EP1973177A3 - Film ferroélectrique, son procédé de production, dispositif ferroélectrique et dispositif de décharge de liquide - Google Patents

Film ferroélectrique, son procédé de production, dispositif ferroélectrique et dispositif de décharge de liquide Download PDF

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Publication number
EP1973177A3
EP1973177A3 EP08005206A EP08005206A EP1973177A3 EP 1973177 A3 EP1973177 A3 EP 1973177A3 EP 08005206 A EP08005206 A EP 08005206A EP 08005206 A EP08005206 A EP 08005206A EP 1973177 A3 EP1973177 A3 EP 1973177A3
Authority
EP
European Patent Office
Prior art keywords
ferroelectric
producing
same
liquid discharge
ferroelectric film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP08005206A
Other languages
German (de)
English (en)
Other versions
EP1973177B8 (fr
EP1973177B1 (fr
EP1973177A2 (fr
Inventor
Takami Arakawa
Takamichi Fujii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007229788A external-priority patent/JP2008266771A/ja
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of EP1973177A2 publication Critical patent/EP1973177A2/fr
Publication of EP1973177A3 publication Critical patent/EP1973177A3/fr
Application granted granted Critical
Publication of EP1973177B1 publication Critical patent/EP1973177B1/fr
Publication of EP1973177B8 publication Critical patent/EP1973177B8/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/14Structure thereof only for on-demand ink jet heads
    • B41J2/14201Structure of print heads with piezoelectric elements
    • B41J2/14233Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1607Production of print heads with piezoelectric elements
    • B41J2/161Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/164Manufacturing processes thin film formation
    • B41J2/1646Manufacturing processes thin film formation thin film formation by sputtering
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/48Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zirconium or hafnium oxides, zirconates, zircon or hafnates
    • C04B35/49Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zirconium or hafnium oxides, zirconates, zircon or hafnates containing also titanium oxides or titanates
    • C04B35/491Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zirconium or hafnium oxides, zirconates, zircon or hafnates containing also titanium oxides or titanates based on lead zirconates and lead titanates, e.g. PZT
    • C04B35/493Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zirconium or hafnium oxides, zirconates, zircon or hafnates containing also titanium oxides or titanates based on lead zirconates and lead titanates, e.g. PZT containing also other lead compounds
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08Oxides
    • C23C14/088Oxides of the type ABO3 with A representing alkali, alkaline earth metal or Pb and B representing a refractory or rare earth metal
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/07Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/074Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
    • H10N30/076Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by vapour phase deposition
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/704Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • H10N30/85Piezoelectric or electrostrictive active materials
    • H10N30/853Ceramic compositions
    • H10N30/8548Lead-based oxides
    • H10N30/8554Lead-zirconium titanate [PZT] based
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01Embodiments of or processes related to ink-jet heads
    • B41J2202/03Specific materials used
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01Embodiments of or processes related to ink-jet heads
    • B41J2202/21Line printing
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3231Refractory metal oxides, their mixed metal oxides, or oxide-forming salts thereof
    • C04B2235/3251Niobium oxides, niobates, tantalum oxides, tantalates, or oxide-forming salts thereof
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/74Physical characteristics
    • C04B2235/76Crystal structural characteristics, e.g. symmetry
    • C04B2235/767Hexagonal symmetry, e.g. beta-Si3N4, beta-Sialon, alpha-SiC or hexa-ferrites

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Composite Materials (AREA)
  • Structural Engineering (AREA)
  • Semiconductor Memories (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Inorganic Insulating Materials (AREA)
EP08005206.1A 2007-03-22 2008-03-19 Film ferroélectrique, son procédé de production, dispositif ferroélectrique et dispositif de décharge de liquide Active EP1973177B8 (fr)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2007074026 2007-03-22
JP2007229788A JP2008266771A (ja) 2007-03-22 2007-09-05 強誘電体膜とその製造方法、強誘電体素子、及び液体吐出装置
JP2007229789A JP4808689B2 (ja) 2007-03-22 2007-09-05 強誘電体膜とその製造方法、強誘電体素子、及び液体吐出装置
JP2007229786A JP5367242B2 (ja) 2007-03-22 2007-09-05 強誘電体膜とその製造方法、強誘電体素子、及び液体吐出装置
JP2007229787A JP2008266770A (ja) 2007-03-22 2007-09-05 強誘電体膜とその製造方法、強誘電体素子、及び液体吐出装置

Publications (4)

Publication Number Publication Date
EP1973177A2 EP1973177A2 (fr) 2008-09-24
EP1973177A3 true EP1973177A3 (fr) 2012-07-04
EP1973177B1 EP1973177B1 (fr) 2014-10-01
EP1973177B8 EP1973177B8 (fr) 2015-01-21

Family

ID=39774253

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08005206.1A Active EP1973177B8 (fr) 2007-03-22 2008-03-19 Film ferroélectrique, son procédé de production, dispositif ferroélectrique et dispositif de décharge de liquide

Country Status (2)

