FR2336801A1 - Circuit integre - Google Patents

Circuit integre

Info

Publication number
FR2336801A1
FR2336801A1 FR7639089A FR7639089A FR2336801A1 FR 2336801 A1 FR2336801 A1 FR 2336801A1 FR 7639089 A FR7639089 A FR 7639089A FR 7639089 A FR7639089 A FR 7639089A FR 2336801 A1 FR2336801 A1 FR 2336801A1
Authority
FR
France
Prior art keywords
integrated circuit
integrated
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7639089A
Other languages
English (en)
Other versions
FR2336801B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Publication of FR2336801A1 publication Critical patent/FR2336801A1/fr
Application granted granted Critical
Publication of FR2336801B1 publication Critical patent/FR2336801B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/0203—Particular design considerations for integrated circuits
    • H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
    • H01L27/07—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration the components having an active region in common
    • H01L27/0705—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration the components having an active region in common comprising components of the field effect type
    • H01L27/0727—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration the components having an active region in common comprising components of the field effect type in combination with diodes, or capacitors or resistors
    • H01L27/0733—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration the components having an active region in common comprising components of the field effect type in combination with diodes, or capacitors or resistors in combination with capacitors only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
    • H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
    • H01L29/0638—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for preventing surface leakage due to surface inversion layer, e.g. with channel stopper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/105—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including field-effect components

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Semiconductor Memories (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
FR7639089A 1975-12-26 1976-12-24 Circuit integre Granted FR2336801A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50156621A JPS5279787A (en) 1975-12-26 1975-12-26 Integrated circuit device

Publications (2)

Publication Number Publication Date
FR2336801A1 true FR2336801A1 (fr) 1977-07-22
FR2336801B1 FR2336801B1 (fr) 1981-07-31

Family

ID=15631706

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7639089A Granted FR2336801A1 (fr) 1975-12-26 1976-12-24 Circuit integre

Country Status (5)

Country Link
US (1) US4163245A (fr)
JP (1) JPS5279787A (fr)
DE (1) DE2658666A1 (fr)
FR (1) FR2336801A1 (fr)
GB (1) GB1566580A (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2399125A1 (fr) * 1977-07-28 1979-02-23 Fujitsu Ltd Memoire a semi-conducteurs en circuit integre
EP0018764A1 (fr) * 1979-05-02 1980-11-12 Fujitsu Limited Dispositif semiconducteur dans lequel un "soft error" causé par des particules alpha est évité
EP0143157A1 (fr) * 1983-10-27 1985-06-05 International Business Machines Corporation Circuit de pompage de charge pour un générateur de tension de substrat
EP0171597A1 (fr) * 1984-08-13 1986-02-19 International Business Machines Corporation Structure à pompage de charges
EP0224213A2 (fr) * 1985-11-22 1987-06-03 Nec Corporation Dispositif de mémoire semi-conducteur

