JPH07170029A - Flexible printed wiring board and its manufacture - Google Patents
Flexible printed wiring board and its manufactureInfo
- Publication number
- JPH07170029A JPH07170029A JP5342263A JP34226393A JPH07170029A JP H07170029 A JPH07170029 A JP H07170029A JP 5342263 A JP5342263 A JP 5342263A JP 34226393 A JP34226393 A JP 34226393A JP H07170029 A JPH07170029 A JP H07170029A
- Authority
- JP
- Japan
- Prior art keywords
- flexible
- base material
- rigid
- circuit pattern
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】Detailed Description of the Invention
【０００１】[0001]
【産業上の利用分野】本発明は、フレキシブル基材の一
部領域に補強板を接着したフレキシブル・プリント配線
板と、その製造方法とに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible printed wiring board in which a reinforcing plate is bonded to a partial region of a flexible base material, and a method for manufacturing the same.
【０００２】[0002]
【従来の技術】可撓性を有するフレキシブル・プリント
配線板の一部に硬基板からなる補強板を接着したものが
公知である。この配線板は、この補強板で補強した領域
（以下リジッド部という）に電子部品を実装したり、こ
のリジッド部をシャーシに固定できるようにしたもので
ある。2. Description of the Related Art It is known that a flexible printed wiring board having flexibility is adhered with a reinforcing plate made of a hard substrate. In this wiring board, an electronic component can be mounted in a region reinforced by the reinforcing plate (hereinafter referred to as a rigid portion), or the rigid portion can be fixed to a chassis.
【０００３】図７はこの従来の補強板付きフレキシブル
・プリント配線板の断面図、図８はこの一部の平面図で
ある。図７において符号１０はフレキシブル基材であ
り、可撓性のベースフィルム１２の両面に銅箔１４、１
６を張り付けたものである。ここにベースフィルム１２
は通常ポリイミド、ポリエステル等の耐熱性樹脂で作ら
れている。FIG. 7 is a sectional view of this conventional flexible printed wiring board with a reinforcing plate, and FIG. 8 is a plan view of a part thereof. In FIG. 7, reference numeral 10 is a flexible base material, and copper foils 14 and 1 are provided on both sides of the flexible base film 12.
6 is attached. Base film 12 here
Is usually made of a heat resistant resin such as polyimide or polyester.
【０００４】このフレキシブル基材１０には、レジスト
を用いたサブトラクティブ法などにより所定の回路パタ
ーンが形成される。すなわち銅箔１４、１６の上にパタ
ーン部分をレジストで形成し、不必要な銅箔部分をエッ
チングにより除去し、その後レジストを除去するもので
ある。またこのフレキシブル基材１０には、電子部品等
を実装する領域すなわち後記する補強板３０を接着する
リジッド部Ｒに、スルーホール１８が形成される。A predetermined circuit pattern is formed on the flexible substrate 10 by a subtractive method using a resist. That is, a pattern portion is formed of a resist on the copper foils 14 and 16, unnecessary copper foil portions are removed by etching, and then the resist is removed. Through holes 18 are formed in the flexible base material 10 in a region where electronic parts are mounted, that is, in a rigid portion R to which a reinforcing plate 30 described later is bonded.
【０００５】このスルーホール１８は、銅箔１４、１６
の回路パターン同志を接続したり、電子部品等の実装用
パッドとなるものである。また回路パターンにはスルー
ホール１８とは別に電子部品等の実装用のランド２０
（図８参照）も形成される。The through holes 18 are formed in the copper foils 14, 16
The circuit patterns are connected to each other and serve as pads for mounting electronic parts and the like. In addition to the through holes 18, the circuit pattern has lands 20 for mounting electronic components and the like.
(See FIG. 8) are also formed.
【０００６】フレキシブル基材１０は次にその両面に柔
軟性絶縁フィルムからなるカバーレイ２２、２４が積層
される。これらのカバーレイ２２、２４はスルーホール
１８やランド２０の範囲が予め切り抜かれ、これらスル
ーホール１８のパッド１８Ａやランド２０を覆わないよ
うに予め外形加工されている。図８に斜線で示す範囲は
このカバーレイ２２（２４）を示し、ここにはスルーホ
ール１８のパッド１８Ａが現れるように丸型の窓２６
が、またランド２０が現れる角型の窓２８が設けられて
いる。The flexible substrate 10 is then laminated with cover lays 22, 24 of flexible insulating film on both sides thereof. The areas of the through holes 18 and the lands 20 are cut out in advance from these coverlays 22 and 24, and the outer shapes are preliminarily processed so as not to cover the pads 18A and the lands 20 of the through holes 18. The shaded area in FIG. 8 shows this coverlay 22 (24), in which a circular window 26 is formed so that the pad 18A of the through hole 18 appears.
However, a rectangular window 28 in which the land 20 appears is provided.
