CH550255A - METHOD FOR ELECTRICALLY COPPER PLATING OF SURFACES. - Google Patents

METHOD FOR ELECTRICALLY COPPER PLATING OF SURFACES.

Info

Publication number: CH550255A
Authority: CH; Switzerland
Prior art keywords: copper plating; electrically; electrically copper; plating; copper
Prior art date: 1969-10-16

Application number

CH1511570A

Other languages

German (de)

Original Assignee

Philips Nv

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1969-10-16

Filing date

1970-10-13

Publication date

1974-06-14

1970-10-13 Application filed by Philips Nv filed Critical Philips Nv

1974-06-14 Publication of CH550255A publication Critical patent/CH550255A/en

Links

Classifications

- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde

CH1511570A 1969-10-16 1970-10-13 METHOD FOR ELECTRICALLY COPPER PLATING OF SURFACES. CH550255A (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
NL6915718A NL6915718A (en)	1969-10-16	1969-10-16

Publications (1)

Publication Number	Publication Date
CH550255A true CH550255A (en)	1974-06-14

Family

ID=19808149

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CH1511570A CH550255A (en)	1969-10-16	1970-10-13	METHOD FOR ELECTRICALLY COPPER PLATING OF SURFACES.

Country Status (11)

Country	Link
US (1)	US3804638A (en)
AT (1)	AT311145B (en)
AU (1)	AU2101370A (en)
BE (1)	BE757573A (en)
CA (1)	CA947458A (en)
CH (1)	CH550255A (en)
DE (1)	DE2049061C3 (en)
FR (1)	FR2065996A5 (en)
GB (1)	GB1330332A (en)
HK (1)	HK49576A (en)
NL (1)	NL6915718A (en)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5627594B2 (en) *	1975-03-14	1981-06-25
US4171225A (en)	1976-01-23	1979-10-16	U.S. Philips Corporation	Electroless copper plating solutions
US4211564A (en) *	1978-05-09	1980-07-08	Hitachi, Ltd.	Chemical copper plating solution
US4301196A (en) *	1978-09-13	1981-11-17	Kollmorgen Technologies Corp.	Electroless copper deposition process having faster plating rates
US4303443A (en) *	1979-06-15	1981-12-01	Hitachi, Ltd.	Electroless copper plating solution
JPS56156749A (en) *	1980-05-08	1981-12-03	Toshiba Corp	Chemical copper plating solution
CA1184359A (en) *	1981-10-23	1985-03-26	Donald A. Arcilesi	Metallic impurity control for electroless copper plating
IT1157006B (en) *	1982-03-09	1987-02-11	Alfachimici Spa	STABILIZING MIXTURE FOR A CHEMICAL COPPER BATH
US4548644A (en) *	1982-09-28	1985-10-22	Hitachi Chemical Company, Ltd.	Electroless copper deposition solution
US4563217A (en) *	1983-07-25	1986-01-07	Hitachi, Ltd.	Electroless copper plating solution
US4908242A (en) *	1986-10-31	1990-03-13	Kollmorgen Corporation	Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
US5925403A (en) *	1994-01-31	1999-07-20	Matsushita Electric Works, Ltd.	Method of coating a copper film on a ceramic substrate
US6852152B2 (en) *	2002-09-24	2005-02-08	International Business Machines Corporation	Colloidal seed formulation for printed circuit board metallization
US20050016416A1 (en) *	2003-07-23	2005-01-27	Jon Bengston	Stabilizer for electroless copper plating solution
TWI335632B (en) *	2003-09-19	2011-01-01	Applied Materials Inc	Apparatus and method of detecting the electroless deposition endpoint
US20050067297A1 (en) *	2003-09-26	2005-03-31	Innovative Technology Licensing, Llc	Copper bath for electroplating fine circuitry on semiconductor chips
US20060062897A1 (en) *	2004-09-17	2006-03-23	Applied Materials, Inc	Patterned wafer thickness detection system
JP2006342428A (en) *	2005-06-10	2006-12-21	Enthone Inc	Method for direct metallization of non-conductive substrate
US20160273112A1 (en) *	2013-03-27	2016-09-22	Atotech Deutschland Gmbh	Electroless copper plating solution
US10060034B2 (en)	2017-01-23	2018-08-28	Rohm And Haas Electronic Materials Llc	Electroless copper plating compositions
US10294569B2 (en)	2017-10-06	2019-05-21	Rohm And Haas Electronic Materials Llc	Stable electroless copper plating compositions and methods for electroless plating copper on substrates
US10655227B2 (en)	2017-10-06	2020-05-19	Rohm And Haas Electronic Materials Llc	Stable electroless copper plating compositions and methods for electroless plating copper on substrates
CN110498532A (en) *	2019-08-15	2019-11-26	深南电路股份有限公司	The processing method and processing unit of printed wiring board waste water
CN113388829A (en) *	2021-06-11	2021-09-14	惠州金晟新电子科技有限公司	Electroless copper plating solution and method for plating copper on substrate by using electroless copper plating solution

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3075856A (en) *	1958-03-31	1963-01-29	Gen Electric	Copper plating process and solution
US3300335A (en) *	1963-11-20	1967-01-24	Dow Chemical Co	Electroless metal plating with foam
US3485643A (en) *	1966-05-06	1969-12-23	Photocircuits Corp	Electroless copper plating
US3472664A (en) *	1966-09-15	1969-10-14	Enthone	Inhibiting stardusting in electroless copper plating
US3515563A (en) *	1967-12-28	1970-06-02	Photocircuits Corp	Autocatalytic metal plating solutions

0
- BE BE757573D patent/BE757573A/en not_active IP Right Cessation
1969
- 1969-10-16 NL NL6915718A patent/NL6915718A/xx unknown
1970
- 1970-10-06 DE DE2049061A patent/DE2049061C3/en not_active Expired
- 1970-10-13 AU AU21013/70A patent/AU2101370A/en not_active Expired
- 1970-10-13 GB GB4859070A patent/GB1330332A/en not_active Expired
- 1970-10-13 CA CA095,339A patent/CA947458A/en not_active Expired
- 1970-10-13 AT AT922170A patent/AT311145B/en not_active IP Right Cessation
- 1970-10-13 CH CH1511570A patent/CH550255A/en not_active IP Right Cessation
- 1970-10-15 FR FR7037240A patent/FR2065996A5/fr not_active Expired
1972
- 1972-04-06 US US00241806A patent/US3804638A/en not_active Expired - Lifetime
1976
- 1976-07-29 HK HK495/76*UA patent/HK49576A/en unknown

Also Published As

Publication number	Publication date
BE757573A (en)	1971-04-15
NL6915718A (en)	1971-04-20
CA947458A (en)	1974-05-21
GB1330332A (en)	1973-09-19
FR2065996A5 (en)	1971-08-06
AU2101370A (en)	1972-04-20
HK49576A (en)	1976-08-06
AT311145B (en)	1973-10-25
DE2049061C3 (en)	1981-04-30
DE2049061B2 (en)	1980-07-24
US3804638A (en)	1974-04-16
DE2049061A1 (en)	1971-04-29

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Legal Events

Date	Code	Title	Description
1986-06-30	PL	Patent ceased