GB2266999A - Method of manufacturing reinforced flexible printed circuit boards - Google Patents

Method of manufacturing reinforced flexible printed circuit boards Download PDF

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Publication number
GB2266999A
GB2266999A GB9306545A GB9306545A GB2266999A GB 2266999 A GB2266999 A GB 2266999A GB 9306545 A GB9306545 A GB 9306545A GB 9306545 A GB9306545 A GB 9306545A GB 2266999 A GB2266999 A GB 2266999A
Authority
GB
United Kingdom
Prior art keywords
resin paste
printed circuit
base film
flexible printed
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB9306545A
Other versions
GB9306545D0 (en
Inventor
Masuo Matsumoto
Takazo Takahashi
Naohiro Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon CMK Corp
Original Assignee
Nippon CMK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon CMK Corp filed Critical Nippon CMK Corp
Publication of GB9306545D0 publication Critical patent/GB9306545D0/en
Publication of GB2266999A publication Critical patent/GB2266999A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0588—Second resist used as pattern over first resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

A method of manufacturing a flexible printed circuit board comprises the steps of forming a circuit pattern 23 on a flexible base film 21 by etching a copper foil, coating a solder resist 24 on the flexible base film 21, and coating and hardening a resin paste 26 on the other side of the circuit pattern of the flexible base film by a printing method. By implementing these steps, certain areas of the flexible printed circuit board may be made relatively rigid. The coating step for the resin paste can be implemented into an automated manufacturing process. A multilayer circuit board may be manufactured using a resin paste between laminates which when hardened acts as a reinforcement. <IMAGE>

