JP2005286103A - 真空処理装置及び真空処理方法 - Google Patents
真空処理装置及び真空処理方法 Download PDFInfo
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- JP2005286103A JP2005286103A JP2004097774A JP2004097774A JP2005286103A JP 2005286103 A JP2005286103 A JP 2005286103A JP 2004097774 A JP2004097774 A JP 2004097774A JP 2004097774 A JP2004097774 A JP 2004097774A JP 2005286103 A JP2005286103 A JP 2005286103A
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- 238000012545 processing Methods 0.000 title claims abstract description 89
- 238000000034 method Methods 0.000 title description 12
- 238000003672 processing method Methods 0.000 claims abstract description 15
- 235000012431 wafers Nutrition 0.000 description 17
- 239000007789 gas Substances 0.000 description 10
- 238000005530 etching Methods 0.000 description 6
- 238000010926 purge Methods 0.000 description 3
- 238000004380 ashing Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000012805 post-processing Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
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-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Drying Of Semiconductors (AREA)
Abstract
【解決手段】 試料2を真空処理する複数の真空処理室7と、真空処理室7に試料を搬入出する真空搬送手段8と、真空処理室へ試料を搬入出するための大気雰囲気もしくは真空雰囲気に切り替え可能な室9と、試料を収納できる複数のカセットを載置し得るカセット載置手段10と、カセット載置手段の任意のカセット内から試料を抜き取れるように上下動可能に構成された搬送手段4と、任意のカセット内の試料を前記搬送手段及び前記切り替え可能な室並びに前記真空搬送手段を介して前記真空処理室に搬入し・前記真空処理室で処理後の処理済試料を搬出するための搬送制御を行う制御手段とで構成された真空処理装置1において、同一カセットに処理済試料と未処理の試料とを混在させないための待避カセット5を載置し得る待避カセット載置手段を設けた。
【選択図】 図1
Description
2.試料+
3.カセット
4.大気搬送手段
5.待避カセット
6.真空待避室
7.真空処理室
8.真空搬送機構
9.大気・真空雰囲気切替室
10.カセット載置機構
Claims (11)
- 試料を真空処理する複数の真空処理室と、該真空処理室に試料を搬入出する真空搬送手段と、前記真空処理室へ試料を搬入出するための大気雰囲気もしくは真空雰囲気に切り替え可能な室と、試料を収納できる複数のカセットを載置し得るカセット載置手段と、該カセット載置手段の任意のカセット内から試料を抜き取れるように上下動可能に構成された搬送手段と、前記任意のカセット内の試料を前記搬送手段及び前記切り替え可能な室並びに前記真空搬送手段を介して前記真空処理室に搬入し・前記真空処理室で処理後の処理済試料を搬出するための搬送制御を行う制御手段とで構成された真空処理装置において、
前記処理済試料と未処理の試料とを混在させないための待避カセットを載置し得る待避カセット載置手段を設けたことを特徴とする真空処理装置。 - 請求項1記載の真空処理装置において、前記待避カセット載置手段は、大気雰囲気下に設けられ、処理済試料を待避させる待避カセットを載置し得ることを特徴とする真空処理装置。
- 請求項1記載の真空処理装置において、前記待避カセット載置手段は、大気雰囲気下に設けられ、未処理の試料を待避させる待避カセットを載置し得ることを特徴とする真空処理装置。
- 請求項1記載の真空処理装置において、前記待避カセット載置手段は、真空雰囲気内に設けられ、処理済試料を待避させる待避室を具備することを特徴とする真空処理装置。
- 請求項2乃至4記載のいずれかの真空処理装置において、任意のカセットから未処理の試料が全て搬出されるまで前記処理済試料または前記未処理の試料を待避させる待避カセットを載置し得ることを特徴とする真空処理装置。
- 請求項1記載の真空処理装置において、前記待避カセット載置手段は、大気雰囲気下に設けられ、上下動又は左右動可能に構成されていることを特徴とする真空処理装置。
- カセット載置手段に載置される任意のカセット内から試料を抜き取り、大気雰囲気もしくは真空雰囲気に切り替え可能な室を経由して真空処理室に搬入し・試料を真空処理する真空処理方法において、
前記未処理の試料または処理済試料を待避カセットに待避させて試料を真空処理することを特徴とする真空処理方法。 - 請求項7記載の真空処理方法において、前記処理済試料を大気雰囲気下に載置される待避カセットに待避させて試料を真空処理することを特徴とする真空処理方法。
- 請求項7記載の真空処理方法において、前記未処理の試料を大気雰囲気下に載置される待避カセットに待避させて試料を真空処理することを特徴とする真空処理方法。
- 請求項7記載の真空処理方法において、前記処理済試料を真空雰囲気内に設けられた待避室に待避させて試料を真空処理することを特徴とする真空処理方法。
- 請求項8乃至10記載のいずれかの真空処理方法において、任意のカセットから未処理の試料がずべて搬出されるまで前記処理済試料または前記未処理の試料を待避させて試料を真空処理することを特徴とする真空処理方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004097774A JP4128973B2 (ja) | 2004-03-30 | 2004-03-30 | 真空処理装置及び真空処理方法 |
US10/874,241 US7476073B2 (en) | 2004-03-30 | 2004-06-24 | Vacuum processing method |
US12/230,466 US8033770B2 (en) | 2004-03-30 | 2008-08-29 | Vacuum processing apparatus |
US12/230,467 US7862289B2 (en) | 2004-03-30 | 2008-08-29 | Vacuum processing apparatus and vacuum processing method |
US13/209,871 US20110299962A1 (en) | 2004-03-30 | 2011-08-15 | Vacuum Processing Apparatus And Vacuum Processing Method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004097774A JP4128973B2 (ja) | 2004-03-30 | 2004-03-30 | 真空処理装置及び真空処理方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2008108839A Division JP4546556B2 (ja) | 2008-04-18 | 2008-04-18 | 真空処理装置及び真空処理方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005286103A true JP2005286103A (ja) | 2005-10-13 |
