HK1019815A1 - Electronic components. - Google Patents
Electronic components.Info
- Publication number
- HK1019815A1 HK1019815A1 HK99104953A HK99104953A HK1019815A1 HK 1019815 A1 HK1019815 A1 HK 1019815A1 HK 99104953 A HK99104953 A HK 99104953A HK 99104953 A HK99104953 A HK 99104953A HK 1019815 A1 HK1019815 A1 HK 1019815A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- electronic components
- electronic
- components
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F5/00—Coils
- H01F2005/006—Coils with conical spiral form
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP247298 | 1998-01-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1019815A1 true HK1019815A1 (en) | 2000-02-25 |
Family
ID=11530276
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK99104953A HK1019815A1 (en) | 1998-01-08 | 1999-11-02 | Electronic components. |
Country Status (7)
Country | Link |
---|---|
US (1) | US6218925B1 (xx) |
EP (1) | EP0929085B1 (xx) |
JP (1) | JP3500319B2 (xx) |
CN (1) | CN1196146C (xx) |
DE (1) | DE69911078D1 (xx) |
HK (1) | HK1019815A1 (xx) |
MY (1) | MY123300A (xx) |
Families Citing this family (71)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6675462B1 (en) * | 1998-05-01 | 2004-01-13 | Taiyo Yuden Co., Ltd. | Method of manufacturing a multi-laminated inductor |
US6413340B1 (en) * | 1998-10-20 | 2002-07-02 | Tdk Corporation | Method for the preparation of laminated inductor device |
DE10002377A1 (de) * | 2000-01-20 | 2001-08-02 | Infineon Technologies Ag | Spule und Spulensystem zur Integration in eine mikroelektronische Schaltung sowie mikroelektronische Schaltung |
JP2002324714A (ja) * | 2001-02-21 | 2002-11-08 | Tdk Corp | コイル封入圧粉磁芯およびその製造方法 |
JP2003229311A (ja) * | 2002-01-31 | 2003-08-15 | Tdk Corp | コイル封入圧粉磁芯およびその製造方法、コイルおよびその製造方法 |
JP3779243B2 (ja) | 2002-07-31 | 2006-05-24 | 富士通株式会社 | 半導体装置及びその製造方法 |
JP4492540B2 (ja) * | 2003-10-10 | 2010-06-30 | 株式会社村田製作所 | 積層コイル部品およびその製造方法 |
JP4211591B2 (ja) * | 2003-12-05 | 2009-01-21 | 株式会社村田製作所 | 積層型電子部品の製造方法および積層型電子部品 |
JP2007134555A (ja) * | 2005-11-11 | 2007-05-31 | Matsushita Electric Ind Co Ltd | 電子部品及びその製造方法 |
JP5008926B2 (ja) * | 2006-08-23 | 2012-08-22 | Tdk株式会社 | 積層型インダクタ及び積層型インダクタのインダクタンス調整方法 |
JP4028884B1 (ja) * | 2006-11-01 | 2007-12-26 | Tdk株式会社 | コイル部品 |
JP2008192673A (ja) * | 2007-02-01 | 2008-08-21 | Matsushita Electric Ind Co Ltd | インダクタンス部品 |
US8004792B2 (en) * | 2007-04-12 | 2011-08-23 | International Business Machines Corporation | Magnetic write transducer |
EP2214181B1 (en) * | 2007-12-26 | 2016-04-13 | Murata Manufacturing Co. Ltd. | Laminated electronic component and electronic component module provided with the same |
US9001527B2 (en) * | 2008-02-18 | 2015-04-07 | Cyntec Co., Ltd. | Electronic package structure |
JP4780175B2 (ja) * | 2008-10-30 | 2011-09-28 | 株式会社村田製作所 | 電子部品 |
CN101521087B (zh) * | 2008-11-17 | 2012-12-05 | 深圳振华富电子有限公司 | 一种电感器及其制造方法 |
SE534510C2 (sv) * | 2008-11-19 | 2011-09-13 | Silex Microsystems Ab | Funktionell inkapsling |
JP5533673B2 (ja) * | 2009-02-10 | 2014-06-25 | 株式会社村田製作所 | 電子部品 |