Description

"METHOD OF MANUFACTURING A FLEXIBLE PRINTED CIRCUIT BOARD" The present invention relates to a method of manufacturing a flexible printed circuit board, whereby it is flexible, and yet has an appropriate rigidity.
Figure 6 of the accompanying drawings shows a manufacturing flow chart for a flexible printed circuit board made in accordance with two conventional methods, a printing method and a photographic method.
In the printing method, a copper-laminated board 100, consisting of a single sided copper foil-laminated flexible base film, is wound into a feeding roll.
While the board is transferred to another winding roll, a pattern resist printing process 101 and an etching process 102 are continuously applied to the board.
In the photographic method, while the board is transferred to another winding roll, a photo-sensitive dry film lamination process 113, an exposure/ development processing process 114, and an etching process 102 are continuously implemented.
In both the foregoing methods, after the circuit pattern is formed, an etching resist ink is removed by implementing a resist removing step 104.
In order to protect the circuit pattern, a solder resist printing step 105 is implemented. Then a components mark printing step 106 is implemented. Or instead of that, an overlay laminating step 115 with a polyamide film or the like is implemented.
Then a stamping-guide-hole drilling step 107 is implemented. Then the working size of the flexible board is stamped into piece parts at a stamping step 108, utilising the stamping-guide-hole as a dimensional reference. An open circuit/short circuit inspecting step 109, a surface treating step 110, and a flux treating step 111 are implemented to complete the product.
The flexible circuit boards manufactured by both foregoing methods are flexible as a whole.
Therefore a predetermined resistivity has been provided by placing a rigid plate on the other side of the circuit pattern of the flexible base film at one or a plurality of locations with adhesive to form a completed product. The reason to provide such rigidity is that a certain degree of a rigidity is required for a flexible printed circuit board when (1) electronic components are placed on the board, (2) part of it is to be inserted into a connector equipped in an electronic equipment, (3) it is installed into an equipment housing, or the like.
However, the process of placing a rigid plate cannot be implemented by an automated manufacturing process so that the process is forced to be effected by a manual operation. This results in a decrease in productivity. Another problem is that the process does not enable the rigid plate to be placed precisely.
The present invention seeks to provide a method of manufacturing a flexible printed circuit board, whereby a certain degree of a rigidity can be precisely provided under an automated production process.
In order to achieve the foregoing object, the present invention provides a method of coating and hardening a resin paste on a circuit pattern-formed flexible base film or a copper foil-laminated flexible base film, thereby providing rigidity. The resin paste can be applied to the circuit pattern-formed side of or the other side of or both sides of the base film. The coating location can be the whole of or a portion of the base film. The coating for the resin paste can be implemented by a printing method such as screen printing or a curtain coating method or a spray coating method or a knife coating method, or the like.
Particularly a printing method has the advantages of securing a precise coating location and for enabling the method to be incorporated into an automated production process for a flexible printed circuit board.
The resin paste implemented by coating and hardening behaves as a reinforced plate so that a predetermined rigidity is provided. So even if it is flexible in nature, it can be used for the automatic placing and reflow soldering for an electronic component without any additional treatment. Also it can easily be inserted into a connector equipped in an associated electronic equipment and can be installed in an equipment housing. In addition the circuit pattern is mechanically protected by means of coating and hardening a resin paste on the location where circuit pattern is formed.
In the case of stacking a plurality of flexible printed circuit boards or flexible copper laminated boards, a multilayer printed circuit board having rigidity can also be achieved by stacking them through a resin paste.
As explained above, the present invention is characterised in manufacturing a flexible printed circuit board by means of coating and hardening a resin paste on a flexible printed circuit board to provide rigidity to the board so it can be used to place electronic components and can be installed in an electronic equipment without any additional treatment.
The manufacturing process is suitable for an automated production process and secures the dimensional precision of the board.
In order that the invention may be better understood, several embodiments thereof will now be described by way of example only and with reference to the accompanying drawings in which: Figure 1 shows the manufacturing flow chart of one of the preferred embodiments implementing the present invention; Figure 2 is an illustration showing the cross section of a flexible copper-laminated board.
Figure 3 is an illustration showing the cross section of a flexible printed circuit board manufactured by one of the preferred embodiments implementing the present invention; Figure 4 is an illustration showing the cross section of a flexible printed circuit board manufactured by another method; Figure 5 is an illustration showing the cross section of a flexible printed circuit board manufactured by another embodiment implementing the present invention; and Figure 6 shows the manufacturing flow chart implementing a conventional method.
In each preferred embodiment to be described, corresponding components are given the same reference numerals, and overlapping explanation has been omitted.
Figure 1 shows the manufacturing flow chart of one of the preferred embodiments implementing the present invention. In this preferred embodiment, a copper-laminated flexible board shown in Figure 2 is used. In Figure 2, reference numeral 21 is a flexible plastic base film such as polyamide, polyester, bendflex, polyesteramide, or the like. A copper foil 22 is laminated on one side of the base film with a predetermined thickness by a thermal pressure method or an adhesion method or the like.
In the present invention, a double sided copperlaminated flexible board, which consists of the base film 21 having a copper foil 22 on both sides, can be used.
