EP0916028A1 - Ensemble clapet - Google Patents

Ensemble clapet

Info

Publication number
EP0916028A1
EP0916028A1 EP97938868A EP97938868A EP0916028A1 EP 0916028 A1 EP0916028 A1 EP 0916028A1 EP 97938868 A EP97938868 A EP 97938868A EP 97938868 A EP97938868 A EP 97938868A EP 0916028 A1 EP0916028 A1 EP 0916028A1
Authority
EP
European Patent Office
Prior art keywords
wafer
valve arrangement
flaps
arrangement according
openings
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP97938868A
Other languages
German (de)
English (en)
Other versions
EP0916028B1 (fr
Inventor
Heinz-Werner Etzkorn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gaswarme-Institut Ev
Original Assignee
Gaswarme-Institut Ev
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gaswarme-Institut Ev filed Critical Gaswarme-Institut Ev
Publication of EP0916028A1 publication Critical patent/EP0916028A1/fr
Application granted granted Critical
Publication of EP0916028B1 publication Critical patent/EP0916028B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F15—FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
    • F15C—FLUID-CIRCUIT ELEMENTS PREDOMINANTLY USED FOR COMPUTING OR CONTROL PURPOSES
    • F15C5/00—Manufacture of fluid circuit elements; Manufacture of assemblages of such elements integrated circuits

