FR2317680A1 - Photo-reserves thermiquement stables et positives - Google Patents
Photo-reserves thermiquement stables et positivesInfo
- Publication number
- FR2317680A1 FR2317680A1 FR7615556A FR7615556A FR2317680A1 FR 2317680 A1 FR2317680 A1 FR 2317680A1 FR 7615556 A FR7615556 A FR 7615556A FR 7615556 A FR7615556 A FR 7615556A FR 2317680 A1 FR2317680 A1 FR 2317680A1
- Authority
- FR
- France
- Prior art keywords
- reserves
- thermally stable
- positive photo
- photo
- positive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/597,226 US4093461A (en) | 1975-07-18 | 1975-07-18 | Positive working thermally stable photoresist composition, article and method of using |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2317680A1 true FR2317680A1 (fr) | 1977-02-04 |
FR2317680B1 FR2317680B1 (fr) | 1981-08-07 |
Family
ID=24390630
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7615556A Expired FR2317680B1 (fr) | 1975-07-18 | 1976-05-21 | Photo-reserves thermiquement stables et positives |
Country Status (9)
Country | Link |
---|---|
US (1) | US4093461A (fr) |
JP (1) | JPS5213315A (fr) |
CA (1) | CA1063416A (fr) |
CH (1) | CH619055A5 (fr) |
DE (1) | DE2631535A1 (fr) |
FR (1) | FR2317680B1 (fr) |
GB (1) | GB1548583A (fr) |
IT (1) | IT1060035B (fr) |
NL (1) | NL164975C (fr) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0264678A1 (fr) * | 1986-10-02 | 1988-04-27 | Hoechst Celanese Corporation | Polyamides contenant des groupes hexafluoroisopropylène, compositions photosensibles positives les contenant et matériaux d'enregistrement les utilisant |
EP0291779A2 (fr) * | 1987-05-18 | 1988-11-23 | Siemens Aktiengesellschaft | Réserves positives résistantes à la chaleur et procédé de fabrication de structures formant réserve résistantes à la chaleur |
EP0368800A2 (fr) * | 1988-11-05 | 1990-05-16 | Ciba-Geigy Ag | Photoréserve positive du genre polyimide |
EP0478321A1 (fr) * | 1990-09-28 | 1992-04-01 | Kabushiki Kaisha Toshiba | Composition résineuse photosensible pour la structuration d'un film de polyimide et méthode pour structurer un film de polyimide |
Families Citing this family (62)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4292384A (en) * | 1977-09-30 | 1981-09-29 | Horizons Research Incorporated | Gaseous plasma developing and etching process employing low voltage DC generation |
US4180404A (en) * | 1977-11-17 | 1979-12-25 | Asahi Kasei Kogyo Kabushiki Kaisha | Heat resistant photoresist composition and process for preparing the same |
US4326018A (en) * | 1977-12-12 | 1982-04-20 | Polychrome Corporation | Lithographic printing plate |
US4208477A (en) * | 1977-12-26 | 1980-06-17 | Asahi Kasei Kogyo Kabushiki Kaisha | Heat resistant photoresist composition and process for preparing the same |
US4268602A (en) * | 1978-12-05 | 1981-05-19 | Toray Industries, Ltd. | Photosensitive O-quinone diazide containing composition |
US4289573A (en) * | 1979-03-30 | 1981-09-15 | International Business Machines Corporation | Process for forming microcircuits |
US4339522A (en) * | 1979-06-18 | 1982-07-13 | International Business Machines Corporation | Ultra-violet lithographic resist composition and process |
DE2931297A1 (de) * | 1979-08-01 | 1981-02-19 | Siemens Ag | Waermebestaendige positivresists und verfahren zur herstellung waermebestaendiger reliefstrukturen |
JPS5622428A (en) * | 1979-08-01 | 1981-03-03 | Toray Ind Inc | Polyimide pattern forming method |
US4284706A (en) * | 1979-12-03 | 1981-08-18 | International Business Machines Corporation | Lithographic resist composition for a lift-off process |
US4369247A (en) * | 1980-09-03 | 1983-01-18 | E. I. Du Pont De Nemours And Company | Process of producing relief structures using polyamide ester resins |
