GB1426462A - Process and composition for sensitizing articles for metallization - Google Patents

Process and composition for sensitizing articles for metallization

Info

Publication number
GB1426462A
GB1426462A GB3408773A GB3408773A GB1426462A GB 1426462 A GB1426462 A GB 1426462A GB 3408773 A GB3408773 A GB 3408773A GB 3408773 A GB3408773 A GB 3408773A GB 1426462 A GB1426462 A GB 1426462A
Authority
GB
United Kingdom
Prior art keywords
sensitizing
compound
july
contacting
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3408773A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Corp
Original Assignee
Kollmorgen Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Corp filed Critical Kollmorgen Corp
Publication of GB1426462A publication Critical patent/GB1426462A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C23C18/1886—Multistep pretreatment
    • C23C18/1893—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Abstract

1426462 Sensitizing for electroless plating KOLLMORGEN CORP 11 July 1973 [11 July 1972] 34087/73 Heading C7F In the electroless deposition of e.g. Cu, Au, Co, Ni, Ag on a non-metallic surface, the surface is sensitized by contacting it with a solution containing a compound of As, Co, Cu, Fe, Pb, Mo, Ni, W, V, or Zn and a compound which is an amine, ammonium hydroxide, alkali-hypophosphitos and phosphates, stannous chloride, hydroquinone, triethanolamine, and benzyltrimethyl ammonium chloride, rinsing and then contacting with e.g. a reducing agent which may be sodium borohydride or stannous chloride. The metal compound solution may contain a wetting agent. The substrate may be epoxy, phenolic polyester, nylon, polystyrene, polyacetal, polycarbonate, glass, porcelain, cloth, paper or compressed wood. The substrate may be first contacted with dimethyl formamide, sulphoxide, mixtures of toluene and water, chromic-sulphuric acid mixtures, permanganate, and sodium bisulphite.
GB3408773A 1972-07-11 1973-07-11 Process and composition for sensitizing articles for metallization Expired GB1426462A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US27086172A 1972-07-11 1972-07-11

Publications (1)

Publication Number Publication Date
GB1426462A true GB1426462A (en) 1976-02-25

Family

ID=23033117

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3408773A Expired GB1426462A (en) 1972-07-11 1973-07-11 Process and composition for sensitizing articles for metallization

Country Status (12)

Country Link
JP (1) JPS5439812B2 (en)
AT (1) AT328248B (en)
AU (1) AU473729B2 (en)
CA (1) CA1000453A (en)
CH (1) CH599350A5 (en)
DE (1) DE2335497C3 (en)
DK (1) DK143609C (en)
ES (1) ES416804A1 (en)
FR (1) FR2192189B1 (en)
GB (1) GB1426462A (en)
IT (1) IT989827B (en)
NL (1) NL179491C (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4136216A (en) * 1975-08-26 1979-01-23 Surface Technology, Inc. Non-precious metal colloidal dispersions for electroless metal deposition
US4265942A (en) 1974-10-04 1981-05-05 Nathan Feldstein Non-noble metal colloidal compositions comprising reaction products for electroless deposition
US4282271A (en) * 1978-08-17 1981-08-04 Nathan Feldstein Dispersions for activating non-conductors for electroless plating
US4297397A (en) 1976-01-22 1981-10-27 Nathan Feldstein Catalytic promoters in electroless plating catalysts in true solutions
US4321285A (en) 1974-10-04 1982-03-23 Surface Technology, Inc. Electroless plating
US4339476A (en) 1978-08-17 1982-07-13 Nathan Feldstein Dispersions for activating non-conductors for electroless plating
GB2134931A (en) * 1982-12-27 1984-08-22 Ibiden Co Ltd Non-electrolytic copper plating for printed circuit board
US4632857A (en) * 1974-05-24 1986-12-30 Richardson Chemical Company Electrolessly plated product having a polymetallic catalytic film underlayer
US5200272A (en) * 1988-04-29 1993-04-06 Miles Inc. Process for metallizing substrate surfaces

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1058457A (en) * 1973-10-18 1979-07-17 Francis J. Nuzzi Process for sensitizing surface of nonmetallic article for electroless deposition
ZA77897B (en) * 1976-04-13 1977-12-28 Kollmorgen Corp Liquid seeders and catalyzation processes for electroless metal deposition
US4259376A (en) * 1977-09-16 1981-03-31 Nathan Feldstein Catalytic promoters in electroless plating catalysts applied as an emulsion
US4233344A (en) * 1978-07-20 1980-11-11 Learonal, Inc. Method of improving the adhesion of electroless metal deposits employing colloidal copper activator
GB8613960D0 (en) * 1986-06-09 1986-07-16 Omi International Gb Ltd Treating laminates

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR824356A (en) * 1936-10-21 1938-02-07 Saint Gobain Wet metallization process
US2968578A (en) * 1958-04-18 1961-01-17 Corning Glass Works Chemical nickel plating on ceramic material
US3561995A (en) * 1967-04-03 1971-02-09 M & T Chemicals Inc Method of activating a polymer surface and resultant article

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4632857A (en) * 1974-05-24 1986-12-30 Richardson Chemical Company Electrolessly plated product having a polymetallic catalytic film underlayer
US4265942A (en) 1974-10-04 1981-05-05 Nathan Feldstein Non-noble metal colloidal compositions comprising reaction products for electroless deposition
US4321285A (en) 1974-10-04 1982-03-23 Surface Technology, Inc. Electroless plating
US4136216A (en) * 1975-08-26 1979-01-23 Surface Technology, Inc. Non-precious metal colloidal dispersions for electroless metal deposition
US4297397A (en) 1976-01-22 1981-10-27 Nathan Feldstein Catalytic promoters in electroless plating catalysts in true solutions
US4282271A (en) * 1978-08-17 1981-08-04 Nathan Feldstein Dispersions for activating non-conductors for electroless plating
US4339476A (en) 1978-08-17 1982-07-13 Nathan Feldstein Dispersions for activating non-conductors for electroless plating
GB2134931A (en) * 1982-12-27 1984-08-22 Ibiden Co Ltd Non-electrolytic copper plating for printed circuit board
US5200272A (en) * 1988-04-29 1993-04-06 Miles Inc. Process for metallizing substrate surfaces

Also Published As

Publication number Publication date
AU473729B2 (en) 1976-07-01
IT989827B (en) 1975-06-10
JPS5439812B2 (en) 1979-11-30
NL179491B (en) 1986-04-16
NL7309650A (en) 1974-01-15
AU5673073A (en) 1974-12-12
FR2192189A1 (en) 1974-02-08
CA1000453A (en) 1976-11-30
FR2192189B1 (en) 1976-06-18
DK143609C (en) 1982-02-22
DE2335497A1 (en) 1974-02-07
ES416804A1 (en) 1976-02-16
CH599350A5 (en) 1978-05-31
DK143609B (en) 1981-09-14
DE2335497B2 (en) 1977-05-05
NL179491C (en) 1986-09-16
ATA601873A (en) 1975-05-15
DE2335497C3 (en) 1978-08-24
AT328248B (en) 1976-03-10
JPS4953133A (en) 1974-05-23

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee