ES8103501A1 - Un dispositivo de laser semiconductor - Google Patents
Un dispositivo de laser semiconductorInfo
- Publication number
- ES8103501A1 ES8103501A1 ES492751A ES492751A ES8103501A1 ES 8103501 A1 ES8103501 A1 ES 8103501A1 ES 492751 A ES492751 A ES 492751A ES 492751 A ES492751 A ES 492751A ES 8103501 A1 ES8103501 A1 ES 8103501A1
- Authority
- ES
- Spain
- Prior art keywords
- assembly block
- semiconductor laser
- laser device
- secured
- block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
- H01S5/02212—Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02375—Positioning of the laser chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
- H01S5/068—Stabilisation of laser output parameters
- H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Abstract
DISPOSITIVO DE LASER SEMICONDUCTOR. UN BLOQUE (1) SIRVE DE BASE PARA TODO EL CONJUNTO; POR UNA BASE (8) SIMILAR A LA ENVOLVENTE DE UN TRANSISTOR SE INTRODUCEN TRES CONDUCTORES; UN CONDUCTOR DE MASA (11), OTRO CONDUCTOR (12) QUE VA CONECTADO AL ELEMENTO LASER (3) A TRAVES DE UN ALAMBRE (14) Y UN CONDUCTOR (13) CONECTADO POR MEDIO DE UN ALAMBRE (15) A UN FOTODIODO (16). ESTE ULTIMO CONTROLA AL ELMENTO LASER (3). UN CAPUCHON (20) CON UNA ABERTURA (22) CERRADA POR UNA PLACA DE VIDRIO (23) DOTA AL DISPOSITIVO DE UN CIERRE HERMETICO. DE APLICACION EN SISTEMAS DE AUDIO Y VIDEO.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NLAANVRAGE7904954,A NL181963C (nl) | 1979-06-26 | 1979-06-26 | Halfgeleiderlaserinrichting. |
Publications (2)
Publication Number | Publication Date |
---|---|
ES492751A0 ES492751A0 (es) | 1981-02-16 |
ES8103501A1 true ES8103501A1 (es) | 1981-02-16 |
Family
ID=19833419
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES492751A Expired ES8103501A1 (es) | 1979-06-26 | 1980-06-25 | Un dispositivo de laser semiconductor |
Country Status (12)
Country | Link |
---|---|
US (1) | US4351051A (es) |
JP (1) | JPS566494A (es) |
AU (1) | AU523568B2 (es) |
BE (1) | BE883986A (es) |
CA (1) | CA1152626A (es) |
CH (1) | CH648156A5 (es) |
DE (1) | DE3023706C2 (es) |
ES (1) | ES8103501A1 (es) |
FR (1) | FR2465335B1 (es) |
GB (1) | GB2052140B (es) |
IT (1) | IT1131636B (es) |
NL (1) | NL181963C (es) |
Families Citing this family (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57177579A (en) * | 1981-04-24 | 1982-11-01 | Nec Corp | Photosemiconductor device |
DE3128418A1 (de) * | 1981-07-17 | 1983-02-03 | Siemens AG, 1000 Berlin und 8000 München | Gehaeuse fuer elektronische bauelemente, insbesondere optoelektronische halbleiterbauelemente |
JPS5821889A (ja) * | 1981-07-31 | 1983-02-08 | Sony Corp | 半導体組立構造 |
JPS5880887A (ja) * | 1981-11-09 | 1983-05-16 | Nec Corp | 半導体レ−ザ・フオトダイオ−ド光集積化素子 |
JPS5884486A (ja) * | 1981-11-13 | 1983-05-20 | Nec Corp | 半導体レ−ザ・フオトデイテクタ光集積化素子 |
JPS5858368U (ja) * | 1981-10-15 | 1983-04-20 | 株式会社東芝 | 半導体レ−ザダイオ−ド装置 |
JPS5898995A (ja) * | 1981-12-09 | 1983-06-13 | Nec Corp | 光半導体装置 |
JPS58145169A (ja) * | 1982-02-23 | 1983-08-29 | Nec Corp | 光半導体装置 |
