EP0694088B1 - Procede pour la fabrication d'une matrice de base pour la production electrolytique de pochoirs rotatifs, sans soudure, principalement en nickel - Google Patents

Procede pour la fabrication d'une matrice de base pour la production electrolytique de pochoirs rotatifs, sans soudure, principalement en nickel Download PDF

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Publication number
EP0694088B1
EP0694088B1 EP95908917A EP95908917A EP0694088B1 EP 0694088 B1 EP0694088 B1 EP 0694088B1 EP 95908917 A EP95908917 A EP 95908917A EP 95908917 A EP95908917 A EP 95908917A EP 0694088 B1 EP0694088 B1 EP 0694088B1
Authority
EP
European Patent Office
Prior art keywords
indentations
grid
sensitive layer
process according
base mould
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP95908917A
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German (de)
English (en)
Other versions
EP0694088A1 (fr
Inventor
Hans-Georg Schepers
Karl-Wilhelm Saueressig
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schepers Druckformtechnik GmbH
Original Assignee
Schepers Druckformtechnik GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schepers Druckformtechnik GmbH filed Critical Schepers Druckformtechnik GmbH
Publication of EP0694088A1 publication Critical patent/EP0694088A1/fr
Application granted granted Critical
Publication of EP0694088B1 publication Critical patent/EP0694088B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
    • B41C1/00—Forme preparation
    • B41C1/14—Forme preparation for stencil-printing or silk-screen printing
    • B41C1/142—Forme preparation for stencil-printing or silk-screen printing using a galvanic or electroless metal deposition processing step
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/10—Moulds; Masks; Masterforms