US4410612A (en) * | 1980-09-03 | 1983-10-18 | E. I. Du Pont De Nemours And Company | Electrical device formed from polymeric heat resistant photopolymerizable composition |
US4329419A (en) * | 1980-09-03 | 1982-05-11 | E. I. Du Pont De Nemours And Company | Polymeric heat resistant photopolymerizable composition for semiconductors and capacitors |
US4414312A (en) * | 1980-09-03 | 1983-11-08 | E. I. Du Pont De Nemours & Co. | Photopolymerizable polyamide ester resin compositions containing an oxygen scavenger |
DE3110632A1 (de) * | 1981-03-19 | 1982-09-30 | Hoechst Ag, 6000 Frankfurt | Verfahren zum einbrennen von lichtempflindlichen schichten bei der herstellung von druckformen |
JPS57168942A (en) * | 1981-04-13 | 1982-10-18 | Hitachi Ltd | Photosensitive polymer composition |
US4476216A (en) * | 1981-08-03 | 1984-10-09 | Amdahl Corporation | Method for high resolution lithography |
US4439516A (en) * | 1982-03-15 | 1984-03-27 | Shipley Company Inc. | High temperature positive diazo photoresist processing using polyvinyl phenol |
JPS58223149A (ja) * | 1982-06-22 | 1983-12-24 | Toray Ind Inc | 感光性ポリイミド用現像液 |
JPS59100135A (ja) * | 1982-11-30 | 1984-06-09 | Japan Synthetic Rubber Co Ltd | 樹脂組成物 |
US4857435A (en) * | 1983-11-01 | 1989-08-15 | Hoechst Celanese Corporation | Positive photoresist thermally stable compositions and elements having deep UV response with maleimide copolymer |
US5059513A (en) * | 1983-11-01 | 1991-10-22 | Hoechst Celanese Corporation | Photochemical image process of positive photoresist element with maleimide copolymer |
JPS60169852A (ja) * | 1984-02-14 | 1985-09-03 | Fuji Photo Film Co Ltd | 湿し水不要ネガ型感光性平版印刷版の製版法 |
CA1255142A (fr) * | 1985-03-11 | 1989-06-06 | Edward C. Fredericks | Methode et compose pour accroitre la definition des conducteurs dans les circuits microelectroniques |
US4745045A (en) * | 1985-03-11 | 1988-05-17 | International Business Machines Corporation | Method for improving resolution in microelectronic circuits using photoresist overlayer by using thermally processed polyimide underlayer formed from positive photoresist and polyamic acid |
DE3683464D1 (de) * | 1985-12-05 | 1992-02-27 | Ibm | Photoresistzusammensetzungen mit vermindertem loesungsgrad in basischen entwicklern, auf basis von durch diazochinon sensibilisierter polyamidsaeure. |
US4942108A (en) * | 1985-12-05 | 1990-07-17 | International Business Machines Corporation | Process of making diazoquinone sensitized polyamic acid based photoresist compositions having reduced dissolution rates in alkaline developers |
CA1308596C (fr) * | 1986-01-13 | 1992-10-13 | Rohm And Haas Company | Structure microplastique et methode de fabrication correspondante |
US4720445A (en) * | 1986-02-18 | 1988-01-19 | Allied Corporation | Copolymers from maleimide and aliphatic vinyl ethers and esters used in positive photoresist |
JPH0721642B2 (ja) * | 1986-06-19 | 1995-03-08 | 宇部興産株式会社 | 感光性ポリイミドのパタ−ン形成方法 |
JPH0644154B2 (ja) * | 1986-07-03 | 1994-06-08 | 宇部興産株式会社 | 有機溶媒可溶性のポジ型感光性ポリイミド組成物 |
US5021320A (en) * | 1986-10-02 | 1991-06-04 | Hoechst Celanese Corporation | Polyamide containing the hexafluoroisopropylidene group with O-quinone diazide in positive working photoresist |
US5077378A (en) * | 1986-10-02 | 1991-12-31 | Hoechst Celanese Corporation | Polyamide containing the hexafluoroisopropylidene group |
US5037720A (en) * | 1987-07-21 | 1991-08-06 | Hoechst Celanese Corporation | Hydroxylated aromatic polyamide polymer containing bound naphthoquinone diazide photosensitizer, method of making and use |
DE3835737A1 (de) * | 1988-10-20 | 1990-04-26 | Ciba Geigy Ag | Positiv-fotoresists mit erhoehter thermischer stabilitaet |
