JP2006278353A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP2006278353A JP2006278353A JP2005090144A JP2005090144A JP2006278353A JP 2006278353 A JP2006278353 A JP 2006278353A JP 2005090144 A JP2005090144 A JP 2005090144A JP 2005090144 A JP2005090144 A JP 2005090144A JP 2006278353 A JP2006278353 A JP 2006278353A
- Authority
- JP
- Japan
- Prior art keywords
- region
- semiconductor device
- back gate
- adjacent
- area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 89
- 239000000758 substrate Substances 0.000 claims abstract description 17
- 239000011229 interlayer Substances 0.000 claims description 9
- 239000013078 crystal Substances 0.000 claims description 4
- 230000015556 catabolic process Effects 0.000 abstract description 13
- 230000003071 parasitic effect Effects 0.000 abstract description 8
- 230000002093 peripheral effect Effects 0.000 abstract description 2
- 230000000052 comparative effect Effects 0.000 description 7
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7813—Vertical DMOS transistors, i.e. VDMOS transistors with trench gate electrode, e.g. UMOS transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0684—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape, relative sizes or dispositions of the semiconductor regions or junctions between the regions
- H01L29/0692—Surface layout
- H01L29/0696—Surface layout of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42372—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the conducting layer, e.g. the length, the sectional shape or the lay-out
- H01L29/4238—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the conducting layer, e.g. the length, the sectional shape or the lay-out characterised by the surface lay-out
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
【解決手段】 半導体装置1は、縦型MOSFETであり、複数の単位セル10、およびゲート電極20を備えている。各単位セル10は、半導体基板に形成されたバックゲート領域12と、半導体基板に形成され、平面視でバックゲート領域12の周囲に隣接して設けられたソース領域14とを含んで構成されている。バックゲート領域12は、その一部がゲート電極20に隣接している。具体的には、バックゲート領域12は、平面視で矩形をしており、その周囲の4辺のうち1組の対向する2辺においてゲート電極20に隣接している。
【選択図】 図1
Description
(第1実施形態)
(第2実施形態)
(第3実施形態)
2 半導体装置
3 半導体装置
10 単位セル
12 バックゲート領域
14 ソース領域
20 ゲート電極
22 ゲート酸化膜
32 ベース領域
40 トレンチ
50 層間絶縁膜
Claims (9)
- 半導体基板に設けられたバックゲート領域、および平面視で前記バックゲート領域の周囲に隣接して設けられたソース領域を含んで構成される単位セルと、
前記半導体基板に設けられたトレンチ内に設けられ、前記単位セルを包囲するゲート電極と、を備え、
前記単位セルは、当該単位セルを内包することが可能な矩形領域のうち面積が最小のものとして定義される仮想的な包囲領域から、当該包囲領域の一部である除去領域を除いて得られる残余領域に平面視で一致し、
前記バックゲート領域は、その一部が前記除去領域において前記ゲート電極に隣接していることを特徴とする半導体装置。 - 請求項1に記載の半導体装置において、
前記単位セルにおける前記ソース領域の周囲のうち前記ゲート電極に隣接する部分の長さの合計は、前記包囲領域の外周の長さ以上である半導体装置。 - 請求項1または2に記載の半導体装置において、
前記バックゲート領域は矩形をしており、
前記ソース領域は、前記バックゲート領域の1組の対向する2辺それぞれに隣接して設けられており、
前記ソース領域の形状は、前記バックゲート領域の前記辺を含み、当該辺よりも長い辺を1辺とする矩形である半導体装置。 - 請求項1または2に記載の半導体装置において、
前記バックゲート領域は矩形をしており、
前記ソース領域は、前記バックゲート領域の4辺それぞれに隣接して設けられており、
前記ソース領域の形状は、前記バックゲート領域の前記辺を1辺とする矩形である半導体装置。 - 請求項1または2に記載の半導体装置において、
前記除去領域は、前記包囲領域の4隅それぞれに位置する矩形の領域であり、
前記バックゲート領域は、前記各除去領域の2辺それぞれの一部に隣接している半導体装置。 - 請求項5に記載の半導体装置において、
前記包囲領域および前記除去領域は共に正方形をしており、
前記包囲領域および前記除去領域の1辺の長さをそれぞれaおよびbとしたとき、
