EP0916028B1 - Ensemble clapet - Google Patents

Ensemble clapet Download PDF

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Publication number
EP0916028B1
EP0916028B1 EP97938868A EP97938868A EP0916028B1 EP 0916028 B1 EP0916028 B1 EP 0916028B1 EP 97938868 A EP97938868 A EP 97938868A EP 97938868 A EP97938868 A EP 97938868A EP 0916028 B1 EP0916028 B1 EP 0916028B1
Authority
EP
European Patent Office
Prior art keywords
wafer
valve arrangement
opening
arrangement according
swing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP97938868A
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German (de)
English (en)
Other versions
EP0916028A1 (fr
Inventor
Heinz-Werner Etzkorn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gaswarme-Institut Ev
Original Assignee
Gaswarme-Institut Ev
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Application filed by Gaswarme-Institut Ev filed Critical Gaswarme-Institut Ev
Publication of EP0916028A1 publication Critical patent/EP0916028A1/fr
Application granted granted Critical
Publication of EP0916028B1 publication Critical patent/EP0916028B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F15—FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
    • F15C—FLUID-CIRCUIT ELEMENTS PREDOMINANTLY USED FOR COMPUTING OR CONTROL PURPOSES
    • F15C5/00—Manufacture of fluid circuit elements; Manufacture of assemblages of such elements integrated circuits

