EP1867003B1 - Coupleur haute frequence ou diviseur de puissance, notamment coupleur haute frequence 3 db ou diviseur de puissance a bande etroite - Google Patents

Coupleur haute frequence ou diviseur de puissance, notamment coupleur haute frequence 3 db ou diviseur de puissance a bande etroite Download PDF

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Publication number
EP1867003B1
EP1867003B1 EP06707501A EP06707501A EP1867003B1 EP 1867003 B1 EP1867003 B1 EP 1867003B1 EP 06707501 A EP06707501 A EP 06707501A EP 06707501 A EP06707501 A EP 06707501A EP 1867003 B1 EP1867003 B1 EP 1867003B1
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EP
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Prior art keywords
coupling
coupler
coupling zone
power splitter
substrate
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EP06707501A
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German (de)
English (en)
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EP1867003B9 (fr
EP1867003A1 (fr
Inventor
Franz Rottmoser
Joachim Herold
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Kathrein SE
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Kathrein Werke KG
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/12—Coupling devices having more than two ports
    • H01P5/16—Conjugate devices, i.e. devices having at least one port decoupled from one other port
    • H01P5/18—Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers
    • H01P5/184—Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers the guides being strip lines or microstrips
    • H01P5/187—Broadside coupled lines

Definitions

  • the invention relates to an RF coupler or RF power divider, in particular narrow-band RF coupler or RF power divider according to the preamble of claim 1, known from the US 2005/0017821 A1 ,
  • Ring couplers are often used for this purpose.
  • Such ring couplers are for example from prong Brunswig " High Frequency Technology ", Springer-Verlag, 6th edition, 2000 known, from page 192.
  • ring couplers are often implemented in microstrip technology.
  • high-frequency couplers are also known in which the degree of coupling is generally set via front-end or longitudinally coupled lines. For higher coupling levels, as necessary for a power divider, these distances are often very low or even too low to be economically manufactured.
  • a directional coupler for example is constructed in suspended substrate technology.
  • a coupling path in stripline technology is provided on a substrate on one side, which are connected to two also in stripline technology formed first and second terminals on the substrate in combination.
  • a second coupling path is arranged, which lead to a third and fourth output or connection.
  • the two coupling paths are arranged at least partially overlapping.
  • EP 1 291 959 A1 can also be connected at the two opposite ends of the two coupling paths also each capacitors, the second connection point is in each case to ground.
  • the coupler is constructed in Koplanartechnik.
  • the two coupling lines are each arranged with their two connection points on a common side of the substrate, wherein the coupling paths extend in the smallest possible distance parallel to each other.
  • a directional coupler has become known, which in turn is also constructed in suspended substrate technology. It is in this prior art directional coupler to a broadband directional coupler with at least two coupled in cascade coupling sections of different coupling loss, in which the coupling sections with loose coupling of frontally coupled strip conductors and the Coupling sections with fixed coupling consist of broadside coupled strip conductors.
  • couplers known from the prior art are often designed in microstrip technology. Due to the relatively high attenuation of the microstrip line and their sensitivity to variations in the dielectric constant, the disadvantages of these couplers are the high space requirements and the relatively large electrical losses and the high cost of high-quality printed circuit board material.
  • the main disadvantages of the directional coupler in coplanar technology are ultimately in the required minimum distances between the longitudinally coupled interconnects and the extent also limited coupling factor. Furthermore, the coupling factor is highly tolerance-dependent (etching tolerances and variations in the dielectric constants of the substrate material exert an adverse influence). Furthermore, a coplanar coupler is not optimal in terms of electrical losses.
  • a high-frequency coupler or power divider which comprises on a substrate on one side two formed coupling links. Both coupling lines are provided at the beginning and at the end with connecting conductors, which lead to staggered terminals. In addition, capacitors for coupling both coupling paths are provided and formed between the two coupling paths.
  • this directional coupler is formed on a substrate so that the one coupling path on one side of the substrate and the coupled therewith second coupling path is formed on the opposite side of the substrate.
  • a through connection through the substrate is provided in each case on one side of the coupling path in order to produce an electrical-galvanic connection of a connecting line to an opposite coupling surface.