US4536062A (en) * | 1982-07-21 | 1985-08-20 | Litton Systems, Inc. | Thermal stabilization for an acousto-optic device |
US4615031A (en) * | 1982-07-27 | 1986-09-30 | International Standard Electric Corporation | Injection laser packages |
JPS5923583A (ja) * | 1982-07-30 | 1984-02-07 | Canon Inc | レ−ザユニツト |
FR2531819A1 (fr) * | 1982-08-12 | 1984-02-17 | Demeure Loic | Embase pour laser a semi-conducteur et son procede de fabrication |
US4550333A (en) * | 1983-09-13 | 1985-10-29 | Xerox Corporation | Light emitting semiconductor mount |
US4832251A (en) * | 1983-12-13 | 1989-05-23 | General Electric Company | Method of mounting semiconductor lasers providing improved lasing spot alignment |
DE3567554D1 (en) * | 1984-08-08 | 1989-02-16 | Siemens Ag | Common housing for two semiconductor bodies |
EP0216174A1 (de) * | 1985-09-25 | 1987-04-01 | Siemens Aktiengesellschaft | Lichtweichen-Einheit |
US4818099A (en) * | 1985-10-25 | 1989-04-04 | Preikschat F K | Optical radar system |
US4761788A (en) * | 1985-10-28 | 1988-08-02 | American Telephone And Telegraph Company | Stripline mount for semiconductor lasers |
US4768070A (en) * | 1986-03-20 | 1988-08-30 | Hitachi, Ltd | Optoelectronics device |
US4757197A (en) * | 1986-05-01 | 1988-07-12 | Lee Wai Hon | Semiconductor laser and detector device |
JPS6340387A (ja) * | 1986-08-05 | 1988-02-20 | Sharp Corp | 半導体レ−ザ装置 |
US4905216A (en) * | 1986-12-04 | 1990-02-27 | Pencom International Corporation | Method for constructing an optical head by varying a hologram pattern |
JP2682641B2 (ja) * | 1988-06-03 | 1997-11-26 | 株式会社リコー | 半導体レーザー光源装置 |
GB2224352B (en) * | 1988-10-05 | 1992-09-16 | Hamamatsu Photonics Kk | Light waveform measuring apparatus |
US4953006A (en) * | 1989-07-27 | 1990-08-28 | Northern Telecom Limited | Packaging method and package for edge-coupled optoelectronic device |
US5075765A (en) * | 1990-09-21 | 1991-12-24 | Unisys | Low stress multichip module |
DE9211110U1 (de) * | 1992-08-19 | 1992-10-29 | Bodenseewerk Gerätetechnik GmbH, 7770 Überlingen | Anordnung zum Einbau von Halbleiter-Laserdioden in optomechanische Systeme |
US5302778A (en) * | 1992-08-28 | 1994-04-12 | Eastman Kodak Company | Semiconductor insulation for optical devices |
JP2661521B2 (ja) * | 1993-09-25 | 1997-10-08 | 日本電気株式会社 | 半導体受光装置 |
JP3682221B2 (ja) * | 2000-11-28 | 2005-08-10 | シャープ株式会社 | 半導体レーザ装置 |
CN100435438C (zh) * | 2002-02-14 | 2008-11-19 | 菲尼萨公司 | 具有集成的冷却装置的头装置 |
US20040021214A1 (en) * | 2002-04-16 | 2004-02-05 | Avner Badehi | Electro-optic integrated circuits with connectors and methods for the production thereof |
AU2003226601A1 (en) * | 2002-04-16 | 2003-10-27 | Xloom Photonics Ltd. | Electro-optical circuitry having integrated connector and methods for the production thereof |
US7061949B1 (en) * | 2002-08-16 | 2006-06-13 | Jds Uniphase Corporation | Methods, apparatus, and systems with semiconductor laser packaging for high modulation bandwidth |