Definitions

  • the invention relates to a valve arrangement for pressure and flow control of a fluid according to the preamble of claim 1.
  • the preferred field of application of the invention is the control of the gas inflow to burners, in particular to atmospheric injector burners.
  • Common valve assemblies of this type have a housing that a Contains many details, namely springs, diaphragms, valve elements as well as any other locking devices that may be driven by additional solenoids or the like.
  • the housing which is usually made of metal, is made from a variety of Drilled holes and channels of different diameters, it can be very fine holes. Mechanical manufacturing Such valve arrangements is very complex and accordingly expensive.
  • valve arrangement which essentially consists of two interconnected wafers.
  • the wafers each have one Through opening, wherein in the through opening of the second wafer a flap is arranged, the membrane-like webs with the second Wafer is connected.
  • the flap can be closed with the aid of control means or be opened.
  • the valve arrangement is used, for example, for Inkjet printers continuously produce a stream of tiny droplets. A variation in the flow rate or the pressure is not provided.
  • valve arrangement is known from WO-A-9508716, which is used for distribution or redirecting flows.
  • a special one is aimed for Tightness of the valve arrangement when closed.
  • a quantitative Control of the flow is not possible with such a valve arrangement.
  • the invention has for its object a structurally simple valve arrangement to create that works with very little pressure loss and a dynamic Control over a wide performance range allows.
  • the valve arrangement of the type mentioned at the outset is characterized according to the invention in that that the first silicon wafer is provided with a plurality of through openings, that the at least one through opening in the second silicon wafer is designed as a continuous frame opening and has a plurality of flaps, each of which is integral with the second silicon wafer via a membrane-like web are connected, the control means of the individual flaps being selectively operable as a function of a control device.
  • This valve arrangement is extremely simple in construction and can, in comparison with common "three-dimensional" valve arrangements, quite as be called "two-dimensional". It essentially consists of the two silicon wafers together, which are a conventional or anisotropic subjected to isotropic etching. This occurs in the first wafer the through openings and in the second wafer the flaps, which in their open position, in which they open the through openings, around which the fluid flows become.
  • An extensive housing can be omitted. Rather, install the arrangement directly into a supply line. Accordingly there are very small sizes, which can also be used in small devices, for example in water heaters, combination devices, heaters for small housing units and the like.
  • the performance-dependent flow is controlled by certain flaps of the second wafer selectively opened and others selectively kept closed become. It has been found that a modulating in this way Control is possible, which ranges from a few percent to 100% covers. With conventional valve arrangements, the dynamic range so far from approx. 60% to 100%.
  • the individual flaps of the second wafer are preferred different numbers and / or sizes of through openings assigned to the first wafer. So that can achieve a maximum range of variation.
  • the control ensures that by selecting certain numbers and / or sizes of passage openings the flow cross-section required in each case is made available. This advantage combined with the small size and the inexpensive Manufacturing, offers the possibility of any injector or A separate valve arrangement is available for the burner segment to deliver. This enables modulating control achieve with optimal accuracy over a maximum range.
  • the flap thickness becomes greatly reduced compared to the thickness of the wafer.
  • the membrane-like webs of the flaps to bias in the closing direction by doping the silicon.
  • the preload is sufficient to hold the flaps of the second Press wafers on the first wafer.
  • the preload of the membrane-like Make a special appearance is possible.
  • a bias can to increase the sealing effect can also be advantageous if the flaps of the second wafer are on the surface anyway rest of the first wafer.
  • the two wafers are Assembly and gluing techniques exactly on top of each other aligned and interconnected, if necessary under Interposition of sealing materials.
  • the valve arrangement consequently makes the Technique of micromachining use.
  • the structure is filigree, and the passage cross sections are - with all variations ready - extremely fine.
  • this results in particular on fuel gases Requirement to work with gases that are as dust-free as possible.
  • the second wafer on its from side facing away from the first wafer is etched as a dust sieve third silicon wafer.
  • the sieve openings can be very fine and yet because of their large number Ensure the required passage cross section. she offer effective protection for the downstream flaps and through openings, the additional structural and cost is extremely low because here too the advantageous technique of micromachining in this regard is used consistently.
  • the control means are preferably for selective effecting the opening and closing movements of the flaps between the first and the second wafer and / or between the second and the third wafer.
  • a third wafer is coming used, there is a possibility to choose between effective control means to the first and second wafers support or replace them entirely.
  • the control means for actuating the flaps can be different Be nature, always with consideration the fact that worked in the field of micromechanics becomes. For example, a thermally controlled one is conceivable Bimetal actuation of the flaps. Is easier under Electrical control under certain circumstances, for example using the piezoelectric effect.
  • the control means capacitive or magnetic field induced Repulsive or attractive forces on the flaps exercise. All that is required is the flaps and the adjacent wafer (s) with opposing ones to provide electrical conductors and these accordingly to poland.
  • the arrangement is preferably so hit that the flaps with de-energized electrical control means take their closed position. In the event of a power failure causes the supply pressure, possibly supported through the pretensioning of the flap webs, an automatic Closing the entire valve assembly.
  • At least one of the Wafers in the area of the openings can be used with a coating to provide thermally expandable material. If there is one If the valve assembly overheats, the material swells the coating and leads to an automatic locking of the openings. A separate thermal safety shut-off valve can therefore be omitted.
