GB1330332A - Electroless deposition of copper - Google Patents
Electroless deposition of copperInfo
- Publication number
- GB1330332A GB1330332A GB4859070A GB4859070A GB1330332A GB 1330332 A GB1330332 A GB 1330332A GB 4859070 A GB4859070 A GB 4859070A GB 4859070 A GB4859070 A GB 4859070A GB 1330332 A GB1330332 A GB 1330332A
- Authority
- GB
- United Kingdom
- Prior art keywords
- mol
- oct
- contacted
- silver nitrate
- copper plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
Abstract
1330332 Electroless copper plating PHILIPS ELECTRONIC & ASSOCIATED INDUSTRIES Ltd 13 Oct 1970 [16 Oct 1969] 48590/70 Heading C7F [Also in Division G2] An alkaline, aqueous Cu-plating solution free from a sulphur compound which is capable of forming a chelate with cuprous ions, inorganic cyanide, organic nitrile or compounds of Mo, Nb, V, Re, V, As, Sb, Bi, Ac, La, and rare earths comprises per litre 0À01 to 0À10 mol of Cu salt, 0À01 to 0À80 mol of complexing agent, 0À05 to 0À50 mol alkalimetal hydroxide, 0À01 to 0À35 mol formaldehyde, and one or more nonionic or ionic polyalkylene oxidic compounds, e.g. a polyalkylene glycol, an ether which may be esterified with an acid sulphate ester or an acid phosphate ester of a fatty alcohol or an alkyl phenol or a polyethylene glycol or an ethoxylated fatty amine or fatty amide. Examples are described of plating on paper-resin laminates and glass plates. The substrate may be first coated with a photo-sensitive material, which is exposed and then contacted with a mercurous nitrate and silver nitrate solution, and intensified with silver nitrate before contacting with the copper plating solution. Alternatively the substrates may be first contacted with stannous and palladium chlorides.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL6915718A NL6915718A (en) | 1969-10-16 | 1969-10-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1330332A true GB1330332A (en) | 1973-09-19 |
Family
ID=19808149
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB4859070A Expired GB1330332A (en) | 1969-10-16 | 1970-10-13 | Electroless deposition of copper |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US3804638A (en) |
| AT (1) | AT311145B (en) |
| AU (1) | AU2101370A (en) |
| BE (1) | BE757573A (en) |
| CA (1) | CA947458A (en) |
| CH (1) | CH550255A (en) |
| DE (1) | DE2049061C3 (en) |
| FR (1) | FR2065996A5 (en) |
| GB (1) | GB1330332A (en) |
| HK (1) | HK49576A (en) |
| NL (1) | NL6915718A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4171225A (en) | 1976-01-23 | 1979-10-16 | U.S. Philips Corporation | Electroless copper plating solutions |
| EP0132594A1 (en) * | 1983-07-25 | 1985-02-13 | Hitachi, Ltd. | Electroless copper plating solution |
| CN110498532A (en) * | 2019-08-15 | 2019-11-26 | 深南电路股份有限公司 | The processing method and processing unit of printed wiring board waste water |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5627594B2 (en) * | 1975-03-14 | 1981-06-25 | ||
| US4211564A (en) * | 1978-05-09 | 1980-07-08 | Hitachi, Ltd. | Chemical copper plating solution |
| US4301196A (en) * | 1978-09-13 | 1981-11-17 | Kollmorgen Technologies Corp. | Electroless copper deposition process having faster plating rates |
| US4303443A (en) * | 1979-06-15 | 1981-12-01 | Hitachi, Ltd. | Electroless copper plating solution |
| JPS56156749A (en) * | 1980-05-08 | 1981-12-03 | Toshiba Corp | Chemical copper plating solution |
| CA1184359A (en) * | 1981-10-23 | 1985-03-26 | Donald A. Arcilesi | Metallic impurity control for electroless copper plating |
| IT1157006B (en) * | 1982-03-09 | 1987-02-11 | Alfachimici Spa | STABILIZING MIXTURE FOR A CHEMICAL COPPER BATH |
| US4548644A (en) * | 1982-09-28 | 1985-10-22 | Hitachi Chemical Company, Ltd. | Electroless copper deposition solution |
| US4908242A (en) * | 1986-10-31 | 1990-03-13 | Kollmorgen Corporation | Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures |
| US5925403A (en) * | 1994-01-31 | 1999-07-20 | Matsushita Electric Works, Ltd. | Method of coating a copper film on a ceramic substrate |