【０００７】このようにカバーレイ２２、２４を積層し
た後、このフレキシブル基材１０の一方の面には補強板
３０、３０が接着剤３２により接着される。これら補強
板３０、３０は予めリジッド部Ｒの形状に外形加工され
ると共に、パッド１８Ａに対応する窓３４（図７）も予
め切り抜かれている。このようにして補強板３０、３０
を接着したリジッド部Ｒと、これを接着しないフレキシ
ブル部Ｆとが一体化されたフレキシブル・プリント配線
板が出来上がる。After laminating the coverlays 22 and 24 in this manner, the reinforcing plates 30 and 30 are bonded to one surface of the flexible substrate 10 with the adhesive 32. These reinforcing plates 30, 30 are preliminarily processed into the shape of the rigid portion R, and the window 34 (FIG. 7) corresponding to the pad 18A is also cut out in advance. In this way, the reinforcing plates 30, 30
A flexible printed wiring board is completed in which the rigid portion R to which is adhered and the flexible portion F to which this is not adhered are integrated.
【０００８】[0008]
【従来技術の問題点】以上説明した従来のものでは、リ
ジッド部Ｒに接着する補強板３０、３０には回路パター
ンは無く、フレキシブル基材１０に形成した回路パター
ンは補強板３０の窓３４の奥に現れる。このためこの補
強板３０側には電子部品等が実装できず、電子部品等の
実装面積を拡大するためにはリジッド部Ｒを大きくする
必要があった。この結果実装密度を高めることが困難に
なったり回路設計が複雑になるなどの問題があった。2. Description of the Related Art In the conventional device described above, there is no circuit pattern on the reinforcing plates 30 and 30 adhered to the rigid portion R, and the circuit pattern formed on the flexible substrate 10 is the window 34 of the reinforcing plate 30. Appears in the back. For this reason, electronic parts and the like cannot be mounted on the side of the reinforcing plate 30, and it is necessary to enlarge the rigid portion R in order to increase the mounting area of the electronic parts and the like. As a result, there are problems that it is difficult to increase the packaging density and the circuit design becomes complicated.
【０００９】またカバーレイ２２、２４には丸型の窓２
６や、角型の窓２８を積層前に予め形成する必要があ
る。丸型の窓２６はドリル加工で容易に形成できるが、
角型の窓２８は簡単には加工できず、通常専用の抜き型
が必要になる。このため製造工程が増え、製造コストの
上昇を招くという問題もあった。The cover windows 22 and 24 have round windows 2
6 or the rectangular window 28 needs to be formed in advance before stacking. The round window 26 can be easily formed by drilling,
The rectangular window 28 cannot be easily machined and usually requires a dedicated die. For this reason, there is a problem that the number of manufacturing processes is increased and the manufacturing cost is increased.
【００１０】[0010]
【発明の目的】本発明はこのような事情に鑑みなされた
ものであり、リジッド部の部品実装面積を増やして回路
設計を容易にすると共に高密度実装化に適するものと
し、また製造工程を減らすことができるフレキシブル・
プリント配線板を提供することを第１の目的とする。ま
たこのフレキシブル・プリント配線板の製造方法を提供
することを第２の目的とする。SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and increases the component mounting area of the rigid portion to facilitate circuit design, is suitable for high-density mounting, and reduces manufacturing steps. Can be flexible
A first object is to provide a printed wiring board. A second object is to provide a method for manufacturing this flexible printed wiring board.
【００１１】[0011]
【発明の構成】本発明によれば第１の目的は、一部領域
に補強板を接着したリジッド部を有するフレキシブル・
プリント配線板において、一方の面に導体回路パターン
が形成されたフレキシブル基材と、前記フレキシブル基
材の他方の面の一部領域に接着された補強板と、前記リ
ジッド部を除き前記導体回路パターンを覆うように前記
フレキシブル基材の一方の面に接着されたカバーレイ
と、前記フレキシブル基材および補強板を貫通し前記導
体回路パターンに導通するスルーホールとを有すること
を特徴とするフレキシブル・プリント配線板により達成
される。また第２の目的は、フレキシブル基材の一方の
面に形成された導体回路パターンをカバーレイで覆った
フレキシブル部と、前記フレキシブル基材の一部領域に
補強板を接着したリジッド部とを有するフレキシブル・
プリント配線板の製造方法において、以下の各工程を有
することを特徴とするフレキシブル・プリント配線板の
製造方法： ａ． シート状接着剤から前記フレキシブル部の形状を
くり抜きかつ外形加工する工程； ｂ． 離型性補助材をフレキシブル部の形状に外形加工
する工程； ｃ． 前記フレキシブル基材およびリジッド基材の非銅
張り面の間に、前記工程ａ、ｂで外形加工したシート状
接着剤および離型性補助材をそれぞれ所定位置に挾ん
で、積層と積層体を形成する工程； ｄ． 前記積層体の前記リジッド部を貫通するスルーホ
ールを形成する工程； ｅ． フレキシブル基材およびリジッド基材の銅張り面
に導体回路パターンを形成する工程； ｆ． 前記フレキシブル部の導体回路パターンを覆うよ
うにカバーレイを外形加工し、積層する工程； ｇ． フレキシブル部とリジッド部との境界に沿って前
記リジッド基材に座ぐり加工を施し不要部分を除去する
工程、により達成される。According to the present invention, a first object is to provide a flexible structure having a rigid portion to which a reinforcing plate is bonded in a partial area.