As explained at a cutting step 1 shown in Figure 1, the copper-laminated flexible board is cut into working size. Then an etching resist printing step 2 is implemented on a flexible copper foil by a screen printing method. The copper foil is then etched by implementing an etching processing step 3.
Then a circuit pattern is formed by implementing a resist removing process 4. In order to protect the circuit pattern, a solder resist is coated by implementing a solder resist printing process 5. A component mark printing step 6 is then implemented.
Further, the base film is flipped over, and a resin paste coating and hardening step 7 is made on the other side of the circuit pattern. In order to meet a specific application, a suitable resin paste is selected and used from materials such as insulating resin paste, inorganic-filler-compound paste having an appropriate thermal conductivity, conductive paste, ultraviolet-curing resin paste, or the like.
With regard to the coating method for the resin paste, a printing method such as screen printing, a spraying method, a roll coating method or the like can be applied. In the preferred embodiment, screen printing is implemented. The coating is provided once, or several times, to enhance the flatness. Further, the coating location is selected from a portion of or the whole of or scattering points or the like of the base film to meet the specific application.
The resin paste coated on the base film is hardened by heating or room temperature hardening or ultra-violet radiation or the like. The hardened resin paste behaves as a reinforced plate so that rigidity is provided over a portion of or the whole of the base film. As a result, the mechanical strength is enhanced. Then after a stamping-guide-hole drilling step 8 is implemented, the base film is separated into piece parts by stamping. After implementing an open circuit/short circuit testing step 11 and a visual inspecting step 12, the piece parts are finished to complete the product.
Figure 3 is an illustration showing the flexible printed circuit board manufactured by the foregoing process. A circuit pattern 23 is formed on the base film 21. Then a solder resist 24 is coated on the base film. Reference numeral 25 is a component mark provided at a predetermined position of the solder resist 24. A reinforced area 26 is formed by coating and hardening a resin paste on the other side of the circuit pattern of the base film 21. As a result, the flexible printed circuit board has rigidity at the location where the reinformed area 26 is provided. However, the board has bendable flexibility at the other location, where a nonreinformed area 27 is provided. Therefore the printed circuit board having the rigidity can be used without any treatment for placing electronic components.
Also, part of the board can easily be inserted into a connector equipped in an associated electronic equipment and can be installed in an electronic equipment housing.
In the preferred embodiment, the reinforced area 26 is formed by a resin paste printing method so that all of the steps can be incorporated by a printing method. This means that volume production of the board is attainable by an automated production process. Also the reinforced area 26 can be precisely formed at a predetermined location on the board. Further, the board has rigidity so that it can be stamped into piece parts with a die.
Therefore the dimensional precision of the board at the stamping step can be tremendously improved compared with a conventional flexible printed circuit board.
Figure 4 is an illustration showing that, in addition to the foregoing preferred embodiment, a protected area 28 is formed on the circuit pattern 23 by printing and hardening a resin paste at the predetermined location of the base film 21. The protected area 28 and the reinformed area 26 located at the other side of the base film 21 provide the flexible printed circuited board with rigidity excluding at the location, where the non-reinforced area 27 is provided.
The protected area 28 is formed over the circuit pattern 23 excluding a land area where electronic components are to be placed so that the circuit pattern 23 is mechanically protected. Also the heat radiation from the circuit pattern 23 can be enhanced because the surface area is extended.
Electromagnetic shielding can be achieved when a conductive paste is selected for the resin paste.
Further, another method of forming the protected area 28 is that, after coating the resin paste, it is cured to some extent, then during this period, a flatness enhancement process is implemented, then it is hardened completely. The flatness of the whole flexible printed circuit board can be enhanced by this procedure.
In the foregoing embodiment, the resin paste is coated onto the copper-laminated base film 21, then the circuit pattern is formed. The present invention is also applicable to the process in which the circuit pattern is formed by etching the base film 21; then the rigidity is provided by coating and hardening the resin paste. In this case, an automated production process of the board can also be applicable with a high productivity.
Figure 5 is an illustration showing the flexible printed circuit board manufactured by another embodiment implementing the present invention. In the embodiment, two pieces of double sided flexible printed circuit boards are stacked together. The manufacturing process is that the circuit patterns 23 and 33 are formed on the base film 21 and the other base film 31 respectively, then the solder resists 24 and 34 are coated on the base film 21 and 31 respectively, and then the two flexible printed circuit boards are stacked.
In these coating and stacking steps, two pieces of the flexible circuit boards can also be stacked by means of coating a resin paste at the predetermined location of either or both of the flexible printed circuit boards, putting one of the flexible printed circuit boards on the other, and hardening the resin paste. In Figure 5, reference numeral 29 is the junction area where the resin paste is coated and hardened. Rigidity is provided due to the existence of the junction area 29, so the board behaves in the same manner as the foregoing embodiment.
In the embodiment shown in Figure 5, after the circuit patterns are formed on both of the double sided copper-laminated boards, the boards are stacked.
The embodiment is not limited to the case of Figure 5.
First the circuit pattern is formed on one side of the double sided copper-laminated board or single sided copper-laminated board, then another single sided copper-laminated board is stacked onto the double sided circuit pattern-formed boards or the single sided circuit pattern-formed board through the resin paste, facing the base film side to the circuit pattern-formed side. Then the circuit pattern is formed on the board.