Definitions

  • the invention relates to a valve arrangement for pressure and flow control of a fluid.
  • the preferred field of application of the invention is
  • valve arrangements of this type have a housing which contains a large number of individual parts, namely springs, membranes, valve elements and, if appropriate, further closure devices which may be driven by additional magnetic coils or the like.
  • the housing which is usually made of metal, is also penetrated by a large number of bores and channels of different diameters, some of which can be very fine bores.
  • the mechanical manufacture of such valve assemblies is very complex and accordingly expensive.
  • the energy content of the gas present under the supply pressure of generally 20-25 mbar is used to carry out the control in order to act on the diaphragm and return springs.
  • the usual valve arrangements therefore work with a corresponding pressure loss, which can easily amount to approximately 30%.
  • the invention has for its object to provide a structurally simple valve arrangement that works with very little pressure loss and allows dynamic control over a wide performance range.
  • valve arrangement of the type mentioned at the outset is characterized according to the invention in that
  • first silicon wafer with a plurality of etched through openings and a second silicon wafer with at least one etched through frame opening are provided, the frame opening being a multiple has a number of flaps produced by etching, which are connected in one piece to the second wafer via membrane-like webs,
  • each flap of the second wafer is assigned at least one of the through openings of the first wafer
  • control means which selectively effect the opening and closing movements of the flaps as a function of a control device.
  • This valve arrangement is extremely simple in construction and, in comparison with conventional "three-dimensional" valve arrangements, can certainly be referred to as "two-dimensional". They essentially consist of the two silicon wafers, which are subjected to a conventional anisotropic or isotropic etching process. This creates the through openings in the first wafer and the flaps in the second wafer, around which the fluid flows in their open position in which they expose the through openings. An extensive housing can be omitted. Rather, the arrangement can be installed directly in a supply line. Accordingly, there are very small sizes, which can also be used in small devices, for example in water heaters, grain brewing devices, heaters for small residential units and the like.
  • the power-dependent flow is controlled by selectively opening certain flaps of the second wafer and keeping others selectively closed. It was found that a modulating control is possible in this way, which ranges from a few percent to 100% covers. With conventional valve arrangements, the dynamic range has hitherto extended from approximately 60% to 100%.
  • Different numbers and / or sizes of through openings of the first wafer are preferably assigned to the individual flaps of the second wafer. This allows a maximum range of variation to be achieved.
  • the control ensures that the flow cross-section required in each case is made available by selecting certain numbers and / or sizes of through openings.
  • This advantage combined with the small size and the inexpensive manufacture, offers the possibility of providing a separate valve arrangement for each injector or burner segment. This enables modulating control to be achieved with optimum accuracy over a maximum range.
  • modules of passage openings and associated flaps can be controlled separately from one another in a modulating manner, so that one and the same wafer arrangement supplies several injectors or burners independently of one another.
  • the through-openings of the first wafer are tapered in the flow direction and that the associated flaps of the second wafer are provided in one piece with complementary locking projections.
  • This offers an additional control option in such a way that the passage cross section of the first wafer can be changed.
  • the etching of the tapered through openings and the complementary locking projections presents no difficulties, since the etching process can follow the crystal orientation of the silicon.
  • the flap thickness is greatly reduced compared to the thickness of the wafer.
  • the pretensioning of the membrane-like webs is particularly useful.
  • a pretension to increase the sealing effect can also be advantageous if the flaps of the second wafer rest on the surface of the first wafer anyway.
  • the two wafers are aligned exactly with one another and connected to one another by suitable adjustment, assembly and bonding techniques, if appropriate with the interposition of sealing materials.
  • the valve arrangement makes consistent use of micromachining technology.
  • the structure is filigree, and the passage cross-sections are extremely fine - with all possible variations. When used on gaseous media, in particular on fuel gases, this results in the requirement to work with gases that are as dust-free as possible. Since this is not always possible, it is proposed in a development of the invention that the second wafer has a third silicon wafer etched as a dust sieve on its side facing away from the first wafer.
  • the sieve openings can be very fine and still ensure the required passage cross section due to their large number. she offer effective protection for the downstream flaps and through-openings, the additional structural and cost-related expenditure being extremely low, since here too, the advantageous technology of micromachining is used consistently.
  • the control means are preferably provided for selectively effecting the opening and closing movements of the flaps between the first and second wafers and / or between the second and third wafers. If a third wafer is used, there is the possibility of switching between to support the first and the second wafer effective control means or to replace them entirely.
  • the control means for actuating the flaps can be of different types, always taking into account the fact that work is carried out in the field of micromechanics.
  • a thermally controlled bimetal actuation of the flaps is conceivable, for example.
  • electrical control is simpler, for example using the piezoelectric effect.
  • the control means exert capacitive or magnetic field-induced repulsive or attractive forces on the flaps. To do this, it is only necessary to provide the flaps and the adjacent wafer or wafers with opposite electrical conductors and to polarize them accordingly.
  • the arrangement is preferably such that the flaps assume their closed position when the electrical control means are de-energized. In the event of a power failure, the supply pressure, possibly supported by the pretensioning of the flap webs, automatically closes the entire valve arrangement.
  • At least one of the wafers can be provided with a coating of thermally expandable material in the region of the openings. If the valve arrangement overheats, the material of the coating swells and leads to an automatic sealing. block the openings. A separate thermal safety shut-off valve can therefore be omitted.
  • the material can cover the inner walls of the through openings of the first wafer. It can also be arranged around the through openings on one or both sides of the first wafer. Attachment to the sealing surfaces of the flaps is also an option. From a manufacturing point of view, the last two options mentioned are likely to be cheaper than coating the inner walls of the through openings. If the third wafer forming a dust sieve is used, it is particularly advantageous to coat it with the expandable material on one and / or the other side. The individual measures can also be combined with one another.
  • valve arrangement in a further development of the invention meets this requirement in that pressure load cells are etched into the first wafer, each of which is closed on the pressure side by a membrane which is integrally connected to the wafer.