In a printed wiring board, a flexible base material having a conductor circuit pattern formed on one surface thereof, a reinforcing plate adhered to a partial region of the other surface of the flexible base material, and the conductor circuit pattern except for the rigid portion. A flexible print having a cover lay adhered to one surface of the flexible base material so as to cover the flexible base material and a through hole penetrating the flexible base material and the reinforcing plate and electrically connected to the conductor circuit pattern. Achieved by the wiring board. A second object is to have a flexible portion in which a conductor circuit pattern formed on one surface of the flexible base material is covered with a coverlay, and a rigid portion in which a reinforcing plate is bonded to a partial region of the flexible base material. flexible·
A method of manufacturing a flexible printed wiring board, which comprises the following steps in a method of manufacturing a printed wiring board: a. A step of hollowing out the shape of the flexible portion from the sheet-like adhesive and performing an outer shape processing; b. A step of externally processing the releasability auxiliary material into the shape of the flexible portion; c. Between the non-copper-clad surfaces of the flexible base material and the rigid base material, the sheet-like adhesive and the releasability auxiliary material that have been externally processed in the steps a and b are sandwiched at predetermined positions to form a laminate and a laminate. D. Forming a through hole penetrating the rigid portion of the laminate; e. Forming a conductor circuit pattern on the copper-clad surfaces of the flexible substrate and the rigid substrate; f. A step of externally processing and laminating a cover lay so as to cover the conductor circuit pattern of the flexible portion; g. This is achieved by a step of counterboring the rigid base material along the boundary between the flexible portion and the rigid portion to remove unnecessary portions.
【００１２】[0012]
【実施例】図１は本発明の一実施例の断面図、図２はフ
レキシブル部およびリジッド部の配置を示すためのリジ
ッド基材の斜視図、図３は積層工程を説明する分解斜視
図、図４は最終工程であるリジッド基材の捨て板部の除
去工程を説明する斜視図である。また図５は製造途中工
程を示す断面図、図６は製造工程流れ図である。1 is a sectional view of an embodiment of the present invention, FIG. 2 is a perspective view of a rigid base material for showing the arrangement of a flexible portion and a rigid portion, FIG. 3 is an exploded perspective view for explaining a laminating process, FIG. 4 is a perspective view illustrating a final step of removing the waste plate portion of the rigid base material. Further, FIG. 5 is a sectional view showing a manufacturing process, and FIG. 6 is a manufacturing process flow chart.
【００１３】これらの図で符号５０はリジッド基材であ
り、片面に銅張りをした硬質樹脂基板５２からなる。す
なわちこの下面（図５（Ａ）参照）には銅箔５４が接着
されている。このリジッド基材５０は、フレキシブル・
プリント配線板の最終製品５６（図４参照）よりも大き
く作られ、この最終製品５６の外側の部分は後記する工
程により適宜数の捨て板部５８となるものである。In these drawings, reference numeral 50 is a rigid base material, which is composed of a hard resin substrate 52 having copper plating on one side. That is, the copper foil 54 is adhered to the lower surface (see FIG. 5A). This rigid base material 50 is flexible
It is made larger than the final product 56 (see FIG. 4) of the printed wiring board, and the outer portion of this final product 56 becomes an appropriate number of waste plate parts 58 by the process described later.
【００１４】すなわち最終製品５６の領域と捨て板部５
８との境界には後記する最終工程においてＶ溝６０Ａあ
るいはスリット６０Ｂからなる割り線部６０が形成さ
れ、捨て板部５８が割り取られる（図２、４）。なおリ
ジッド基材５０の隅には位置決め用の基準穴６２が予め
適宜数形成されている（図３）。That is, the area of the final product 56 and the waste plate portion 5
A dividing line portion 60 composed of a V groove 60A or a slit 60B is formed at the boundary with the groove 8 and a discarding plate portion 58 is cut (FIGS. 2 and 4). It is to be noted that an appropriate number of reference holes 62 for positioning are formed in advance in the corners of the rigid base material 50 (FIG. 3).
【００１５】最終製品５４は図４に示すように略Ｌ字形
であり、フレキシブル部Ｆとリジッド部Ｒとは交互に配
列されている。図２で斜線部（Ｒ）はこのリジッド部Ｒ
となる範囲を示し、また黒点を付した部分（Ｆ）はフレ
キシブル部Ｆとなる範囲を示す。The final product 54 is substantially L-shaped as shown in FIG. 4, and the flexible portions F and the rigid portions R are alternately arranged. In FIG. 2, the shaded portion (R) is the rigid portion R.
And the portion (F) marked with a black dot indicates the flexible portion F.
