ES2400681T3 - Instalación de producción para la fabricación de células solares en el procedimiento continuo, así como procedimiento para la integración de un proceso discontinuo en una instalación de producción continua de varias pistas para células solares - Google Patents
Instalación de producción para la fabricación de células solares en el procedimiento continuo, así como procedimiento para la integración de un proceso discontinuo en una instalación de producción continua de varias pistas para células solares Download PDFInfo
- Publication number
- ES2400681T3 ES2400681T3 ES07856184T ES07856184T ES2400681T3 ES 2400681 T3 ES2400681 T3 ES 2400681T3 ES 07856184 T ES07856184 T ES 07856184T ES 07856184 T ES07856184 T ES 07856184T ES 2400681 T3 ES2400681 T3 ES 2400681T3
- Authority
- ES
- Spain
- Prior art keywords
- support
- cells
- continuous
- discontinuous
- installation part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 57
- 238000010924 continuous production Methods 0.000 title claims abstract description 36
- 238000000034 method Methods 0.000 title claims description 71
- 230000010354 integration Effects 0.000 title claims description 4
- 238000010923 batch production Methods 0.000 title description 8
- 230000008859 change Effects 0.000 claims abstract description 55
- 238000009434 installation Methods 0.000 claims description 108
- 230000008569 process Effects 0.000 claims description 51
- 238000011282 treatment Methods 0.000 claims description 9
- 239000011159 matrix material Substances 0.000 claims description 3
- 210000004027 cell Anatomy 0.000 claims 15
- 210000001912 transporting cell Anatomy 0.000 claims 1
- 230000032258 transport Effects 0.000 description 65
- 235000012431 wafers Nutrition 0.000 description 13
- 230000008901 benefit Effects 0.000 description 7
- 238000004140 cleaning Methods 0.000 description 6
- 230000006866 deterioration Effects 0.000 description 6
- 238000005406 washing Methods 0.000 description 4
- 238000001035 drying Methods 0.000 description 3
- 230000004656 cell transport Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000007726 management method Methods 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000005779 cell damage Effects 0.000 description 1
- 208000037887 cell injury Diseases 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Photovoltaic Devices (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102006054846A DE102006054846C5 (de) | 2006-11-20 | 2006-11-20 | Produktionsanlage zur Herstellung von Solarzellen im Inline-Verfahren, sowie Verfahren zur Integration eines Batch-Prozesses in eine mehrspurige Inline-Produktionsanlage für Solarzellen |
DE102006054846 | 2006-11-20 | ||
PCT/EP2007/010001 WO2008061689A2 (de) | 2006-11-20 | 2007-11-20 | Produktionsanlage zur herstellung von solarzellen, inline-batch-umsetzeinrichtung, batch-inline-umsetzeinrichtung sowie das dazugehörige verfahren |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2400681T3 true ES2400681T3 (es) | 2013-04-11 |
Family
ID=39326152
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES07856184T Active ES2400681T3 (es) | 2006-11-20 | 2007-11-20 | Instalación de producción para la fabricación de células solares en el procedimiento continuo, así como procedimiento para la integración de un proceso discontinuo en una instalación de producción continua de varias pistas para células solares |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP2095411B1 (de) |
DE (1) | DE102006054846C5 (de) |
ES (1) | ES2400681T3 (de) |
TW (1) | TW200836360A (de) |
WO (1) | WO2008061689A2 (de) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101569031B1 (ko) | 2009-03-23 | 2015-11-13 | 엘지전자 주식회사 | Home (e)NodeB에 대한 단말의 접속을 제어하는 방법 |
DE102009024239A1 (de) | 2009-05-29 | 2010-12-02 | Schmid Technology Systems Gmbh | Vorrichtung und Verfahren zum Stapeln bzw. Transport einer Vielzahl von flachen Substraten |
DE102010008233A1 (de) | 2010-02-11 | 2011-08-11 | Schmid Technology GmbH, 68723 | Vorrichtung und Verfahren zum Transport von Substraten |
DE102011052325A1 (de) * | 2011-08-01 | 2013-02-07 | Roth & Rau Ag | Reinigungsmodul und Reinigungsverfahren für Substrate und/oder Substratträger |
NL1039112C2 (nl) * | 2011-10-18 | 2013-04-22 | Edward Bok | Semiconductor chips, bewerkstelligd in een semiconductor installatie, en waarbij daartoe in een tunnel-opstelling ervan de productie van rechthoekige platen en waaruit tenslotte in een inrichting door deling het verkrijgen ervan. |
NL1039111C2 (nl) * | 2011-10-18 | 2013-04-22 | Edward Bok | Uitwisselbare semiconductor cassette achter een semiconductor tunnel-opstelling voor het daarin tijdelijk opslaan van de daarin bewerkstelligde rechthoekige platen, bevattende reeds basis-chips. |