CN102342021B (zh) * | 2009-03-02 | 2014-07-23 | 株式会社村田制作所 | 电子元器件及电子装置 |
DE102009022992A1 (de) * | 2009-03-02 | 2010-10-07 | Micro-Epsilon Messtechnik Gmbh & Co. Kg | Positionssensor |
JP2011029520A (ja) * | 2009-07-29 | 2011-02-10 | Murata Mfg Co Ltd | 電子部品 |
JP5365420B2 (ja) * | 2009-08-28 | 2013-12-11 | Tdk株式会社 | 積層型電子部品 |
JP5223821B2 (ja) * | 2009-08-28 | 2013-06-26 | Tdk株式会社 | 積層型電子部品 |
US8254142B2 (en) | 2009-09-22 | 2012-08-28 | Wintec Industries, Inc. | Method of using conductive elastomer for electrical contacts in an assembly |
US8593825B2 (en) * | 2009-10-14 | 2013-11-26 | Wintec Industries, Inc. | Apparatus and method for vertically-structured passive components |
US8519575B2 (en) * | 2009-11-09 | 2013-08-27 | Nucleus Scientific, Inc. | Linear electric machine with linear-to-rotary converter |
US8624699B2 (en) | 2009-11-09 | 2014-01-07 | Nucleus Scientific, Inc. | Electric coil and method of manufacture |
CN101789307A (zh) * | 2010-03-15 | 2010-07-28 | 深圳顺络电子股份有限公司 | 一种叠层片式元器件内电极的螺形线圈的结构 |
WO2011145517A1 (ja) * | 2010-05-19 | 2011-11-24 | 株式会社村田製作所 | 電子部品 |
WO2012023315A1 (ja) * | 2010-08-18 | 2012-02-23 | 株式会社村田製作所 | 電子部品及びその製造方法 |
KR101218985B1 (ko) * | 2011-05-31 | 2013-01-04 | 삼성전기주식회사 | 칩형 코일 부품 |
US8766493B2 (en) | 2011-07-01 | 2014-07-01 | Nucleus Scientific, Inc. | Magnetic stator assembly |
WO2013146568A1 (ja) * | 2012-03-27 | 2013-10-03 | 株式会社村田製作所 | 電子部品 |
JP5288025B2 (ja) * | 2012-04-27 | 2013-09-11 | Tdk株式会社 | 積層型インダクタ及び積層型インダクタのインダクタンス調整方法 |
KR20140023141A (ko) * | 2012-08-17 | 2014-02-26 | 삼성전기주식회사 | 인덕터 및 인덕터 제조방법 |
JP2014107513A (ja) * | 2012-11-29 | 2014-06-09 | Taiyo Yuden Co Ltd | 積層インダクタ |
CN105453200B (zh) * | 2013-07-29 | 2017-11-10 | 株式会社村田制作所 | 层叠线圈 |
JP6044716B2 (ja) * | 2013-08-13 | 2016-12-14 | 株式会社村田製作所 | 電子部品 |
US20150102891A1 (en) * | 2013-10-16 | 2015-04-16 | Samsung Electro-Mechanics Co., Ltd. | Chip electronic component, board having the same, and packaging unit thereof |
KR101642578B1 (ko) * | 2013-10-16 | 2016-08-10 | 삼성전기주식회사 | 코일부품, 그 실장기판 및 포장체 |
KR20150114747A (ko) * | 2014-04-02 | 2015-10-13 | 삼성전기주식회사 | 칩형 코일 부품 및 그 실장 기판 |
KR102004791B1 (ko) * | 2014-05-21 | 2019-07-29 | 삼성전기주식회사 | 칩 전자부품 및 그 실장기판 |
KR101686989B1 (ko) | 2014-08-07 | 2016-12-19 | 주식회사 모다이노칩 | 파워 인덕터 |
KR20160019265A (ko) * | 2014-08-11 | 2016-02-19 | 삼성전기주식회사 | 칩형 코일 부품 및 그 제조방법 |
KR101662207B1 (ko) * | 2014-09-11 | 2016-10-06 | 주식회사 모다이노칩 | 파워 인덕터 |
KR101580411B1 (ko) * | 2014-09-22 | 2015-12-23 | 삼성전기주식회사 | 칩 전자부품 및 칩 전자부품의 실장 기판 |
KR101832546B1 (ko) * | 2014-10-16 | 2018-02-26 | 삼성전기주식회사 | 칩 전자부품 및 칩 전자부품의 실장 기판 |
KR101607027B1 (ko) * | 2014-11-19 | 2016-03-28 | 삼성전기주식회사 | 칩 전자 부품 및 칩 전자 부품의 실장 기판 |
KR101709841B1 (ko) * | 2014-12-30 | 2017-02-23 | 삼성전기주식회사 | 칩 전자부품 및 그 제조방법 |
JP6544080B2 (ja) * | 2015-06-30 | 2019-07-17 | 株式会社村田製作所 | コイル部品 |
JP6534880B2 (ja) * | 2015-07-14 | 2019-06-26 | 太陽誘電株式会社 | インダクタ及びプリント基板 |
JP6465046B2 (ja) * | 2016-02-09 | 2019-02-06 | 株式会社村田製作所 | 電子部品 |
JP6536437B2 (ja) * | 2016-03-04 | 2019-07-03 | 株式会社村田製作所 | 電子部品 |
US10483832B2 (en) | 2016-09-13 | 2019-11-19 | Indigo Technologies, Inc. | Multi-bar linkage electric drive system |
