NL6915718A - - Google Patents

Info

Publication number
NL6915718A
NL6915718A NL6915718A NL6915718A NL6915718A NL 6915718 A NL6915718 A NL 6915718A NL 6915718 A NL6915718 A NL 6915718A NL 6915718 A NL6915718 A NL 6915718A NL 6915718 A NL6915718 A NL 6915718A
Authority
NL
Netherlands
Application number
NL6915718A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to BE757573D priority Critical patent/BE757573A/xx
Application filed filed Critical
Priority to NL6915718A priority patent/NL6915718A/xx
Priority to DE2049061A priority patent/DE2049061C3/de
Priority to GB4859070A priority patent/GB1330332A/en
Priority to AT922170A priority patent/AT311145B/de
Priority to CH1511570A priority patent/CH550255A/xx
Priority to CA095,339A priority patent/CA947458A/en
Priority to AU21013/70A priority patent/AU2101370A/en
Priority to FR7037240A priority patent/FR2065996A5/fr
Publication of NL6915718A publication Critical patent/NL6915718A/xx
Priority to US00241806A priority patent/US3804638A/en
Priority to HK495/76*UA priority patent/HK49576A/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde
NL6915718A 1969-10-16 1969-10-16 NL6915718A (xx)

Priority Applications (11)

Application Number Priority Date Filing Date Title
BE757573D BE757573A (fr) 1969-10-16 Depot sans courant de cuivre flexible
NL6915718A NL6915718A (xx) 1969-10-16 1969-10-16
DE2049061A DE2049061C3 (de) 1969-10-16 1970-10-06 Alkalisches wäßriges Bad und dessen Verwendung zur stromlosen Verkupferung
CH1511570A CH550255A (de) 1969-10-16 1970-10-13 Verfahren zur stromlosen verkupferung von oberflaechen.
AT922170A AT311145B (de) 1969-10-16 1970-10-13 Alkalisches wässeriges stromloses Verkupferungsbad und Verfahren zur stromlosen Verkupferung
GB4859070A GB1330332A (en) 1969-10-16 1970-10-13 Electroless deposition of copper
CA095,339A CA947458A (en) 1969-10-16 1970-10-13 Electroless deposition of ductile copper
AU21013/70A AU2101370A (en) 1969-10-16 1970-10-13 Electroless deposition of ductile copper
FR7037240A FR2065996A5 (xx) 1969-10-16 1970-10-15
US00241806A US3804638A (en) 1969-10-16 1972-04-06 Electroless deposition of ductile copper
HK495/76*UA HK49576A (en) 1969-10-16 1976-07-29 Electroless deposition of copper

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6915718A NL6915718A (xx) 1969-10-16 1969-10-16

Publications (1)

Publication Number Publication Date
NL6915718A true NL6915718A (xx) 1971-04-20

Family

ID=19808149

Family Applications (1)

Application Number Title Priority Date Filing Date
NL6915718A NL6915718A (xx) 1969-10-16 1969-10-16

Country Status (11)