EP1676160A4 (en) | 2003-10-15 | 2008-04-09 | Xloom Photonics Ltd | ELECTRO-OPTICAL CIRCUITRY HAVING AN INTEGRATED CONNECTOR AND METHODS OF PRODUCING THE SAME |
JP4549298B2 (ja) * | 2003-11-14 | 2010-09-22 | 三洋電機株式会社 | 半導体レーザ装置 |
US20050196173A1 (en) * | 2003-12-29 | 2005-09-08 | Finisar Corporation | Receive optical assembly with angled optical receiver |
US20090093137A1 (en) * | 2007-10-08 | 2009-04-09 | Xloom Communications, (Israel) Ltd. | Optical communications module |
JP7240160B2 (ja) * | 2018-12-11 | 2023-03-15 | 新光電気工業株式会社 | ステム |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1403801A (en) * | 1973-01-30 | 1975-08-28 | Standard Telephones Cables Ltd | Semiconductor device stud mount |
US3857993A (en) * | 1973-11-21 | 1974-12-31 | Raytheon Co | Beam lead semiconductor package |
GB1463233A (en) * | 1975-02-13 | 1977-02-02 | Standard Telephones Cables Ltd | Injection laser assembly |
DE2741700A1 (de) * | 1977-09-16 | 1979-03-22 | Siemens Ag | Einrichtung zum ueberwachen der emission eines halbleiterstrahlers |
JPS54101296A (en) * | 1978-01-26 | 1979-08-09 | Nec Corp | Photo semiconductor device |
JPS54142988A (en) * | 1978-04-28 | 1979-11-07 | Hitachi Ltd | Photo semiconductor device |
US4240090A (en) * | 1978-06-14 | 1980-12-16 | Rca Corporation | Electroluminescent semiconductor device with fiber-optic face plate |
-
1979
- 1979-06-26 NL NLAANVRAGE7904954,A patent/NL181963C/xx not_active IP Right Cessation
-
1980
- 1980-06-18 CA CA000354239A patent/CA1152626A/en not_active Expired
- 1980-06-23 CH CH4819/80A patent/CH648156A5/de not_active IP Right Cessation
- 1980-06-23 IT IT22937/80A patent/IT1131636B/it active
- 1980-06-23 FR FR8013869A patent/FR2465335B1/fr not_active Expired
- 1980-06-23 GB GB8020519A patent/GB2052140B/en not_active Expired
- 1980-06-23 AU AU59511/80A patent/AU523568B2/en not_active Ceased
- 1980-06-24 BE BE0/201161A patent/BE883986A/fr not_active IP Right Cessation
- 1980-06-24 JP JP8468880A patent/JPS566494A/ja active Granted
- 1980-06-25 ES ES492751A patent/ES8103501A1/es not_active Expired
- 1980-06-25 DE DE3023706A patent/DE3023706C2/de not_active Expired
- 1980-06-30 US US06/164,200 patent/US4351051A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE3023706C2 (de) | 1987-02-26 |
US4351051A (en) | 1982-09-21 |
AU5951180A (en) | 1981-01-08 |
ES492751A0 (es) | 1981-02-16 |
NL7904954A (nl) | 1980-12-30 |
FR2465335B1 (fr) | 1985-10-31 |
DE3023706A1 (de) | 1981-01-15 |
IT8022937A0 (it) | 1980-06-23 |
JPS571914B2 (es) | 1982-01-13 |
IT1131636B (it) | 1986-06-25 |
NL181963C (nl) | 1987-12-01 |
FR2465335A1 (fr) | 1981-03-20 |
GB2052140A (en) | 1981-01-21 |
NL181963B (nl) | 1987-07-01 |
BE883986A (fr) | 1980-12-24 |
CA1152626A (en) | 1983-08-23 |
AU523568B2 (en) | 1982-08-05 |
CH648156A5 (de) | 1985-02-28 |
GB2052140B (en) | 1983-04-27 |
JPS566494A (en) | 1981-01-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC1A | Transfer granted | ||
FD1A | Patent lapsed |
Effective date: 20020401 |