EP3533852A4 - MANUFACTURING METHOD FOR ELECTRONIC DEVICE, ADHESIVE FILM FOR MANUFACTURING METHOD FOR ELECTRONIC DEVICE AND TEST DEVICE FOR ELECTRONIC COMPONENTS - Google Patents
MANUFACTURING METHOD FOR ELECTRONIC DEVICE, ADHESIVE FILM FOR MANUFACTURING METHOD FOR ELECTRONIC DEVICE AND TEST DEVICE FOR ELECTRONIC COMPONENTS Download PDFInfo
- Publication number
- EP3533852A4 EP3533852A4 EP17866122.9A EP17866122A EP3533852A4 EP 3533852 A4 EP3533852 A4 EP 3533852A4 EP 17866122 A EP17866122 A EP 17866122A EP 3533852 A4 EP3533852 A4 EP 3533852A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- electronic device
- device production
- electronic
- adhesive film
- component testing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2642—Testing semiconductor operation lifetime or reliability, e.g. by accelerated life tests
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Laminated Bodies (AREA)
- Dicing (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016210626 | 2016-10-27 | ||
PCT/JP2017/038366 WO2018079552A1 (ja) | 2016-10-27 | 2017-10-24 | 電子装置の製造方法、電子装置製造用粘着性フィルムおよび電子部品試験装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3533852A1 EP3533852A1 (en) | 2019-09-04 |
EP3533852A4 true EP3533852A4 (en) | 2020-06-17 |
Family
ID=62024133
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP17866122.9A Pending EP3533852A4 (en) | 2016-10-27 | 2017-10-24 | MANUFACTURING METHOD FOR ELECTRONIC DEVICE, ADHESIVE FILM FOR MANUFACTURING METHOD FOR ELECTRONIC DEVICE AND TEST DEVICE FOR ELECTRONIC COMPONENTS |
Country Status (8)
Country | Link |
---|---|
US (2) | US11047900B2 (zh) |
EP (1) | EP3533852A4 (zh) |
JP (1) | JP6726296B2 (zh) |
KR (1) | KR102243345B1 (zh) |
CN (1) | CN109891253A (zh) |
SG (1) | SG11201903701SA (zh) |
TW (1) | TWI745464B (zh) |
WO (1) | WO2018079552A1 (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10566254B2 (en) * | 2016-03-30 | 2020-02-18 | Mitsui Chemicals Tohcello, Inc. | Method for manufacturing semiconductor device |
WO2022172990A1 (ja) * | 2021-02-10 | 2022-08-18 | 三井化学東セロ株式会社 | 電子部品の製造方法、製造用フィルム及び製造用具 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6313339A (ja) * | 1986-07-04 | 1988-01-20 | Hitachi Ltd | 異物有無検査装置 |
US20050003635A1 (en) * | 2002-03-04 | 2005-01-06 | Kiyoshi Takekoshi | Dicing method, method of inspecting integrated circuit element, substrate holding device, and pressure sensitive adhesive film |
WO2011004825A1 (ja) * | 2009-07-08 | 2011-01-13 | 古河電気工業株式会社 | ウエハ貼着用粘着シートおよびそれを用いたウエハの加工方法 |
JP2015169589A (ja) * | 2014-03-10 | 2015-09-28 | 新日本無線株式会社 | 半導体試験装置 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5697884A (en) * | 1980-01-07 | 1981-08-06 | Mitsubishi Electric Corp | Testing method for damp resistance of electronic parts |
JPH02235355A (ja) * | 1989-03-08 | 1990-09-18 | Nec Kansai Ltd | 半導体製造装置及び製造方法 |
JPH10163281A (ja) | 1996-10-04 | 1998-06-19 | Hitachi Ltd | 半導体素子およびその製造方法 |
JP2000180469A (ja) | 1998-12-18 | 2000-06-30 | Fujitsu Ltd | 半導体装置用コンタクタ及び半導体装置用コンタクタを用いた試験装置及び半導体装置用コンタクタを用いた試験方法及び半導体装置用コンタクタのクリーニング方法 |
US6445202B1 (en) | 1999-06-30 | 2002-09-03 | Cascade Microtech, Inc. | Probe station thermal chuck with shielding for capacitive current |
US6541989B1 (en) * | 2000-09-29 | 2003-04-01 | Motorola, Inc. | Testing device for semiconductor components and a method of using the device |
JP2003303919A (ja) * | 2002-04-10 | 2003-10-24 | Hitachi Ltd | 半導体装置及びその製造方法 |
US20050224978A1 (en) | 2002-06-24 | 2005-10-13 | Kohichiro Kawate | Heat curable adhesive composition, article, semiconductor apparatus and method |
DE60315650T2 (de) | 2002-06-24 | 2008-06-05 | 3M Innovative Properties Co., St. Paul | Wärmehärtbare klebstoffzusammensetzung, gegenstand, halbleitervorrichtung und verfahren |
