HK1045965A1 - 電力不粘結材料 - Google Patents

電力不粘結材料

Info

Publication number
HK1045965A1
HK1045965A1 HK02107349.1A HK02107349A HK1045965A1 HK 1045965 A1 HK1045965 A1 HK 1045965A1 HK 02107349 A HK02107349 A HK 02107349A HK 1045965 A1 HK1045965 A1 HK 1045965A1
Authority
HK
Hong Kong
Prior art keywords
composition
functionality
electrolyte
materials
matrix
Prior art date
Application number
HK02107349.1A
Other languages
English (en)
Inventor
D Gilbert Michael
Original Assignee
Eic Laboratories Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eic Laboratories Inc filed Critical Eic Laboratories Inc
Publication of HK1045965A1 publication Critical patent/HK1045965A1/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/748—Releasability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2405/00—Adhesive articles, e.g. adhesive tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
    • C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1153—Temperature change for delamination [e.g., heating during delaminating, etc.]
    • Y10T156/1158—Electromagnetic radiation applied to work for delamination [e.g., microwave, uv, ir, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Paints Or Removers (AREA)
  • Electrotherapy Devices (AREA)
  • Graft Or Block Polymers (AREA)
  • Walking Sticks, Umbrellas, And Fans (AREA)
  • Insulators (AREA)
  • Cold Cathode And The Manufacture (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
HK02107349.1A 1999-07-14 2002-10-08 電力不粘結材料 HK1045965A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/352,976 US7332218B1 (en) 1999-07-14 1999-07-14 Electrically disbonding materials
PCT/US2000/018419 WO2001005584A1 (en) 1999-07-14 2000-07-05 Electrically disbonding materials

Publications (1)

Publication Number Publication Date
HK1045965A1 true HK1045965A1 (zh) 2002-12-20

Family

ID=23387243

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02107349.1A HK1045965A1 (zh) 1999-07-14 2002-10-08 電力不粘結材料

Country Status (9)

Country Link
US (4) US7332218B1 (zh)
EP (1) EP1200252B1 (zh)
JP (2) JP3361328B1 (zh)
AT (1) ATE339301T1 (zh)
CA (1) CA2341417C (zh)
DE (1) DE60030727T2 (zh)
ES (1) ES2270851T3 (zh)
HK (1) HK1045965A1 (zh)
WO (1) WO2001005584A1 (zh)