NL1039113C2 (nl) * | 2011-10-18 | 2013-04-22 | Edward Bok | Semiconductor installatie, bevattende een semiconductor tunnel,waarin de bewerkstelliging van opvolgende rechthoekige platen, bevattende een aantal semiconductor basis-chips, met een tijdelijke opslag ervan in een daarachter gelegen cassette. |
NL1039114C2 (nl) * | 2011-10-18 | 2013-04-22 | Edward Bok | Semiconductor installatie, waarbij in een semiconductor tunnel ervan de bewerkstelliging van opvolgende rechthoekige platen, bevattende een aantal basis-chips ten behoeve van in een inrichting door deling ervan het verkrijgen van chips. |
NL1039463C2 (nl) * | 2012-03-13 | 2013-09-16 | Edward Bok | Semiconductor chip, vervaardigd in een semiconductor installatie en waarbij in een semiconductor tunnel-opstelling ervan de opname van een extreem ultra violet lithographysysteem ten behoeve van met behulp van de euv-stralen het plaatsvinden van een belichtings-proces van opvolgende gedeeltes van een semiconductor substraat. |
NL1039462C2 (nl) * | 2012-03-13 | 2013-09-16 | Edward Bok | Semiconductor tunnel-opstelling, waarbij in een sectie ervan de opname van een extreem ultra violet lithographie-systeem ten behoeve van met behulp van de euv-stralen het plaatsvinden van een belichtings-proces van opvolgende, daarin toegevoerde gedeeltes van een ononderbroken semiconductor substraat. |
NL1039461C2 (nl) * | 2012-03-13 | 2013-09-16 | Edward Bok | Semiconductor installatie, waarin de opname van een tunnel-opstelling, en waarbij in een sectie ervan de opname van een extreem ultra violet lithographie-systeem ten behoeve van met behulp van de euv-stralen het plaatsvinden van een belichtings-proces van opvolgende gedeeltes van een ononderbroken substraat. |
DE102019102492A1 (de) | 2019-01-31 | 2020-08-06 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Vorrichtung und Verfahren zur Bearbeitung von Wafern |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4228902A (en) * | 1979-02-21 | 1980-10-21 | Kasper Instruments, Inc. | Carrier for semiconductive wafers |
US4313254A (en) * | 1979-10-30 | 1982-02-02 | The Johns Hopkins University | Thin-film silicon solar cell with metal boride bottom electrode |
US4353160A (en) * | 1980-11-24 | 1982-10-12 | Spire Corporation | Solar cell junction processing system |
US4576685A (en) * | 1985-04-23 | 1986-03-18 | Schering Ag | Process and apparatus for plating onto articles |
DE3529313A1 (de) * | 1985-08-14 | 1987-02-26 | Schering Ag | Automatische transport- und behandlungseinrichtung fuer waren, insbesondere leiterplatten |
DE3703542A1 (de) * | 1987-02-06 | 1988-08-18 | Schering Ag | Verfahren und anordnung zur beschickung von traggestellen in anlagen zum chemischen behandeln in baedern, insbesondere zum galvanisieren von plattenfoermigen gegenstaenden |
US4762353A (en) * | 1987-03-09 | 1988-08-09 | Dexon, Inc. | Flexible carrier for semiconductor wafer cassettes |
JP2598305B2 (ja) * | 1988-06-06 | 1997-04-09 | 日東電工株式会社 | 半導体ウエハの処理システム |
US4981408A (en) * | 1989-12-18 | 1991-01-01 | Varian Associates, Inc. | Dual track handling and processing system |
FR2697004B1 (fr) * | 1992-10-16 | 1994-11-18 | Commissariat Energie Atomique | Système de stockage et de transport d'objets plats tels que des boîtes extra-plates et son ratelier portatif. |
JPH09107026A (ja) * | 1995-10-12 | 1997-04-22 | Shin Etsu Polymer Co Ltd | ウェーハ収納容器のウェーハカセット |
DE19736805A1 (de) * | 1997-08-23 | 1999-02-25 | Atotech Deutschland Gmbh | Verfahren und Vorrichtung zur naßchemischen Behandlung von Teilen |
CN1996553A (zh) * | 2001-08-31 | 2007-07-11 | 阿赛斯特技术公司 | 用于半导体材料处理***的一体化机架 |
DE10210271A1 (de) * | 2002-03-08 | 2003-10-02 | Infineon Technologies Ag | Hordenanordnung, Hordenhalter und Verfahren |
JP2004319889A (ja) * | 2003-04-18 | 2004-11-11 | Seiko Epson Corp | 製造対象物の受け渡し装置および製造対象物の受け渡し方法 |
JP2005235916A (ja) * | 2004-02-18 | 2005-09-02 | Mitsubishi Heavy Ind Ltd | 薄膜太陽電池製造システム |
-
2006
- 2006-11-20 DE DE102006054846A patent/DE102006054846C5/de not_active Expired - Fee Related
-
2007
- 2007-11-20 ES ES07856184T patent/ES2400681T3/es active Active
- 2007-11-20 WO PCT/EP2007/010001 patent/WO2008061689A2/de active Application Filing
- 2007-11-20 EP EP07856184A patent/EP2095411B1/de active Active
- 2007-11-20 TW TW096143929A patent/TW200836360A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
DE102006054846B4 (de) | 2009-10-15 |
DE102006054846A1 (de) | 2008-05-29 |
EP2095411B1 (de) | 2013-02-13 |
EP2095411A2 (de) | 2009-09-02 |
WO2008061689A3 (de) | 2009-02-12 |
DE102006054846C5 (de) | 2012-05-03 |
WO2008061689A2 (de) | 2008-05-29 |
TW200836360A (en) | 2008-09-01 |
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