ES485223A1 - Un procedimiento para el tratamiento de un substrato plasti-co polimerico - Google Patents

Un procedimiento para el tratamiento de un substrato plasti-co polimerico

Info

Publication number
ES485223A1
ES485223A1 ES485223A ES485223A ES485223A1 ES 485223 A1 ES485223 A1 ES 485223A1 ES 485223 A ES485223 A ES 485223A ES 485223 A ES485223 A ES 485223A ES 485223 A1 ES485223 A1 ES 485223A1
Authority
ES
Spain
Prior art keywords
alkyl amine
composition containing
polymeric substrates
substrates prior
accelerating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES485223A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oxy Metal Industries Corp
Original Assignee
Oxy Metal Industries Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oxy Metal Industries Corp filed Critical Oxy Metal Industries Corp
Publication of ES485223A1 publication Critical patent/ES485223A1/es
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)

Abstract

Un procedimiento para el tratamiento de un substrato plástico polimérico para hacerlo receptivo a los depósitos no electrolíticos, cuyo procedimiento comprende las operaciones de mordentar el substrato, enjuagar y activar el substrato mordentado con un complejo ácido de estaño-paladio, enjuagar y después acelerar el substrato activado empleando una solución acelerante acuosa mejorada que contiene una alquilamina sustituida compatible soluble. La solución acelerante mejorada es estable, fácil de controlar, tolerante a las impurezas metálicas presentes en la solución, inhibe la deposición en la rejilla y es de uso versátil.
ES485223A 1978-10-20 1979-10-19 Un procedimiento para el tratamiento de un substrato plasti-co polimerico Expired ES485223A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/953,153 US4204013A (en) 1978-10-20 1978-10-20 Method for treating polymeric substrates prior to plating employing accelerating composition containing an alkyl amine

Publications (1)

Publication Number Publication Date
ES485223A1 true ES485223A1 (es) 1980-07-01

Family

ID=25493642

Family Applications (1)

Application Number Title Priority Date Filing Date
ES485223A Expired ES485223A1 (es) 1978-10-20 1979-10-19 Un procedimiento para el tratamiento de un substrato plasti-co polimerico

Country Status (13)

