HK1165093A1 - 半導體發光設備 - Google Patents
半導體發光設備Info
- Publication number
- HK1165093A1 HK1165093A1 HK12105596.3A HK12105596A HK1165093A1 HK 1165093 A1 HK1165093 A1 HK 1165093A1 HK 12105596 A HK12105596 A HK 12105596A HK 1165093 A1 HK1165093 A1 HK 1165093A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- light emitting
- emitting device
- semiconductor light
- semiconductor
- light
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010130509A JP5343040B2 (ja) | 2010-06-07 | 2010-06-07 | 半導体発光装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1165093A1 true HK1165093A1 (zh) | 2012-09-28 |
Family
ID=44721176
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK12105596.3A HK1165093A1 (zh) | 2010-06-07 | 2012-06-07 | 半導體發光設備 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8692279B2 (zh) |
EP (1) | EP2393132B1 (zh) |
JP (1) | JP5343040B2 (zh) |
CN (1) | CN102270722B (zh) |
HK (1) | HK1165093A1 (zh) |
TW (1) | TWI462336B (zh) |
Families Citing this family (52)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010517274A (ja) | 2007-01-22 | 2010-05-20 | クリー レッド ライティング ソリューションズ、インコーポレイテッド | 外部で相互接続された発光素子のアレイを用いる照明デバイスとその製造方法 |
JP5642623B2 (ja) | 2011-05-17 | 2014-12-17 | 株式会社東芝 | 半導体発光装置 |
JP5662277B2 (ja) | 2011-08-08 | 2015-01-28 | 株式会社東芝 | 半導体発光装置及び発光モジュール |
JP2013065726A (ja) | 2011-09-16 | 2013-04-11 | Toshiba Corp | 半導体発光装置及びその製造方法 |
JP2013140942A (ja) | 2011-12-07 | 2013-07-18 | Toshiba Corp | 半導体発光装置 |
US20130240934A1 (en) * | 2012-03-14 | 2013-09-19 | Samsung Electronics Co., Ltd. | Light emitting element package and method of manufacturing the same |
JP5985322B2 (ja) | 2012-03-23 | 2016-09-06 | 株式会社東芝 | 半導体発光装置及びその製造方法 |
CN104205366B (zh) * | 2012-03-30 | 2018-08-31 | 亮锐控股有限公司 | 密封的半导体发光器件 |
TWI447961B (zh) * | 2012-04-16 | 2014-08-01 | Lextar Electronics Corp | 發光二極體封裝體 |
JP5816127B2 (ja) * | 2012-04-27 | 2015-11-18 | 株式会社東芝 | 半導体発光装置およびその製造方法 |
JP5845134B2 (ja) * | 2012-04-27 | 2016-01-20 | 株式会社東芝 | 波長変換体および半導体発光装置 |
JP5982179B2 (ja) * | 2012-05-28 | 2016-08-31 | 株式会社東芝 | 半導体発光装置およびその製造方法 |
JP5989420B2 (ja) | 2012-06-28 | 2016-09-07 | 株式会社東芝 | 半導体発光装置 |
US11792898B2 (en) | 2012-07-01 | 2023-10-17 | Ideal Industries Lighting Llc | Enhanced fixtures for area lighting |
US11160148B2 (en) | 2017-06-13 | 2021-10-26 | Ideal Industries Lighting Llc | Adaptive area lamp |
KR101740531B1 (ko) * | 2012-07-02 | 2017-06-08 | 서울바이오시스 주식회사 | 표면 실장용 발광 다이오드 모듈 및 이의 제조방법. |
US9461212B2 (en) | 2012-07-02 | 2016-10-04 | Seoul Viosys Co., Ltd. | Light emitting diode module for surface mount technology and method of manufacturing the same |