Claims (5)

1. A method of manufacturing a flexible printed circuit board comprising the steps of: forming a circuit pattern by etching a copper foil laminated on a flexible base film; and coating and hardening a resin paste on a portion of or the whole of said base film at the circuit pattern-formed side and/or the other side of said base film, whereby the resin paste behaves as a reinforced plate.
2. A method of manufacturing a flexible printed circuit board comprising the steps of: forming a reinforced plate by coating and hardening a resin paste on a portion of or the whole of the unlaminated side of a single sided copper foillaminated flexible base film; and forming a circuit pattern by etching said copper foil.
3. A method of manufacturing a flexible printed circuit board as claimed in either one of claims 1 or 2, further comprising curing said resin paste to some extent, enhancing the flatness of the resin paste surface, and hardening said resin paste completely.
4. A method of manufacturing a printed circuit board comprising the steps of: stacking a plurality of circuit pattern-formed base films implemented by etching a copper foil and/or copper foil-laminated base films using a resin paste so as to overlap a portion of or the whole of the base films; and hardening said resin paste, whereby said resin paste behaves as a reinforced plate.
5. A method of manufacturing a flexible printed circuit board substantially as hereinbefore described with reference to Figures 1 to 5 of the accompanying drawings.
GB9306545A 1992-05-15 1993-03-29 Method of manufacturing reinforced flexible printed circuit boards Withdrawn GB2266999A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14864092A JPH05327192A (en) 1992-05-15 1992-05-15 Manufacture of flexible printed circuit board

Publications (2)

Publication Number Publication Date
GB9306545D0 GB9306545D0 (en) 1993-05-19
GB2266999A true GB2266999A (en) 1993-11-17

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
GB9306545A Withdrawn GB2266999A (en) 1992-05-15 1993-03-29 Method of manufacturing reinforced flexible printed circuit boards

Country Status (2)

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JP (1) JPH05327192A (en)
GB (1) GB2266999A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2279817A (en) * 1993-07-02 1995-01-11 Gec Avery Ltd A method of encapsulating components on a printed circuit
WO2021116532A1 (en) * 2019-12-13 2021-06-17 Canatu Oy A formed film and a manufacturing method thereof

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100925155B1 (en) * 2007-11-29 2009-11-05 (주)예스텔레콤 Flexible printed circuit board assembly and manufacturing method for the same
CN105517317B (en) * 2014-09-22 2019-03-01 深南电路有限公司 A kind of production method and circuit board of circuit board
KR101915947B1 (en) * 2016-07-20 2019-01-30 스템코 주식회사 Flexible printed circuit boards and method for fabricating the same

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1191909A (en) * 1967-10-16 1970-05-13 Westinghouse Electric Corp Flexible Flame-Retardant Foil-Clad Laminates and Method of Manufacture
GB1254281A (en) * 1968-05-22 1971-11-17 Lucas Industries Ltd Printed circuits
GB1256526A (en) * 1967-12-26 1971-12-08
GB2104297A (en) * 1980-12-08 1983-03-02 Sony Corp Multilayer wiring substrate
GB2207287A (en) * 1987-07-17 1989-01-25 Junkosha Co Ltd A multilayer circuit board

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1191909A (en) * 1967-10-16 1970-05-13 Westinghouse Electric Corp Flexible Flame-Retardant Foil-Clad Laminates and Method of Manufacture
GB1256526A (en) * 1967-12-26 1971-12-08
GB1254281A (en) * 1968-05-22 1971-11-17 Lucas Industries Ltd Printed circuits
GB2104297A (en) * 1980-12-08 1983-03-02 Sony Corp Multilayer wiring substrate
GB2207287A (en) * 1987-07-17 1989-01-25 Junkosha Co Ltd A multilayer circuit board

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2279817A (en) * 1993-07-02 1995-01-11 Gec Avery Ltd A method of encapsulating components on a printed circuit
GB2279817B (en) * 1993-07-02 1998-01-14 Gec Avery Ltd A method of encapsulating components on a printed circuit
WO2021116532A1 (en) * 2019-12-13 2021-06-17 Canatu Oy A formed film and a manufacturing method thereof

Also Published As

Publication number Publication date
JPH05327192A (en) 1993-12-10
GB9306545D0 (en) 1993-05-19

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