Definitions

  • the invention relates to a method for producing a Mother matrix for the galvanic generation of seamless Rotary screen printing stencils, especially made of Nickel, being a metallic mother matrix base body with a cylindrical outer surface on its outer circumference with depressions distributed in a regular grid is provided that a round or polygonal Have an outline and a regular network between them grid webs remain, and the depressions then with an electrically non-conductive Filling compound filled flush to the height of the grid bars are then repeated by galvanic application of metal and axially pulling off the resulting Sleeve screen printing stencils can be generated.
  • mother matrices are used for the above Previously used for so-called moletting manufactured.
  • the desired one is made using a molette Deepening grid in the outer surface of the mother matrix base body indented.
  • the Molette is a relatively small roller on the circumference of the mother matrix base body along a helix below strong pressure force is unrolled.
  • the molette carries arranged on its peripheral surface in the desired grid Projections that are a negative image of the desired Show recesses for the mother matrix.
  • the depressions that can be produced by the mettling can only truncated pyramid or truncated cone with relative be flat inclined flanks. This leads to the disadvantage that the lying in the wells electrically non-conductive filling compound at the edges of the depressions becomes very thin and breaks out easily there. Later galvanic application of metal to the mother matrix The screen printing stencil is then formed when peeling off the finished galvanized template to damage through the surface of the mother matrix Stencil protruding metal noses, which are in could form the breakouts of the filling compound.
  • the mother matrix is made of relatively soft copper, over which, for example, nickel is preferred
  • Screen printing stencil material is relatively hard to form themselves despite the chrome plating, which is only very thin can be slight striations in the longitudinal direction of the mother matrix, their usability on relatively few production runs for the production of screen printing stencils limit.
  • the invention has the advantage that all the mettling tools and not the devices required for this are more needed. This will save a lot in terms of technical, personnel and time Effort reached. Because the outline of the depressions and the grid in which these depressions are arranged are now electronically stored, the Outline shape of the wells and their distribution within of the grid made very precisely and with little Effort changed and adapted to the respective needs without, as was previously required, would be to produce new filleting tools.
  • the depressions get a contour that improves Hold the electrically non-conductive filling compound offers.
  • the wells are not now more truncated cones or with flanks Are truncated pyramids, but viewed in cross section rather get the shape of oval bowls.
  • This keeps the filling mass within the wells also in whose edge areas have a comparatively large thickness, so that breakouts of the filling compound are avoided.
  • the later electroplating of the screen printing stencil form what better quality stencils results and damage to the mother matrix when axially pulling off the template avoids. This gives the mother matrix has a longer service life, which in the Practice can be two to three times as long as this previously used mother matrices was accessible.
  • an ultraviolet laser beam is used as the beam or a thermal laser beam or an electron beam is used.
  • the mentioned rays can be comparatively easily generate and focus so that, in cooperation with a correspondingly selected coating with a suitable Sensitivity, deepening and grid with a high Resolution and accuracy as well as large MESH numbers let generate.
  • nickel Since no mechanical Press the depressions into the mother matrix base body more takes place, this no longer has to be relative soft copper, but can also consist of one harder metal exist, this preferably nickel is.
  • the metal nickel offers the advantage of a high Hardness, high strength and a high structural density. It also has good electrical conductivity and is easy to galvanize. As a result, a Chromium plating of the surface of the mother matrix is eliminated, what is the recycling of mother matrices that can no longer be used facilitated.
  • Another by using Nickel more accessible as a material for the mother matrix The advantage is that the nickel surface of the Mother die automatically through the formation of a nickel oxide layer protects, but remains electrically conductive. At the same time, this nickel oxide layer ensures that the screen printing stencil galvanized onto the mother die slightly pull off the mother matrix leaves, because the nickel oxide layer on the mother matrix as Release agent works.
  • a mother matrix base body can as a mother matrix base body also a hollow cylindrical one Nickel sleeve are used. This is straightforward possible because of the elimination of mechanical Pressure forces between the Molette and the base matrix body the latter does not have a particularly high mechanical stability must have more. The use also allows a hollow cylindrical nickel sleeve easier handling and a lighter and cheaper one Transport or shipping between the manufacturer of the mother matrix and generally not the same Manufacturer of screen printing stencils.
  • the electrically non-conductive filling compound a curable synthetic resin or a curable ceramic Mass used.
  • These materials offer the advantage that on the one hand it was initially still a viscous mass can be introduced into the recesses and that they are on the other side after hardening very firm in the wells adhere and have high strength and surface quality.
  • these materials are after curing also by mechanical methods, e.g. Rotate or loops, editable without them coming out of the Loosen depressions or break out at the edge of the depressions.
  • the wells are preferably made with a regular generated hexagonal outline; the deepening continues preferably honeycomb in a hexagonal grid distributed.
  • This has the advantage that the screen printing stencils produced on this mother die high strength and stability with low weight and have a good web-to-passage ratio. Because of the electronic storability of the outline form the wells and their distribution in the grid is of course, every freedom in the design of this Given parameters.
  • FIG. 1 to 5 of the drawing show a section from the peripheral area of a mother matrix base body during various process steps; the figure 6 the drawing shows a section of the peripheral area a finished mother matrix.
  • the mother matrix base body 1 made of metal and has a cylindrical outer surface 10 on.
  • the base body 1 can be a cylinder or hollow cylindrical sleeve.
  • a sensitive is on the lateral surface 10 of the base body 1
  • Coating 2 in the form of a comparatively thin Layer applied, which is exaggerated in the drawing is shown in bold.
  • this coating 2 can it is a photo, thermo or electro sensitive material act as is known per se. Also order process for achieving such coatings a uniform layer thickness are known and need not to be explained in more detail here.
  • Figure 2 of the drawing shows the mother matrix base body 1 during a process step in which of a laser 30 which controls a laser beam 3 emits an exposure of the sensitive coating 2, here with the negative image of the desired wells he follows.
  • the mother matrix base body 1 and the laser 30 in two directions relative to one another, preferably the axial direction and the circumferential direction moved, so that gradually the entire peripheral surface of the mother matrix base body 1 is covered.
  • the Beam 3 in accordance with electronically stored data on and off to the positive or negative image to expose a desired grid onto the coating 2, depending on whether this is photopositive or photonegative responds.
  • the coating 2 by the Exposure in areas 20 changed so that they are for a subsequent chemical and / or physical Removal process becomes insoluble. Between the exposed areas 20 remain unexposed areas 21 which Correspond to areas in which later specializations in the base body 1 are to be generated.
  • Figure 3 of the drawing shows the mother matrix base body 1 after going through the removal process in which the unexposed areas 21 of the coating 2 are removed have been. Now the coating remains 2 only the exposed ones on the lateral surface 10 Areas 20 that have a grid-like pattern from protruding webs form outside, each regular Include hexagons.
  • a suitable Removal process of the remaining part 20 of the coating 2 also removed, after which the mother matrix base body the surface shape shown in Figure 5 having. This is characterized by a grid of recesses 11 hexagonal in outline, between which are webs 12 distributed webs. The outer The surface of the webs 12 corresponds to the lateral surface 10 of the base body 1.
  • Figure 6 of the drawing finally shows the finished mother matrix 1 ', in which the recesses 11 are now complete with a filling compound 4 up to the level of the upper edge the webs 12 and thus up to the original lateral surface 10 of the mother matrix base body 1 filled are.
  • the mother matrix is on the lateral surface 10 1 'in the desired distribution areas different electrical properties formed, namely electrically in the area of the surface of the filling compound 4 non-conductive areas and in the area of the surface the webs 12 electrically conductive areas.
  • This screen printing sleeve thus formed can then in the axial direction of the mother die 1 ', i.e. parallel to Shell surface 10, deducted from the mother die 1 ' become.