  • a microwave coupler which also has four ports and two coupling links, between the two coupling links - which are kept relatively short - from the beginning to the end capacitors are provided for coupling between the coupling links.
  • a disadvantage of all types of couplers mentioned above is that, in particular when used for a modern telecommunications system, they do not have the requisite required properties of a high-frequency coupler, for example with sufficient coupling factor, sufficient directivity or symmetry or can not be realized or only with considerable development effort.
  • a generic coupler or power divider is from the US 2005/0017821 A1 known.
  • two first connecting lines are provided, which lead to a beginning and to an end of a first coupling path.
  • a second, coupled to the first coupling path coupling path is provided, leading to the beginning and the end of two further connection lines.
  • the aforementioned two coupling paths are formed on the substrate on two opposite sides, wherein the entire arrangement rests with the lower coupling path on a lower substrate.
  • a further coupler is known to be known, for example, includes grounded interdigital capacitors, which serve to improve the electrical property.
  • the RF coupler or power divider according to the invention has a number of positive advantages that offset conventional solutions.
  • the high-frequency coupler according to the invention has a narrowband design.
  • the coupler according to the invention or power divider has at the respective opposite end or connection areas to the respective coupling path capacitors, as in principle also from the EP 1 291 959 A1 are known. In deviation, however, are not discrete Reactants or capacitors used, but so-called interdigital capacitors. Although reveals the US 2004/0113717 A1 a coupler with grounded interdigital capacitors, but here a second substrate is provided without vias.
  • a power divider or coupler is realized with very little space, the electrical parameters are relatively freely adjustable or preselected within wide limits. Above all, it has low electrical losses.
  • the power divider or coupler according to the invention is also characterized by its high directivity. Above all, the fact that the coupler or power divider according to the invention - which is usually installed in a housing - also in the region of the lower coupling path a distance from the housing, i. has a housing wall, in this case no fixed dielectric is provided immediately adjacent, can be realized and achieve a lower ⁇ , which has a positive impact on the electrical properties of the coupler or power divider reflected. As a result, the coupler or power divider according to the invention has further advantages over the generic state of the art.
  • the coupler or power divider according to the invention is also comparatively robust with respect to housing tolerances. This is especially evident in the choice of different cover distances. This robustness to housing tolerances also opens the possibility to reuse individual designs in other applications.
  • the coupler according to the invention is also comparatively robust to etching tolerances as well as to fluctuations in the Dielectric constant of the substrate material. Furthermore, basically no further wiring or concentrated components are necessary, although they could basically be used if necessary. Finally, all leads are provided on the same side of the substrate side, which is to be regarded as advantageous.
  • FIG. 1 the plan view of a first embodiment of a coupler according to the invention or power divider 1 is shown, which is constructed on a substrate 3 in the form of a printed circuit board.
  • FIG. 1 Visible top surface 3a of the substrate four surface regions 5 visible, which are electrically-electrically isolated from recesses 7 from each other.
  • This surface area 5 is a ground area 5.
  • a first coupling path 9 is formed in stripline technique, which extends in a first direction or longitudinal direction on the substrate 3.
  • a first and second connection line 13a and 13b is provided transversely, which lead to connections 15a and 15b on the one substrate edge 3 '.
  • the non-conductive recessed area 7 is in plan view in the embodiment according to FIG. 1 H-shaped. In the immediate extension of the connecting line 13a and 13b but separated from these, two more connecting lines 17a and 17b are seen, leading to the opposite substrate edge 3 "and there form connections 19a and 19b.
  • connection lines 17a, 17b which are opposite to the connections 19a and 19b, these are provided adjacent to the first coupling path 9 with plated-through holes 21, which extend through bores 21 'through the substrate 3.
  • a second coupling path 25 is provided on the reproduced there underside 3b, which runs parallel to the first coupling path 9 and in plan view itself preferably with this completely or at least partially overlapped.
  • the length and / or width of both coupling paths is at least approximately the same in the embodiment shown.
  • the second connection lines 17a and 17b are electrically-galvanically connected to the second coupling path 25 via the aforementioned two plated-through holes.
