JP2006173605A - パッケージングされた電子デバイス及びその製作方法 - Google Patents
パッケージングされた電子デバイス及びその製作方法 Download PDFInfo
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- JP2006173605A JP2006173605A JP2005353136A JP2005353136A JP2006173605A JP 2006173605 A JP2006173605 A JP 2006173605A JP 2005353136 A JP2005353136 A JP 2005353136A JP 2005353136 A JP2005353136 A JP 2005353136A JP 2006173605 A JP2006173605 A JP 2006173605A
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- 239000002184 metal Substances 0.000 claims abstract description 5
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- 239000000126 substance Substances 0.000 claims abstract description 3
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- 239000002131 composite material Substances 0.000 claims description 2
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 239000003566 sealing material Substances 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
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- 230000003014 reinforcing effect Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 229920006104 Amodel® Polymers 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 239000004954 Polyphthalamide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
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- 230000000994 depressogenic effect Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
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- 238000000926 separation method Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
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Abstract
【解決手段】金属、プラスチック、シリコン等の基板200上に電気接続部202、204、206が形成され、電気接続部204の上にLED等の電子デバイス208が接着剤218等によって固定される。ワイヤボンド210、212が接続された後、固定剤214が供給され、固化して電子デバイス208が電気接続部204に固定される。基板200は、機械的、あるいは化学的な方法によって除去され、電気接続部202、204、206は固定剤214の一面で露出した状態となり、パッケージの接続部を構成する。パッケージの製造プロセス中で必要であった基板200が最終的に除去されることで、パッケージ全体としての高さが減じられて薄型化が達成される。
【選択図】図2C
Description
202、204、206、502、504、602、604、702、704、706、802、804、1204、1206、1208、1210:電気接続部
208:電子デバイス
214:固定剤
708:リフレクタカップ
1212:LED
1218、1220:バイア
1222:透明封止剤
Claims (10)
- 電子デバイスをパッケージングする方法であって、
前記電子デバイスを基板上の電気接続部へ電気的に接続することと、
前記電子デバイスを前記電気接続部に固定する為に固定剤を供給することと、
前記電気接続部をパッケージの接続部として露出させる為に前記基板の少なくとも一部分を除去することと
を有することを特徴とする方法。 - 前記電子デバイスが発光ダイオードであることを特徴とする請求項1に記載の方法。
- 前記固定剤が透明であることを特徴とする請求項1又は2に記載の方法。
- 前記基板上に前記電気接続部を形成することを更に有し、前記電気接続部が不均一な厚さに形成されるものであることを特徴とする請求項1に記載の方法。
- 前記電気接続部がリフレクタカップを備えるように形成され、前記電子デバイスを前記リフレクタカップ中に搭載することを更に有することを特徴とする請求項4に記載の方法。
- 前記電気接続部の、前記固定剤が供給される側の面にスロットが設けられることを特徴とする請求項4に記載の方法。
- 前記基板が、半導体、ポリマー、プラスチック複合材、及び金属を含むグループから選択された材料で形成されることを特徴とする請求項1に記載の方法。
- 前記基板が機械的な処理により少なくとも部分的に除去されることを特徴とする請求項1に記載の方法。
- 前記基板が化学的な処理により少なくとも部分的に除去されることを特徴とする請求項1に記載の方法。
- 電子デバイスと、
前記電子デバイスに電気的に接続される電気接続部と、
前記電子デバイスを前記電気接続部へ固定する固定剤と
を具備し、
前記固定剤が前記電子デバイスのパッケージを提供するものであり、
前記電気接続部が前記固定剤中に埋め込まれ、前記固定剤の一面において露出している
ことを特徴とする、パッケージングされた電子デバイス。
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US11/014,646 US20060131708A1 (en) | 2004-12-16 | 2004-12-16 | Packaged electronic devices, and method for making same |
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JP2012180460A Division JP2013016819A (ja) | 2004-12-16 | 2012-08-16 | パッケージングされた電子デバイス及びその製作方法 |
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JP2006173605A true JP2006173605A (ja) | 2006-06-29 |
JP2006173605A5 JP2006173605A5 (ja) | 2008-11-27 |
Family
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JP2005353136A Pending JP2006173605A (ja) | 2004-12-16 | 2005-12-07 | パッケージングされた電子デバイス及びその製作方法 |
JP2012180460A Pending JP2013016819A (ja) | 2004-12-16 | 2012-08-16 | パッケージングされた電子デバイス及びその製作方法 |
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JP2012180460A Pending JP2013016819A (ja) | 2004-12-16 | 2012-08-16 | パッケージングされた電子デバイス及びその製作方法 |
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JP (2) | JP2006173605A (ja) |
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JP2011096970A (ja) * | 2009-11-02 | 2011-05-12 | Dainippon Printing Co Ltd | Led素子載置部材、led素子載置基板およびその製造方法、ならびにled素子パッケージおよびその製造方法 |
JP2011129876A (ja) * | 2009-11-17 | 2011-06-30 | Stanley Electric Co Ltd | 発光装置およびその製造方法 |
JP2011134961A (ja) * | 2009-12-25 | 2011-07-07 | Hitachi Chem Co Ltd | 半導体装置、半導体素子搭載接続用配線基材、半導体装置搭載配線板及びそれらの製造法 |
JP2011151323A (ja) * | 2010-01-25 | 2011-08-04 | Dainippon Printing Co Ltd | 樹脂付リードフレームおよびその製造方法、ならびにled素子パッケージおよびその製造方法 |
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JP2012028630A (ja) * | 2010-07-26 | 2012-02-09 | Dainippon Printing Co Ltd | Led用リードフレームまたは基板およびその製造方法、ならびに半導体装置およびその製造方法 |
US9773960B2 (en) | 2010-11-02 | 2017-09-26 | Dai Nippon Printing Co., Ltd. | Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements |
JP2015185619A (ja) * | 2014-03-20 | 2015-10-22 | 日立マクセル株式会社 | 半導体装置用基板、当該基板の製造方法、半導体装置、及び半導体装置の製造方法 |
JP2015065470A (ja) * | 2014-12-08 | 2015-04-09 | 日亜化学工業株式会社 | 発光装置の製造方法 |
JP2015133524A (ja) * | 2015-04-23 | 2015-07-23 | 日亜化学工業株式会社 | 光半導体装置及びその製造方法 |
JP2016029747A (ja) * | 2015-12-01 | 2016-03-03 | 大日本印刷株式会社 | Led素子載置部材、led素子載置基板およびその製造方法、ならびにled素子パッケージおよびその製造方法 |
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