【００１６】６４はシート状接着剤であり、リジッド基
材５０と同一外形を持つと共に、フレキシブル部（Ｆ）
となる領域（Ｆ0 ）がくり抜かれるように外形加工され
ている（図３、図６の工程Ｓ１００）。６６は離型性補
助材であり、予めフレキシブル部Ｆの形状に外形加工さ
れている（図３、図６の工程Ｓ１０２）。シート状接着
剤６４は樹脂流れが少ないプリプレグを用いることがで
きる。離型性補助材６６はシート状接着剤６４と略同じ
厚さの硬化した樹脂の板などを所定形状に切って用い
る。Reference numeral 64 denotes a sheet-like adhesive, which has the same outer shape as the rigid base material 50 and has a flexible portion (F).
The outer shape is processed so as to hollow out the region (F 0 ) that becomes (step S100 in FIGS. 3 and 6). Reference numeral 66 is a releasability auxiliary material, which has been externally processed in advance into the shape of the flexible portion F (step S102 in FIGS. 3 and 6). As the sheet adhesive 64, a prepreg with a small resin flow can be used. As the releasability auxiliary material 66, a cured resin plate or the like having substantially the same thickness as the sheet adhesive 64 is cut into a predetermined shape and used.
【００１７】６８はフレキシブル基材であり、リジッド
基材５０と略同一外形寸法を持ち、かつベースフィルム
７０の片面に銅箔７２を接着したものである。このフレ
キシブル基材６８は、その銅箔７２が張られていない面
すなわち非銅張り面６８Ａが、シート状接着剤６４と離
型性補助材６６とを挟んでリジッド基材５０の非銅張り
面５０Ａに積層される（図３、図５の（Ａ）参照）。こ
こに離型性補助材６６はシート状接着剤６４の領域（Ｆ
0 ）に位置合せして嵌め込まれている（図６の工程Ｓ１
０４）。Reference numeral 68 denotes a flexible base material, which has substantially the same outer dimensions as the rigid base material 50 and has a copper foil 72 adhered to one surface of the base film 70. In this flexible base material 68, the surface on which the copper foil 72 is not stretched, that is, the non-copper-clad surface 68A sandwiches the sheet adhesive 64 and the releasability auxiliary material 66, and the non-copper-clad surface of the rigid base material 50. 50A (see FIG. 3 and FIG. 5A). Here, the releasability auxiliary material 66 is the area (F
(0 ) is aligned and fitted (step S1 in FIG. 6).
04).
【００１８】この積層体７４のリジッド部（Ｒ）の領域
内には、複数のスルーホール７８が形成される。すなわ
ち貫通孔がドリル加工され（図６、工程Ｓ１０６）、こ
の貫通孔に導電性のめっきが施されてスルーホール７８
が作られる（図６の工程Ｓ１０８、図５の（Ｂ）参
照）。次にこの積層体７４の両面に回路パターン５４
Ａ、７２Ａが形成される（図５の（Ｃ）参照、図６の工
程Ｓ１１０）。すなわち両面の銅箔５４、７２にスクリ
ーン印刷などにより回路パターンとして残す部分にレジ
ストを塗布し、エッチングにより銅箔５４、７２の不要
部分を除去する。A plurality of through holes 78 are formed in the region of the rigid portion (R) of the laminated body 74. That is, the through hole is drilled (step S106 in FIG. 6), the through hole is plated with a conductive material, and the through hole 78 is formed.
Are created (see step S108 in FIG. 6 and FIG. 5B). Next, the circuit pattern 54 is formed on both sides of the laminated body 74
A and 72A are formed (see FIG. 5C, step S110 in FIG. 6). That is, a resist is applied to the portions of the copper foils 54, 72 on both sides that remain as a circuit pattern by screen printing or the like, and unnecessary portions of the copper foils 54, 72 are removed by etching.
【００１９】一方カバーレイ８０がフレキシブル部Ｆの
回路パターン７２Ａをカバーする形状に外形加工されて
用意される（図６の工程Ｓ１１２）。このカバーレイ８
０は、積層体７４のフレキシブル部Ｆの回路パターン７
２Ａを覆うように接着される（図５の（Ｃ）、図６の工
程Ｓ１１４）。On the other hand, the cover lay 80 is prepared by external processing to a shape that covers the circuit pattern 72A of the flexible portion F (step S112 in FIG. 6). This coverlay 8
0 is the circuit pattern 7 of the flexible portion F of the laminate 74.
It is adhered so as to cover 2A ((C) of FIG. 5, step S114 of FIG. 6).
【００２０】積層体７４にはさらに必要箇所がソルダー
レジスト８２によりカバーされる（図５の（Ｄ）、図６
の工程Ｓ１１６）。例えば図８に示すパッド１８Ａやラ
ンド２０などのはんだ付けを行う部分を除いて、はんだ
付けが不要な配線ライン部分などにソルダーレジスト８
２が塗布される。そして積層体７４はソルダーめっき槽
に入れられてソルダーコート８４が形成される（図５の
（Ｅ）、図６の工程Ｓ１１８）。この結果はんだ付けす
る箇所にソルダーコート８４が付着し、電子部品等のは
んだ付けを容易にすることができる。Necessary portions of the laminate 74 are further covered with a solder resist 82 (FIG. 5 (D), FIG. 6).
