JP2008045020A - 粘着性フィルム剥離方法 - Google Patents
粘着性フィルム剥離方法 Download PDFInfo
- Publication number
- JP2008045020A JP2008045020A JP2006221306A JP2006221306A JP2008045020A JP 2008045020 A JP2008045020 A JP 2008045020A JP 2006221306 A JP2006221306 A JP 2006221306A JP 2006221306 A JP2006221306 A JP 2006221306A JP 2008045020 A JP2008045020 A JP 2008045020A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive film
- substrate
- adhesive
- peeling
- metal salt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
- H01J11/20—Constructional details
- H01J11/34—Vessels, containers or parts thereof, e.g. substrates
- H01J11/44—Optical arrangements or shielding arrangements, e.g. filters, black matrices, light reflecting means or electromagnetic shielding means
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/52—Recovery of material from discharge tubes or lamps
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
- C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1153—Temperature change for delamination [e.g., heating during delaminating, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1911—Heating or cooling delaminating means [e.g., melting means, freezing means, etc.]
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Electromagnetism (AREA)
- Plasma & Fusion (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Processing Of Solid Wastes (AREA)
Abstract
【解決手段】粘着性ポリマーと、その中に分散した加熱分解性金属水酸化物もしくは金属塩水和物フィラーを含む粘着性フィルムによって接着された第一の基材と第二の基材との剥離方法であって、
前記粘着性フィルムを金属水酸化物もしくは金属塩水和物が分解して脱水する温度に加熱し、剥離を促進する工程を含む、剥離方法。
【選択図】なし
Description
(1)200℃前後の加熱や有機溶剤によって、粘着剤の凝集力を低下させ、捻るなどの物理的、外的負荷をかけることで剥離する。
(2)ディスプレイパネルとシャーシとの間にワイヤーや糸などを挿入し、粘着性フィルムを切断し、分離する。
(3)粘着性フィルム片を短冊状に配置し、側面からそれを引き抜くことで分離する。
(4)特許文献1(特開2004−69766号公報)及び特許文献2(特開2004−309551号公報)は、ディスプレイパネルと支持プレートの間に、それらを支持する粘着テープを有し、その粘着テープが端部を引っ張ることで支持プレートから剥離可能である、ディスプレイ装置を開示している。
(1)粘着性ポリマーと、その中に分散した加熱分解性金属水酸化物もしくは金属塩水和物フィラーを含む粘着性フィルムによって接着された第一の基材と第二の基材との剥離方法であって、
前記粘着性フィルムを金属水酸化物もしくは金属塩水和物が分解して脱水する温度に加熱し、剥離を促進する工程を含む、剥離方法。
本発明は、1つの態様において、粘着性ポリマーと、その中に分散した加熱分解性金属水酸化物もしくは金属塩水和物フィラーを含む粘着性フィルムによって接着された第一の基材と第二の基材との剥離方法であって、
前記粘着性フィルムを金属水酸化物もしくは金属塩水和物が分解して脱水する温度に加熱し、剥離を促進する工程を含む、剥離方法である。
実施例1
1.粘着性フィルムの製造
