GB1307927A - Electroless plating - Google Patents
Electroless platingInfo
- Publication number
- GB1307927A GB1307927A GB4009070A GB4009070A GB1307927A GB 1307927 A GB1307927 A GB 1307927A GB 4009070 A GB4009070 A GB 4009070A GB 4009070 A GB4009070 A GB 4009070A GB 1307927 A GB1307927 A GB 1307927A
- Authority
- GB
- United Kingdom
- Prior art keywords
- plating
- metal
- electroless
- article
- bath
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007772 electroless plating Methods 0.000 title abstract 4
- 238000007747 plating Methods 0.000 abstract 7
- 229910052751 metal Inorganic materials 0.000 abstract 6
- 239000002184 metal Substances 0.000 abstract 6
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 abstract 2
- 230000003197 catalytic effect Effects 0.000 abstract 2
- 239000011248 coating agent Substances 0.000 abstract 2
- 238000000576 coating method Methods 0.000 abstract 2
- 230000008021 deposition Effects 0.000 abstract 2
- 239000003112 inhibitor Substances 0.000 abstract 2
- 229910000510 noble metal Inorganic materials 0.000 abstract 2
- -1 0À03 to 0À75 M Substances 0.000 abstract 1
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 abstract 1
- 239000003638 chemical reducing agent Substances 0.000 abstract 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 abstract 1
- 239000008139 complexing agent Substances 0.000 abstract 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 abstract 1
- 150000002825 nitriles Chemical class 0.000 abstract 1
- 239000004033 plastic Substances 0.000 abstract 1
- 229920003023 plastic Polymers 0.000 abstract 1
- 150000003839 salts Chemical class 0.000 abstract 1
- MNWBNISUBARLIT-UHFFFAOYSA-N sodium cyanide Chemical compound [Na+].N#[C-] MNWBNISUBARLIT-UHFFFAOYSA-N 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 235000011149 sulphuric acid Nutrition 0.000 abstract 1
- 239000001117 sulphuric acid Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
1307927 Electroless plating CROWN CITY PLATING Co 20 Aug 1970 [20 Aug 1969] 40090/70 Heading C7F An article having a catalytic noble metal on its surface is immersed in a first electroless plating solution to initiate desposition of plating metal on the article, and removed when a coating of metal has been deposited, and then immersed in a second electroless plating solution comprising a plating inhibitor in a concentration which is sufficient to prevent deposition of plating metal on an article having the catalytic noble metal surface but insufficient to prevent deposition of plating metal on an article having the coating of plating metal. The substrate, e.g. a plastics such as ABS may be etched in chromic/sulphuric acid, and treated with SnCl 2 and Pd Cl 2 , and placed in a first electroless "strike" bath, e. g. at pH 12-14 and containing Cu salt:- 0À02 to 0À15 M, complexing agent, 0À03 to 0À75 M, and reducing agent 0À05 to 1À50 M, and then placed in a second electroless bath, the same as bath (1) but containing also a plating inhibitor, e.g. 0À0015 to 0À24 M water-soluble cyanide such as NaCN, KCN, a complex metal cyanide, or a nitrile.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US00851762A US3853590A (en) | 1969-08-20 | 1969-08-20 | Electroless plating solution and process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1307927A true GB1307927A (en) | 1973-02-21 |
Family
ID=25311618
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB4009070A Expired GB1307927A (en) | 1969-08-20 | 1970-08-20 | Electroless plating |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US3853590A (en) |
| JP (1) | JPS526694B1 (en) |
| DE (1) | DE2040930C3 (en) |
| ES (1) | ES382866A1 (en) |
| FR (1) | FR2058989A5 (en) |
| GB (1) | GB1307927A (en) |