Step S116). For example, except for a portion to be soldered such as the pad 18A and the land 20 shown in FIG. 8, the solder resist 8 is applied to a wiring line portion that does not require soldering.
2 is applied. Then, the laminated body 74 is put into a solder plating tank to form the solder coat 84 ((E) of FIG. 5, step S118 of FIG. 6). As a result, the solder coat 84 is attached to the soldering points, which facilitates the soldering of electronic components and the like.
【００２１】この積層板７４には、次に捨て板部５８を
割り取るための割り線部６０がＮＣルータにより加工さ
れ、また他の不要部分すなわちリジッド基材５０のフレ
キシブル部（Ｆ）に対応する部分の外形がＮＣルータに
より座ぐり加工される（図５の（Ｅ）、図６の工程Ｓ１
２０）。この座ぐり加工は図５の（Ｅ）に示すように、
リジッド基板５０側から離型性補助材６６に達する深さ
までスリット状に切り込みを入れるものである。この実
施例ではフレキシブル部Ｆの２辺はスリット６０Ｂとな
っているから、実際にはリジッド部（Ｒ）との境界とな
る他の２辺にこの座ぐり加工が施される。Next, a dividing line portion 60 for dividing the discarding plate portion 58 is processed by the NC router in the laminated plate 74, and corresponds to another unnecessary portion, that is, the flexible portion (F) of the rigid base material 50. The outer shape of the portion to be cut is counterbored by the NC router ((E) of FIG. 5, step S1 of FIG. 6).
20). This counterbore processing is as shown in FIG.
A slit-like cut is made from the rigid substrate 50 side to a depth reaching the releasability auxiliary material 66. In this embodiment, the slit 60B is formed on two sides of the flexible portion F, so that the other two sides that are boundaries with the rigid portion (R) are actually subjected to the spot facing.
【００２２】この座ぐり加工によりリジッド基材５０の
うちフレキシブル部（Ｆ）に対応する部分が除去でき、
さらに離型性補助材６６も除去される。図５の（Ｅ）は
この状態を示している。そしてリジッド基材５０の捨て
板部５８を割り線部６０に沿って割り取って外形加工を
行えば最終製品５６が得られる。またソルダーレジスト
８２は剥離してもよいし、そのまま残しておいてもよ
い。By this counterbore processing, the portion of the rigid base material 50 corresponding to the flexible portion (F) can be removed,
Further, the releasability auxiliary material 66 is also removed. FIG. 5E shows this state. Then, the waste plate portion 58 of the rigid base material 50 is cut along the dividing line portion 60 and the outer shape is processed, so that the final product 56 is obtained. Further, the solder resist 82 may be peeled off or may be left as it is.
【００２３】このようにリジッド部Ｒには、銅箔７２に
よる回路パターン７２Ａだけでなく、リジッド基材５０
側の銅箔５４にも回路パターン５４Ａが形成されるか
ら、両面に部品の実装が可能になる。このため回路設計
の自由度が増え設計が容易になり、高密度化が可能にな
る。またカバーレイに丸あるいは矩形の窓を加工する必
要が無いから製造工程が減る。As described above, not only the circuit pattern 72A made of the copper foil 72 but also the rigid base material 50 is provided in the rigid portion R.
Since the circuit pattern 54A is also formed on the copper foil 54 on the side, components can be mounted on both sides. For this reason, the degree of freedom in circuit design is increased, design is facilitated, and high density can be achieved. Further, since it is not necessary to process a round or rectangular window on the coverlay, the number of manufacturing steps is reduced.
【００２４】この実施例では、積層体７４は最終製品５
６の外周に捨て板部５８を有する形状としたから、この
捨て板部５８あるいは捨て板部５８とフレキシブル部
（Ｆ）に対応する座ぐり加工された部分を除去する前の
状態で、この捨て板部５８を保持して搬送することがで
きる。この場合には捨て板部５８を保持して搬送するこ
とにより、一般的なリジッド（硬質）プリント配線板と
同様な工程、装置を用いて部品の自動自装填を行うこと
ができる。このように部品を自動実装した後に捨て板部
５８やフレキシブル部Ｆに対応する部分を除去すれば、
部品実装済みのフレキシブル・プリント配線板とするこ
とができる。In this embodiment, the laminate 74 is the final product 5
6 has a discard plate portion 58 on the outer periphery thereof, the discard plate portion 58 or a portion corresponding to the discard plate portion 58 and the flexible portion (F), which has been counterbored, is removed before being discarded. The plate portion 58 can be held and conveyed. In this case, by holding and transporting the discarding plate portion 58, it is possible to perform automatic self-loading of components by using the same process and apparatus as those for a general rigid (hard) printed wiring board. If parts corresponding to the discard plate portion 58 and the flexible portion F are removed after the components are automatically mounted in this way,
It can be a flexible printed wiring board with components already mounted.