(メタ)アクリル酸アルキルエステルモノマーとして2−エチルヘキシルアクリレート(日本触媒社(大阪市中央区)製)100部と、光開始剤としてイルガキュア651(2,2−ジメトキシ−2−フェニルアセトフェノン:チバ・スペシャルティー・ケミカルズ社(東京都港区)製)0.04部をガラス容器中でよく混合し、窒素ガスにて溶存酸素を置換した後に、低圧水銀ランプで数分間紫外線照射して部分重合させ、粘度が1500cPの粘性液体(シロップ)を得た。得られた組成物100部に対して極性モノマーとしてアクリル酸(三菱化学社(東京都港区)製)3部、架橋剤として1,6−ヘキサンジオールジアクリレート(HDDA)(新中村化学社(和歌山県和歌山市)製のNK−エステル−A−HD(商品名))0.08部、金属水酸化物フィラーとして、平均粒径が30μmである水酸化アルミニウム(Al(OH)3、日本軽金属社(東京都品川区)製のB−303(商品名))を得られる粘着剤の質量を基準として20質量%となる量で加え、均一になるまで攪拌した。この混合物を真空脱泡した後に、剥離処理を施した50μm厚のポリエステルフィルムの上に1mm厚となるように塗工し、重合を阻害する酸素を除去するためにもう一枚の上記と同一のフィルムを被せ、両面から低圧水銀ランプで約5分間照射し、粘着性フィルムを得た。
第一の基材として200mm×300mm×3mmのフロートガラス(プラズマディスプレイパネルをシミュレート)(415g)、第二の基材として200mm×330mm×2mmのアルミニウム板(シャーシをシミュレート)を用意し、190mm×290mmの寸法の上述の粘着性フィルムを用いてこれらの基材を接合した。貼り合わされた試験体の斜視図を図1に示す。図1中、符号1は粘着性フィルム、2は第一の基材(フロートガラス)、3は第二の基材(アルミニウム板)を示す。このような試験体を6つ作製し、図2に示すように、各試験体を150℃、200℃、250℃、300℃、350℃及び400℃にセットしたオーブン内に台座4を用いて設置し、第一の基材(フロートガラス)2と、第二の基材(アルミニウム板)3とが剥離するまでの時間を計測した。結果を表1に示す。
実施例1と同様に粘着性フィルムを形成し、評価したが、水酸化アルミニウムの量が50質量%となるようにした。結果を表1に示す。
実施例1と同様に粘着性フィルムを形成し、評価したが、水酸化アルミニウムの量が70質量%となるようにした。結果を表1に示す。
実施例1と同様に粘着性フィルムを形成し、評価したが、水酸化アルミニウムを全く含ませなかった。結果を表1に示す。
実施例1と同様に粘着性フィルムを形成したが、水酸化アルミニウムの量が10質量%となるようにした。
実施例1と同様に粘着性フィルムを形成したが、水酸化アルミニウムの量が80質量%となるようにした。
実施例1と同様に粘着性フィルムを形成したが、水酸化アルミニウムの添加量を粘着性フィルムの質量を基準として46質量%とした。また、評価試験においては、第一の基材として実際のプラズマディスプレイ用ガラスパネル、第二の基材としてアルミニウムシャーシを用いた。
ガラスパネル:42”サイズ、重量9kg
アルミニウムシャーシ:42”サイズ、重量6kg
粘着性フィルム面積:0.42m2
実施例1と同様に粘着性フィルムを製造したが、水酸化アルミニウムの添加量を粘着性フィルムの質量を基準として60質量%とした。また、評価試験は、実施例4と同様に行ったが、2つの試験体を用いて、250℃及び300℃のオーブンにて試験した。
2 第一の基材(フロートガラス、ガラスパネル)
3 第二の基材(アルミニウム板、アルミニウムシャーシ)
4 台座
5 吊り下げ治具
Claims (8)
- 粘着性ポリマーと、その中に分散した加熱分解性金属水酸化物もしくは金属塩水和物フィラーを含む粘着性フィルムによって接着された第一の基材と第二の基材との剥離方法であって、
前記粘着性フィルムを金属水酸化物もしくは金属塩水和物が分解して脱水する温度に加熱し、剥離を促進する工程を含む、剥離方法。 - 前記第一の基材及び第二の基材は剛性基材である、請求項1記載の方法。
- 前記第一の基材はディスプレイパネルであり、前記第二の基材はディスプレイ設置用シャーシである、請求項2記載の方法。
- 前記加熱分解性金属水酸化物もしくは金属塩水和物フィラーは水酸化アルミニウム、水酸化マグネシウム、ドーソナイト、アルミン酸カルシウム水和物、二水和石こう及びホウ酸亜鉛水和物からなる群より選択される、請求項1〜3のいずれか1項記載の方法。
- 前記加熱分解性金属水酸化物もしくは金属塩水和物フィラーは粘着剤の質量を基準として20〜70質量%の量で含まれる、請求項1〜4のいずれか1項記載の方法。
- 前記粘着性ポリマーは(メタ)アクリル系ポリマー、ポリエステル、ポリウレタン、シリコーン樹脂、ポリエーテル、ポリカーボネート、ポリビニルエーテル、ポリ塩化ビニル、ポリ酢酸ビニル、ビニルエステル系ポリマー、ポリイソブチレン、ポリスチレン、ポリブタジエン、ポリイソプレン及びポリアクリロニトリルからなる群より選ばれる、請求項1〜5のいずれか1項記載の方法。
- 前記粘着性ポリマーは(メタ)アクリル系ポリマーである、請求項6記載の方法。
- 前記加熱分解性金属水酸化物は水酸化アルミニウムであり、前記粘着性フィルムは250℃以上の温度にまで加熱される、請求項1〜7のいずれか1項記載の方法。
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JP2006221306A JP5173166B2 (ja) | 2006-08-14 | 2006-08-14 | 粘着性フィルム剥離方法 |
US12/376,451 US8062475B2 (en) | 2006-08-14 | 2007-08-09 | Method for detaching pressure-sensitive adhesive film |
EP07800054A EP2052380A1 (en) | 2006-08-14 | 2007-08-09 | Method for detaching pressure-sensitive adhesive film |
CN2007800298409A CN101501744B (zh) | 2006-08-14 | 2007-08-09 | 用于分离压敏粘合剂膜的方法 |
KR1020097003014A KR20090048593A (ko) | 2006-08-14 | 2007-08-09 | 감압 접착제 필름의 분리 방법 |
PCT/US2007/075540 WO2008021923A1 (en) | 2006-08-14 | 2007-08-09 | Method for detaching pressure-sensitive adhesive film |
TW096129881A TW200817183A (en) | 2006-08-14 | 2007-08-13 | Method for detaching pressure-sensitive adhesive film |
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KR (1) | KR20090048593A (ja) |
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JP2013520009A (ja) * | 2010-02-12 | 2013-05-30 | ダウ コーニング コーポレーション | 半導体加工のための一時的ウェハー接着方法 |
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JP5547954B2 (ja) * | 2009-12-14 | 2014-07-16 | 日東電工株式会社 | 粘着テープ剥離方法およびその装置 |
EP2550267A1 (en) | 2010-03-24 | 2013-01-30 | Vertex Pharmaceuticals Incorporated | Analogues for the treatment or prevention of flavivirus infections |
US20140020845A1 (en) * | 2012-07-20 | 2014-01-23 | Thermal Conductive Bonding, Inc. | Method For Debonding Items With Reactive Multilayer Foil |
US10585518B2 (en) | 2014-10-15 | 2020-03-10 | Microsoft Technology Licensing, Llc | Display module support |
US9862115B2 (en) | 2015-03-27 | 2018-01-09 | Intel Corporation | Hidden feature for accessing or repairing mobile devices |
US9618973B2 (en) * | 2015-06-26 | 2017-04-11 | Intel Corporation | Mechanically embedded heating element |
KR102591568B1 (ko) * | 2017-01-19 | 2023-10-23 | 삼성전자주식회사 | 디스플레이를 포함하는 전자 장치 |
US10369774B2 (en) * | 2017-06-30 | 2019-08-06 | Microsoft Technology Licensing, Llc | Thermally conductive de-bonding aid |
US11084955B2 (en) | 2018-07-23 | 2021-08-10 | Microsoft Technology Licensing, Llc | Pressure sensitive adhesive with thermally conductive release tab |
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CN101501744A (zh) | 2009-08-05 |
EP2052380A1 (en) | 2009-04-29 |
KR20090048593A (ko) | 2009-05-14 |
US20100175829A1 (en) | 2010-07-15 |
WO2008021923A1 (en) | 2008-02-21 |
JP5173166B2 (ja) | 2013-03-27 |
TW200817183A (en) | 2008-04-16 |
CN101501744B (zh) | 2012-01-11 |
US8062475B2 (en) | 2011-11-22 |
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