JP2009059917A - 半導体装置製造用の接着シート、及びそれを用いた半導体装置の製造方法 - Google Patents
半導体装置製造用の接着シート、及びそれを用いた半導体装置の製造方法 Download PDFInfo
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- JP2009059917A JP2009059917A JP2007226282A JP2007226282A JP2009059917A JP 2009059917 A JP2009059917 A JP 2009059917A JP 2007226282 A JP2007226282 A JP 2007226282A JP 2007226282 A JP2007226282 A JP 2007226282A JP 2009059917 A JP2009059917 A JP 2009059917A
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Abstract
【解決手段】 本発明の半導体装置製造用の接着シートは、半導体素子を被着体に接着させる半導体装置製造用の接着シートであって、波長域が290〜450nmの範囲内にある光を吸収又は反射させる顔料を含有することを特徴とする。
【選択図】 図1
Description
本発明に係る接着シートは顔料を含有するものであれば、その構成は特に限定されない。例えば、図1(a)に示す様に、接着剤層の単層のみからなる接着シート101や、同図(b)に示すように、コア材料102の片面に接着剤層103が積層された接着シート104、又はその両面に接着剤層を形成した多層構造の接着シート等が挙げられる。
前記基板等上に半導体素子を3次元実装する場合、半導体素子の回路が形成される面側には、バッファーコート膜が形成されている。当該バッファーコート膜としては、例えば窒化珪素膜やポリイミド樹脂等の耐熱樹脂からなるものが挙げられる。
先ず、ブチルアクリレートを主成分としたポリマー(根上工業(株)製、商品名;パラクロンSN−710)100部に対して、イソシアネート系架橋剤(日本ポリウレタン(株)製、商品名;コロネートHX)3部、エポキシ樹脂(ジャパンエポキシレジン(株)製、商品名;エピコート1003)33部、フェノール樹脂(荒川化学(株)製、商品名;P−180)22部、及び顔料として超微粒子酸化チタン(チタン工業(株)製、商品名;STT−4D、平均粒径0.15μm)0.2部をメチルエチルケトンに溶解させて撹拌し、濃度15重量%の接着剤組成物の溶液を調製した。
アクリル系接着剤100部に対して、イソシアネート系架橋剤(日本ポリウレタン(株)製、商品名:コロネートHX)3部を添加したアクリル系接着剤組成物を調製した。尚、前記アクリル系接着剤は、アクリル酸2−エチルヘキシル70部、アクリル酸n−ブチル25部、及びアクリル酸5部を配合し、これらが構成モノマーとなるアクリル系共重合体を調製した後、当該アクリル系共重合体と、顔料としてファストゲンブルーGNPS(大日本インキ化学(株)製、青色顔料:銅フタロシアニン系顔料、平均粒径0.1μm)1部とをメチルエチルケトンに溶解させて、濃度15%となる様に調製して得た。
本比較例1に於いては、接着剤組成物の調製の際に顔料を添加しなかったこと以外は、実施例1と同様にして、本比較例1に係る接着シートを作製した。
前記の実施例1、2及び比較例1の接着シートについて、以下の方法により、引張貯蔵弾性率、剪断接着力、ダイシング性、吸湿信頼性の各評価を行った。これらの結果は表1に示される通りであった。
前記実施例及び比較例で作製した接着シートについて、波長が400nmの光に対する透過率を次の通りに測定した。日立ハイテクノロジーズ社製のU−3310(商品名)で紫外−可視−近赤外の吸収スペクトルをスキャンスピード300nm/minで測定し、各透過率を求めた。結果を下記表1に示す。
前記実施例及び比較例で作製した接着シートに対して、半導体ウェハ100枚のマウントを行った際のトラブル回数を測定した。マウントには、日東精機(株)製のDR−8500II(商品名)を用いた。また、トラブル回数は、半導体ウェハが接着シート上の貼り合わせ位置にマウントされない等の位置ズレが発生し、当該装置が一時停止する様な場合を計測した。結果を下記表1に示す。
前記実施例及び比較例で得られた接着シートにダイシングテープ(日東電工(株)製、商品名;DU−300)をラミネート温度40℃、線圧4kgf/cmで貼り付けし、半導体ウェハ(直径8インチ、厚さ100μm)の裏面に50℃で貼り付けした。その後、ダイサーを用いて、スピンドル回転数40,000rpm、切断速度50mm/secで5mm×5mm角の半導体チップのサイズにダイシング(切断)した。
前記半導体チップをビスマレイミド−トリアジン樹脂基板に、120℃×500gf×1secの条件でダイボンディングした。その後、180℃で1hrの熱履歴をかけ、エポキシ系封止樹脂(日東電工製、商品名;HC−300B6)により、これらをモールドマシン(TOWA製,Model−Y−serise)を用いて、175℃で、プレヒート設定3秒、インジェクション時間12秒、キュア時間120秒にてモールドした。更に、175℃×5hrの条件で加熱硬化して半導体パッケージを得た。
102 コア材料
103 接着剤層
104 接着シート
201 回路基板(被着体)
202 半導体チップ(半導体素子)
203 ボンディングワイヤー
204 封止樹脂
301 第1接着シート
302 第1半導体チップ(半導体素子)
303 第2接着シート
304 第2半導体チップ(半導体素子)
Claims (10)
- 半導体素子を被着体に接着させる半導体装置製造用の接着シートであって、波長域が290〜450nmの範囲内にある光を吸収又は反射させる顔料を含有することを特徴とする半導体装置製造用の接着シート。
- 前記顔料の含有量は、前記接着シートを構成する接着剤組成物100重量部に対して、0.1〜1重量部の範囲内であることを特徴とする請求項1に記載の半導体装置製造用の接着シート。
- 前記顔料の平均粒径が0.01〜0.5μmの範囲内であることを特徴とする請求項1又は2に記載の半導体装置製造用の接着シート。
- 前記290〜450nmの波長域にある光に対する透過率が40%以下であることを特徴とする請求項1〜3の何れか1項に記載の半導体装置製造用の接着シート。
- 前記接着剤組成物として熱可塑性樹脂が含有されていることを特徴とする請求項2〜4の何れか1項に記載の半導体装置製造用の接着シート。