【００２５】また本実施例ではフレキシブル部Ｆもリジ
ッド部Ｒも１枚の製品であるが、これらを複数枚重ねた
ものや、異なる基板あるいは製品と組合せた集合基板と
することも可能である。例えば銅箔なしの基板と銅張り
した基板とを接着して所定厚さのリジッド基材５０を形
成してもよい。またリジッド基材５０やフレキシブル基
材６８は予め銅箔を張ったものに代えて、積層時（図６
の工程Ｓ１０４）に積層・接着するものであってもよ
い。Further, in the present embodiment, the flexible portion F and the rigid portion R are one product, but it is also possible to stack a plurality of these, or a different substrate or a collective substrate combined with a product. For example, a rigid base material 50 having a predetermined thickness may be formed by bonding a substrate without copper foil and a copper-clad substrate. Further, the rigid base material 50 and the flexible base material 68 are replaced with the copper foils preliminarily stretched, and when laminated (see FIG. 6).
It may be laminated and adhered to the step S104).
【００２６】[0026]
【発明の効果】請求項１の発明は以上のように、片面に
導体回路パターンが形成されたフレキシブル基材の他の
片面に補強板を接着し、フレキシブル基材のフレキシブ
ル部に対応する回路パターンをカバーレイでカバーする
と共に、補強板およびフレキシブル基材を貫通するスル
ーホールを設けたものであるから、リジッド部の両面に
部品を実装することが可能になり、部品実装面積が増え
る。このため回路設計が容易になり、実装密度を高める
ことが可能になる。As described above, according to the first aspect of the present invention, a reinforcing plate is adhered to another side of a flexible base material having a conductor circuit pattern formed on one side, and a circuit pattern corresponding to the flexible portion of the flexible base material. Since the cover lay is covered with through holes penetrating the reinforcing plate and the flexible base material, components can be mounted on both surfaces of the rigid portion, and the component mounting area is increased. Therefore, the circuit design becomes easy and the packaging density can be increased.
【００２７】またカバーレイにスルーホールやランドに
対応する窓を形成しておく必要が無いので製造工程が減
り、製造コストの低減にも適する。Further, since it is not necessary to form windows corresponding to through holes and lands in the coverlay, the number of manufacturing steps is reduced, and the manufacturing cost is also reduced.
【００２８】請求項２の発明によればこのフレキシブル
・プリント配線板の製造方法が得られる。ここでリジッ
ド部の非はんだ付け部分を含む所定領域をソルダーレジ
ストで覆い、はんだ付け部分にソルダーコートを施して
おいてもよい（請求項３）。According to the invention of claim 2, the method for manufacturing the flexible printed wiring board can be obtained. Here, a predetermined area including the non-soldered portion of the rigid portion may be covered with a solder resist, and the soldered portion may be solder-coated (claim 3).
【００２９】特にソリッド基材には、製品となる部分の
外周に割り線部を形成して割り取り可能な捨て板部を設
けておけば、この捨て板部を保持して搬送することによ
り部品の自動実装装置を使って部品自動実装を行うこと
ができる（請求項４）。捨て板部はこの部品実装後に割
り取ればよい。ここにリジッド基材のフレキシブル部に
対応する部分は、捨て板部を除去する際に同時に除去す
るようにしてもよい。割り線部はＶ溝やスリットで形成
することができ、特にフレキシブル部に接する部分をス
リットにすれば、フレキシブル部に対応するリジッド部
材を容易に除去することができ、都合がよい（請求項
５）。Particularly, in a solid substrate, if a dividing line portion is formed on the outer periphery of a portion to be a product and a disposable discarding plate portion is provided, the discarding plate portion is held and conveyed to carry out parts. Parts can be automatically mounted using the automatic mounting apparatus of (Claim 4). The discard plate may be cut after mounting this component. Here, the portion corresponding to the flexible portion of the rigid base material may be removed at the same time when the discarding plate portion is removed. The split line portion can be formed by a V groove or a slit. Particularly, if the portion contacting the flexible portion is formed as a slit, the rigid member corresponding to the flexible portion can be easily removed, which is convenient. ).
【図１】本発明の一実施例を示す断面図FIG. 1 is a sectional view showing an embodiment of the present invention.
【図２】リジッド基材の斜視図FIG. 2 is a perspective view of a rigid base material.
【図３】分解斜視図FIG. 3 is an exploded perspective view
【図４】捨て板部の除去工程の説明図FIG. 4 is an explanatory diagram of a process of removing the discard plate portion.
【図５】製造途中の工程を示す断面図FIG. 5 is a cross-sectional view showing a process during manufacturing.
【図６】製造工程流れ図[Figure 6] Manufacturing process flow chart
【図７】従来の配線板の断面図FIG. 7 is a sectional view of a conventional wiring board.