  • a capillary channel is etched into the first wafer and covered except for an inflow-side inlet opening and an outflow-side outlet opening,
  • the capillary channel must have a predetermined length and is therefore meandered in the first wafer.
  • the inlet opening on the upstream side is closed and the outlet opening on the downstream side is opened.
  • the capillary channel In the capillary channel the atmospheric pressure.
  • the outflow-side outlet opening is closed and the upstream-side inlet opening is opened.
  • the gas now flows through the capillary channel at a speed that depends not only on the geometric conditions but also on the viscosity of the gas. The latter in turn is a measure of the upcoming gas quality. Since the gas quality can be recorded and included in the control system before each burner start, there is a further increase in the control quality.
  • the pressure sensor of the capillary channel as an etched pressure load cell, which is closed by a membrane which is connected in one piece to the first wafer.
  • Fig. L shows a section through a built-in valve assembly consisting of three wafers
  • Design features of the individual wafers are omitted; 2 shows a plan view of one of the wafers; 3 shows a detail from FIG. 2 in a modified embodiment;
  • FIG. 4 is a top view of another of the wafers; 5 shows a partial section through the valve arrangement; 6 shows a modified embodiment in a representation corresponding to FIG. 5. ⁇
  • a valve arrangement 1 consists of three wafers, namely a first wafer 2, a second wafer 3 and a third wafer 4.
  • the valve arrangement is installed in a fuel gas line 5, which in the present case leads to an injector burner .
  • the valve arrangement 1 allows a flow in the direction indicated by arrows.
  • the wafers 2 to 4 consist of silicon, their shape being produced by conventional etching.
  • the first wafer 2 has a plurality of through openings 6, which can be selectively opened and closed in a manner to be described in order to control the pressure and flow of the gas as a function of a control device, not shown.
  • the through openings 6 are shown as smooth openings of the same size, with a circular cross section. Their number is adapted to the respective circumstances.
  • Fig. 3 shows a modified embodiment in which the through opening 6 has a square cross section and is also tapered in the direction of flow. Smooth through openings with a square or rectangular cross-section are equally possible. It should also be noted that the through openings 6 can also be of different sizes.
  • FIG. 4 shows the second wafer 3, via which the opening and closing of the through openings 6 is effected.
  • Flaps 7, which have been produced by etching the second wafer 3, are provided as closing elements.
  • a frame opening 8 has formed in the second wafer 3, into which the flaps 7 protrude.
  • Each flap 7 is connected to the body of the wafer 3 via a membrane-like web 9.
  • the membrane-like webs 9 allow selective movement of the flaps 7.
  • Fig. 4 shows a section through the valve arrangement at the location of one of the flaps 7. It follows that the wafers 2 and 3 lie on one another, the flap 7 of the second wafer 3 closing the associated through-opening 6 of the first wafer 2. Electrical control means 10 open the flap 7.
  • the control means 10 are two conductor surfaces, one of which is assigned to the first wafer 2 and the other to the flap 7.
  • a corresponding polarity causes a capacitive repulsive force which brings the flap 7 into the open position while elastically deforming its web 9.
  • the flap 7 closes, the supply pressure of the fuel gas causing an additional closing force.
  • the arrangement works with very little pressure loss.
  • the third wafer 4 is provided with etched-in sieve openings 11 and thus forms an upstream dust sieve: which protects the downstream valve system against contamination. If the fuel gas is sufficiently dust-free, the third wafer 4 can also be dispensed with.
  • the third wafer 4 also fulfills an additional function in that it supports the opening movement of the flap 7.
  • a further set of control means 10 is provided, which are assigned to the third wafer 4 on the one hand and the flap 7 on the other hand.
  • the polarity is such that a capacitive attraction is brought about.
  • the action of force ceases as soon as the control means are switched off.
  • FIG. 5 shows that the through opening 6 is provided with a coating 12.
  • the latter consists of a thermally expandable material, especially a plastic, and serves as a thermal fuse. As soon as the temperature of the valve arrangement rises above a certain value, for example 650 ° C., the coating 12 expands and automatically closes the passage opening 6.
  • the arrangement of the coating 12 on the inner wall of the passage opening 6 was chosen as an example that can be represented in the drawing. For manufacturing reasons, it may be more advantageous to apply the coating in the area of the passage opening 6 on one and / or other surface of the wafer 2 or else on the sealing surface of the flap 7. A particularly simple possibility is to coat the third wafer 4 on one and / or the other side. A combination of the individual measures is also possible.
  • the through opening 6 is tapered conically in the flow direction.
  • the flap 7 is provided with a complementary locking projection 13. This offers the possibility of changing the cross section of the through opening 6 and thereby further increasing the variability of the dynamic control.
  • the silicon of the second wafer 3 is doped at the location of the web 9 in such a way that the flap 7 is preloaded accordingly.
  • the capillary channel 14 has an inflow-side inlet opening 15 and an outflow-side outlet opening 16, these openings being closable by flaps 7, see FIG
  • the inlet opening 15 can be subjected to the supply pressure, while the outlet opening 16 can be connected to the atmosphere.
  • the outlet opening 16 forms a pressure cell, which is provided with a membrane. The latter is formed by etching the first wafer 2.
  • the inlet opening 15 of the capillary channel 14 is closed and the outlet opening 16 is connected to the atmosphere, so that the atmospheric pressure is established within the capillary channel 14. Then the outlet opening 16 is closed and the inlet opening 15 is opened. The supply pressure then builds up in the capillary channel 14. The rise in pressure is detected at the pressure transducer assigned to the outlet opening 16 and provides information about the viscosity of the fuel gas and thus about its gas quality.
  • two further pressure transducers 17 and 18 are etched into the first wafer 2.
  • Both pressure transducers 17 and 18 have membranes made of silicon, which are formed in one piece with the wafer 2 during the etching.
  • the pressure cell 17 detects the supply pressure and the pressure cell 18 the working pressure, these values being included in the control. This increases their accuracy.
  • 2 and 4 show the assignment of a first set of through openings and flaps to an injector burner. Additional sets can be provided in order to control further injector burners or injectors of burner sets independently of one another.
  • the second wafer 3 can be placed on the first wafer 2 in the reverse orientation.
  • the web 9 of the flap 7 is then doped in such a way that the flap assumes its closed position, as is shown with reference to FIG. 6.
  • the control means 10 shown are capacitive control means. Instead of this, inductive control means can also be provided. Further there is the possibility to effect the opening and closing movements of the flaps piezoelectrically. Thermal control using a bimetal element is also conceivable.
  • the capillary channel 14 is provided on the output side with a pressure cell.
  • An anemometer can also be connected here in order to obtain information about the viscosity and thus the quality of the fuel gas via the resulting flow rate.
  • valve arrangement can also be used for other gases and also for liquids.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Mechanical Engineering (AREA)
  • Magnetically Actuated Valves (AREA)