  • the material can be the inner walls the through openings of the first wafer. It can also be around the through holes on one or be arranged on both sides of the first wafer. Further there is an attachment on the sealing surfaces of the flaps in question. The latter two options are likely from a manufacturing point of view, be cheaper than the coating the inner walls of the through openings. He comes a third wafer forming a dust sieve is used, so it is very particularly advantageous, this with the expandable material to coat on one and / or the other side. The individual measures can also be combined become.
  • the pressure sensor of the capillary channel as an etched pressure cell, that of one piece connected to the first wafer Membrane is closed.
  • a valve arrangement 1 consists of three wafers, namely a first wafer 2, a second wafer 3 and a third wafer 4.
  • the valve arrangement is in a Fuel gas line 5 installed, which in the present case to a Injector burner leads.
  • the valve assembly 1 can Flow in the direction indicated by arrows.
  • Wafers 2 to 4 consist of silicon, their Shaping has been created by conventional etching.
  • the first wafer 2 has a plurality of Through openings 6 on that in yet to be described Way can be selectively opened and closed to Pressure and flow of the gas depending on one control device, not shown.
  • the through openings 6 are the same as smooth openings Size shown, with a circular cross-section. Their number is adapted to the respective circumstances.
  • Fig. 3 shows a modified embodiment in which the passage opening 6 has a square cross section and also tapered in the direction of flow is. Smooth through openings with square or rectangular cross-section are equally possible. Furthermore it should be noted that the through openings 6 can also be of different sizes.
  • Closing elements are flaps 7 provided by etching of the second wafer 3 have been generated. It is in the second Wafer 3 a frame opening 8, into which the Project flaps 7. Each flap 7 is over a membrane-like Web 9 connected to the body of the wafer 3. The membrane-like webs 9 allow a selective movement of the Close 7.
  • Fig. 5 shows a section through the valve assembly on Locations of one of the flaps 7. It follows that the wafer 2 and 3 lie on top of each other, the flap 7 of the second Wafers 3 the associated through opening 6 of the first wafer 2 closes. Electrical control means 10 act Opening the flap 7.
  • the control means 10 are concerned two conductive surfaces, one of which is the first Wafer 2 and the other of the flap 7 is assigned. A appropriate polarity causes a capacitive repulsive force, which the flap 7 with its elastic deformation Brings web 9 into the open position. Once the tax funds 10 are switched off, the closes Flap 7, the supply pressure of the fuel gas an additional Closing force causes. The arrangement works with very low pressure drop.
  • Fig. 5 also shows that the third wafer 4 with etched Screen openings 11 is provided and thus an upstream Dust sieve that forms the downstream valve system protects against pollution. If the fuel gas is sufficient is dust-free, can also on the third wafer 4 to be dispensed with.
  • the third wafer 4 in the present case Another function added by opening movement the flap 7 supports.
  • This is another one Set of control means 10 provided on the one hand the third wafer 4 and on the other hand again assigned to the flap 7 are.
  • the polarity is such that a capacitive Attraction is effected.
  • the force is also heard here as soon as the control means are de-energized become.
  • FIG. 5 shows that the through opening 6 is provided with a coating 12.
  • the latter consists of a thermally expandable material, in particular from a Plastic, and serves as a thermal fuse. As soon as the Temperature of the valve assembly above a certain value increases from, for example, 650 ° C, the coating swells 12 and automatically closes the passage opening 6.
  • the arrangement of the coating 12 on the inner wall the through opening 6 was shown as easy to draw Example chosen. For technical reasons it may be more advantageous to apply the coating in the area the through opening 6 on one and / or other surface of the wafer 2 or on the sealing surface of the Attach flap 7. A particularly easy option consists of the third wafer 4 on one and / or to coat the other side. A combination of the individual Measures are also possible.
  • the through opening is 6 tapered in the direction of flow. Besides, that is Flap 7 with a complementary locking projection 13 provided. This offers the possibility of the cross section to change the through opening 6 and thereby the To further increase the variability of the dynamic control.
  • the first wafer 2 with a Capillary channel 14 is provided. This is in the wafer 2 etched and covered with suitable means.
  • the capillary channel 14 has an upstream inlet opening 15 and a downstream outlet opening 16, these openings can be closed by flaps 7, see Fig. 4.
  • Die Inlet opening 15 can be supplied with the supply pressure become connectable to the atmosphere while the outlet opening 16 is.
  • the outlet opening 16 forms a Pressure cell with a membrane. Latter is formed by etching the first wafer 2.
  • the inlet opening 15 of the capillary channel 14 closed and the outlet opening 16 related to the atmosphere, see above that the atmospheric pressure within the capillary channel 14 sets.
  • the outlet opening 16 is then closed and the inlet opening 15 opened. It builds up then the supply pressure in the capillary channel 14.
  • the Pressure increase is associated with that of the outlet opening 16 Pressure sensor detects and provides information about the viscosity of the fuel gas and thus its gas quality.
  • Pressure transducers 17 and 18 there are two more Pressure transducers 17 and 18 etched into the first wafer 2. Both pressure transducers 17 and 18 have membranes Silicon formed in one piece with the wafer 2 during the etching become.
  • the pressure cell 17 detects the supply pressure and the load cell 18 the working pressure, these values be included in the regulation. This increases their accuracy.
  • 2 and 4 show the assignment of a first set of through openings and flaps an injector burner. Additional sentences can be provided for further injector burners or injectors of burner sets to control each independently.
  • the second wafer 3 in reverse Orientation be placed on the first wafer 2.
  • the web 9 of the flap 7 is then doped such that the Flap assumes its closed position, as is shown in FIG. 6 is shown.
  • the control means 10 shown it concerns capacitive control means. Instead of inductive control means can also be provided.
  • opening and closing movements to effect the flaps piezoelectrically It is also conceivable thermal control using a bimetal element.
  • the capillary channel 14 is on the output side provided with a pressure can.
  • a Anemometer can be connected to adjust over the Flow rate statements about the viscosity and in order to maintain the quality of the fuel gas.
  • the invention was based on a burner control explained, but the valve arrangement can also be used for others Gases and also be used for liquids.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Mechanical Engineering (AREA)
  • Magnetically Actuated Valves (AREA)

