FR2760289B1 - Boitier de puce de semiconducteur ayant une structure combinee de conducteurs situes sur la puce et de conducteurs normaux standards - Google Patents

Boitier de puce de semiconducteur ayant une structure combinee de conducteurs situes sur la puce et de conducteurs normaux standards

Info

Publication number
FR2760289B1
FR2760289B1 FR9714045A FR9714045A FR2760289B1 FR 2760289 B1 FR2760289 B1 FR 2760289B1 FR 9714045 A FR9714045 A FR 9714045A FR 9714045 A FR9714045 A FR 9714045A FR 2760289 B1 FR2760289 B1 FR 2760289B1
Authority
FR
France
Prior art keywords
chip
conductors
connection pads
sides
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9714045A
Other languages
English (en)
French (fr)
Other versions
FR2760289A1 (fr
Inventor
Do Soo Jeong
Oh Sik Kwon
Young Hee Song
Min Bin Yim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of FR2760289A1 publication Critical patent/FR2760289A1/fr
Application granted granted Critical
Publication of FR2760289B1 publication Critical patent/FR2760289B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
FR9714045A 1997-02-28 1997-11-07 Boitier de puce de semiconducteur ayant une structure combinee de conducteurs situes sur la puce et de conducteurs normaux standards Expired - Fee Related FR2760289B1 (fr)

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KR19970006505 1997-02-28
KR1019970037789A KR100227120B1 (ko) 1997-02-28 1997-08-07 엘오씨(loc)리드와 표준형 리드가 복합된 구조를 갖는 반도체 칩 패키지

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FR2760289A1 FR2760289A1 (fr) 1998-09-04
FR2760289B1 true FR2760289B1 (fr) 2002-08-30

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JP (1) JP2981194B2 (de)
KR (1) KR100227120B1 (de)
CN (1) CN1114948C (de)
DE (1) DE19749539B4 (de)
FR (1) FR2760289B1 (de)
TW (1) TW354856B (de)

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KR100401536B1 (ko) * 1997-12-31 2004-01-24 주식회사 하이닉스반도체 센터 패드형 반도체 칩을 퍼리퍼럴 패드형 반도체 칩으로 변경하는 방법
JP2002076233A (ja) 2000-09-04 2002-03-15 Mitsubishi Electric Corp 半導体装置
DE10158770B4 (de) 2001-11-29 2006-08-03 Infineon Technologies Ag Leiterrahmen und Bauelement mit einem Leiterrahmen
KR100525091B1 (ko) * 2001-12-28 2005-11-02 주식회사 하이닉스반도체 반도체 패키지
JP4222920B2 (ja) 2003-10-01 2009-02-12 株式会社ルネサステクノロジ 半導体装置
KR100654338B1 (ko) * 2003-10-04 2006-12-07 삼성전자주식회사 테이프 배선 기판과 그를 이용한 반도체 칩 패키지
JP6698306B2 (ja) * 2015-09-29 2020-05-27 株式会社巴川製紙所 リードフレーム固定用接着テープ
CN110931420A (zh) * 2019-11-19 2020-03-27 苏州日月新半导体有限公司 一种加热块单元及加热装置

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JPH06105721B2 (ja) * 1985-03-25 1994-12-21 日立超エル・エス・アイエンジニアリング株式会社 半導体装置
JP2748940B2 (ja) * 1989-06-05 1998-05-13 株式会社日立製作所 樹脂封止型半導体装置
JPH01276656A (ja) * 1988-04-27 1989-11-07 Mitsubishi Electric Corp 樹脂封止型半導体装置
JPH02132848A (ja) * 1988-11-14 1990-05-22 Nec Corp 半導体装置
JPH04372161A (ja) * 1991-06-21 1992-12-25 Mitsubishi Electric Corp 半導体装置
KR100276781B1 (ko) * 1992-02-03 2001-01-15 비센트 비. 인그라시아 리드-온-칩 반도체장치 및 그 제조방법
JP2677737B2 (ja) * 1992-06-24 1997-11-17 株式会社東芝 半導体装置
US5545920A (en) * 1994-09-13 1996-08-13 Texas Instruments Incorporated Leadframe-over-chip having off-chip conducting leads for increased bond pad connectivity

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KR100227120B1 (ko) 1999-10-15
JPH10242373A (ja) 1998-09-11
CN1192048A (zh) 1998-09-02
TW354856B (en) 1999-03-21
CN1114948C (zh) 2003-07-16
KR19980069880A (ko) 1998-10-26
JP2981194B2 (ja) 1999-11-22
DE19749539A1 (de) 1998-09-10
DE19749539B4 (de) 2006-04-13
FR2760289A1 (fr) 1998-09-04

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