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Adornments (AREA)

Claims (8)

  1. Procédé pour fabriquer une matrice mère (1') pour la production galvanique de pochoirs de sérigraphie rotatifs sans cordon de jonction, notamment en nickel, selon lequel on aménage, dans la périphérie extérieure d'un corps de base métallique de la matrice mère (1) pourvu d'une surface enveloppe cylindrique (10), des renfoncements (11) qui sont répartis selon un réseau régulier et possèdent un contour circulaire ou polygonal et entre lesquels subsistent des barrettes (12) du réseau qui forment un réseau régulier, et selon lequel on remplit ensuite des renfoncements de niveau, jusqu'à la hauteur des barrettes (12) du réseau, avec une masse de remplissage (4)non électriquement conductrice, à la suite de quoi on peut fabriquer des pochoirs de sérigraphie d'une manière répétée au moyen d'un dépôt galvanique d'un métal et d'un retrait axial de la douille ainsi obtenue,
    caractérisé par les étapes opérations suivantes :
    a) on recouvre la surface enveloppe (10) du corps de base (1) de la matrice mère par un revêtement photosensible ou thermosensible ou électrosensible (2).
    b) on éclaire le revêtement (2) à l'aide d'un faisceau (3) commandé en fonction de données mémorisées électroniquement, avec l'image positive ou négative du réseau désiré de renfoncements, la forme du contour des renfoncements (11) et leur répartition dans le réseau étant mémorisées, d'une manière pouvant être librement configurée, dans les données, et on élimine le revêtement (2), immédiatement ou après exécution d'un processus de développement, dans les zones (21) dans lesquels les renfoncements (11) sont prévus, à l'aide d'un processus d'élimination chimique et/ou physique,
    c) on forme les renfoncements (11) dans les zones, dans lesquelles le revêtement (2) a été éliminé, de la surface enveloppe (10) du corps de base (11) de la matrice mère, par corrosion ou enlèvement électrolytique de métal ;
    d) on retire complètement les parties restantes (20) du revêtement (2), et
    e) on remplit les renfoncements (11) avec la masse de remplissage non électriquement conductrice (4).
  2. Procédé selon la revendication 1, caractérisé en ce que l'étape opératoire b) est exécutée comme suit :
    b) on élimine directement le revêtement (2), au moyen d'un faisceau (3) commandé en fonction de données mémorisées électroniquement, dans les zones (21) dans lesquelles les renfoncements (11) sont prévus, la forme de contour des renfoncements (11) et leur répartition dans le réseau étant mémorisées, d'une manière pouvant être librement conformée, dans les données.
  3. Procédé selon la revendication 1 ou 2, caractérisé en ce qu'on utilise comme faisceau (3) un faisceau laser à ultraviolet ou un faisceau laser à effet thermique ou un faisceau d'électrons.
  4. Procédé selon l'une des revendications 1 à 3, caractérisé en ce qu'on utilise comme corps de base formant matrice mère (1) un cylindre de nickel.
  5. Procédé selon l'une des revendications 1 à 3, caractérisé en ce qu'on utilise comme corps de base (1) de la matrice mère une douille cylindrique creuse en nickel.
  6. Procédé selon l'une des revendications précédentes, caractérisé en ce qu'on utilise comme masse de remplissage non électriquement conductrice (4), une résine synthétique durcissable ou une masse céramique durcissable.
  7. Procédé selon l'une des revendications précédentes, caractérisé en ce qu'on forme les renfoncements (11) avec un contour hexagonal régulier.
  8. Procédé selon la revendication 7, caractérisé en ce que les renfoncements (11) sont disposés en nid d'abeilles en étant répartis selon un réseau hexagonal.
EP95908917A 1994-02-12 1995-02-09 Procede pour la fabrication d'une matrice de base pour la production electrolytique de pochoirs rotatifs, sans soudure, principalement en nickel Expired - Lifetime EP0694088B1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE4404560A DE4404560C1 (de) 1994-02-12 1994-02-12 Verfahren zur Herstellung einer Muttermatrize für die galvanische Erzeugung von nahtlosen Rotations-Siebdruckschablonen, insbesondere aus Nickel
DE4404560 1994-02-12
PCT/EP1995/000458 WO1995021951A1 (fr) 1994-02-12 1995-02-09 Procede pour la fabrication d'une matrice de base pour la production electrolytique de pochoirs rotatifs, sans soudure, principalement en nickel

Publications (2)

Publication Number Publication Date
EP0694088A1 EP0694088A1 (fr) 1996-01-31
EP0694088B1 true EP0694088B1 (fr) 1999-05-19

Family

ID=6510148

Family Applications (1)

Application Number Title Priority Date Filing Date
EP95908917A Expired - Lifetime EP0694088B1 (fr) 1994-02-12 1995-02-09 Procede pour la fabrication d'une matrice de base pour la production electrolytique de pochoirs rotatifs, sans soudure, principalement en nickel

Country Status (9)