| SE (1) | SE353743B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2134931A (en) * | 1982-12-27 | 1984-08-22 | Ibiden Co Ltd | Non-electrolytic copper plating for printed circuit board |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3985851A (en) * | 1974-06-24 | 1976-10-12 | General Dynamics Corporation | Method of forming a feed horn |
| US4063004A (en) * | 1975-12-30 | 1977-12-13 | Hooker Chemicals & Plastics Corporation | Metal plating of plastics |
| US4228201A (en) * | 1977-06-06 | 1980-10-14 | Nathan Feldstein | Method for rendering a non-platable semiconductor substrate platable |
| US4419390A (en) * | 1977-06-06 | 1983-12-06 | Nathan Feldstein | Method for rendering non-platable semiconductor substrates platable |
| US4328266A (en) * | 1977-06-06 | 1982-05-04 | Surface Technology, Inc. | Method for rendering non-platable substrates platable |
| US4305997A (en) * | 1977-06-06 | 1981-12-15 | Surface Technology, Inc. | Electrolessly metallized product of non-catalytic metal or alloy |
| US4181760A (en) * | 1977-06-06 | 1980-01-01 | Surface Technology, Inc. | Method for rendering non-platable surfaces platable |
| US4355083A (en) * | 1977-06-06 | 1982-10-19 | Nathan Feldstein | Electrolessly metallized silver coated article |
| DE3012006A1 (en) * | 1980-03-28 | 1981-10-08 | Merck Patent Gmbh, 6100 Darmstadt | METHOD FOR DEFLECTIVE METAL DEPOSITION |
| US4683036A (en) * | 1983-06-10 | 1987-07-28 | Kollmorgen Technologies Corporation | Method for electroplating non-metallic surfaces |
| US4552787A (en) * | 1984-02-29 | 1985-11-12 | International Business Machines Corporation | Deposition of a metal from an electroless plating composition |
| US4525390A (en) * | 1984-03-09 | 1985-06-25 | International Business Machines Corporation | Deposition of copper from electroless plating compositions |
| US5361914A (en) * | 1993-10-05 | 1994-11-08 | Digital Equipment Corporation | Device for component processing |
| US5903344A (en) * | 1996-03-04 | 1999-05-11 | Reedy Scientific Instruments | Matrix isolation apparatus for spectroscopic analysis of chemical compounds |
| US8187664B2 (en) * | 2005-02-08 | 2012-05-29 | Fujifilm Corporation | Metallic pattern forming method, metallic pattern obtained thereby, printed wiring board using the same, and TFT wiring board using the same |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3075856A (en) * | 1958-03-31 | 1963-01-29 | Gen Electric | Copper plating process and solution |
| US3095309A (en) * | 1960-05-03 | 1963-06-25 | Day Company | Electroless copper plating |
| US3443988A (en) * | 1965-05-06 | 1969-05-13 | Photocircuits Corp | Printed circuits,work holders and method of preventing electroless metal deposition |
| US3370974A (en) * | 1965-10-20 | 1968-02-27 | Ivan C. Hepfer | Electroless plating on non-conductive materials |
-
1969
- 1969-08-20 US US00851762A patent/US3853590A/en not_active Expired - Lifetime
-
1970
- 1970-08-18 DE DE2040930A patent/DE2040930C3/en not_active Expired
- 1970-08-19 FR FR7030463A patent/FR2058989A5/fr not_active Expired
- 1970-08-19 SE SE11315/70A patent/SE353743B/xx unknown
- 1970-08-19 ES ES382866A patent/ES382866A1/en not_active Expired
- 1970-08-20 JP JP45072453A patent/JPS526694B1/ja active Pending
- 1970-08-20 GB GB4009070A patent/GB1307927A/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2134931A (en) * | 1982-12-27 | 1984-08-22 | Ibiden Co Ltd | Non-electrolytic copper plating for printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| DE2040930C3 (en) | 1981-08-13 |
| DE2040930B2 (en) | 1978-05-11 |
| SE353743B (en) | 1973-02-12 |
| JPS526694B1 (en) | 1977-02-24 |
| DE2040930A1 (en) | 1971-03-04 |
| FR2058989A5 (en) | 1971-05-28 |
| US3853590A (en) | 1974-12-10 |
| ES382866A1 (en) | 1972-12-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PCNP | Patent ceased through non-payment of renewal fee |