  • the length of the coupling lines corresponds to approximately ⁇ / 4.
  • the four supply or connecting lines 13a, 13b and 17a, 17b are implemented in coplanar conductor technology and connect the coupler 1 with further in the present embodiment, not shown in detail high-frequency modules.
  • capacitors C are also provided in the illustrated embodiment, which in each case in the input and output area, ie at the beginning 11a and at the end 12b of the first coupling path 9 or at the beginning 11'a and at the end of the 12th 'b the second coupling path 25 are located.
  • the capacitors C-9a and C-9b are arranged at one end and the corresponding capacitors C-9c and C-9d at the other end of the first coupling path 9.
  • Corresponding capacitors are also provided at the beginning and end of the second coupling path 25, namely the capacitors C-25a and C-25b and at the opposite end of the coupling path 25, the capacitors C-25c and C-25d.
  • FIGS. 1 and 2 it is also apparent that in the illustrated embodiment, preferably in the middle region, ie halfway along the respective coupling path 9 or 25 is still provided in each case a further capacitor pair C, which in the embodiment shown as C-9e and C-9f as well C-25e and C-25f.
  • each capacitor surface or half is conductively connected to the respective coupling path 9 or 25 and the respective electrically-galvanically separated capacitor surface or half interacting therewith has the associated ground surface.
  • the substrate 3 is provided with a circumferentially closed ground surface 31, in the central region of a non-conductive recess 36 is provided within which the longitudinal direction of the second coupling path 2 thereof is galvanically separated.
  • the dimensioning of the interdigital capacitors can be carried out in such a way that specific coupling properties are set or preselected.
  • the aforementioned ground planes are necessary in order to ensure defined mass ratios on the one hand and to form a ground potential for the interdigital capacitors on the other hand.
  • the actual coupling takes place through the formed on the two sides of the substrate 3 lines 9 and 25 (suspended substrate).
  • a recess 37 is formed in a housing 29 below the coupling region, ie a distance 37 to a corresponding housing wall 29 is provided.
  • the extent of the depression that is the degree of the distance between the substrate and the housing or the housing wall 29 and the distance between the substrate and the associated lid 41 can be freely selected within certain limits.
  • the capacitors provided preferably in the middle in the coupling paths may also be provided, starting from the center, between the capacitors provided at the beginning and at the end of the respective coupling path. If appropriate, additional capacitors may also be provided between the capacitors provided at the beginning and at the end region of the respective coupling path, that is, more than in the exemplary embodiments shown.
  • the input and output capacitors C-9a, C-9b and C-9c, C-9d and on the opposite Side the capacitors C-25a, C-25b or C-25c, C-25d are also more offset to the center.
  • the distance from the beginning and end regions may well be up to 30% of the total length of the coupling path, but preferably less, in particular less as 25%, 20%, 15% and 10% of the total length of the coupling path. It should be noted that the positioning of the capacitors at the beginning and at the end of the coupler have the greatest effect.
  • FIGS. 4 and 5 corresponds largely to that after the FIGS. 1 to 3 ,
  • the lying on one side of the substrate coupling path 9 is not provided with two leading to the same edge boundary 3 'of the substrate connection lines, but the in FIG. 4 right lying connection line 15b, which is electrically-galvanically connected to the coupling path 9, leads to the opposite side 3 "of the substrate to the connection 17b formed there FIG. 4 top right connection line 17 b provided with a through-connection 21, so that the in FIG. 4 top right terminal 19b with the in FIG. 4 bottom left terminal 19a is electrically-galvanically connected.
  • the ground areas have recesses 7 on both sides of the substrate in the area of the connection lines as well as the coupling sections 9 and 25.
  • the distance between the coupler paths 9 and 25 and the ground planes is preferably 1.5 to 4 times the width of the line.
  • the distance of the connection lines to the adjacent ground planes is approximately 1.5 to 4 times the width of these connecting lines.
  • both coupling lines 9, 25 should either lie one above the other or have a lateral offset, which is preferably smaller than the width of the coupling line.
  • the coupling lines are not adjacent to each other in plan view, but overlap.
  • the lateral offset is greater than half the width of the coupling conductor track 9 or 25, so that cover both lines at preferably the same width to fifty percent.
  • the coverage should preferably be more than 0%, in particular more than 10%, more than 20%, more than 30% and preferably more than 50%, in particular based on the width of the coupling tracks 9 and 25.
  • connection lines 13a, 13b and 17a, 17b are formed in coplanar technology.
  • the two coupling paths 9 and 25 are formed in suspended substrate technology.