US5024922A (en) * | 1988-11-07 | 1991-06-18 | Moss Mary G | Positive working polyamic acid/imide and diazoquinone photoresist with high temperature pre-bake |
JP2890213B2 (ja) * | 1991-02-25 | 1999-05-10 | チッソ株式会社 | 感光性重合体組成物及びパターンの形成方法 |
JP3677191B2 (ja) | 1999-03-15 | 2005-07-27 | 株式会社東芝 | 感光性ポリイミド用現像液、ポリイミド膜パターン形成方法、及び電子部品 |
JP4529252B2 (ja) | 1999-09-28 | 2010-08-25 | 日立化成デュポンマイクロシステムズ株式会社 | ポジ型感光性樹脂組成物、パターンの製造法及び電子部品 |
KR100422971B1 (ko) | 1999-12-29 | 2004-03-12 | 삼성전자주식회사 | 나프톨 구조를 가진 이온형 광산발생제 및 이를 이용한감광성 폴리이미드 조성물 |
JP3773845B2 (ja) | 2000-12-29 | 2006-05-10 | 三星電子株式会社 | ポジティブ型感光性ポリイミド前駆体およびこれを含む組成物 |
KR100532590B1 (ko) * | 2002-11-07 | 2005-12-01 | 삼성전자주식회사 | 감광성 폴리이미드 전구체용 가용성 폴리이미드 및, 이를포함하는 감광성 폴리이드 전구체 조성물 |
JP4775261B2 (ja) | 2004-05-07 | 2011-09-21 | 日立化成デュポンマイクロシステムズ株式会社 | ポジ型感光性樹脂組成物、パターンの製造方法及び電子部品 |
US7638254B2 (en) | 2004-05-07 | 2009-12-29 | Hitachi Chemical Dupont Microsystems Ltd | Positive photosensitive resin composition, method for forming pattern, and electronic part |
TWI407255B (zh) * | 2005-09-22 | 2013-09-01 | Hitachi Chem Dupont Microsys | 負片型感光性樹脂組成物、圖案形成方法以及電子零件 |
JP4730436B2 (ja) * | 2006-03-16 | 2011-07-20 | 旭硝子株式会社 | ネガ型感光性含フッ素芳香族系樹脂組成物 |
JP5123846B2 (ja) * | 2006-04-28 | 2013-01-23 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂組成物及び感光性フィルム |
KR101025395B1 (ko) * | 2006-06-20 | 2011-03-28 | 히다치 가세이듀퐁 마이쿠로시스데무즈 가부시키가이샤 | 네거티브형 감광성 수지 조성물, 패턴의 제조방법 및 전자부품 |
US8298747B2 (en) * | 2007-03-12 | 2012-10-30 | Hitachi Chemical Dupont Microsystems, Ltd. | Photosensitive resin composition, process for producing patterned hardened film with use thereof and electronic part |
JP5316417B2 (ja) * | 2007-10-29 | 2013-10-16 | 日立化成デュポンマイクロシステムズ株式会社 | ポジ型感光性樹脂組成物、パターンの製造方法及び電子部品 |
WO2009123122A1 (fr) | 2008-03-31 | 2009-10-08 | 大日本印刷株式会社 | Agent générateur de base, composition de résine photosensible, matériau formant motifs contenant la composition de résine photosensible, procédé de formation de motifs au moyen de la composition de résine photosensible, et article |
US8071273B2 (en) * | 2008-03-31 | 2011-12-06 | Dai Nippon Printing Co., Ltd. | Polyimide precursor, resin composition comprising the polyimide precursor, pattern forming method using the resin composition, and articles produced by using the resin composition |
US9274438B1 (en) * | 2008-06-25 | 2016-03-01 | Western Digital (Fremont), Llc | Method and system for exposing photoresist in a microelectric device |
CN102365341B (zh) | 2009-03-31 | 2014-12-31 | 大日本印刷株式会社 | 碱产生剂、感光性树脂组合物、含有该感光性树脂组合物的图案形成用材料、使用该感光性树脂组合物的图案形成方法以及物品 |
JP5655794B2 (ja) | 2010-01-21 | 2015-01-21 | 日立化成デュポンマイクロシステムズ株式会社 | ポジ型感光性樹脂組成物、パターン硬化膜の製造方法及び電子部品 |
US9519221B2 (en) * | 2014-01-13 | 2016-12-13 | Applied Materials, Inc. | Method for microwave processing of photosensitive polyimides |
TWI534182B (zh) | 2014-04-18 | 2016-05-21 | 胡網加成股份有限公司 | 聚矽倍半氧烷共聚物及包含該共聚物之光敏樹脂 |
KR102597875B1 (ko) | 2015-03-16 | 2023-11-03 | 다이요 홀딩스 가부시키가이샤 | 포지티브형 감광성 수지 조성물, 드라이 필름, 경화물 및 프린트 배선판 |
KR102071112B1 (ko) | 2017-10-11 | 2020-01-29 | 타코마테크놀러지 주식회사 | 바인더 수지 및 이를 포함하는 감광성 수지 조성물 또는 코팅 용액 |
JP7233189B2 (ja) | 2018-09-21 | 2023-03-06 | 太陽ホールディングス株式会社 | 感光性樹脂組成物、ドライフィルム、硬化物および電子部品 |
JP2021092758A (ja) | 2019-12-03 | 2021-06-17 | 東京応化工業株式会社 | ネガ型感光性樹脂組成物及び硬化膜の製造方法 |
JP2022175020A (ja) | 2021-05-12 | 2022-11-25 | 東京応化工業株式会社 | 感光性樹脂、ネガ型感光性樹脂組成物、パターン化された硬化膜の製造方法及びカルボキシ基含有樹脂 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE569884A (fr) * | 1957-08-03 | |||
NL125781C (fr) * | 1959-02-04 | |||
US3179634A (en) * | 1962-01-26 | 1965-04-20 | Du Pont | Aromatic polyimides and the process for preparing them |
GB1116674A (en) * | 1966-02-28 | 1968-06-12 | Agfa Gevaert Nv | Naphthoquinone diazide sulphofluoride |