Country Link
US (1) US5972194A (fr)
EP (1) EP0694088B1 (fr)
CN (1) CN1095881C (fr)
AT (1) ATE180291T1 (fr)
AU (1) AU1706195A (fr)
DE (2) DE4404560C1 (fr)
ES (1) ES2133736T3 (fr)
GR (1) GR3031024T3 (fr)
WO (1) WO1995021951A1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1851060B (zh) * 2006-04-10 2011-05-04 南京航空航天大学 中空零件电铸成形中沟槽的填充方法
CN101271275B (zh) * 2008-04-28 2011-08-10 彩虹集团电子股份有限公司 一种喇叭网的蚀刻法生产工艺
CN101373334B (zh) * 2008-10-13 2011-02-16 彩虹集团电子股份有限公司 一种栅网半蚀刻连接点人工抖料方法
KR100903962B1 (ko) * 2008-11-21 2009-06-25 주식회사 센트랄 볼 시트의 제조방법
DE102009017686A1 (de) 2009-04-16 2010-10-28 Steinemann Technology Ag Siebdruckmaschine mit Greifertransport
DE102011015456A1 (de) 2011-03-30 2012-10-04 Thomas Walther Siebdruckverfahren und dazu gehörige Vorrichtung
KR102320282B1 (ko) * 2017-09-04 2021-10-29 후지필름 가부시키가이샤 전주용 원반 및 그 전주용 원반을 이용한 전주 몰드의 제조 방법

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Publication number Priority date Publication date Assignee Title
US2166366A (en) * 1935-11-30 1939-07-18 Edward O Norris Inc Means and method of producing metallic screens
BE788470A (fr) * 1971-11-12 1973-01-02 Buckbee Mears Co Procede ameliore d'accroissement de la rigidite des ecrans d'impressio
AT311294B (de) * 1972-05-23 1973-11-12 Zimmer Johannes Schablonenhülse
US3960675A (en) * 1975-04-17 1976-06-01 Motter Printing Press Co. Method for deplating and replating rotogravure cylinders
DE2544603A1 (de) * 1975-10-04 1977-04-14 Kabel Metallwerke Ghh Verfahren zur herstellung eines zylindrischen matrizenkoerpers
IN155834B (fr) * 1976-10-05 1985-03-16 Iten K Ag
JPS54156880A (en) * 1978-05-04 1979-12-11 Kenseido Kagaku Kogyo Kk Production of sleeve for rotary screen printing
DE2965624D1 (en) * 1978-09-26 1983-07-14 Wallace Watson Sword The production of rotary screen printing cylinders
NL7909089A (nl) * 1979-12-17 1981-07-16 Stork Screens Bv Werkwijze voor de vervaardiging van een matrijs.
DE3011192A1 (de) * 1980-03-22 1981-10-01 Hoechst Ag, 6000 Frankfurt Verfahren zur herstellung von siebdruckschablonen auf galvanischem wege
JPH0793255B2 (ja) * 1987-07-23 1995-10-09 松下電器産業株式会社 微細パタ−ン形成方法
JPH01254944A (ja) * 1988-04-04 1989-10-11 Fuji Photo Film Co Ltd ハロゲン化銀写真感光材料
NL8802928A (nl) * 1988-11-28 1990-06-18 Stork Screens Bv Werkwijze en inrichting voor het vormen van een weerstandspatroon op een cylindrisch voorwerp alsmede een onder toepassing van een dergelijk weerstandspatroon verkregen geetste metalen cylinder.
BE1002787A7 (fr) * 1989-01-31 1991-06-11 Centre Rech Metallurgique Dispositif de fabrication, par electrodeposition, d'une feuille metallique perforee de faible epaisseur, ainsi que procedes de realisation et d'utilisation d'un tel dispositif.
JP2727445B2 (ja) * 1991-05-25 1998-03-11 株式会社 シンク・ラボラトリー ロータリースクリーンの製造方法
US5328537A (en) * 1991-12-11 1994-07-12 Think Laboratory Co., Ltd. Method for manufacturing screen printing plate
US5334815A (en) * 1992-01-15 1994-08-02 Wear Guard Corp. Apparatus and method for producing a printing screen
US5573815A (en) * 1994-03-07 1996-11-12 E. I. Du Pont De Nemours And Company Process for making improved metal stencil screens for screen printing

Also Published As

Publication number Publication date
CN1123039A (zh) 1996-05-22
ATE180291T1 (de) 1999-06-15
CN1095881C (zh) 2002-12-11
DE4404560C1 (de) 1995-08-24
US5972194A (en) 1999-10-26
ES2133736T3 (es) 1999-09-16
AU1706195A (en) 1995-08-29
WO1995021951A1 (fr) 1995-08-17
GR3031024T3 (en) 1999-12-31
DE59505958D1 (de) 1999-06-24
EP0694088A1 (fr) 1996-01-31

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