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  • Waveguides (AREA)
  • Microwave Amplifiers (AREA)
  • Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Claims (15)

  1. Coupleur HF ou diviseur de puissance HF, présentant les éléments suivants :
    - il est prévu un substrat (3),
    - sur le substrat (3) sont prévues deux premières lignes de connexion (13a, 13b) qui mènent à un début (11a) et à une fin (11b) d'un premier trajet de couplage (9),
    - il est prévu un second trajet de couplage (25) couplé avec le premier trajet de couplage (9), au début (27a) et à la fin (27b) duquel mènent deux autres lignes de connexion (17a, 17b),
    - les quatre lignes de connexion (13a, 13b ; 17a, 17b) mènent en éloignement du trajet de couplage respectif vers des bornes (15a, 15b ; 19a, 19b) décalées les unes des autres,
    - les quatre lignes de connexion (13a, 13b ; 17a, 17b) sont agencées sur le même côté (3a) du substrat (3),
    - les deux trajets de couplage (9 ; 25) sont réalisés sur le substrat sur deux côtés opposés (3a, 3b),
    - les deux lignes de connexion (13a, 13b) sont reliées par voie électrique-galvanique au premier trajet de couplage (9) en étant agencées sur le même côté (3a) du substrat (3) que le premier trajet de couplage (9),
    - le second trajet de couplage (25) est relié par voie électrique-galvanique, à son début et à sa fin (27a, 27b), via au moins un trou métallisé (21), aux autres lignes de connexion associées (17a, 17b) qui se trouvent sur le côté (3a) du substrat (3) opposé au second trajet de couplage (25),
    caractérisé par les autres éléments suivants :
    - au-dessous de la zone de couplage du second trajet de couplage (25) est prévu un renfoncement dans une paroi de boîtier (29),
    - en direction longitudinale des deux trajets de couplage (9 ; 25) sont prévus des condensateurs interdigités (C) qui sont couplés chacun entre un trajet de couplage et la masse.
  2. Coupleur ou diviseur de puissance, en particulier coupleur HF ou diviseur de puissance HF ou coupleur selon la revendication 1, caractérisé en ce qu'il est prévu au moins un autre condensateur interdigité (C-9e, C-9f ; C-25e, C-25f) entre la zone initiale et la zone finale (11a, 11b ; 18a, 18b).
  3. Coupleur ou diviseur de puissance selon la revendication 2, caractérisé en ce que d'autres condensateurs (C-9e, C-9f ; C-25e, C-25f) sont agencés dans la zone médiane du trajet de couplage respectif (9, 25).
  4. Coupleur ou diviseur de puissance selon l'une des revendications 1 à 3, caractérisé en ce que l'un des trajets de couplage (9) avec les lignes de connexion associées (13a, 13b) est agencé, en vue de dessus, de telle sorte que les lignes de connexion (13a, 13b) mènent vers le même bord de substrat (3') par rapport au trajet de couplage (9) et forment de préférence au moins approximativement un tracé de ligne en forme de U, en vue de dessus.
  5. Coupleur ou diviseur de puissance selon l'une des revendications 1 à 4, caractérisé en ce que la ligne de connexion (17a, 17b) reliée par voie électrique-galvanique au second trajet de couplage (25) via le trou métallisé (21) est agencée, en vue de dessus, de telle sorte que les lignes de connexion (17a, 17b) mènent au même bord de substrat (3") par rapport au trajet de couplage (25) et forment de préférence un tracé de ligne approximativement en forme de U, en vue de dessus.
  6. Coupleur ou diviseur de puissance selon la revendication 4 ou 5, caractérisé en ce que la ligne de connexion (13a, 13b) reliée à l'un des trajets de couplage (9) mène à l'un des bords de substrat (3'), tandis que la ligne de connexion (17a, 17b) reliée par voie électrique-galvanique au second trajet de couplage (25) mène au bord de substrat opposé (3").
  7. Coupleur ou diviseur de puissance selon l'une des revendications 1 à 3, caractérisé en ce que l'un des trajets de couplage (9) avec les lignes de connexion associées (13a, 13b) est agencé de telle sorte que, en vue de dessus, l'une des lignes de connexion (13a), par rapport au trajet de couplage (9), mène au moins par une composante dans une direction en éloignement du trajet de couplage (9) de préférence vers un bord de substrat (3'), tandis que la seconde ligne de connexion (13b) mène avec une composante dirigée en sens opposé en éloignement du trajet de couplage (9), de préférence vers le bord de substrat opposé (3").
  8. Coupleur ou diviseur de puissance selon la revendication 6 ou 7, caractérisé en ce que les deux lignes de connexion (13a, 13b) reliées au trajet de couplage (9) au début (11a) et à la fin (11b) mènent par une composante opposée de préférence en sens opposés en éloignement du trajet de couplage (9), de sorte qu'il se forme de préférence au moins approximativement un tracé de ligne en forme de Z, en vue de dessus.
  9. Coupleur ou diviseur de puissance selon l'une des revendications 6 à 8, caractérisé en ce que les lignes de connexion (17a, 17b) reliées par voie électrique-galvanique au trajet de couplage opposé (25) par le trou métallisé (21) mènent également avec une composante opposée et de préférence en sens opposés en éloignement du trajet de couplage (25), au début (27a) et à la fin (27b) de ce trajet de couplage (25), de sorte qu'il se forme de préférence au moins approximativement un tracé de ligne en forme de Z, en vue de dessus.
  10. Coupleur ou diviseur de puissance selon l'une des revendications 1 à 9, caractérisé en ce que dans la zone du trajet de couplage (9, 25) et/ou dans la zone des lignes de connexion (13a, 13b ; 17a, 17b), les surfaces de masse (5, 31) réalisées sur le côté supérieur ou inférieur du substrat (3) présentent des évidements (7) dans lesquels sont agencés les lignes de connexion (13a, 13b ; 17a, 17b) ainsi que les trajets de couplage (9, 25).
  11. Coupleur ou diviseur de puissance selon la revendication 10, caractérisé en ce que la distance entre les trajets de couplage (9, 25) et/ou les lignes de connexion (13a, 13b ; 17a, 17b) et les surfaces de masse (5, 31) est 1,5 à 4 fois la largeur du trajet de couplage (9, 25) ou la largeur des lignes de connexion (13a, 13b ; 17a, 17b).
  12. Coupleur ou diviseur de puissance selon l'une des revendications 1 à 11, caractérisé en ce que les trajets de couplage (9, 25) se chevauchent en vue de dessus perpendiculairement à la surface du substrat (3), et la zone de chevauchement est d'au moins 10 %, de préférence de plus de 40 % ou en particulier de plus de 70 % par rapport à la largeur des deux trajets de couplage (9, 25).
  13. Coupleur ou diviseur de puissance selon l'une des revendications 1 à 12, caractérisé en ce que les quatre lignes de connexion (13a, 13b ; 17a, 17b) sont réalisées en technique coplanaire.
  14. Coupleur ou diviseur de puissance selon l'une des revendications 1 à 13, caractérisé en ce que les deux trajets de couplage (9, 25) sont réalisés en technique dite "suspended substrat" (à substrat suspendu).
  15. Coupleur ou diviseur de puissance selon l'une des revendications 1 à 14, caractérisé en ce que la distance (37) ou le renfoncement (37) est prévu(e) au-dessous de la zone de couplage du second trajet de couplage (25) dans un boîtier (29).
EP06707501A 2005-04-07 2006-03-09 Coupleur haute frequence ou diviseur de puissance, notamment coupleur haute frequence 3 db ou diviseur de puissance a bande etroite Active EP1867003B9 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102005016054A DE102005016054A1 (de) 2005-04-07 2005-04-07 Hochfrequenzkoppler oder Leistungsteiler, insbesondere schmalbandiger und/oder 3dB-Koppler oder Leistungsteiler
PCT/EP2006/002189 WO2006105847A1 (fr) 2005-04-07 2006-03-09 Coupleur haute frequence ou diviseur de puissance, notamment coupleur haute frequence 3 db ou diviseur de puissance a bande etroite