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6041463B2 (ja) * 1976-11-19 1985-09-17 株式会社日立製作所 ダイナミツク記憶装置
JPS55146961A (en) * 1979-05-02 1980-11-15 Hitachi Ltd Semiconductor memory device
JPS60777B2 (ja) * 1979-05-25 1985-01-10 株式会社東芝 Ｍｏｓ半導体集積回路
JPS55156358A (en) * 1979-05-25 1980-12-05 Hitachi Ltd Semiconductor memory device
US4539490A (en) * 1979-12-08 1985-09-03 Tokyo Shibaura Denki Kabushiki Kaisha Charge pump substrate bias with antiparasitic guard ring
US4399520A (en) * 1980-02-22 1983-08-16 Tokyo Shibaura Denki Kabushiki Kaisha Semiconductor integrated circuit device
US4433257A (en) * 1980-03-03 1984-02-21 Tokyo Shibaura Denki Kabushiki Kaisha Voltage supply for operating a plurality of changing transistors in a manner which reduces minority carrier disruption of adjacent memory cells
JPS577161A (en) * 1980-06-16 1982-01-14 Toshiba Corp Mos semiconductor device
JPS587860A (ja) * 1981-07-06 1983-01-17 Hitachi Ltd 半導体記憶装置
JPS5851558A (ja) * 1981-09-22 1983-03-26 Nec Corp Ｍｏｓ型半導体装置
JPS5863159A (ja) * 1981-10-09 1983-04-14 Toshiba Corp 半導体装置
JPS602782B2 (ja) * 1982-06-30 1985-01-23 富士通株式会社 半導体記憶装置
JPS59111357A (ja) * 1982-12-17 1984-06-27 Nec Corp Ｃ−ｍｏｓ集積回路とその使用方法
JPS59197159A (ja) * 1983-04-22 1984-11-08 Nec Corp 半導体装置
JPS6032356A (ja) * 1983-08-03 1985-02-19 Sharp Corp Νチャンネルｍｏｓ集積回路装置
US4658283A (en) * 1984-07-25 1987-04-14 Hitachi, Ltd. Semiconductor integrated circuit device having a carrier trapping trench arrangement
JPS6132567A (ja) * 1984-07-25 1986-02-15 Hitachi Micro Comput Eng Ltd 半導体集積回路装置
US4665420A (en) * 1984-11-08 1987-05-12 Rca Corporation Edge passivated charge-coupled device image sensor
US5324982A (en) 1985-09-25 1994-06-28 Hitachi, Ltd. Semiconductor memory device having bipolar transistor and structure to avoid soft error
US6740958B2 (en) 1985-09-25 2004-05-25 Renesas Technology Corp. Semiconductor memory device
IT1218128B (it) * 1987-03-05 1990-04-12 Sgs Microelettronica Spa Struttura integrata per rete di trasferimento di segnali,particolarmente per circuito di pilotaggio per transistori mos di potenza
JP2712079B2 (ja) * 1988-02-15 1998-02-10 株式会社東芝 半導体装置
JPS63178351U (fr) * 1988-05-12 1988-11-18
JPS6432670A (en) * 1988-06-15 1989-02-02 Hitachi Ltd Semiconductor memory circuit device
JPH0828467B2 (ja) * 1988-11-15 1996-03-21 株式会社東芝 半導体装置
US4866567A (en) * 1989-01-06 1989-09-12 Ncr Corporation High frequency integrated circuit channel capacitor
US5286986A (en) * 1989-04-13 1994-02-15 Kabushiki Kaisha Toshiba Semiconductor device having CCD and its peripheral bipolar transistors
JPH07105458B2 (ja) * 1989-11-21 1995-11-13 株式会社東芝 複合型集積回路素子
JP2523409B2 (ja) * 1990-05-02 1996-08-07 三菱電機株式会社 半導体記憶装置およびその製造方法
DE4143521C2 (de) * 1990-06-28 1995-04-06 Mitsubishi Electric Corp Halbleiterspeichervorrichtung
KR950009893B1 (ko) * 1990-06-28 1995-09-01 미쓰비시 뎅끼 가부시끼가이샤 반도체기억장치
US5235216A (en) * 1991-07-15 1993-08-10 International Business Machines Corporation Bipolar transistor using emitter-base reverse bias carrier generation
US5684314A (en) * 1996-03-18 1997-11-04 Kenney; Donald M. Trench capacitor precharge structure and leakage shield
JPH10223853A (ja) * 1997-02-04 1998-08-21 Mitsubishi Electric Corp 半導体装置
US6586283B2 (en) * 2000-03-30 2003-07-01 Agilent Technologies, Inc. Apparatus and method for protecting integrated circuit charge storage elements from photo-induced currents
JP4781509B2 (ja) * 2000-09-28 2011-09-28 ルネサスエレクトロニクス株式会社 Ｃｍｏｓイメージセンサ及びｃｍｏｓイメージセンサの製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4044373A (en) * 1967-11-13 1977-08-23 Hitachi, Ltd. IGFET with gate protection diode and antiparasitic isolation means
US3899793A (en) * 1968-08-24 1975-08-12 Sony Corp Integrated circuit with carrier killer selectively diffused therein and method of making same
US3573509A (en) * 1968-09-09 1971-04-06 Texas Instruments Inc Device for reducing bipolar effects in mos integrated circuits
US3925120A (en) * 1969-10-27 1975-12-09 Hitachi Ltd A method for manufacturing a semiconductor device having a buried epitaxial layer
GB1263817A (en) * 1969-11-10 1972-02-16 Marconi Co Ltd Improvements in or relating to integrated circuits
US3701198A (en) * 1970-08-14 1972-10-31 Bell Telephone Labor Inc Monolithic integrated circuit structures and methods of making same
DE2055661A1 (de) * 1970-11-12 1972-06-29 Itt Ind Gmbh Deutsche Monolithisch integrierte Festkörperschaltung
US3703669A (en) * 1971-08-12 1972-11-21 Motorola Inc Photocurrent cross talk isolation
JPS492437A (fr) * 1972-04-18 1974-01-10
US3965481A (en) * 1974-11-22 1976-06-22 U.S. Philips Corporation Charge transfer device with J FET isolation and means to drain stray charge