Claims (12)

  1. Disposition de vanne pour la commande de la pression et du débit d'un fluide avec
    un premier disque (2) et un deuxième disque (3), liés l'un à l'autre et présentant chacun au moins un orifice de passage gravé (6, 8), où dans l'orifice de passage (8) du deuxième disque (3) au nombre d'au moins un est disposée, de façon élastique et mobile, une trappe (7) affectée à l'orifice de passage (6) du premier disque au nombre d'au moins un;
    des moyens de commande (10) prévus au niveau de la trappe (7) au nombre d'au moins un, et provoquant les mouvements d'ouverture et de fermeture de cette dernière,
    caractérisée par le fait que le premier disque au silicium (2) est muni de plusieurs orifices de passage (6), que l'orifice de passage (8) au nombre d'au moins un du deuxième disque au silicium (3) est conçu sous forme d'ouverture à cadre d'une traite et qu'il présente plusieurs trappes (7) liées chacune par une barrette (9) ressemblant à une membrane au deuxième disque au silicium (3), les moyens de commande (10) de chaque trappe (7) pouvant être actionnés de manière sélective en fonction d'un dispositif de commande.
  2. Disposition de vanne suivant la revendication 1, caractérisée par le fait qu'aux différentes trappes (7) du deuxième disque (3) sont attribués des orifices de passage (6) du premier disque (2) qui différent de par leur nombre et/ou leurs dimensions.
  3. Disposition de vanne suivant l'une des revendications 1 ou 2, caractérisée par le fait qu'au moins quelques uns des orifices de passage (6) du premier disque (2) s'amincissent en cône en direction d'écoulement, et que les trappes (7) correspondantes du deuxième disque (3) sont munies, en une seule pièce, de saillies obturatrices (13) complémentaires.
  4. Disposition de vanne suivant l'une des revendications 1 à 3, caractérisée par le fait que les barrettes (9) ressemblant à des membranes des trappes (7) sont précontraintes en direction de fermeture par le dopage du silicium.
  5. Disposition de vanne suivant l'une des revendications 1 à 4, caractérisée par le fait que le deuxième disque (3) présente, à sa surface opposée au premier disque (2), un troisième disque au silicium (4) gravé sous forme de crible de poussière.
  6. Disposition de vanne suivant l'une des revendications 1 à 5, caractérisée par le fait que les moyens de commande (10) provoquant, de façon sélective, les mouvements d'ouverture et de fermeture des trappes (7) sont prévus entre le premier et le deuxième disques (2, 3) et/ou le deuxième et le troisième disques (3, 4).
  7. Disposition de vanne suivant l'une des revendications 1 à 6, caractérisée par le fait que les moyens de commande (10) exercent sur les trappes (7) des forces de répulsion respectivement d'attraction capacitives ou induites par magnétisme.
  8. Disposition de vanne suivant l'une des revendications 1 à 7, caractérisée par le fait que les trappes (7) se mettent à leur position de fermeture quand les moyens de commande électriques (10) sont hors tension.
  9. Disposition de vanne suivant l'une des revendications 1 à 8, caractérisée par le fait qu'au moins un des disques (2 à 4) présente, au niveau des orifices, un revêtement (12) d'un matériau thermiquement gonflable.
  10. Disposition de vanne suivant l'une des revendications 1 à 9, caractérisée par le fait que des dynamomètres (17, 18) sont gravés dans le premier disque (2) et fermés à chaque fois, du côté aspiration, par une membrane liée en une seule pièce au disque.
  11. Disposition de vanne suivant l'une des revendications 1 à 8, caractérisée parle fait
    qu'un canal capillaire (14) est gravé dans le premier disque (2) et recouvert à l'exception d'un orifice d'entrée (15) du côté aspiration et d'un orifice de sortie (16) du côté refoulement;
    que, à chaque fois, une trappe (7) du deuxième disque (3) est attribuée aux orifices d'entrée et de sortie (15, 16) du canal capillaire (14);
    qu'un capteur de pression ou un anémomètre peuvent être raccordés à l'orifice de sortie (16).
  12. Disposition de vanne suivant la revendication 11, caractérisée par le fait que le capteur de pression du canal capillaire (14) est conçu sous forme de dynamomètre gravé et fermé par une membrane liée en une seule pièce au premier disque (2).
EP97938868A 1996-08-06 1997-08-02 Ensemble clapet Expired - Lifetime EP0916028B1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19631693 1996-08-06
DE19631693A DE19631693A1 (de) 1996-08-06 1996-08-06 Ventilanordnung
PCT/EP1997/004223 WO1998005871A1 (fr) 1996-08-06 1997-08-02 Ensemble clapet