TWI572068B (zh) | 2012-12-07 | 2017-02-21 | 晶元光電股份有限公司 | 發光元件 |
JP5377725B1 (ja) | 2012-08-21 | 2013-12-25 | 株式会社東芝 | 半導体発光素子 |
JP6029912B2 (ja) * | 2012-09-25 | 2016-11-24 | スタンレー電気株式会社 | 半導体発光素子 |
JP6580299B2 (ja) * | 2013-02-12 | 2019-09-25 | 日亜化学工業株式会社 | 発光装置 |
CN103227261B (zh) * | 2013-04-26 | 2015-10-07 | 东莞市福地电子材料有限公司 | Led倒装芯片 |
KR102075147B1 (ko) * | 2013-06-05 | 2020-02-10 | 엘지이노텍 주식회사 | 발광 소자 및 발광 소자 패키지 |
JP6180801B2 (ja) * | 2013-06-07 | 2017-08-16 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP2015079929A (ja) * | 2013-09-11 | 2015-04-23 | 株式会社東芝 | 半導体発光装置及びその製造方法 |
US10304998B2 (en) * | 2013-09-27 | 2019-05-28 | Seoul Viosys Co., Ltd. | Light emitting diode chip and light emitting device having the same |
JP6182050B2 (ja) | 2013-10-28 | 2017-08-16 | 株式会社東芝 | 半導体発光装置 |
JP2015173142A (ja) * | 2014-03-11 | 2015-10-01 | 株式会社東芝 | 半導体発光装置 |
TWI548117B (zh) * | 2014-03-27 | 2016-09-01 | Toshiba Kk | Semiconductor light emitting device and manufacturing method thereof |
JP6185415B2 (ja) * | 2014-03-27 | 2017-08-23 | 株式会社東芝 | 半導体発光装置 |
JP2015195332A (ja) * | 2014-03-27 | 2015-11-05 | 株式会社東芝 | 半導体発光装置及びその製造方法 |
KR20160025782A (ko) * | 2014-08-28 | 2016-03-09 | 엘지이노텍 주식회사 | 발광 소자 패키지 |
US9433050B2 (en) * | 2014-10-08 | 2016-08-30 | Mikro Mesa Technology Co., Ltd. | Micro-light-emitting diode |
JP6619966B2 (ja) * | 2015-08-21 | 2019-12-11 | アルパッド株式会社 | 半導体発光装置 |
JP2017059700A (ja) * | 2015-09-17 | 2017-03-23 | サンケン電気株式会社 | 半導体発光装置及びその製造方法 |
DE102015115722A1 (de) * | 2015-09-17 | 2017-03-23 | Osram Opto Semiconductors Gmbh | Träger für ein Bauelement, Bauelement und Verfahren zur Herstellung eines Trägers oder eines Bauelements |
CN111987210A (zh) * | 2015-11-18 | 2020-11-24 | 晶元光电股份有限公司 | 发光元件 |
EP3428979A4 (en) * | 2016-03-08 | 2019-10-02 | ALPAD Corporation | LIGHT-EMITTING SEMICONDUCTOR ELEMENT |
US10529696B2 (en) | 2016-04-12 | 2020-01-07 | Cree, Inc. | High density pixelated LED and devices and methods thereof |
KR102501181B1 (ko) * | 2016-06-14 | 2023-02-17 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 반도체 소자 |
EP3511990B1 (en) * | 2016-09-10 | 2023-12-13 | Suzhou Lekin Semiconductor Co., Ltd. | Semiconductor device |
WO2018048154A1 (ko) * | 2016-09-12 | 2018-03-15 | 서울바이오시스 주식회사 | 발광 구조물을 포함하는 반도체 발광 소자 |
KR102588170B1 (ko) | 2016-11-16 | 2023-10-13 | 삼성전자주식회사 | 다층 구조의 반사막을 구비한 반도체 발광 소자 |
US10651357B2 (en) | 2017-08-03 | 2020-05-12 | Cree, Inc. | High density pixelated-led chips and chip array devices |
US10734363B2 (en) | 2017-08-03 | 2020-08-04 | Cree, Inc. | High density pixelated-LED chips and chip array devices |