Families Citing this family (136)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080196828A1 (en) * 1999-07-14 2008-08-21 Gilbert Michael D Electrically Disbonding Adhesive Compositions and Related Methods
US7332218B1 (en) * 1999-07-14 2008-02-19 Eic Laboratories, Inc. Electrically disbonding materials
EP1373420B1 (de) * 2001-03-05 2005-11-30 Georg Gros Beschichtungsgemisch auf wasserbasis, verfahren zum aufbringen einer korrosionsschutzschicht mit diesem gemisch, derart beschichtete unterlage und deren verwendung
US6617698B2 (en) * 2001-03-09 2003-09-09 International Business Machines Corporation Reworkable and thermally conductive adhesive and use thereof
CN100363438C (zh) * 2002-04-20 2008-01-23 坎梅陶尔股份有限公司 用于施涂耐腐蚀的、可电焊的聚合物涂层的混合物和用于生产该涂层的方法
US7395882B2 (en) 2004-02-19 2008-07-08 Baker Hughes Incorporated Casing and liner drilling bits
US7954570B2 (en) * 2004-02-19 2011-06-07 Baker Hughes Incorporated Cutting elements configured for casing component drillout and earth boring drill bits including same
US7624818B2 (en) 2004-02-19 2009-12-01 Baker Hughes Incorporated Earth boring drill bits with casing component drill out capability and methods of use
AU2005295472B2 (en) * 2004-10-14 2011-11-10 Trustees Of Tufts College Electrochemically degradable polymers
US8241458B2 (en) * 2004-11-01 2012-08-14 Polytechnic Institute Of New York University Methods and apparatus for modifying gel adhesion strength
US7736710B2 (en) * 2005-08-01 2010-06-15 Stora Enso Ab Package and method of closing and opening a package
CN101233053B (zh) * 2005-08-01 2013-01-23 斯托拉恩索公司 包装物及封闭和打开包装物的方法
RU2008107982A (ru) * 2005-08-01 2009-09-10 Стора Энсо Аб (Se) Упаковка
EP1914285A1 (en) * 2005-08-09 2008-04-23 The Yokohama Rubber Co., Ltd. Electropeeling composition, and making use of the same, adhesive and electropeeling multilayer adhesive
KR100812507B1 (ko) * 2005-08-19 2008-03-11 주식회사 엘지화학 아크릴계 점착제 조성물
TW200709035A (en) * 2005-08-30 2007-03-01 Realtek Semiconductor Corp Audio processing device and method thereof
JP4839044B2 (ja) * 2005-08-30 2011-12-14 富士機工株式会社 シフトレバーのレンジ位置表示装置
US20070114366A1 (en) * 2005-11-21 2007-05-24 General Electric Company Optical article having a multi-component structure as an anti-theft feature and a system and method for inhibiting theft of same
US20070182025A1 (en) * 2006-02-07 2007-08-09 Stora Enso Ab Laminate structure and method of producing the same
US7621351B2 (en) 2006-05-15 2009-11-24 Baker Hughes Incorporated Reaming tool suitable for running on casing or liner
US20070269659A1 (en) * 2006-05-17 2007-11-22 Eic Laboratories, Inc. Electrically disbondable compositions and related methods
WO2007142600A1 (en) * 2006-06-05 2007-12-13 Stora Enso Ab An electrochemically weakable adhesive composition
US20070290378A1 (en) * 2006-06-20 2007-12-20 International Business Machines Corporation Novel reworkable underfills for ceramic mcm c4 protection
