Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01C—RESISTORS
  • H01C1/00—Details
  • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
  • H01C1/144—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being welded or soldered
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01C—RESISTORS
  • H01C1/00—Details
  • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
  • H01C1/1413—Terminals or electrodes formed on resistive elements having negative temperature coefficient
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01C—RESISTORS
  • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
  • H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
  • H01C17/281—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thick film techniques
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
  • H01R4/02—Soldered or welded connections
  • H01R4/023—Soldered or welded connections between cables or wires and terminals
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
  • H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
  • H01R4/62—Connections between conductors of different materials; Connections between or with aluminium or steel-core aluminium conductors
  • H01R4/625—Soldered or welded connections

Definitions

• the present invention is a
• electrical component comprising a solder joint and a wire attached thereto.
• an electrical component has at least one contact surface on which a wire is fastened by means of a solder connection.
• This wire is at known
• Voids formation has a negative effect on the strength of the solder joint.
• the object is to find a way to improve the stability of a solder joint between an electrical component and a wire.
• This wire has at its end a support portion, with he rests on the component, and at the end of
• Pad section at least one kink.
• the wire may have at its attached end a flattening which extends through a rectangular to oval
• Cross section of the wire is distinguished.
• the flattening is characterized by the fact that the wire, as it progresses from its end, turns into its original, unflattened cross-section.
• the small amount of solder and the formation of voids at the contact point can be have a negative effect on the stability of the solder joint. This is compensated with the kink after the contact surface again.
• the flattened end of the wire can be on all corners and edges, both horizontal and vertical
• Section view should be rounded to a uniform
• second kink or other kinks may have a rounded shape and not be sharply angled. Due to the rounding the solder flows around the entire contact better than if the flattening of the wire would have sharp corners. For better contacting, a contact surface of the electrical component on which a solder joint
• Such a coating can be applied to the device by screen printing
• the flattening of the wire is generally of any length and may extend from the fixed end of the wire or from the support surface to beyond the kink described above.
• the kink can be arranged at the end of the flattening.
• the wire can be seen from the soldered end after the first another kink. It can be left open whether the further kink still in the area of the flattening or at the border. This further bend leads to a change in the angle between the
• the new angle is in a range of 0 ° to 80 °.
• the angle range may also extend from 0 ° to 45 °, or in the preferred case from 0 ° to 20 °.
• Contact surface extends may arise an increased accumulation of solder.
• the resulting higher amount of solder can have a positive effect on the stability of the solder joint.
• the wire may be provided in its course away from the solder joint with an insulation.
• the wire can be insulated from a polymer
• Plastic material that can extend over the remaining length of wire. The insulation of the wire prevents unwanted electrical contacts to others
• the component may have a NTC ceramic as the main body in a specific example. This may be in the form of a cut chip or a pressed disc based on spinel or perovskite ceramics. On a contact surface of this body of the wire is soldered.
• another wire can be soldered to the device.
• This additional wire can have the same characteristics as the previously described wire
• the device comprising all existing solder joints and parts of the wires may be provided with a polymeric cladding, e.g. from an epoxy.
• a polymeric cladding e.g. from an epoxy.
• FIG. 1 shows an NTC ceramic with two wires
• FIG. 2 shows a component together with a wire in one
• FIG. 1 shows an electrical component B of a preferred embodiment in a perspective view.
• Two opposing contact surfaces E on a base made of an NTC ceramic C are coated with silver. At these contact surfaces E is ever a wire with its flattening F or with its flattened
• a first kink Kl is present in the wires.
• the length of the flattened wire sections resting on the contact surfaces which constitute the support surface i. the length from the respective wire end D to the first kink, is chosen smaller than the contact surface of the device.
• the wire end D is located near an edge of the contact surface E, so that the wire still has a section M to 0, which extends over the contact surface E.
• the wires which are still flattened in this section run away from the ceramic body C at an angle of approximately 60 ° to the contact surface E.
• the wires pass into an area R of round cross-sectional shape.
• the wires have a second kink K2.
• Angle of the second bend is opposite to the first, so that the wires in the further course of a smaller
• the wires are provided with an insulation J made of a polymeric material.
• FIG. 2 shows an electrical component B with a wire in a schematic section
• the illustrated contact surface E an NTC ceramic C is coated with silver.
• a wire with its flattening F on is a wire with its flattening F on.
• the wire has a rounded end E on the flattened side.
• Section M has removed from the ceramic, it has another K2 kink.
• the wire runs at an angle ⁇ to the contact surface E, where ⁇ ⁇ .
• the wire passes into the area O of round cross-sectional shape R. The volume in the region of the distance A between the sections N and O and the
• Contact surface E can fill with solder during the soldering process and leads to an increased stability of the solder joint.
• the wire is provided with a polymeric insulation J.

Landscapes

• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Manufacturing & Machinery (AREA)
• Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
• Thermistors And Varistors (AREA)
• Details Of Resistors (AREA)
• Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Applications Claiming Priority (2)

Publications (1)

Family

ID=62904485

Family Applications (1)

Country Status (6)

Families Citing this family (1)

Family Cites Families (25)

• 2017
  • 2017-07-20 DE DE102017116381.6A patent/DE102017116381A1/de active Pending
• 2018
  • 2018-07-12 WO PCT/EP2018/068999 patent/WO2019016076A1/de unknown
  • 2018-07-12 US US16/611,294 patent/US10770204B2/en active Active
  • 2018-07-12 CN CN201880048609.2A patent/CN110914929B/zh active Active
  • 2018-07-12 JP JP2019565889A patent/JP7103570B2/ja active Active
  • 2018-07-12 EP EP18740209.4A patent/EP3655977A1/de active Pending
• 2022
  • 2022-04-14 JP JP2022067139A patent/JP2022087294A/ja not_active Ceased

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