JP2005286103A5 JP2005286103A5 (ja) | 2006-12-28 |
JP4128973B2 JP4128973B2 (ja) | 2008-07-30 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2004097774A Expired - Lifetime JP4128973B2 (ja) | 2004-03-30 | 2004-03-30 | 真空処理装置及び真空処理方法 |
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US (4) | US7476073B2 (ja) |
JP (1) | JP4128973B2 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05147707A (ja) * | 1991-11-27 | 1993-06-15 | Murata Mach Ltd | ピツキング台車 |
JPH0936198A (ja) * | 1995-07-19 | 1997-02-07 | Hitachi Ltd | 真空処理装置およびそれを用いた半導体製造ライン |
JP4128973B2 (ja) * | 2004-03-30 | 2008-07-30 | 株式会社日立ハイテクノロジーズ | 真空処理装置及び真空処理方法 |
TWI278416B (en) * | 2004-12-09 | 2007-04-11 | Au Optronics Corp | Cassette stocker |
US20080206020A1 (en) * | 2007-02-27 | 2008-08-28 | Smith John M | Flat-panel display processing tool with storage bays and multi-axis robot arms |
US7585142B2 (en) * | 2007-03-16 | 2009-09-08 | Asm America, Inc. | Substrate handling chamber with movable substrate carrier loading platform |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62216315A (ja) | 1986-03-18 | 1987-09-22 | Toshiba Mach Co Ltd | 半導体処理装置 |
US5292393A (en) * | 1986-12-19 | 1994-03-08 | Applied Materials, Inc. | Multichamber integrated process system |
JP2644912B2 (ja) * | 1990-08-29 | 1997-08-25 | 株式会社日立製作所 | 真空処理装置及びその運転方法 |
US6257827B1 (en) * | 1997-12-01 | 2001-07-10 | Brooks Automation Inc. | Apparatus and method for transporting substrates |
JP3667527B2 (ja) | 1998-05-20 | 2005-07-06 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP4674705B2 (ja) * | 1998-10-27 | 2011-04-20 | 東京エレクトロン株式会社 | 搬送システムの搬送位置合わせ方法及び搬送システム |
US6811369B2 (en) * | 1999-09-02 | 2004-11-02 | Canon Kabushiki Kaisha | Semiconductor fabrication apparatus, pod carry apparatus, pod carry method, and semiconductor device production method |
JP2001093791A (ja) | 1999-09-20 | 2001-04-06 | Hitachi Ltd | 真空処理装置の運転方法及びウエハの処理方法 |
JP2000216211A (ja) | 2000-01-01 | 2000-08-04 | Hitachi Ltd | 真空処理装置用の基板搬送システム |
US6962471B2 (en) * | 2000-10-26 | 2005-11-08 | Leica Microsystems Jena Gmbh | Substrate conveying module and system made up of substrate conveying module and workstation |
US6451118B1 (en) * | 2000-11-14 | 2002-09-17 | Anon, Inc. | Cluster tool architecture for sulfur trioxide processing |
US6852194B2 (en) * | 2001-05-21 | 2005-02-08 | Tokyo Electron Limited | Processing apparatus, transferring apparatus and transferring method |
JP4219579B2 (ja) * | 2001-07-24 | 2009-02-04 | 東京エレクトロン株式会社 | ウエハ移載システム及びウエハ移載方法、並びに無人搬送車システム |
JP2003115518A (ja) | 2001-10-02 | 2003-04-18 | Hitachi Kokusai Electric Inc | 基板処理装置 |
JP4128973B2 (ja) * | 2004-03-30 | 2008-07-30 | 株式会社日立ハイテクノロジーズ | 真空処理装置及び真空処理方法 |
-
2004
- 2004-03-30 JP JP2004097774A patent/JP4128973B2/ja not_active Expired - Lifetime
- 2004-06-24 US US10/874,241 patent/US7476073B2/en active Active
-
2008
- 2008-08-29 US US12/230,467 patent/US7862289B2/en active Active
- 2008-08-29 US US12/230,466 patent/US8033770B2/en not_active Expired - Lifetime
-
2011
- 2011-08-15 US US13/209,871 patent/US20110299962A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US7862289B2 (en) | 2011-01-04 |
US7476073B2 (en) | 2009-01-13 |
US20050220575A1 (en) | 2005-10-06 |
US20110299962A1 (en) | 2011-12-08 |
US8033770B2 (en) | 2011-10-11 |
US20090003978A1 (en) | 2009-01-01 |
JP4128973B2 (ja) | 2008-07-30 |
US20090010738A1 (en) | 2009-01-08 |
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