US20080103580A1 (en) * 2006-10-31 2008-05-01 Medtronic, Inc. Implantable medical elongated member with dual purpose conduit
US9643004B2 (en) * 2006-10-31 2017-05-09 Medtronic, Inc. Implantable medical elongated member with adhesive elements
US20080103578A1 (en) * 2006-10-31 2008-05-01 Medtronic, Inc. Implantable medical elongated member with in situ formed fixation element
US7780419B1 (en) * 2007-03-06 2010-08-24 Florida Turbine Technologies, Inc. Replaceable leading edge insert for an IBR
WO2008150227A1 (en) * 2007-06-05 2008-12-11 Stora Enso Ab An electrochemically weakable adhesive and a laminate structure
SE531351C2 (sv) * 2007-06-05 2009-03-03 Stora Enso Ab Laminatstruktur innefattande elektrokemiskt försvagningsbart lim
JP4416815B2 (ja) * 2007-09-26 2010-02-17 シャープ株式会社 トナーカートリッジ、それを備えた画像形成装置およびトナーカートリッジのリサイクル方法
JP4404926B2 (ja) 2007-09-26 2010-01-27 シャープ株式会社 インクカートリッジおよびそのリサイクル方法
US7954571B2 (en) 2007-10-02 2011-06-07 Baker Hughes Incorporated Cutting structures for casing component drillout and earth-boring drill bits including same
US8245797B2 (en) 2007-10-02 2012-08-21 Baker Hughes Incorporated Cutting structures for casing component drillout and earth-boring drill bits including same
JP4971106B2 (ja) * 2007-11-06 2012-07-11 Ｓｒｉスポーツ株式会社 ゴルフクラブ及びその分離方法
JP4469888B2 (ja) * 2007-12-28 2010-06-02 シャープ株式会社 画像形成装置
US7932342B2 (en) * 2008-01-16 2011-04-26 International Business Machines Corporation Method to improve wettability by reducing liquid polymer macromolecule mobility through forming polymer blend system
DE102008009766A1 (de) * 2008-02-19 2009-08-20 Lisa Dräxlmaier GmbH Materialschicht mit Haftvermittlern und Verfahren zur Herstellung einer solchen Materialschicht
US8488428B2 (en) 2008-05-14 2013-07-16 Nbcuniversal Media, Llc Enhanced security of optical article
JP5210078B2 (ja) * 2008-07-31 2013-06-12 ビッグテクノス株式会社 電気剥離性粘着剤組成物、電気剥離性粘着製品及びその剥離方法
JP5296446B2 (ja) * 2008-07-31 2013-09-25 ビッグテクノス株式会社 電気剥離性粘着剤組成物、電気剥離性粘着製品及びその剥離方法
US8691928B2 (en) 2008-08-25 2014-04-08 Seeo, Inc. Polymer electrolyte materials based on block copolymers
JP4621785B2 (ja) 2008-10-10 2011-01-26 シャープ株式会社 現像カートリッジおよびそれを用いた画像形成装置
JP5441400B2 (ja) * 2008-12-19 2014-03-12 キヤノン株式会社 撮像装置、放射線撮像装置及びその製造方法
GB0900606D0 (en) 2009-01-15 2009-02-25 Downhole Products Plc Tubing shoe
US20100239918A1 (en) * 2009-03-17 2010-09-23 Seeo, Inc Nanoparticle-block copolymer composites for solid ionic electrolytes
JP2013506063A (ja) * 2009-05-22 2013-02-21 プロテクト テクノロジーズ インコーポレーテッド 遠隔活性化ロックシステムと方法
US8327944B2 (en) * 2009-05-29 2012-12-11 Varel International, Ind., L.P. Whipstock attachment to a fixed cutter drilling or milling bit
US8517123B2 (en) * 2009-05-29 2013-08-27 Varel International, Ind., L.P. Milling cap for a polycrystalline diamond compact cutter
EP2394016B1 (en) * 2009-06-05 2017-12-27 Varel International, Ind., L.P. Casing bit and casing reamer designs
DE102009030742B4 (de) * 2009-06-26 2014-11-20 Leibniz-Institut Für Polymerforschung Dresden E.V. Reaktiver Schmelzklebstoff und dessen Verwendung