【図８】その一部の平面図FIG. 8 is a plan view of a part thereof.
【符号の説明】 ５０ リジッド基材 ５４Ａ、７２Ａ 回路パターン ５８ 捨て板部 ６０ 割り線部 ６０Ａ Ｖ溝 ６０Ｂ スリット ６４ シート状接着剤 ６６ 離型性補助材 ６８ フレキシブル基材（補強板） ７４ 積層体 ７８ スルーホール ８０ カバーレイ ８２ ソルダーレジスト ８４ ソルダーコート Ｆ フレキシブル部 Ｒ リジッド部[Explanation of reference numerals] 50 Rigid base material 54A, 72A Circuit pattern 58 Discard plate portion 60 Dividing line portion 60A V groove 60B Slit 64 Sheet adhesive 66 Releasing auxiliary material 68 Flexible base material (reinforcing plate) 74 Laminated body 78 Through hole 80 Coverlay 82 Solder resist 84 Solder coat F Flexible part R Rigid part
Claims (5)
を有するフレキシブル・プリント配線板において、一方
の面に導体回路パターンが形成されたフレキシブル基材
と、前記フレキシブル基材の他方の面の一部領域に接着
された補強板と、前記リジッド部を除き前記導体回路パ
ターンを覆うように前記フレキシブル基材の一方の面に
接着されたカバーレイと、前記フレキシブル基材および
補強板を貫通し前記導体回路パターンに導通するスルー
ホールとを有することを特徴とするフレキシブル・プリ
ント配線板。1. A flexible printed wiring board having a rigid portion having a reinforcing plate adhered to a partial area thereof, wherein a flexible base material having a conductor circuit pattern formed on one surface and a flexible base material on the other surface of the flexible base material. A reinforcing plate adhered to a partial area, a cover lay adhered to one surface of the flexible base material so as to cover the conductor circuit pattern except the rigid portion, and penetrates the flexible base material and the reinforcing plate. A flexible printed wiring board having a through hole that is electrically connected to the conductor circuit pattern.
た導体回路パターンをカバーレイで覆ったフレキシブル
部と、前記フレキシブル基材の一部領域に補強板を接着
したリジッド部とを有するフレキシブル・プリント配線
板の製造方法において、以下の各工程を有することを特
徴とするフレキシブル・プリント配線板の製造方法： ａ． シート状接着剤から前記フレキシブル部の形状を
くり抜きかつ外形加工する工程； ｂ． 離型性補助材をフレキシブル部の形状に外形加工
する工程； ｃ． 前記フレキシブル基材およびリジッド基材の非銅
張り面の間に、前記工程ａ、ｂで外形加工したシート状
接着剤および離型性補助材をそれぞれ所定位置に挾ん
で、積層と積層体を形成する工程； ｄ． 前記積層体の前記リジッド部を貫通するスルーホ
ールを形成する工程； ｅ． フレキシブル基材およびリジッド基材の銅張り面
に導体回路パターンを形成する工程； ｆ． 前記フレキシブル部の導体回路パターンを覆うよ
うにカバーレイを外形加工し、積層する工程； ｇ． フレキシブル部とリジッド部との境界に沿って前
記リジッド基材に座ぐり加工を施し不要部分を除去する
工程。2. A flexible part having a flexible part in which a conductor circuit pattern formed on one surface of a flexible base material is covered with a coverlay, and a rigid part in which a reinforcing plate is bonded to a partial region of the flexible base material. A method of manufacturing a flexible printed wiring board, which comprises the following steps in a method of manufacturing a printed wiring board: a. A step of hollowing out the shape of the flexible portion from the sheet-like adhesive and performing an outer shape processing; b. A step of externally processing the releasability auxiliary material into the shape of the flexible portion; c. Between the non-copper-clad surfaces of the flexible base material and the rigid base material, the sheet-like adhesive and the releasability auxiliary material that have been externally processed in the steps a and b are sandwiched at predetermined positions to form a laminate and a laminate. D. Forming a through hole penetrating the rigid portion of the laminate; e. Forming a conductor circuit pattern on the copper-clad surfaces of the flexible substrate and the rigid substrate; f. A step of externally processing and laminating a coverlay so as to cover the conductor circuit pattern of the flexible portion; g. A step of counterboring the rigid base material along the boundary between the flexible portion and the rigid portion to remove unnecessary portions.
との間に以下の工程を追加したフレキシブル・プリント
配線板の製造方法： ｆ１． リジッド部の非はんだ付け部分を含む所定領域
をソルダーレジストで覆う工程； ｆ２． はんだ付け部にソルダーコートを施す工程。3. The method according to claim 2, wherein step f and step g are performed.
A method for manufacturing a flexible printed wiring board, in which the following steps are added between and: f1. Step of covering a predetermined region including a non-soldered portion of the rigid portion with a solder resist; f2. Process of applying solder coat to the soldering part.