JP6594837B2 (ja) | 2016-09-30 | 2019-10-23 | 太陽誘電株式会社 | コイル部品 |
CN209449029U (zh) * | 2016-11-28 | 2019-09-27 | 株式会社村田制作所 | 多层基板以及多层基板向电路基板的安装构造 |
JP6569654B2 (ja) * | 2016-12-14 | 2019-09-04 | 株式会社村田製作所 | チップインダクタ |
KR102597150B1 (ko) * | 2016-12-20 | 2023-11-02 | 삼성전기주식회사 | 인덕터 및 그 실장기판 |
KR101952866B1 (ko) | 2017-02-22 | 2019-02-27 | 삼성전기주식회사 | 파워 인덕터, 그 실장 기판, 및 파워 인덕터를 이용한 전류 측정 방법 |
KR101892849B1 (ko) * | 2017-03-02 | 2018-08-28 | 삼성전기주식회사 | 전자 부품 |
KR101952873B1 (ko) * | 2017-07-05 | 2019-02-27 | 삼성전기주식회사 | 박막형 인덕터 |
JP2019096818A (ja) * | 2017-11-27 | 2019-06-20 | 株式会社村田製作所 | 積層型コイル部品 |
JP6780629B2 (ja) * | 2017-11-27 | 2020-11-04 | 株式会社村田製作所 | 積層型コイル部品 |
JP6954217B2 (ja) * | 2018-04-02 | 2021-10-27 | 株式会社村田製作所 | 積層型コイル部品 |
JP6954216B2 (ja) * | 2018-04-02 | 2021-10-27 | 株式会社村田製作所 | 積層型コイル部品 |
KR102064072B1 (ko) | 2018-04-26 | 2020-01-08 | 삼성전기주식회사 | 인덕터 |
KR102609134B1 (ko) * | 2018-05-14 | 2023-12-05 | 삼성전기주식회사 | 인덕터 및 이를 구비하는 인덕터 모듈 |
JP7088083B2 (ja) * | 2019-03-04 | 2022-06-21 | 株式会社村田製作所 | 積層型コイル部品 |
JP7151655B2 (ja) * | 2019-07-27 | 2022-10-12 | 株式会社村田製作所 | インダクタ |
JP7167971B2 (ja) * | 2020-10-14 | 2022-11-09 | 株式会社村田製作所 | 積層型コイル部品 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3812442A (en) | 1972-02-29 | 1974-05-21 | W Muckelroy | Ceramic inductor |
US3765082A (en) * | 1972-09-20 | 1973-10-16 | San Fernando Electric Mfg | Method of making an inductor chip |
JPS59189212U (ja) * | 1983-05-18 | 1984-12-15 | 株式会社村田製作所 | チツプ型インダクタ |
JPH02172207A (ja) * | 1988-12-23 | 1990-07-03 | Murata Mfg Co Ltd | 積層型インダクター |
US5302932A (en) * | 1992-05-12 | 1994-04-12 | Dale Electronics, Inc. | Monolythic multilayer chip inductor and method for making same |
JPH07320936A (ja) * | 1994-05-24 | 1995-12-08 | Taiyo Yuden Co Ltd | 積層形チップインダクタ |
JPH0855726A (ja) | 1994-08-10 | 1996-02-27 | Taiyo Yuden Co Ltd | 積層型電子部品及びその製造方法 |
US5821846A (en) * | 1995-05-22 | 1998-10-13 | Steward, Inc. | High current ferrite electromagnetic interference suppressor and associated method |
US5945902A (en) * | 1997-09-22 | 1999-08-31 | Zefv Lipkes | Core and coil structure and method of making the same |
-
1998
- 1998-12-22 JP JP36447998A patent/JP3500319B2/ja not_active Expired - Fee Related
-
1999
- 1999-01-04 MY MYPI99000011A patent/MY123300A/en unknown
- 1999-01-07 CN CNB991009290A patent/CN1196146C/zh not_active Expired - Lifetime
- 1999-01-08 DE DE69911078T patent/DE69911078D1/de not_active Expired - Lifetime
- 1999-01-08 EP EP99100266A patent/EP0929085B1/en not_active Expired - Lifetime
- 1999-01-08 US US09/227,188 patent/US6218925B1/en not_active Expired - Lifetime
- 1999-11-02 HK HK99104953A patent/HK1019815A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US6218925B1 (en) | 2001-04-17 |
EP0929085B1 (en) | 2003-09-10 |
CN1196146C (zh) | 2005-04-06 |
EP0929085A3 (en) | 2000-02-23 |
DE69911078D1 (de) | 2003-10-16 |
JP3500319B2 (ja) | 2004-02-23 |
MY123300A (en) | 2006-05-31 |
CN1222745A (zh) | 1999-07-14 |
EP0929085A2 (en) | 1999-07-14 |
JPH11260644A (ja) | 1999-09-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20120107 |