JP4973699B2 (ja) * 2009-07-06 2012-07-11 横浜ゴム株式会社 タイヤホイール組立体及びその分解方法
JP5503926B2 (ja) * 2009-08-31 2014-05-28 ビッグテクノス株式会社 電気剥離性粘着製品及びその剥離方法
US8333855B2 (en) * 2009-12-02 2012-12-18 Pitney Bowes Inc. Monitoring electrical continuity for envelope seal integrity
JP5731137B2 (ja) * 2010-06-15 2015-06-10 電気化学工業株式会社 エキシマ光照射による接着体の解体方法
JP5548062B2 (ja) * 2010-08-11 2014-07-16 株式会社日立製作所 配管用モジュール向け仮設部材の施工方法及び配管モジュールの搬送方法
AU2012249793B2 (en) 2011-04-26 2016-10-13 Becton, Dickinson And Company Adhesive patch and method of use in a packaging system
KR101450378B1 (ko) 2011-11-03 2014-10-15 (주)엘지하우시스 유전율이 높은 전자종이용 점착 조성물
DE102012203794A1 (de) 2012-03-12 2013-09-12 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Elektrisch lösbarer Polyamid-Klebstoff
KR102131466B1 (ko) 2012-06-01 2020-07-07 헨켈 아게 운트 코. 카게아아 술폰아미드기를 지닌 접착 촉진제가 있는 접착제
KR101617387B1 (ko) * 2013-02-26 2016-05-02 주식회사 엘지화학 코팅 조성물 및 이로부터 제조되는 플라스틱 필름
JP6152288B2 (ja) * 2013-03-27 2017-06-21 リンテック株式会社 電気剥離性粘着剤組成物、及び電気剥離性粘着シート、並びに電気剥離性粘着シートの使用方法
US20160009960A1 (en) * 2013-03-27 2016-01-14 Lintec Corporation Electrically peelable adhesive composition and electrically peelable adhesive sheet, and method for using electrically peelable adhesive sheet
WO2014157408A1 (ja) 2013-03-27 2014-10-02 リンテック株式会社 電気剥離性粘着剤組成物、及び電気剥離性粘着シート、並びに電気剥離性粘着シートの使用方法
CN105143385B (zh) * 2013-09-27 2017-09-29 琳得科株式会社 电剥离性粘合剂组合物、电剥离性粘合片、以及电剥离性粘合片的使用方法
JP6398264B2 (ja) * 2014-03-31 2018-10-03 富士通株式会社 インターポーザ構造体及び半導体装置の製造方法
EP2957610A1 (en) 2014-06-20 2015-12-23 Nitto Denko Corporation Debondable adhesive composition
EP3173231B1 (en) 2014-07-25 2020-03-04 Mitsubishi Chemical Corporation Gas barrier multilayer film
TR201901528T4 (tr) 2015-02-02 2019-02-21 Coloplast As Ostomi cihazı.
EP3056225A1 (en) 2015-02-16 2016-08-17 Nitto Denko Corporation Debondable adhesive system
JP6770523B2 (ja) * 2015-02-27 2020-10-14 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェンＨｅｎｋｅｌ ＡＧ ＆ Ｃｏ． ＫＧａＡ 剥離可能な反応性ホットメルト接着剤
ES2741852T3 (es) 2015-04-10 2020-02-12 Coloplast As Dispositivo de ostomía
JP6768281B2 (ja) * 2015-10-16 2020-10-14 日東電工株式会社 粘着シート接合体分離方法
WO2017064925A1 (ja) * 2015-10-16 2017-04-20 日東電工株式会社 両面粘着シート、両面粘着シート接合体、および、被着体の接合・分離方法
JP6767104B2 (ja) * 2015-11-24 2020-10-14 日東電工株式会社 被着体の接合・分離方法
EP3199344B1 (en) * 2016-02-01 2022-04-13 Henkel AG & Co. KGaA Electrical debonding of pu hot melt adhesives by use of conductive inks
US10707531B1 (en) 2016-09-27 2020-07-07 New Dominion Enterprises Inc. All-inorganic solvents for electrolytes
FR3062327B1 (fr) * 2017-01-30 2019-04-19 Safran Aircraft Engines Procede pour le decollement d'un element metallique colle a un element en materiau composite
EP3357953A1 (en) 2017-02-06 2018-08-08 Nitto Denko Corporation Composition and method for prevention of leading edge erosion in wind turbines
WO2018142370A1 (en) 2017-02-06 2018-08-09 Nitto Denko Corporation Composition and method for prevention of leading edge errosion in wind turbines