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2399125A1 (fr) * 1977-07-28 1979-02-23 Fujitsu Ltd Memoire a semi-conducteurs en circuit integre
EP0018764A1 (fr) * 1979-05-02 1980-11-12 Fujitsu Limited Dispositif semiconducteur dans lequel un "soft error" causé par des particules alpha est évité
EP0143157A1 (fr) * 1983-10-27 1985-06-05 International Business Machines Corporation Circuit de pompage de charge pour un générateur de tension de substrat
US4591738A (en) * 1983-10-27 1986-05-27 International Business Machines Corporation Charge pumping circuit
EP0171597A1 (fr) * 1984-08-13 1986-02-19 International Business Machines Corporation Structure à pompage de charges
EP0224213A2 (fr) * 1985-11-22 1987-06-03 Nec Corporation Dispositif de mémoire semi-conducteur
EP0224213A3 (fr) * 1985-11-22 1987-10-28 Nec Corporation Dispositif de mémoire semi-conducteur

Also Published As

Publication number Publication date
GB1566580A (en) 1980-05-08
JPS5279787A (en) 1977-07-05
US4163245A (en) 1979-07-31
FR2336801B1 (fr) 1981-07-31
DE2658666C2 (fr) 1987-06-04
DE2658666A1 (de) 1977-07-07

Similar Documents

Publication Publication Date Title
FR2336801A1 (fr) Circuit integre
AT359316B (de) Anschlussschaltung
SE7712295L (sv) Integrerad krets
DK479576A (da) Transistortendingskredslob
BE843622A (fr) Circuit integre bipolaire
TR19646A (tr) Duesey saptirma devresi
FR2335052A1 (fr) Circuit integre
FR2319236A1 (fr) Circuit redresseur
AT380599B (de) Oszillatorschaltung
SE417237B (sv) Sekring for lasring
SE404854B (sv) Interferometerkrets
IT1067765B (it) Circuito integrato
SE7613319L (sv) Krets
SE417033B (sv) Optoelektronisk omkopplare
SE7601984L (sv) Reglerbar integrerad krets
BE839687A (fr) Termineur electronique
SE7605316L (sv) Integrerad kopplingskrets
IT1073327B (it) Disposizione circuitale integrata
NL7603827A (nl) Geintegreerde schakeling.
SE402687B (sv) Logikkrets
FR2319246A1 (fr) Circuit oscillateur
AT336930B (de) Integrierte schaltung
SE7712296L (sv) Integrerad krets
RO76695A (fr) Autocommutateur electronique
ATA373975A (de) Bauelement