前記各除去領域の前記2辺それぞれにおける前記バックゲート領域と隣接する部分の長さは、2b2/a以下である半導体装置。 - 請求項1乃至6いずれかに記載の半導体装置において、
前記ソース領域と前記ゲート電極との隣接面の結晶方位は、(100)である半導体装置。 - 請求項1乃至7いずれかに記載の半導体装置において、
前記ゲート電極上に設けられた層間絶縁膜を備え、
前記層間絶縁膜は、前記トレンチ内に収まっている半導体装置。 - 請求項1乃至8いずれかに記載の半導体装置において、
前記単位セルを複数備え、
前記単位セルの前記除去領域には、他の前記単位セルの前記ソース領域が配置されている半導体装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005090144A JP4944383B2 (ja) | 2005-03-25 | 2005-03-25 | 半導体装置 |
US11/372,143 US7521754B2 (en) | 2005-03-25 | 2006-03-10 | Semiconductor cell array with unit cells having adjacently surrounding source and gate electrode |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005090144A JP4944383B2 (ja) | 2005-03-25 | 2005-03-25 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006278353A true JP2006278353A (ja) | 2006-10-12 |
JP4944383B2 JP4944383B2 (ja) | 2012-05-30 |
Family
ID=37034353
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005090144A Expired - Fee Related JP4944383B2 (ja) | 2005-03-25 | 2005-03-25 | 半導体装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7521754B2 (ja) |
JP (1) | JP4944383B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009238872A (ja) * | 2008-03-26 | 2009-10-15 | Ricoh Co Ltd | 半導体装置及びその製造方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10125918A (ja) * | 1996-10-21 | 1998-05-15 | Samsung Electron Co Ltd | 電力用半導体素子 |
JPH1174511A (ja) * | 1997-08-27 | 1999-03-16 | Nissan Motor Co Ltd | 半導体装置 |
JP2000106434A (ja) * | 1998-09-29 | 2000-04-11 | Toshiba Corp | 高耐圧半導体装置 |
JP2001060688A (ja) * | 1999-08-23 | 2001-03-06 | Nec Corp | 半導体装置及びその製造方法 |
JP2001352063A (ja) * | 2000-06-09 | 2001-12-21 | Sanyo Electric Co Ltd | 絶縁ゲート型半導体装置 |
JP2002050760A (ja) * | 2000-08-03 | 2002-02-15 | Sanyo Electric Co Ltd | 絶縁ゲート型電界効果半導体装置 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4672407A (en) * | 1984-05-30 | 1987-06-09 | Kabushiki Kaisha Toshiba | Conductivity modulated MOSFET |
US4994871A (en) * | 1988-12-02 | 1991-02-19 | General Electric Company | Insulated gate bipolar transistor with improved latch-up current level and safe operating area |
US6603173B1 (en) * | 1991-07-26 | 2003-08-05 | Denso Corporation | Vertical type MOSFET |
US5468982A (en) * | 1994-06-03 | 1995-11-21 | Siliconix Incorporated | Trenched DMOS transistor with channel block at cell trench corners |
US6005271A (en) * | 1997-11-05 | 1999-12-21 | Magepower Semiconductor Corp. | Semiconductor cell array with high packing density |
EP1050908B1 (en) * | 1998-01-22 | 2016-01-20 | Mitsubishi Denki Kabushiki Kaisha | Insulating gate type bipolar semiconductor device |
US6413822B2 (en) * | 1999-04-22 | 2002-07-02 | Advanced Analogic Technologies, Inc. | Super-self-aligned fabrication process of trench-gate DMOS with overlying device layer |
JP2001102576A (ja) | 1999-09-29 | 2001-04-13 | Sanyo Electric Co Ltd | 半導体装置 |
JP2002158355A (ja) * | 2000-11-20 | 2002-05-31 | Nec Kansai Ltd | 半導体装置およびその製造方法 |
JP3742332B2 (ja) * | 2001-11-12 | 2006-02-01 | 株式会社新川 | ワイヤボンデイング装置 |
JP4158453B2 (ja) * | 2002-08-22 | 2008-10-01 | 株式会社デンソー | 半導体装置及びその製造方法 |