US3551154A (en) * | 1966-12-28 | 1970-12-29 | Ferrania Spa | Light sensitive article comprising a quinone diazide and polymeric binder |
US3802885A (en) * | 1967-08-15 | 1974-04-09 | Algraphy Ltd | Photosensitive lithographic naphthoquinone diazide printing plate with aluminum base |
US3637384A (en) * | 1969-02-17 | 1972-01-25 | Gaf Corp | Positive-working diazo-oxide terpolymer photoresists |
US3623870A (en) * | 1969-07-22 | 1971-11-30 | Bell Telephone Labor Inc | Technique for the preparation of thermally stable photoresist |
DE2000623C3 (de) * | 1970-01-08 | 1979-06-28 | Agfa-Gevaert Ag, 5090 Leverkusen | Photographisches Verfahren zur Herstellung von Bildern |
US3759711A (en) * | 1970-09-16 | 1973-09-18 | Eastman Kodak Co | Er compositions and elements nitrogen linked apperding quinone diazide light sensitive vinyl polym |
DE2053363C3 (de) * | 1970-10-30 | 1980-09-18 | Hoechst Ag, 6000 Frankfurt | Lichtempfindliches Gemisch |
US3833436A (en) * | 1972-09-05 | 1974-09-03 | Buckbee Mears Co | Etching of polyimide films |
US3871930A (en) * | 1973-12-19 | 1975-03-18 | Texas Instruments Inc | Method of etching films made of polyimide based polymers |
-
1975
- 1975-07-18 US US05/597,226 patent/US4093461A/en not_active Expired - Lifetime
-
1976
- 1976-04-22 CA CA250,802A patent/CA1063416A/fr not_active Expired
- 1976-05-12 IT IT23187/76A patent/IT1060035B/it active
- 1976-05-13 GB GB19875/76A patent/GB1548583A/en not_active Expired
- 1976-05-21 FR FR7615556A patent/FR2317680B1/fr not_active Expired
- 1976-07-08 CH CH874876A patent/CH619055A5/de not_active IP Right Cessation
- 1976-07-14 DE DE19762631535 patent/DE2631535A1/de not_active Withdrawn
- 1976-07-15 JP JP51083611A patent/JPS5213315A/ja active Pending
- 1976-07-16 NL NL7607897.A patent/NL164975C/xx not_active IP Right Cessation
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0264678A1 (fr) * | 1986-10-02 | 1988-04-27 | Hoechst Celanese Corporation | Polyamides contenant des groupes hexafluoroisopropylène, compositions photosensibles positives les contenant et matériaux d'enregistrement les utilisant |
EP0291779A2 (fr) * | 1987-05-18 | 1988-11-23 | Siemens Aktiengesellschaft | Réserves positives résistantes à la chaleur et procédé de fabrication de structures formant réserve résistantes à la chaleur |
EP0291779A3 (en) * | 1987-05-18 | 1989-09-20 | Siemens Aktiengesellschaft | Heat-resistant positive resist, and process for the production of heat-resistant resist patterns |
EP0368800A2 (fr) * | 1988-11-05 | 1990-05-16 | Ciba-Geigy Ag | Photoréserve positive du genre polyimide |
EP0368800A3 (fr) * | 1988-11-05 | 1990-11-22 | Ciba-Geigy Ag | Photoréserve positive du genre polyimide |
EP0478321A1 (fr) * | 1990-09-28 | 1992-04-01 | Kabushiki Kaisha Toshiba | Composition résineuse photosensible pour la structuration d'un film de polyimide et méthode pour structurer un film de polyimide |
US5348835A (en) * | 1990-09-28 | 1994-09-20 | Kabushiki Kaisha Toshiba | Photosensitive resin composition for forming polyimide film pattern comprising an o-quinone diazide photosensitive agent |
Also Published As
Publication number | Publication date |
---|---|
NL7607897A (nl) | 1977-01-20 |
DE2631535A1 (de) | 1977-02-03 |
JPS5213315A (en) | 1977-02-01 |
FR2317680B1 (fr) | 1981-08-07 |
US4093461A (en) | 1978-06-06 |
CA1063416A (fr) | 1979-10-02 |
IT1060035B (it) | 1982-07-10 |
CH619055A5 (fr) | 1980-08-29 |
GB1548583A (en) | 1979-07-18 |
NL164975B (nl) | 1980-09-15 |
NL164975C (nl) | 1981-02-16 |
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Legal Events
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ST | Notification of lapse |