にはフレキシブル部およびリジッド部の外周に捨て板部
が一体に設けられ、前記工程ｇでこの捨て板部と前記フ
レキシブル部およびリジッド部との境界に沿って割り線
部が形成されるフレキシブル・プリント配線板の製造方
法。4. The laminate according to claim 2 or 3, wherein the laminated body is integrally provided with a sacrificial plate portion on an outer periphery of the flexible portion and the rigid portion, and the sacrificial plate portion and the flexible portion and the rigid portion are formed in the step g. A method for manufacturing a flexible printed wiring board in which a dividing line is formed along the boundary of the.
外縁に接するスリットである請求項４のフレキシブル・
プリント配線板の製造方法。5. The flexible member according to claim 4, wherein a part of the dividing line portion is a slit in contact with an outer edge of the flexible portion.
Manufacturing method of printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5342263A JPH07170029A (en) | 1993-12-15 | 1993-12-15 | Flexible printed wiring board and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5342263A JPH07170029A (en) | 1993-12-15 | 1993-12-15 | Flexible printed wiring board and its manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07170029A true JPH07170029A (en) | 1995-07-04 |
Family
ID=18352365
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5342263A Pending JPH07170029A (en) | 1993-12-15 | 1993-12-15 | Flexible printed wiring board and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07170029A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2871336A1 (en) * | 2004-06-02 | 2005-12-09 | Bree Ind Soc Par Actions Simpl | FLEX-RIGID PRINTED CIRCUIT BY COLLAGE |
| JP2006179863A (en) * | 2004-11-25 | 2006-07-06 | Fujikura Ltd | Circuit wiring composite substrate |
| WO2009013988A1 (en) * | 2007-07-25 | 2009-01-29 | Canon Kabushiki Kaisha | Print circuit board and electronic device using the same |
| JP2009277692A (en) * | 2008-05-12 | 2009-11-26 | Fujitsu Ltd | Multilayer printed wiring board, electronic device, and production method of electronic device |
| WO2011062146A1 (en) * | 2009-11-20 | 2011-05-26 | 株式会社村田製作所 | Method of manufacturing rigid/flexible multilayered wiring substrate, and integrated substrate |
| CN113038690A (en) * | 2021-01-28 | 2021-06-25 | 江苏运鸿辉电子科技有限公司 | Soft and hard composite circuit board |
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| JPS5435364A (en) * | 1977-08-03 | 1979-03-15 | Mack Robert L | Method of making print circuit board |
| JPH02229492A (en) * | 1989-03-02 | 1990-09-12 | Hitachi Chem Co Ltd | Manufacture of wiring board |
| JPH04213888A (en) * | 1990-02-05 | 1992-08-04 | Carl Freudenberg:Fa | Manufacture of hard/soft printed board |
| JPH05243737A (en) * | 1992-02-28 | 1993-09-21 | Nippon Avionics Co Ltd | Flexible rigid printed wiring board |
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1993
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| JPS5067456A (en) * | 1973-10-19 | 1975-06-06 | ||
| JPS5435364A (en) * | 1977-08-03 | 1979-03-15 | Mack Robert L | Method of making print circuit board |
| JPH02229492A (en) * | 1989-03-02 | 1990-09-12 | Hitachi Chem Co Ltd | Manufacture of wiring board |
| JPH04213888A (en) * | 1990-02-05 | 1992-08-04 | Carl Freudenberg:Fa | Manufacture of hard/soft printed board |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2871336A1 (en) * | 2004-06-02 | 2005-12-09 | Bree Ind Soc Par Actions Simpl | FLEX-RIGID PRINTED CIRCUIT BY COLLAGE |
| WO2006000694A1 (en) * | 2004-06-02 | 2006-01-05 | Bree Industrie | Flex-rigid printed circuit by bonding |
| JP2006179863A (en) * | 2004-11-25 | 2006-07-06 | Fujikura Ltd | Circuit wiring composite substrate |
| WO2009013988A1 (en) * | 2007-07-25 | 2009-01-29 | Canon Kabushiki Kaisha | Print circuit board and electronic device using the same |
| US9426881B2 (en) | 2007-07-25 | 2016-08-23 | Canon Kabushiki Kaisha | Print circuit board and electronic device using the same |
| JP2009277692A (en) * | 2008-05-12 | 2009-11-26 | Fujitsu Ltd | Multilayer printed wiring board, electronic device, and production method of electronic device |
| WO2011062146A1 (en) * | 2009-11-20 | 2011-05-26 | 株式会社村田製作所 | Method of manufacturing rigid/flexible multilayered wiring substrate, and integrated substrate |
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| US9119335B2 (en) | 2009-11-20 | 2015-08-25 | Murata Manufacturing Co., Ltd. | Method for manufacturing rigid-flexible multilayer wiring board and collective board |
| CN113038690A (en) * | 2021-01-28 | 2021-06-25 | 江苏运鸿辉电子科技有限公司 | Soft and hard composite circuit board |
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