Country Link
US (1) US8100513B2 (fr)
EP (1) EP1973177B8 (fr)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4993294B2 (ja) * 2007-09-05 2012-08-08 富士フイルム株式会社 ペロブスカイト型酸化物、強誘電体膜とその製造方法、強誘電体素子、及び液体吐出装置
JP4505492B2 (ja) * 2007-11-06 2010-07-21 富士フイルム株式会社 ペロブスカイト型酸化物、強誘電体膜、強誘電体素子、及び液体吐出装置
JP5290610B2 (ja) * 2008-04-09 2013-09-18 富士フイルム株式会社 圧電膜の成膜方法
JP4438892B1 (ja) * 2009-02-03 2010-03-24 富士フイルム株式会社 圧電体とその製造方法、圧電素子、及び液体吐出装置
JP4438893B1 (ja) * 2009-02-04 2010-03-24 富士フイルム株式会社 圧電体とその製造方法、圧電素子、及び液体吐出装置
JP5592104B2 (ja) * 2009-02-17 2014-09-17 富士フイルム株式会社 圧電体膜並びにそれを備えた圧電素子及び液体吐出装置
US8557088B2 (en) * 2009-02-19 2013-10-15 Fujifilm Corporation Physical vapor deposition with phase shift
US8540851B2 (en) * 2009-02-19 2013-09-24 Fujifilm Corporation Physical vapor deposition with impedance matching network
US8164234B2 (en) 2009-02-26 2012-04-24 Fujifilm Corporation Sputtered piezoelectric material
JP5506031B2 (ja) * 2009-12-28 2014-05-28 富士フイルム株式会社 アクチュエータ素子の駆動方法、及びデバイス検査方法
JP5555072B2 (ja) 2010-06-25 2014-07-23 富士フイルム株式会社 圧電体膜、圧電素子および液体吐出装置
WO2012133529A1 (fr) * 2011-03-30 2012-10-04 日本碍子株式会社 Procédé de fabrication d'un substrat piézoélectrique
JP6036460B2 (ja) * 2013-03-26 2016-11-30 三菱マテリアル株式会社 PNbZT強誘電体薄膜の形成方法
US10369787B2 (en) 2015-05-25 2019-08-06 Konica Minolta, Inc. Piezoelectric thin film, piezoelectric actuator, inkjet head, inkjet printer, and method for manufacturing piezoelectric actuator
JP6661771B2 (ja) 2016-07-28 2020-03-11 富士フイルム株式会社 圧電体膜、圧電素子および圧電体膜の製造方法
CN109983592B (zh) 2016-12-12 2023-05-12 松下知识产权经营株式会社 压电功能膜、致动器以及喷墨头
US10615330B1 (en) 2017-02-16 2020-04-07 Panasonic Intellectual Property Management Co., Ltd. Piezoelectric element, actuator, and liquid droplet ejection head
KR20210138997A (ko) * 2020-05-13 2021-11-22 삼성전자주식회사 커패시터, 커패시터 제어 방법, 및 이를 포함하는 트랜지스터

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EP1557481A2 (fr) * 2004-01-20 2005-07-27 Seiko Epson Corporation Couche ferroélectrique, mémoire ferroélectrique et élément piézoélectrique
EP1760768A1 (fr) * 2005-08-30 2007-03-07 Seiko Epson Corporation Matériau isolant pour cible de pulvérisation, procédé de fabrication de celui-ci, une couche d'oxyde complexe et dispositif
EP1905866A1 (fr) * 2006-09-28 2008-04-02 Fujifilm Corporation Processus de formation d'un film, film piézoélectrique, dispositif piézoélectrique, et appareil de décharge de liquide
EP1905867A1 (fr) * 2006-09-28 2008-04-02 Fujifilm Corporation Procédé de formation d'un film, film piézoélectrique, et dispositif piézoélectrique

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JP4752156B2 (ja) 2001-08-23 2011-08-17 株式会社村田製作所 積層圧電素子用圧電磁器組成物、積層圧電素子、積層圧電素子の製造方法および積層圧電装置
JP2005101512A (ja) 2002-10-24 2005-04-14 Seiko Epson Corp 強誘電体膜、強誘電体メモリ、圧電素子、半導体素子、液体噴射ヘッド、プリンタ及び強誘電体膜の製造方法
JP3791614B2 (ja) 2002-10-24 2006-06-28 セイコーエプソン株式会社 強誘電体膜、強誘電体メモリ装置、圧電素子、半導体素子、圧電アクチュエータ、液体噴射ヘッド及びプリンタ
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EP1557481A2 (fr) * 2004-01-20 2005-07-27 Seiko Epson Corporation Couche ferroélectrique, mémoire ferroélectrique et élément piézoélectrique
EP1760768A1 (fr) * 2005-08-30 2007-03-07 Seiko Epson Corporation Matériau isolant pour cible de pulvérisation, procédé de fabrication de celui-ci, une couche d'oxyde complexe et dispositif
EP1905866A1 (fr) * 2006-09-28 2008-04-02 Fujifilm Corporation Processus de formation d'un film, film piézoélectrique, dispositif piézoélectrique, et appareil de décharge de liquide
EP1905867A1 (fr) * 2006-09-28 2008-04-02 Fujifilm Corporation Procédé de formation d'un film, film piézoélectrique, et dispositif piézoélectrique

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Also Published As

Publication number Publication date
US20080231667A1 (en) 2008-09-25
US8100513B2 (en) 2012-01-24
EP1973177B8 (fr) 2015-01-21
EP1973177B1 (fr) 2014-10-01
EP1973177A2 (fr) 2008-09-24

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