| US6852152B2 (en) * | 2002-09-24 | 2005-02-08 | International Business Machines Corporation | Colloidal seed formulation for printed circuit board metallization |
| US20050016416A1 (en) * | 2003-07-23 | 2005-01-27 | Jon Bengston | Stabilizer for electroless copper plating solution |
| TWI335632B (en) * | 2003-09-19 | 2011-01-01 | Applied Materials Inc | Apparatus and method of detecting the electroless deposition endpoint |
| US20050067297A1 (en) * | 2003-09-26 | 2005-03-31 | Innovative Technology Licensing, Llc | Copper bath for electroplating fine circuitry on semiconductor chips |
| US20060062897A1 (en) * | 2004-09-17 | 2006-03-23 | Applied Materials, Inc | Patterned wafer thickness detection system |
| JP2006342428A (en) * | 2005-06-10 | 2006-12-21 | Enthone Inc | Method for direct metallization of non-conductive substrate |
| US20160273112A1 (en) * | 2013-03-27 | 2016-09-22 | Atotech Deutschland Gmbh | Electroless copper plating solution |
| US10060034B2 (en) | 2017-01-23 | 2018-08-28 | Rohm And Haas Electronic Materials Llc | Electroless copper plating compositions |
| US10294569B2 (en) | 2017-10-06 | 2019-05-21 | Rohm And Haas Electronic Materials Llc | Stable electroless copper plating compositions and methods for electroless plating copper on substrates |
| US10655227B2 (en) | 2017-10-06 | 2020-05-19 | Rohm And Haas Electronic Materials Llc | Stable electroless copper plating compositions and methods for electroless plating copper on substrates |
| CN113388829A (en) * | 2021-06-11 | 2021-09-14 | 惠州金晟新电子科技有限公司 | Electroless copper plating solution and method for plating copper on substrate by using electroless copper plating solution |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3075856A (en) * | 1958-03-31 | 1963-01-29 | Gen Electric | Copper plating process and solution |
| US3300335A (en) * | 1963-11-20 | 1967-01-24 | Dow Chemical Co | Electroless metal plating with foam |
| US3485643A (en) * | 1966-05-06 | 1969-12-23 | Photocircuits Corp | Electroless copper plating |
| US3472664A (en) * | 1966-09-15 | 1969-10-14 | Enthone | Inhibiting stardusting in electroless copper plating |
| US3515563A (en) * | 1967-12-28 | 1970-06-02 | Photocircuits Corp | Autocatalytic metal plating solutions |
-
0
- BE BE757573D patent/BE757573A/en not_active IP Right Cessation
-
1969
- 1969-10-16 NL NL6915718A patent/NL6915718A/xx unknown
-
1970
- 1970-10-06 DE DE2049061A patent/DE2049061C3/en not_active Expired
- 1970-10-13 AU AU21013/70A patent/AU2101370A/en not_active Expired
- 1970-10-13 GB GB4859070A patent/GB1330332A/en not_active Expired
- 1970-10-13 CA CA095,339A patent/CA947458A/en not_active Expired
- 1970-10-13 AT AT922170A patent/AT311145B/en not_active IP Right Cessation
- 1970-10-13 CH CH1511570A patent/CH550255A/en not_active IP Right Cessation
- 1970-10-15 FR FR7037240A patent/FR2065996A5/fr not_active Expired
-
1972
- 1972-04-06 US US00241806A patent/US3804638A/en not_active Expired - Lifetime
-
1976
- 1976-07-29 HK HK495/76*UA patent/HK49576A/en unknown
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4171225A (en) | 1976-01-23 | 1979-10-16 | U.S. Philips Corporation | Electroless copper plating solutions |
| EP0132594A1 (en) * | 1983-07-25 | 1985-02-13 | Hitachi, Ltd. | Electroless copper plating solution |
| CN110498532A (en) * | 2019-08-15 | 2019-11-26 | 深南电路股份有限公司 | The processing method and processing unit of printed wiring board waste water |
Also Published As
| Publication number | Publication date |
|---|---|
| BE757573A (en) | 1971-04-15 |
| CH550255A (en) | 1974-06-14 |
| NL6915718A (en) | 1971-04-20 |
| CA947458A (en) | 1974-05-21 |
| FR2065996A5 (en) | 1971-08-06 |
| AU2101370A (en) | 1972-04-20 |
| HK49576A (en) | 1976-08-06 |
| AT311145B (en) | 1973-10-25 |
| DE2049061C3 (en) | 1981-04-30 |
| DE2049061B2 (en) | 1980-07-24 |
| US3804638A (en) | 1974-04-16 |
| DE2049061A1 (en) | 1971-04-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PCNP | Patent ceased through non-payment of renewal fee |