Country Link
US (1) US3804638A (xx)
AT (1) AT311145B (xx)
AU (1) AU2101370A (xx)
BE (1) BE757573A (xx)
CA (1) CA947458A (xx)
CH (1) CH550255A (xx)
DE (1) DE2049061C3 (xx)
FR (1) FR2065996A5 (xx)
GB (1) GB1330332A (xx)
HK (1) HK49576A (xx)
NL (1) NL6915718A (xx)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5627594B2 (xx) * 1975-03-14 1981-06-25
US4171225A (en) 1976-01-23 1979-10-16 U.S. Philips Corporation Electroless copper plating solutions
US4211564A (en) * 1978-05-09 1980-07-08 Hitachi, Ltd. Chemical copper plating solution
US4301196A (en) * 1978-09-13 1981-11-17 Kollmorgen Technologies Corp. Electroless copper deposition process having faster plating rates
US4303443A (en) * 1979-06-15 1981-12-01 Hitachi, Ltd. Electroless copper plating solution
JPS56156749A (en) * 1980-05-08 1981-12-03 Toshiba Corp Chemical copper plating solution
CA1184359A (en) * 1981-10-23 1985-03-26 Donald A. Arcilesi Metallic impurity control for electroless copper plating
IT1157006B (it) * 1982-03-09 1987-02-11 Alfachimici Spa Miscela stabilizzante per un bagno di rame chimico
US4548644A (en) * 1982-09-28 1985-10-22 Hitachi Chemical Company, Ltd. Electroless copper deposition solution
US4563217A (en) * 1983-07-25 1986-01-07 Hitachi, Ltd. Electroless copper plating solution
US4908242A (en) * 1986-10-31 1990-03-13 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
US5925403A (en) * 1994-01-31 1999-07-20 Matsushita Electric Works, Ltd. Method of coating a copper film on a ceramic substrate
US6852152B2 (en) * 2002-09-24 2005-02-08 International Business Machines Corporation Colloidal seed formulation for printed circuit board metallization
US20050016416A1 (en) * 2003-07-23 2005-01-27 Jon Bengston Stabilizer for electroless copper plating solution
TWI335632B (en) * 2003-09-19 2011-01-01 Applied Materials Inc Apparatus and method of detecting the electroless deposition endpoint
US20050067297A1 (en) * 2003-09-26 2005-03-31 Innovative Technology Licensing, Llc Copper bath for electroplating fine circuitry on semiconductor chips
US20060062897A1 (en) * 2004-09-17 2006-03-23 Applied Materials, Inc Patterned wafer thickness detection system
JP2006342428A (ja) * 2005-06-10 2006-12-21 Enthone Inc 非導電性の基板に直接金属被覆する方法
US20160273112A1 (en) * 2013-03-27 2016-09-22 Atotech Deutschland Gmbh Electroless copper plating solution
US10060034B2 (en) 2017-01-23 2018-08-28 Rohm And Haas Electronic Materials Llc Electroless copper plating compositions
US10294569B2 (en) 2017-10-06 2019-05-21 Rohm And Haas Electronic Materials Llc Stable electroless copper plating compositions and methods for electroless plating copper on substrates
US10655227B2 (en) 2017-10-06 2020-05-19 Rohm And Haas Electronic Materials Llc Stable electroless copper plating compositions and methods for electroless plating copper on substrates
CN110498532A (zh) * 2019-08-15 2019-11-26 深南电路股份有限公司 印制线路板废水的处理方法及处理装置
CN113388829A (zh) * 2021-06-11 2021-09-14 惠州金晟新电子科技有限公司 化学镀铜液以及利用化学镀铜液镀铜基板的方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3075856A (en) * 1958-03-31 1963-01-29 Gen Electric Copper plating process and solution
US3300335A (en) * 1963-11-20 1967-01-24 Dow Chemical Co Electroless metal plating with foam
US3485643A (en) * 1966-05-06 1969-12-23 Photocircuits Corp Electroless copper plating
US3472664A (en) * 1966-09-15 1969-10-14 Enthone Inhibiting stardusting in electroless copper plating
US3515563A (en) * 1967-12-28 1970-06-02 Photocircuits Corp Autocatalytic metal plating solutions

Also Published As

Publication number Publication date
BE757573A (fr) 1971-04-15
CH550255A (de) 1974-06-14
CA947458A (en) 1974-05-21
GB1330332A (en) 1973-09-19
FR2065996A5 (xx) 1971-08-06
AU2101370A (en) 1972-04-20
HK49576A (en) 1976-08-06
AT311145B (de) 1973-10-25
DE2049061C3 (de) 1981-04-30
DE2049061B2 (de) 1980-07-24
US3804638A (en) 1974-04-16
DE2049061A1 (de) 1971-04-29

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