US10529773B2 (en) | 2018-02-14 | 2020-01-07 | Cree, Inc. | Solid state lighting devices with opposing emission directions |
JP7101032B2 (ja) * | 2018-04-23 | 2022-07-14 | 旭化成株式会社 | 窒化物半導体発光素子 |
US10903265B2 (en) | 2018-12-21 | 2021-01-26 | Cree, Inc. | Pixelated-LED chips and chip array devices, and fabrication methods |
EP4052296A1 (en) | 2019-10-29 | 2022-09-07 | Creeled, Inc. | Texturing for high density pixelated-led chips |
CN112768484B (zh) * | 2019-11-04 | 2024-03-26 | 厦门三安光电有限公司 | 发光二极管及其制作方法 |
JP7216296B2 (ja) * | 2020-09-30 | 2023-02-01 | 日亜化学工業株式会社 | 発光素子及び発光装置 |
US11437548B2 (en) | 2020-10-23 | 2022-09-06 | Creeled, Inc. | Pixelated-LED chips with inter-pixel underfill materials, and fabrication methods |
Family Cites Families (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2661420B2 (ja) | 1991-07-16 | 1997-10-08 | 豊田合成株式会社 | 窒化ガリウム系化合物半導体発光素子の製造方法 |
JPH07254732A (ja) * | 1994-03-15 | 1995-10-03 | Toshiba Corp | 半導体発光装置 |
US6633120B2 (en) * | 1998-11-19 | 2003-10-14 | Unisplay S.A. | LED lamps |
US6307218B1 (en) * | 1998-11-20 | 2001-10-23 | Lumileds Lighting, U.S., Llc | Electrode structures for light emitting devices |
US6331450B1 (en) * | 1998-12-22 | 2001-12-18 | Toyoda Gosei Co., Ltd. | Method of manufacturing semiconductor device using group III nitride compound |
JP2000244012A (ja) | 1998-12-22 | 2000-09-08 | Toyoda Gosei Co Ltd | Iii族窒化物系化合物半導体素子の製造方法 |
US6614056B1 (en) * | 1999-12-01 | 2003-09-02 | Cree Lighting Company | Scalable led with improved current spreading structures |
WO2002089221A1 (en) * | 2001-04-23 | 2002-11-07 | Matsushita Electric Works, Ltd. | Light emitting device comprising led chip |
JP2003017757A (ja) * | 2001-06-29 | 2003-01-17 | Sanken Electric Co Ltd | フリップチップ形半導体発光素子 |
JP4214704B2 (ja) * | 2002-03-20 | 2009-01-28 | 日亜化学工業株式会社 | 半導体素子 |
EP1603170B1 (en) | 2003-03-10 | 2018-08-01 | Toyoda Gosei Co., Ltd. | Method for manufacturing a solid-state optical element device |
KR100576853B1 (ko) * | 2003-12-18 | 2006-05-10 | 삼성전기주식회사 | 질화물 반도체 발광소자 |
US7179670B2 (en) * | 2004-03-05 | 2007-02-20 | Gelcore, Llc | Flip-chip light emitting diode device without sub-mount |
JP2006086469A (ja) * | 2004-09-17 | 2006-03-30 | Matsushita Electric Ind Co Ltd | 半導体発光装置、照明モジュール、照明装置及び半導体発光装置の製造方法 |
US20060113548A1 (en) * | 2004-11-29 | 2006-06-01 | Ching-Chung Chen | Light emitting diode |
US7535028B2 (en) * | 2005-02-03 | 2009-05-19 | Ac Led Lighting, L.Lc. | Micro-LED based high voltage AC/DC indicator lamp |
US7341878B2 (en) * | 2005-03-14 | 2008-03-11 | Philips Lumileds Lighting Company, Llc | Wavelength-converted semiconductor light emitting device |