US9737060B1 (en) 2017-02-23 2017-08-22 Jeffrey Racho Fishing apparatus
KR102478800B1 (ko) 2017-03-02 2022-12-16 닛토덴코 가부시키가이샤 이온성 조성물 및 이의 관련 용도
JP7136567B2 (ja) * 2017-03-03 2022-09-13 日東電工株式会社 電気剥離用粘着剤組成物、粘着シート、及び接合体
US10481021B2 (en) * 2017-05-25 2019-11-19 TacSense, Inc. Supercapacitive iontronic nanofabric sensing assemblies
CN107785614B (zh) * 2017-07-02 2019-11-05 江汉大学 基于peo的超交联分子凝胶复合电解质膜的制备方法
US11747532B2 (en) 2017-09-15 2023-09-05 Southwall Technologies Inc. Laminated optical products and methods of making them
CN109721947A (zh) 2017-10-27 2019-05-07 财团法人工业技术研究院 环氧树脂组合物
KR20200088871A (ko) 2017-11-21 2020-07-23 닛토덴코 가부시키가이샤 염기성 이온성 액체 조성물 및 이를 포함하는 부재
FR3074480B1 (fr) * 2017-12-01 2020-01-03 Arianegroup Sas Separation en deux temps de viroles appartenant a un lanceur
CN109870837B (zh) * 2017-12-05 2021-10-15 华为终端有限公司 显示组件、显示器、终端及显示器拆卸方法
JP2019156912A (ja) * 2018-03-08 2019-09-19 日東電工株式会社 電気剥離型粘着シート、接合体及び接合体の剥離方法
JP7063660B2 (ja) 2018-03-08 2022-05-09 日東電工株式会社 電気剥離型粘着シート、接合体、並びに被着体の接合及び分離方法
JP2020164778A (ja) * 2018-09-03 2020-10-08 日東電工株式会社 粘着剤組成物、粘着シート、及び接合体
JP2019023304A (ja) * 2018-09-27 2019-02-14 日東電工株式会社 被着体の接合・分離方法
US11081898B2 (en) 2018-12-17 2021-08-03 Microsoft Technology Licensing, Llc Electrical battery de-bonding
EP3739664A1 (en) 2019-05-14 2020-11-18 Nitto Belgium NV Safety valve for electrochemical device casings
EP3739665A1 (en) 2019-05-14 2020-11-18 Nitto Belgium NV Safety valve with debonding function
TWI825341B (zh) * 2019-08-09 2023-12-11 日商日東電工股份有限公司 電氣剝離型黏著片材、接合體、及接合體之分離方法
ES2973449T3 (es) * 2019-12-13 2024-06-20 Henkel Ag & Co Kgaa Composición adhesiva curable de dos componentes (2K)
PL3835383T3 (pl) 2019-12-13 2023-09-11 Henkel Ag & Co. Kgaa Jednoskładnikowa (1K), utwardzalna kompozycja klejąca
EP3835378A1 (en) * 2019-12-13 2021-06-16 Henkel AG & Co. KGaA Two component (2k) curable adhesive composition
EP3835381B1 (en) * 2019-12-13 2023-02-08 Henkel AG & Co. KGaA Two component (2k) curable adhesive composition
CN111640949B (zh) * 2020-06-12 2022-02-22 宁德新能源科技有限公司 集流体、电极极片、电化学装置和电子装置
JP7028913B2 (ja) * 2020-06-17 2022-03-02 日東電工株式会社 粘着シート接合体分離方法
JP2020200481A (ja) * 2020-09-16 2020-12-17 日東電工株式会社 被着体の接合・分離方法
KR20230073226A (ko) * 2020-09-28 2023-05-25 린텍 가부시키가이샤 전기 박리성 점착제 조성물, 전기 박리성 점착 시트, 및 전기 박리성 점착 시트의 사용 방법
JPWO2022065480A1 (zh) * 2020-09-28 2022-03-31
CN112521886A (zh) * 2020-12-14 2021-03-19 西南科技大学 一种按需剥离拆卸新型胶黏剂的制备及使用方法
EP4050040A1 (en) * 2021-02-26 2022-08-31 Henkel AG & Co. KGaA One component (1k) curable adhesive composition
EP4067401A1 (en) 2021-03-30 2022-10-05 Henkel AG & Co. KGaA Two component (2k) curable adhesive composition
JP2024513589A (ja) 2021-04-14 2024-03-26 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン 溶剤系感圧性接着剤（ｐｓａ）をベースとした剥離可能な構造
CN113136159B (zh) * 2021-04-27 2022-07-19 西南科技大学 一种通电可按需剥离的环氧结构胶黏剂的制备及使用方法
JP2024522538A (ja) * 2021-06-04 2024-06-21 スリーエム イノベイティブ プロパティズ カンパニー オンデマンド剥離挙動を示す接着剤組成物を含有する物品
DE102022104817A1 (de) 2022-03-01 2023-09-07 Tesa Se Haftklebstoffzusammensetzung