SG116533A1 (en) * | 2003-03-26 | 2005-11-28 | Toshiba Kk | Semiconductor manufacturing apparatus and method of manufacturing semiconductor device. |
TWI402325B (zh) | 2005-05-12 | 2013-07-21 | Nitto Denko Corp | 切割用黏著片以及使用此黏著片的切割方法 |
JP5054949B2 (ja) | 2006-09-06 | 2012-10-24 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
CN102472790B (zh) | 2009-08-02 | 2015-01-28 | Qmc株式会社 | 拾取设备以及具有该拾取设备的发光二极管芯片分选设备 |
JP2012241063A (ja) | 2011-05-17 | 2012-12-10 | Nitto Denko Corp | 半導体装置製造用の接着シート |
JP6159163B2 (ja) | 2013-06-21 | 2017-07-05 | 日東電工株式会社 | 粘着シート |
JP2016210626A (ja) | 2013-10-18 | 2016-12-15 | 旭硝子株式会社 | 真空複層ガラスの製造方法 |
JP6482818B2 (ja) * | 2013-10-23 | 2019-03-13 | リンテック株式会社 | ダイシングシート |
KR102444374B1 (ko) | 2015-02-06 | 2022-09-16 | 에이지씨 가부시키가이샤 | 필름, 그 제조 방법 및 그 필름을 사용한 반도체 소자의 제조 방법 |
JP6587811B2 (ja) * | 2015-02-24 | 2019-10-09 | 日東電工株式会社 | 熱剥離型粘着シート |
-
2017
- 2017-10-24 SG SG11201903701SA patent/SG11201903701SA/en unknown
- 2017-10-24 WO PCT/JP2017/038366 patent/WO2018079552A1/ja unknown
- 2017-10-24 EP EP17866122.9A patent/EP3533852A4/en active Pending
- 2017-10-24 JP JP2018547689A patent/JP6726296B2/ja active Active
- 2017-10-24 KR KR1020197011795A patent/KR102243345B1/ko active IP Right Grant
- 2017-10-24 US US16/344,900 patent/US11047900B2/en active Active
- 2017-10-24 CN CN201780066329.XA patent/CN109891253A/zh active Pending
- 2017-10-26 TW TW106136860A patent/TWI745464B/zh active
-
2021
- 2021-02-18 US US17/178,905 patent/US11747388B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6313339A (ja) * | 1986-07-04 | 1988-01-20 | Hitachi Ltd | 異物有無検査装置 |
US20050003635A1 (en) * | 2002-03-04 | 2005-01-06 | Kiyoshi Takekoshi | Dicing method, method of inspecting integrated circuit element, substrate holding device, and pressure sensitive adhesive film |
WO2011004825A1 (ja) * | 2009-07-08 | 2011-01-13 | 古河電気工業株式会社 | ウエハ貼着用粘着シートおよびそれを用いたウエハの加工方法 |
JP2015169589A (ja) * | 2014-03-10 | 2015-09-28 | 新日本無線株式会社 | 半導体試験装置 |
Also Published As
Publication number | Publication date |
---|---|
TW201816984A (zh) | 2018-05-01 |
US20190285687A1 (en) | 2019-09-19 |
TWI745464B (zh) | 2021-11-11 |
WO2018079552A1 (ja) | 2018-05-03 |
US11747388B2 (en) | 2023-09-05 |
KR102243345B1 (ko) | 2021-04-21 |
US11047900B2 (en) | 2021-06-29 |
SG11201903701SA (en) | 2019-05-30 |
EP3533852A1 (en) | 2019-09-04 |
KR20190059935A (ko) | 2019-05-31 |
US20210172993A1 (en) | 2021-06-10 |
CN109891253A (zh) | 2019-06-14 |
JPWO2018079552A1 (ja) | 2019-10-03 |
JP6726296B2 (ja) | 2020-07-22 |
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Legal Events
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Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE |
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PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
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Extension state: BA ME |
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DAV | Request for validation of the european patent (deleted) | ||
DAX | Request for extension of the european patent (deleted) | ||
A4 | Supplementary search report drawn up and despatched |
Effective date: 20200515 |
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RIC1 | Information provided on ipc code assigned before grant |
Ipc: G01R 31/26 20200101ALI20200511BHEP Ipc: C09J 7/20 20180101AFI20200511BHEP |
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Free format text: STATUS: EXAMINATION IS IN PROGRESS |
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RIC1 | Information provided on ipc code assigned before grant |
Ipc: G01R 31/28 20060101AFI20221128BHEP |
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17Q | First examination report despatched |
Effective date: 20221219 |