JP2005064457A - 熱電変換装置 - Google Patents
熱電変換装置 Download PDFInfo
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- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
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- H10N10/81—Structural details of the junction
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- H—ELECTRICITY
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- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/01—Manufacture or treatment
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
【解決手段】 熱電変換装置1は、各々の熱電素子が配置されるべき位置に対応して配列される複数の放熱側電極13が、平面をなす放熱側基板14の表面にアレイ状に配列され、複数のp型熱電素子10およびn型熱電素子11について、これら熱電素子の吸熱側端面に吸熱側電極5を摺接させるとともに、それぞれの熱電素子10,11の放熱側端面と放熱側電極13とは、はんだ12によって接合されている。
【選択図】 図1
Description
を具備する熱電変換装置を提供する。
また、前記熱電素子と前記電極部材との間に設けられる導電性素材による変形可能な構造部材を有することが好ましい。
、熱電素子には、スクッテルダイト構造を有するp型およびn型の熱電素子を使用した。p型ならびにn型とは、熱を加えたときの電流の生じる方向が熱の勾配の方向に対して互いに逆向きとなるような関係に構成されたものを示す。p型およびn型の熱電素子10,11を放熱側電極13ならびに吸熱側電極5によって直列に接続することにより、起電力の電圧を昇圧している。すなわち、電流は、p型熱電素子10とn型熱電素子11とを交互に通過して外部配線18から取り出される。
5…吸熱側電極、6…金属細線、7…コバールリング、8…銀ろう、
9…枠、10…p型熱電素子、11…n型熱電素子、12…はんだ、
13…放熱側電極、14…放熱側基板、15…金属被膜、16…スルーホール、
17…はんだ、18…外部配線、19…絶縁樹脂、20…組立治具
Claims (9)
- 配線基板と、
前記配線基板上に一端面が固着され立設された複数の熱電素子と、
複数の前記熱電素子の他端面に接触するよう配置される複数の電極部材と、
前記熱電素子の一端面から他端面方向に圧力が加えられるように配置されることによって複数の前記熱電素子と複数の前記電極部材とを保持する蓋部と、
前記配線基板と前記蓋部との相対位置を保持する結合部材と、
を具備することを特徴とする熱電変換装置。 - 前記電極部材は、前記熱電素子が圧接されている領域を囲うように設けられ、前記熱電素子の位置を規制する凸部を有することを特徴とする請求項1記載の熱電変換装置。
- 前記電極部材は、前記熱電素子を直列に接続するように配置されていることを特徴とする請求項1記載の熱電変換装置。
- 前記熱電素子と前記電極部材との間に設けられる導電性素材による変形可能な構造部材を有することを特徴とする請求項1記載の熱電変換装置。
- 熱電素子の位置を規制する絶縁部材が、離間して配置される前記熱電素子の間に配置されていることを特徴とする請求項1記載の熱電変換装置。
- 前記電極部材により囲われた熱電素子間の間隔を、当該電熱素子と当該電極部材に隣接する電極部材により囲われた熱電素子との間隔よりも短くしたことを特徴とする請求項2記載の熱電変換装置。
- 前記結合部材は、ろう材によって前記配線基板に接合されるものであって、前記結合部材のろう材との接合面を面取り形状にしたことを特徴とする請求項1記載の熱電変換装置。
- 前記結合部材の前記蓋部との接触部分に外側へ折り返す折返部を設けたことを特徴とする請求項1記載の熱電変換装置。
- 前記蓋部に圧力が加えられる方向に折れ曲がる折曲部を設けたことを特徴とする請求項1記載の熱電変換装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004090250A JP4488778B2 (ja) | 2003-07-25 | 2004-03-25 | 熱電変換装置 |
EP04017514.3A EP1505662B1 (en) | 2003-07-25 | 2004-07-23 | Thermoelectric device |
US10/896,998 US7024865B2 (en) | 2003-07-25 | 2004-07-23 | Thermoelectric device |
CNB2004100951624A CN100449811C (zh) | 2003-07-25 | 2004-07-23 | 热电变换装置 |
US11/344,118 US7278199B2 (en) | 2003-07-25 | 2006-02-01 | Method of making a thermoelectric device |
US11/694,073 US20070256427A1 (en) | 2003-07-25 | 2007-03-30 | Thermoelectric device |
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JP2003202121 | 2003-07-25 | ||
JP2004090250A JP4488778B2 (ja) | 2003-07-25 | 2004-03-25 | 熱電変換装置 |
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JP2005064457A true JP2005064457A (ja) | 2005-03-10 |
JP4488778B2 JP4488778B2 (ja) | 2010-06-23 |
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JP2004090250A Expired - Fee Related JP4488778B2 (ja) | 2003-07-25 | 2004-03-25 | 熱電変換装置 |
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US (3) | US7024865B2 (ja) |
EP (1) | EP1505662B1 (ja) |
JP (1) | JP4488778B2 (ja) |
CN (1) | CN100449811C (ja) |
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JP2007110082A (ja) * | 2005-08-02 | 2007-04-26 | Toshiba Corp | 熱電変換装置及びその製造方法 |
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WO2018151176A1 (ja) * | 2017-02-15 | 2018-08-23 | 日本特殊陶業株式会社 | 熱電素子内蔵パッケージ |
JPWO2018151176A1 (ja) * | 2017-02-15 | 2019-07-18 | 日本特殊陶業株式会社 | 熱電素子内蔵パッケージ |
Also Published As
Publication number | Publication date |
---|---|
EP1505662A2 (en) | 2005-02-09 |
US20070256427A1 (en) | 2007-11-08 |
US20060123799A1 (en) | 2006-06-15 |
US7278199B2 (en) | 2007-10-09 |
EP1505662B1 (en) | 2013-08-21 |
CN1604353A (zh) | 2005-04-06 |
JP4488778B2 (ja) | 2010-06-23 |
CN100449811C (zh) | 2009-01-07 |
US20050016183A1 (en) | 2005-01-27 |
US7024865B2 (en) | 2006-04-11 |
EP1505662A3 (en) | 2008-02-20 |
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