WO2023241875A1 (en) 2022-06-17 2023-12-21 Henkel Ag & Co. Kgaa Two component (2k) curable adhesive composition
US11730217B1 (en) 2022-06-30 2023-08-22 CreateMe Technologies LLC Methods of disassembling apparel products having cycloalkene adhesives
US11712873B1 (en) 2022-06-30 2023-08-01 CreateMe Technologies LLC Boronate adhesives for apparel products
US11653709B1 (en) * 2022-06-30 2023-05-23 CreateMe Technologies LLC Methods of disassembling apparel products having disulfide adhesives
US11530336B1 (en) 2022-06-30 2022-12-20 CreateMe Technologies LLC Methods of assembling apparel products having cyclodextrin-azobenzene adhesives
US11530340B1 (en) 2022-06-30 2022-12-20 CreateMe Technologies LLC Cyclodextrin-azobenzene adhesives for apparel products
US11542413B1 (en) 2022-06-30 2023-01-03 CreateMe Technologies LLC Methods of disassembling apparel products having imine adhesives
US11857013B1 (en) 2022-06-30 2024-01-02 Createme Technologies Inc. Methods of assembling apparel products having shape memory adhesives
US11629272B1 (en) 2022-06-30 2023-04-18 CreateMe Technologies LLC Methods of assembling apparel products having thioester adhesives
US11632995B1 (en) * 2022-06-30 2023-04-25 CreateMe Technologies LLC Methods of assembling apparel products having disulfide adhesives
US11655397B1 (en) 2022-06-30 2023-05-23 CreateMe Technologies LLC Methods of assembling apparel products having cycloalkene adhesives
US11634616B1 (en) 2022-06-30 2023-04-25 CreateMe Technologies LLC Methods of assembling apparel products having boronate adhesives
US11692111B1 (en) 2022-06-30 2023-07-04 CreateMe Technologies LLC Methods of disassembling apparel products having shape memory adhesives
US11752234B1 (en) 2022-06-30 2023-09-12 CreateMe Technologies LLC Shape memory adhesives for apparel products
US11732159B1 (en) 2022-06-30 2023-08-22 CreateMe Technologies LLC Methods of disassembling apparel products having boronate adhesives
US11905440B1 (en) 2022-06-30 2024-02-20 Createme Technologies Inc. Disulfide adhesives for apparel products
US11542412B1 (en) 2022-06-30 2023-01-03 CreateMe Technologies LLC Methods of disassembling apparel products having cyclodextrin-azobenzene adhesives
US11730215B1 (en) 2022-06-30 2023-08-22 CreateMe Technologies LLC Thioester adhesives for apparel products
US11713405B1 (en) 2022-06-30 2023-08-01 CreateMe Technologies LLC Methods of disassembling apparel products having thioester adhesives
US11849791B1 (en) 2022-06-30 2023-12-26 Createme Technologies Inc. Methods of assembling apparel products having imine adhesives
EP4332190A1 (en) 2022-09-05 2024-03-06 Henkel AG & Co. KGaA Debondable solvent-borne pressure sensitive adhesive (psa)
EP4332144A1 (en) 2022-09-05 2024-03-06 Henkel AG & Co. KGaA One component (1k) curable adhesive composition
EP4353760A1 (en) 2022-10-13 2024-04-17 Henkel AG & Co. KGaA Curable and electrically debondable one-component (1k) structural adhesive composition

