DE1900442B2 - Electroless copper plating baths contng an silicon cpd - Google Patents

Electroless copper plating baths contng an silicon cpd

Info

Publication number
DE1900442B2
DE1900442B2 DE19691900442 DE1900442A DE1900442B2 DE 1900442 B2 DE1900442 B2 DE 1900442B2 DE 19691900442 DE19691900442 DE 19691900442 DE 1900442 A DE1900442 A DE 1900442A DE 1900442 B2 DE1900442 B2 DE 1900442B2
Authority
DE
Germany
Prior art keywords
copper plating
electroless copper
cupric ions
contng
cpd
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19691900442
Other languages
German (de)
Other versions
DE1900442A1 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of DE1900442A1 publication Critical patent/DE1900442A1/en
Publication of DE1900442B2 publication Critical patent/DE1900442B2/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde

Abstract

Basic aqueous copper plating mixture for electroless copper plating consists of (I) a source of cupric ions, (II) sufficient free hydroxide to provide a desired pH, (III) a reducing agent for reducing cupric ions in the presence of a catalytic surface, (IV) sufficient complexing agent to render the cupric ions soluble in alkaline soln., and (V) a silicon cpd. in an amount sufficient to improve the copper plating, but insufficient to prevent the deposition. The addition of the silicon cpd. (V) gives electroplating baths of increased stability. The baths give Cu layers of improved ductility, with increased resistance to breakage, which are firmly bonded to the substrate.
DE19691900442 1968-01-05 1969-01-04 Electroless copper plating baths contng an silicon cpd Withdrawn DE1900442B2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US69586068A 1968-01-05 1968-01-05

Publications (2)

Publication Number Publication Date
DE1900442A1 DE1900442A1 (en) 1969-11-20
DE1900442B2 true DE1900442B2 (en) 1971-09-09

Family

ID=24794740

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19691900442 Withdrawn DE1900442B2 (en) 1968-01-05 1969-01-04 Electroless copper plating baths contng an silicon cpd

Country Status (7)

Country Link
US (1) US3475186A (en)
BE (1) BE726182A (en)
DE (1) DE1900442B2 (en)
FR (1) FR1599501A (en)
GB (1) GB1195330A (en)
NL (1) NL139095B (en)
SE (1) SE345144B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3765936A (en) * 1968-08-13 1973-10-16 Shipley Co Electroless copper plate
US3615733A (en) * 1968-08-13 1971-10-26 Shipley Co Electroless copper plating
US3615735A (en) * 1968-08-13 1971-10-26 Shipley Co Electroless copper plating
US3978252A (en) * 1973-03-23 1976-08-31 Macdermid Incorporated Method of improving the adhesion between a molded resin substrate and a metal film deposited thereon
US4167601A (en) * 1976-11-15 1979-09-11 Western Electric Company, Inc. Method of depositing a stress-free electroless copper deposit
US4228213A (en) * 1979-08-13 1980-10-14 Western Electric Company, Inc. Method of depositing a stress-free electroless copper deposit
US4563217A (en) * 1983-07-25 1986-01-07 Hitachi, Ltd. Electroless copper plating solution
US4969842A (en) * 1989-11-30 1990-11-13 Amp Incorporated Molded electrical connector having integral spring contact beams
US20090206526A1 (en) * 2008-02-18 2009-08-20 Huntsman Petrochemical Corporation Sintering aids

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3361580A (en) * 1963-06-18 1968-01-02 Day Company Electroless copper plating
GB1089317A (en) * 1965-06-19 1967-11-01 Asahi Dow Ltd An electroless copper plating bath

Also Published As

Publication number Publication date
GB1195330A (en) 1970-06-17
BE726182A (en) 1969-06-27
DE1900442A1 (en) 1969-11-20
NL6900088A (en) 1969-07-08
FR1599501A (en) 1970-07-15
NL139095B (en) 1973-06-15
US3475186A (en) 1969-10-28
SE345144B (en) 1972-05-15

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Legal Events

Date Code Title Description
SH Request for examination between 03.10.1968 and 22.04.1971
E77 Valid patent as to the heymanns-index 1977
EHJ Ceased/non-payment of the annual fee