Country Link
US (1) US4204013A (es)
JP (1) JPS6049717B2 (es)
AU (1) AU528226B2 (es)
BR (1) BR7906754A (es)
CA (1) CA1144432A (es)
DE (1) DE2941997C2 (es)
ES (1) ES485223A1 (es)
FR (1) FR2439214A1 (es)
GB (1) GB2036755B (es)
HK (1) HK67986A (es)
IT (1) IT1164737B (es)
MX (1) MX152328A (es)
SG (1) SG42386G (es)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0066656B1 (en) * 1981-06-02 1985-09-25 Asahi Glass Company Ltd. Process for preparing nickel layer
US4448811A (en) * 1981-12-30 1984-05-15 Omi International Corporation Oxidizing agent for acidic accelerator in electroless metal plating process
DE3376852D1 (en) * 1982-05-26 1988-07-07 Macdermid Inc Catalyst solutions for activating non-conductive substrates and electroless plating process
US4863758A (en) * 1982-05-26 1989-09-05 Macdermid, Incorporated Catalyst solutions for activating non-conductive substrates and electroless plating process
US4450191A (en) * 1982-09-02 1984-05-22 Omi International Corporation Ammonium ions used as electroless copper plating rate controller
US4610895A (en) * 1984-02-01 1986-09-09 Shipley Company Inc. Process for metallizing plastics
US4592929A (en) * 1984-02-01 1986-06-03 Shipley Company Inc. Process for metallizing plastics
JPS60218477A (ja) * 1984-04-11 1985-11-01 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 無電解付着のための触媒化処理法
JPS6230509U (es) * 1985-08-09 1987-02-24
JPH0765154B2 (ja) * 1985-09-02 1995-07-12 ポリプラスチックス株式会社 表面金属処理した樹脂成形品
US4814009A (en) * 1986-11-14 1989-03-21 Nippondenso Co., Ltd. Electroless copper plating solution
DE3743743A1 (de) * 1987-12-23 1989-07-06 Basf Ag Polymere konditionierungsmittel zur vorbehandlung von nichtmetallischen oberflaechen fuer eine chemische metallisierung
US5053280A (en) * 1988-09-20 1991-10-01 Hitachi-Chemical Co., Ltd. Adhesive composition for printed wiring boards with acrylonitrile-butadiene rubber having carboxyl groups and 20 ppm or less metal ionic impurities; an alkyl phenol resin; an epoxy resin; palladium catalyst, and coupling agent
US5965211A (en) * 1989-12-29 1999-10-12 Nippondenso Co., Ltd. Electroless copper plating solution and process for formation of copper film
US5843538A (en) * 1996-12-09 1998-12-01 John L. Raymond Method for electroless nickel plating of metal substrates
US6361712B1 (en) * 1999-10-15 2002-03-26 Arch Specialty Chemicals, Inc. Composition for selective etching of oxides over metals
DE10054544A1 (de) * 2000-11-01 2002-05-08 Atotech Deutschland Gmbh Verfahren zum chemischen Metallisieren von Oberflächen
US6638326B2 (en) * 2001-09-25 2003-10-28 Ekc Technology, Inc. Compositions for chemical mechanical planarization of tantalum and tantalum nitride
US6783690B2 (en) * 2002-03-25 2004-08-31 Donna M. Kologe Method of stripping silver from a printed circuit board
CA2539656A1 (en) * 2002-09-20 2004-04-01 Noble Fiber Technologies Improved silver plating method and articles made therefrom
DE10259187B4 (de) * 2002-12-18 2008-06-19 Enthone Inc., West Haven Metallisierung von Kunststoffsubstraten und Lösung zum Beizen und Aktivieren
EP2233608B1 (en) * 2009-03-23 2016-03-23 ATOTECH Deutschland GmbH Pre-treatment process for electroless nickel plating
US10000652B2 (en) 2013-07-24 2018-06-19 National Research Council Of Canada Process for depositing metal on a substrate
KR102447849B1 (ko) * 2014-04-01 2022-09-26 아토테크 도이칠란트 게엠베하 운트 콤파니 카게 비전도성 플라스틱 표면들을 금속화하기 위한 조성 및 프로세스
ES2828459T5 (es) * 2014-07-10 2024-04-30 Okuno Chem Ind Co Método de galvanización de resina

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3011920A (en) * 1959-06-08 1961-12-05 Shipley Co Method of electroless deposition on a substrate and catalyst solution therefor
US3532518A (en) * 1967-06-28 1970-10-06 Macdermid Inc Colloidal metal activating solutions for use in chemically plating nonconductors,and process of preparing such solutions
US3620804A (en) * 1969-01-22 1971-11-16 Borg Warner Metal plating of thermoplastics
US3622370A (en) * 1969-04-07 1971-11-23 Macdermid Inc Method of and solution for accelerating activation of plastic substrates in electroless metal plating system
US3962497A (en) * 1975-03-11 1976-06-08 Oxy Metal Industries Corporation Method for treating polymeric substrates prior to plating
DE2659680C2 (de) * 1976-12-30 1985-01-31 Ibm Deutschland Gmbh, 7000 Stuttgart Verfahren zum Aktivieren von Oberflächen

Also Published As

Publication number Publication date
BR7906754A (pt) 1980-06-17
AU5116679A (en) 1980-04-24
JPS5556137A (en) 1980-04-24
JPS6049717B2 (ja) 1985-11-05
DE2941997A1 (de) 1980-04-30
SG42386G (en) 1987-03-27
MX152328A (es) 1985-06-27
FR2439214A1 (fr) 1980-05-16
DE2941997C2 (de) 1982-12-23
FR2439214B1 (es) 1983-07-01
GB2036755B (en) 1983-05-11
US4204013A (en) 1980-05-20
AU528226B2 (en) 1983-04-21
HK67986A (en) 1986-09-18
IT7950601A0 (it) 1979-10-18
CA1144432A (en) 1983-04-12
IT1164737B (it) 1987-04-15
GB2036755A (en) 1980-07-02

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