Family Cites Families (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3679534A (en) 1971-02-09 1972-07-25 American Cyanamid Co Electrochemical formation of bonded structures
JPS5141882B2 (zh) * 1973-06-08 1976-11-12
US3909497A (en) 1974-04-12 1975-09-30 Stanford Research Inst Solid polymers thermally degradable to flowable compositions
US4171240A (en) 1978-04-26 1979-10-16 Western Electric Company, Inc. Method of removing a cured epoxy from a metal surface
JPS6123615A (ja) 1984-06-18 1986-02-01 Takeda Chem Ind Ltd 硬化性樹脂組成物
US4729797A (en) 1986-12-31 1988-03-08 International Business Machines Corporation Process for removal of cured epoxy
US4882399A (en) 1987-08-21 1989-11-21 Polytechnic University Epoxy resins having reversible crosslinks
US5100494A (en) 1989-09-05 1992-03-31 Hughes Aircraft Company Structural bonding and debonding system
US5219679A (en) 1991-01-17 1993-06-15 Eic Laboratories, Inc. Solid electrolytes
ATE141222T1 (de) * 1991-07-03 1996-08-15 Gurit Essex Ag Lösbare klebeverbindungen, verfahren zu deren herstellung und verwendung von vorrichtungen zum lösen solcher klebeverbindungen
JP2728106B2 (ja) 1991-09-05 1998-03-18 インターナショナル・ビジネス・マシーンズ・コーポレイション 電子パッケージングにおける除去可能なデバイス保護のための開裂性ジエポキシド
JPH0594818A (ja) 1991-10-01 1993-04-16 Nippon Telegr & Teleph Corp <Ntt> 電池正極シート及びその製造方法
EP0555114B1 (en) 1992-01-20 1996-11-13 Nippon Telegraph And Telephone Corporation Solid polymer electrolyte and method of manufacture thereof
US5252413A (en) 1992-04-07 1993-10-12 Eic Laboratories, Inc. Solid polymer electrolyte lithium batteries
US5441830A (en) 1992-10-29 1995-08-15 Moulton; Russell D. Electrically-conducting adhesion-promoters on conductive plastic
US5489624A (en) 1992-12-01 1996-02-06 Minnesota Mining And Manufacturing Company Hydrophilic pressure sensitive adhesives
DE69328172T2 (de) * 1992-12-25 2000-12-21 Tdk Corp Lithium-sekundärbatterie
JPH06246228A (ja) * 1993-02-24 1994-09-06 Nippon Paint Co Ltd 剥離の容易な塗膜を有する導電性体
US5399447A (en) 1993-12-06 1995-03-21 Valence Technology, Inc. Acidity reduction of adhesion promoter layer and electrolytic cells produced therefrom
US6074747A (en) 1995-06-06 2000-06-13 Avery Dennison Corporation Ink-imprintable release coatings, and pressure sensitive adhesive constructions
JPH0912980A (ja) * 1995-06-28 1997-01-14 Toshiba Corp 接着材、その接着方法およびその剥離方法
JPH09104849A (ja) * 1995-10-09 1997-04-22 Dainippon Printing Co Ltd 粘着層の形成方法
JPH09199113A (ja) 1996-01-23 1997-07-31 Toshiba Battery Co Ltd ポリマー電解質二次電池
US5824120A (en) 1996-04-10 1998-10-20 Valence Technology, Inc. Electrically conductive adhesion promoters for current collectors
JPH10147752A (ja) 1996-11-19 1998-06-02 Nippon Avionics Co Ltd 接着構造物の電解剥離方法
JP3225864B2 (ja) 1996-12-04 2001-11-05 三菱電機株式会社 リチウムイオン二次電池及びその製造方法
US5760337A (en) 1996-12-16 1998-06-02 Shell Oil Company Thermally reworkable binders for flip-chip devices
JP3225867B2 (ja) 1996-12-18 2001-11-05 三菱電機株式会社 リチウムイオン二次電池及びその製造方法
JPH10302843A (ja) 1997-02-28 1998-11-13 Mitsubishi Electric Corp 電池用接着剤及びそれを用いた電池とその製造法
JPH11134275A (ja) 1997-10-27 1999-05-21 Nippon Telegr & Teleph Corp <Ntt> 通信接続方法および通信インタフェース装置
JP3677390B2 (ja) 1998-05-19 2005-07-27 京セラ株式会社 粉砕装置
JP3847003B2 (ja) 1998-07-07 2006-11-15 日東電工株式会社 ゲル状組成物とその利用
JP2000129217A (ja) * 1998-10-26 2000-05-09 Nitto Denko Corp シート状接着剤組成物およびそれを用いた電子部品装置ならびにそのリペアー方法
JP3848490B2 (ja) * 1999-05-14 2006-11-22 積水化学工業株式会社 剥離方法及び剥離性接合体
US7332218B1 (en) 1999-07-14 2008-02-19 Eic Laboratories, Inc. Electrically disbonding materials
US6572971B2 (en) 2001-02-26 2003-06-03 Ashland Chemical Structural modified epoxy adhesive compositions
GB0108199D0 (en) 2001-04-02 2001-05-23 Dupont Teijin Films Us Ltd Multilayer film
US7018440B2 (en) 2001-07-18 2006-03-28 Sumitomo Chemical Company, Limited Granular coated fertilizer
US6960248B2 (en) 2003-05-22 2005-11-01 Arizona Chemical Company Cyclic bisamides useful in formulating inks for phase-change printing
KR100497251B1 (ko) 2003-08-20 2005-06-23 삼성에스디아이 주식회사 리튬 설퍼 전지용 음극 보호막 조성물 및 이를 사용하여제조된 리튬 설퍼 전지

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ATE339301T1 (de) 2006-10-15
CA2341417A1 (en) 2001-01-25
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US20010031367A1 (en) 2001-10-18
ES2270851T3 (es) 2007-04-16
US7968188B2 (en) 2011-06-28
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US20080283415A1 (en) 2008-11-20
US20100000878A1 (en) 2010-01-07

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