Publications (3)

Publication Number Publication Date
EP1867003A1 EP1867003A1 (fr) 2007-12-19
EP1867003B1 true EP1867003B1 (fr) 2008-09-24
EP1867003B9 EP1867003B9 (fr) 2009-08-26

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EP06707501A Active EP1867003B9 (fr) 2005-04-07 2006-03-09 Coupleur haute frequence ou diviseur de puissance, notamment coupleur haute frequence 3 db ou diviseur de puissance a bande etroite

Country Status (6)

Country Link
US (1) US20090051462A1 (fr)
EP (1) EP1867003B9 (fr)
CN (1) CN101213705B (fr)
AT (1) ATE409360T1 (fr)
DE (2) DE102005016054A1 (fr)
WO (1) WO2006105847A1 (fr)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015139813A1 (fr) 2014-03-20 2015-09-24 Kathrein-Werke Kg Coupleur directionnel à large bande multi-étages

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ATE409360T1 (de) 2008-10-15
DE102005016054A1 (de) 2006-10-12
WO2006105847A1 (fr) 2006-10-12
CN101213705A (zh) 2008-07-02
EP1867003B9 (fr) 2009-08-26
CN101213705B (zh) 2010-07-21
EP1867003A1 (fr) 2007-12-19
DE502006001639D1 (de) 2008-11-06
US20090051462A1 (en) 2009-02-26

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