JP2007288097A (ja) * | 2006-04-20 | 2007-11-01 | Showa Denko Kk | フリップチップ型半導体発光素子用の実装基板、フリップチップ型半導体発光素子の実装構造及び発光ダイオードランプ |
JP2007184411A (ja) * | 2006-01-06 | 2007-07-19 | Sony Corp | 発光ダイオードおよびその製造方法ならびに集積型発光ダイオードおよびその製造方法ならびに発光ダイオードバックライトならびに発光ダイオード照明装置ならびに発光ダイオードディスプレイならびに電子機器ならびに電子装置およびその製造方法 |
DE102007019776A1 (de) | 2007-04-26 | 2008-10-30 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zur Herstellung einer Mehrzahl optoelektronischer Bauelemente |
US7867793B2 (en) * | 2007-07-09 | 2011-01-11 | Koninklijke Philips Electronics N.V. | Substrate removal during LED formation |
DE102007062046B4 (de) * | 2007-12-21 | 2023-09-07 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Lichtemittierende Bauelementeanordnung, lichtemittierendes Bauelement sowie Verfahren zum Herstellen einer Mehrzahl von lichtemittierenden Bauelementen |
JP2010027768A (ja) * | 2008-07-17 | 2010-02-04 | Toyoda Gosei Co Ltd | 発光装置及び発光装置の製造方法 |
US9117944B2 (en) * | 2008-09-24 | 2015-08-25 | Koninklijke Philips N.V. | Semiconductor light emitting devices grown on composite substrates |
JP4799606B2 (ja) | 2008-12-08 | 2011-10-26 | 株式会社東芝 | 光半導体装置及び光半導体装置の製造方法 |
JP4724222B2 (ja) * | 2008-12-12 | 2011-07-13 | 株式会社東芝 | 発光装置の製造方法 |
JP5431818B2 (ja) * | 2009-07-21 | 2014-03-05 | シチズン電子株式会社 | 発光ダイオード光源装置 |
JP5101645B2 (ja) | 2010-02-24 | 2012-12-19 | 株式会社東芝 | 半導体発光装置 |
JP2011199193A (ja) * | 2010-03-23 | 2011-10-06 | Toshiba Corp | 発光装置及びその製造方法 |
JP5101650B2 (ja) * | 2010-03-25 | 2012-12-19 | 株式会社東芝 | 半導体発光装置及びその製造方法 |
JP5356312B2 (ja) * | 2010-05-24 | 2013-12-04 | 株式会社東芝 | 半導体発光装置 |
US9490235B2 (en) * | 2010-11-22 | 2016-11-08 | Cree, Inc. | Light emitting devices, systems, and methods |
-
2010
- 2010-06-07 JP JP2010130509A patent/JP5343040B2/ja active Active
-
2011
- 2011-03-09 TW TW100107920A patent/TWI462336B/zh active
- 2011-03-17 CN CN201110070617.7A patent/CN102270722B/zh active Active
- 2011-03-21 US US13/052,248 patent/US8692279B2/en active Active
- 2011-03-22 EP EP11159169.9A patent/EP2393132B1/en active Active
-
2012
- 2012-06-07 HK HK12105596.3A patent/HK1165093A1/zh unknown
Also Published As
Publication number | Publication date |
---|---|
JP5343040B2 (ja) | 2013-11-13 |
JP2011258670A (ja) | 2011-12-22 |
US20110297997A1 (en) | 2011-12-08 |
EP2393132A3 (en) | 2011-12-21 |
EP2393132B1 (en) | 2015-12-02 |
TWI462336B (zh) | 2014-11-21 |
CN102270722A (zh) | 2011-12-07 |
TW201208121A (en) | 2012-02-16 |
EP2393132A2 (en) | 2011-12-07 |
US8692279B2 (en) | 2014-04-08 |
CN102270722B (zh) | 2014-09-17 |
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