GB1263445A - Ductility promoter and stabilizer for electroless plating baths - Google Patents

Ductility promoter and stabilizer for electroless plating baths

Info

Publication number
GB1263445A
GB1263445A GB4211/70A GB421170A GB1263445A GB 1263445 A GB1263445 A GB 1263445A GB 4211/70 A GB4211/70 A GB 4211/70A GB 421170 A GB421170 A GB 421170A GB 1263445 A GB1263445 A GB 1263445A
Authority
GB
United Kingdom
Prior art keywords
electroless plating
oxide
metal
stabilizer
borohydride
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4211/70A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Corp
Original Assignee
Photocircuits Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Photocircuits Corp filed Critical Photocircuits Corp
Publication of GB1263445A publication Critical patent/GB1263445A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Abstract

1,263,445. Electroless plating. PHOTO- CIRCUITS CORP. Jan.28, 1970 [Feb.4, 1969], No.4211/70. Heading C7F. An electroless plating solution comprises water, a complexing agent, a reducing agent and a stabilizing agent for the metal ion to be deposited, a pH adjuster, and an amount of a polyalkylene oxide insufficient to prevent electroless deposition of metal but sufficient to enhance the stability of the solution, said amount being in the range 0À1 to 80 mg/l. The polyalkylene oxide preferably has MW 6000-6,000,000 and may be polyethylene oxide, polypropylene oxide or polybutylene oxide. The metal may be Cu, the reducing agents may be formaldehyde, paraformaldehyde, trioxane, dimethyl hydantoin, glyoxal, Na or K borohydride, Na trimethoxy-borohydride, boranes, or amine boranes and the stabilizing agent may be NaCN or 2-mercapto-benzothiazole.
GB4211/70A 1969-02-04 1970-01-28 Ductility promoter and stabilizer for electroless plating baths Expired GB1263445A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US79654269A 1969-02-04 1969-02-04

Publications (1)

Publication Number Publication Date
GB1263445A true GB1263445A (en) 1972-02-09

Family

ID=25168439

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4211/70A Expired GB1263445A (en) 1969-02-04 1970-01-28 Ductility promoter and stabilizer for electroless plating baths

Country Status (9)

Country Link
US (1) US3607317A (en)
JP (1) JPS4834975B1 (en)
AT (1) AT313017B (en)
CH (1) CH533690A (en)
DK (1) DK139590B (en)
FR (1) FR2033925A5 (en)
GB (1) GB1263445A (en)
NL (1) NL165507C (en)
SE (1) SE366776B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2610470A1 (en) * 1975-03-14 1976-09-30 Hitachi Ltd SOLUTION TO NON-GALVANIC COPPER

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4082898A (en) * 1975-06-23 1978-04-04 Ppg Industries, Inc. Electroless deposition of electrically nonconductive copper-boron coatings on nonmetallic substrates
US4171225A (en) * 1976-01-23 1979-10-16 U.S. Philips Corporation Electroless copper plating solutions
DE2635457C2 (en) * 1976-08-04 1985-06-05 Schering AG, 1000 Berlin und 4709 Bergkamen Catalytic varnish and its use in the manufacture of printed circuits
JPS56156749A (en) * 1980-05-08 1981-12-03 Toshiba Corp Chemical copper plating solution
DE3121015C2 (en) * 1981-05-27 1986-12-04 Friedr. Blasberg GmbH und Co KG, 5650 Solingen Process for activating pickled surfaces and solution for carrying out the same
US4405663A (en) * 1982-03-29 1983-09-20 Republic Steel Corporation Tin plating bath composition and process
US4548644A (en) * 1982-09-28 1985-10-22 Hitachi Chemical Company, Ltd. Electroless copper deposition solution
DE3239090A1 (en) * 1982-10-22 1984-04-26 Bayer Ag, 5090 Leverkusen BLACK METALIZED SUBSTRATE SURFACES
JPS6033358A (en) * 1983-08-04 1985-02-20 Hitachi Chem Co Ltd Electroless copper plating liquid
US4666858A (en) * 1984-10-22 1987-05-19 International Business Machines Corporation Determination of amount of anionic material in a liquid sample
US4617205A (en) * 1984-12-21 1986-10-14 Omi International Corporation Formaldehyde-free autocatalytic electroless copper plating
DE3622090C1 (en) * 1986-07-02 1990-02-15 Blasberg-Oberflaechentechnik Gmbh, 5650 Solingen, De
US4908242A (en) * 1986-10-31 1990-03-13 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2472393A (en) * 1944-09-25 1949-06-07 American Steel & Wire Co Process and bath for copper coating ferrous metal
US3095309A (en) * 1960-05-03 1963-06-25 Day Company Electroless copper plating
US3246995A (en) * 1962-02-19 1966-04-19 Aerojet General Co Metal marking composition
US3472664A (en) * 1966-09-15 1969-10-14 Enthone Inhibiting stardusting in electroless copper plating

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2610470A1 (en) * 1975-03-14 1976-09-30 Hitachi Ltd SOLUTION TO NON-GALVANIC COPPER

Also Published As

Publication number Publication date
NL165507C (en) 1981-04-15
AT313017B (en) 1974-01-25
US3607317A (en) 1971-09-21
DE2005032B2 (en) 1975-06-12
FR2033925A5 (en) 1970-12-04
DK139590C (en) 1979-09-03
DE2005032A1 (en) 1970-08-20
JPS4834975B1 (en) 1973-10-25
SE366776B (en) 1974-05-06
DK139590B (en) 1979-03-12
CH533690A (en) 1973-02-15
NL7001599A (en) 1970-08-06

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