JP4028333B2 (ja) * | 2002-09-02 | 2007-12-26 | 株式会社東芝 | 半導体装置 |
JP4841829B2 (ja) * | 2004-11-17 | 2011-12-21 | ルネサスエレクトロニクス株式会社 | 半導体装置及びその製造方法 |
-
2005
- 2005-03-25 JP JP2005090144A patent/JP4944383B2/ja not_active Expired - Fee Related
-
2006
- 2006-03-10 US US11/372,143 patent/US7521754B2/en not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10125918A (ja) * | 1996-10-21 | 1998-05-15 | Samsung Electron Co Ltd | 電力用半導体素子 |
JPH1174511A (ja) * | 1997-08-27 | 1999-03-16 | Nissan Motor Co Ltd | 半導体装置 |
JP2000106434A (ja) * | 1998-09-29 | 2000-04-11 | Toshiba Corp | 高耐圧半導体装置 |
JP2001060688A (ja) * | 1999-08-23 | 2001-03-06 | Nec Corp | 半導体装置及びその製造方法 |
JP2001352063A (ja) * | 2000-06-09 | 2001-12-21 | Sanyo Electric Co Ltd | 絶縁ゲート型半導体装置 |
JP2002050760A (ja) * | 2000-08-03 | 2002-02-15 | Sanyo Electric Co Ltd | 絶縁ゲート型電界効果半導体装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009238872A (ja) * | 2008-03-26 | 2009-10-15 | Ricoh Co Ltd | 半導体装置及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP4944383B2 (ja) | 2012-05-30 |
US20060214240A1 (en) | 2006-09-28 |
US7521754B2 (en) | 2009-04-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10777548B2 (en) | Method for manufacturing semiconductor device | |
JP5687364B2 (ja) | 半導体装置 | |
JP7113221B2 (ja) | 炭化珪素半導体装置 | |
US7276405B2 (en) | Power semiconductor device having high breakdown voltage, low on-resistance and small switching loss and method of forming the same | |
JP2007116049A (ja) | 半導体装置 | |
JP6966844B2 (ja) | 半導体装置 | |
JP2005322949A (ja) | 半導体装置 | |
JP7289258B2 (ja) | 半導体装置 | |
US20070278613A1 (en) | Semiconductor device | |
JP3875245B2 (ja) | 半導体装置 | |
JP4944383B2 (ja) | 半導体装置 | |
JP4820899B2 (ja) | 半導体装置 | |
JP4749665B2 (ja) | 半導体装置 | |
WO2006081382A2 (en) | Power semiconductor device with endless gate trenches | |
JP7352360B2 (ja) | 半導体装置 | |
JP2004140086A (ja) | トレンチゲート型半導体装置 | |
US10622440B2 (en) | High voltage metal oxide semiconductor device and manufacturing method thereof | |
JP2004111772A (ja) | 絶縁ゲート型電界効果半導体装置 | |
US20070114601A1 (en) | Gate contact structure for a power device | |
JP4797484B2 (ja) | Flr領域を有する半導体素子 | |
JP2004349384A (ja) | 半導体装置 | |
JP2004281524A (ja) | 半導体装置 | |
JP5848619B2 (ja) | 半導体装置および半導体装置の製造方法 | |
JP2005136116A (ja) | 半導体素子およびその製造方法 | |
JP2023039219A (ja) | 半導体装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20080215 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110823 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20110825 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20111019 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20111206 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120203 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20120228 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20120302 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4944383 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150309 Year of fee payment: 3 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
LAPS | Cancellation because of no payment of annual fees |