- 前記接着剤組成物として、熱硬化性樹脂と熱可塑性樹脂の双方が含有されていることを特徴とする請求項2〜4の何れか1項に記載の半導体装置製造用の接着シート。
- 前記熱可塑性樹脂がアクリル樹脂であることを特徴とする請求項5又は6に記載の半導体装置製造用の接着シート。
- 前記熱硬化性樹脂がエポキシ樹脂又はフェノール樹脂の少なくとも何れか一方であることを特徴とする請求項6に記載の半導体装置製造用の接着シート。
- 架橋剤が添加されていることを特徴とする請求項6又は8に記載の半導体装置製造用の接着シート。
- 波長域が290〜450nmの範囲内にある光を吸収又は反射させる顔料を含有する半導体装置製造用の接着シートに対し、半導体ウェハ又はダイシングシートを貼り合わせる際に、290〜450nmの波長域の光を吸収又は反射する前記接着シートを識別し、かつ、半導体ウェハ又はダイシングシートとの位置合わせをしながら貼り合わせを行うことを特徴とする半導体装置の製造方法。
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JP2007226282A JP4975564B2 (ja) | 2007-08-31 | 2007-08-31 | 半導体装置製造用の接着シート、及びそれを用いた半導体装置の製造方法 |
PCT/JP2008/065164 WO2009028484A1 (ja) | 2007-08-31 | 2008-08-26 | 半導体装置製造用の接着シート、及びそれを用いた半導体装置の製造方法 |
US12/675,433 US20100236689A1 (en) | 2007-08-31 | 2008-08-26 | Adhesive sheet for manufacturing semiconductor device, and semiconductor device manufacturing method using the sheet |
CN200880101005A CN101765909A (zh) | 2007-08-31 | 2008-08-26 | 半导体装置制造用的胶粘片及使用其的半导体装置的制造方法 |
TW97132979A TW200918632A (en) | 2007-08-31 | 2008-08-28 | Adhesive sheet for manufacturing semiconductor device and method for manufacturing semiconductor device using thereof |
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JP2011111530A (ja) * | 2009-11-26 | 2011-06-09 | Hitachi Chem Co Ltd | 接着シート及びその製造方法、並びに、半導体装置の製造方法及び半導体装置 |
JP2011129786A (ja) * | 2009-12-18 | 2011-06-30 | Furukawa Electric Co Ltd:The | ウエハ加工用テープ及びその製造方法 |
JP2011135042A (ja) * | 2009-11-26 | 2011-07-07 | Nitto Denko Corp | 熱硬化型接着フィルム、ダイシングフィルム付き接着フィルム、及び、該熱硬化型接着フィルム又は該ダイシングフィルム付き接着フィルムを用いた半導体装置の製造方法 |
JP2011175176A (ja) * | 2010-02-25 | 2011-09-08 | Talex Optical Co Ltd | 眼鏡用合わせガラスレンズ |
WO2012046737A1 (ja) * | 2010-10-06 | 2012-04-12 | 古河電気工業株式会社 | ウエハ加工用テープ及びその製造方法 |
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JP2015013946A (ja) * | 2013-07-05 | 2015-01-22 | 日東電工株式会社 | 接着剤組成物及び接着シート |
WO2016098378A1 (ja) * | 2014-12-15 | 2016-06-23 | リンテック株式会社 | ダイシングダイボンディングシート |
JP2021015865A (ja) * | 2019-07-11 | 2021-02-12 | 日東電工株式会社 | ダイボンドフィルム及びダイシングダイボンドフィルム |
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JP2012080023A (ja) * | 2010-10-06 | 2012-04-19 | Furukawa Electric Co Ltd:The | ウエハ加工用テープ及びその製造方法 |
JP2012191048A (ja) * | 2011-03-11 | 2012-10-04 | Nitto Denko Corp | 保護フィルム付きダイシングフィルム |
US8614139B2 (en) | 2011-03-11 | 2013-12-24 | Nitto Denko Corporation | Dicing film with protecting film |
JP2015013946A (ja) * | 2013-07-05 | 2015-01-22 | 日東電工株式会社 | 接着剤組成物及び接着シート |
WO2016098378A1 (ja) * | 2014-12-15 | 2016-06-23 | リンテック株式会社 | ダイシングダイボンディングシート |
JP2021015865A (ja) * | 2019-07-11 | 2021-02-12 | 日東電工株式会社 | ダイボンドフィルム及びダイシングダイボンドフィルム |
KR20220159984A (ko) | 2020-03-27 | 2022-12-05 | 린텍 가부시키가이샤 | 반도체 장치 제조용 시트 |
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CN101765909A (zh) | 2010-06-30 |
TW200918632A (en) | 2009-05-01 |
JP4975564B2 (ja) | 2012-07-11 |
US20100236689A1 (en) | 2010-09-23 |
WO2009028484A1 (ja) | 2009-03-05 |
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