Publications (2)

Publication Number Publication Date
EP0916028A1 EP0916028A1 (fr) 1999-05-19
EP0916028B1 true EP0916028B1 (fr) 2000-11-08

Family

ID=7801907

Family Applications (1)

Application Number Title Priority Date Filing Date
EP97938868A Expired - Lifetime EP0916028B1 (fr) 1996-08-06 1997-08-02 Ensemble clapet

Country Status (3)

Country Link
EP (1) EP0916028B1 (fr)
DE (2) DE19631693A1 (fr)
WO (1) WO1998005871A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10162983B4 (de) * 2001-12-20 2010-07-08 Qimonda Ag Kontaktfederanordnung zur elektrischen Kontaktierung eines Halbleiterwafers zu Testzwecken sowie Verfahren zu deren Herstellung
KR100512185B1 (ko) * 2003-07-07 2005-09-05 엘지전자 주식회사 유량 제어 밸브

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5065978A (en) * 1988-04-27 1991-11-19 Dragerwerk Aktiengesellschaft Valve arrangement of microstructured components
DE3914031C2 (de) * 1989-04-28 1993-10-28 Deutsche Aerospace Mikromechanischer Aktuator
DE3917423C1 (fr) * 1989-05-29 1990-05-31 Buerkert Gmbh & Co Werk Ingelfingen, 7118 Ingelfingen, De
DE4101575A1 (de) * 1991-01-21 1992-07-23 Bosch Gmbh Robert Mikroventil
DE4221089A1 (de) * 1992-06-26 1994-01-05 Bosch Gmbh Robert Mikroventil
DE4222660C2 (de) * 1992-07-10 1996-03-21 Kernforschungsz Karlsruhe Verfahren zur Herstellung eines Mikroventils
US5417235A (en) * 1993-07-28 1995-05-23 Regents Of The University Of Michigan Integrated microvalve structures with monolithic microflow controller
CA2169826A1 (fr) * 1993-09-24 1995-03-30 Cynthia R. Nelson Robinet micro-usine
US5640995A (en) * 1995-03-14 1997-06-24 Baxter International Inc. Electrofluidic standard module and custom circuit board assembly

Also Published As

Publication number Publication date
DE59702612D1 (de) 2000-12-14
EP0916028A1 (fr) 1999-05-19
DE19631693A1 (de) 1998-02-12
WO1998005871A1 (fr) 1998-02-12

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