating wheel (41) is just flush with the upper surface of the double-belt conveyor (1), the substrate is transmitted to the substrate bearing plane at the moment, the substrate is converted into a vertical state from a horizontal state along with the continuous rotation of the plate rotating wheel (41), the bottom of the substrate is clamped in an included angle formed by the plate rotating wheel (41) and the movable arm (43), when the movable arm (43) rotates to the auxiliary wheel (46), the inner side surface of the movable arm (43) tends to be parallel to the substrate bearing plane due to the extrusion of the auxiliary wheel (46), the substrate at the moment is instantly and vertically dropped onto the supporting plate (51), and the negative pressure sucker (52) adsorbs the substrate to ensure the stability of the substrate; then, a cylinder rod of the pushing cylinder (55) extends out, and the negative pressure sucker (52) adsorbed with the substrate is driven by the fixing frame (54) to push forwards until the substrate is placed in the C-shaped frame (72);
step three, automatic clamping and fixing of the substrate, when the substrate is contacted with the lock tongue (76), under the action of the top force of the substrate, the lock tongue (76) is forced to compress the reset spring (75) to shrink inwards towards the C-shaped shell (74), and when the substrate is attached to the C-shaped frame (72), the lock tongue (76) resets under the top force of the reset spring (75), so that the locking of the substrate is realized, and falling during rotary sputtering coating is avoided;
step four, sputtering coating of the substrate, when all the C-shaped frames (72) are provided with the substrate, the rodless cylinder (66) acts to enable the guard plate (65) to move upwards, so that the outer cylinder (61) forms a sealed container, and at the moment, the vacuum pump (11) vacuumizes the outer cylinder (61) through the vacuumizing tube (12); after reaching a certain negative pressure value, the sputtering coating control system (13) filters and outputs high-voltage direct current after full-bridge rectification, the anode and the cathode of the sputtering coating control system (13) discharge and generate electrons in a vacuum environment through the anode discharge frame (8) and the target (62), the concentrated bombarding target (62) is deflected by a magnetic field generated by the magnet (63), and components on the target (62) are ionized and sputtered on a substrate, so that a very thin metallized film capable of conducting is formed, and finally the sputtering coating of the ceramic substrate is completed;
the water cooling pipe (64) and the circulating water seat are subjected to cold water circulation in the film coating process, so that the temperature of the target material (62) and the magnet (63) can be reduced, and the normal temperature of the target material (62) is ensured;
step five, taking out the membrane ceramic substrate; after the ceramic substrate is subjected to sputtering coating, the rodless cylinder (66) acts to enable the guard plate (65) to move downwards, the outer cylinder (61) breaks vacuum, and then the ceramic substrate is directly pulled out after the discharging door (68) is opened, so that the ceramic substrate is quite simple and convenient to discharge.
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| CN202311261524.1A CN117568757A (en) | 2023-09-27 | 2023-09-27 | Sputtering coating equipment and method for processing metal film ceramic substrate |
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| CN202311261524.1A CN117568757A (en) | 2023-09-27 | 2023-09-27 | Sputtering coating equipment and method for processing metal film ceramic substrate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN118086853A (en) * | 2024-04-29 | 2024-05-28 | 江苏透波光电科技有限公司 | High-power vacuum sputtering equipment for ceramic substrate |
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