Abstract

L'ensemble clapet comprend deux plaquettes de silicium superposées. La plaquette montée en aval présente une pluralité d'orifices de passage (6) gravés et la plaquette montée en amont (3) une pluralité de clapets (7). Ceux-ci sont formés par attaque du silicium et sont disposés dans des ouvertures (8) entourées d'un cadre. Ils sont reliés à la plaquette (3) par des éléments de liaison (9) de type membrane qui autorisent des mouvements élastiques d'ouverture et de fermeture. Les différents clapets (7) comportent un nombre variable d'orifices de passage (6), de taille différente, de façon que leur actionnement sélectif commande dynamiquement la pression et le débit sur une très large plage de réglage. Les clapets (7) sont actionnés par un dispositif de commande électrique qui produit des forces capacitives de répulsion et d'attraction.
EP97938868A 1996-08-06 1997-08-02 Ensemble clapet Expired - Lifetime EP0916028B1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19631693 1996-08-06
DE19631693A DE19631693A1 (de) 1996-08-06 1996-08-06 Ventilanordnung
PCT/EP1997/004223 WO1998005871A1 (fr) 1996-08-06 1997-08-02 Ensemble clapet

Publications (2)

Publication Number Publication Date
EP0916028A1 true EP0916028A1 (fr) 1999-05-19
EP0916028B1 EP0916028B1 (fr) 2000-11-08

Family

ID=7801907

Family Applications (1)

Application Number Title Priority Date Filing Date
EP97938868A Expired - Lifetime EP0916028B1 (fr) 1996-08-06 1997-08-02 Ensemble clapet

Country Status (3)

Country Link
EP (1) EP0916028B1 (fr)
DE (2) DE19631693A1 (fr)
WO (1) WO1998005871A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10162983B4 (de) * 2001-12-20 2010-07-08 Qimonda Ag Kontaktfederanordnung zur elektrischen Kontaktierung eines Halbleiterwafers zu Testzwecken sowie Verfahren zu deren Herstellung
KR100512185B1 (ko) * 2003-07-07 2005-09-05 엘지전자 주식회사 유량 제어 밸브

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5065978A (en) * 1988-04-27 1991-11-19 Dragerwerk Aktiengesellschaft Valve arrangement of microstructured components
DE3914031C2 (de) * 1989-04-28 1993-10-28 Deutsche Aerospace Mikromechanischer Aktuator
DE3917423C1 (fr) * 1989-05-29 1990-05-31 Buerkert Gmbh & Co Werk Ingelfingen, 7118 Ingelfingen, De
DE4101575A1 (de) * 1991-01-21 1992-07-23 Bosch Gmbh Robert Mikroventil
DE4221089A1 (de) * 1992-06-26 1994-01-05 Bosch Gmbh Robert Mikroventil
DE4222660C2 (de) * 1992-07-10 1996-03-21 Kernforschungsz Karlsruhe Verfahren zur Herstellung eines Mikroventils
US5417235A (en) * 1993-07-28 1995-05-23 Regents Of The University Of Michigan Integrated microvalve structures with monolithic microflow controller
CN1133080A (zh) * 1993-09-24 1996-10-09 罗斯芒特分析公司 微细加工的阀门装置
US5640995A (en) * 1995-03-14 1997-06-24 Baxter International Inc. Electrofluidic standard module and custom circuit board assembly

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO9805871A1 *

Also Published As

Publication number Publication date
DE19631693A1 (de) 1998-02-12
EP0916028B1 (fr) 2000-11-08
WO1998005871A1 (fr) 1998-02-12
DE59702612D1 (de) 2000-12-14

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