EP0164580A3 - Electroless copper plating bath and plating method using such bath - Google Patents

Electroless copper plating bath and plating method using such bath Download PDF

Info

Publication number: EP0164580A3
Authority: EP; European Patent Office
Prior art keywords: bath; plating; electroless copper; copper plating; plating method
Prior art date: 1984-05-17
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

EP85105723A

Other versions

EP0164580B1 (en

EP0164580A2 (en

Inventor

William Joseph Amelio

Peter Gerard Bartolotta

Voya Markovich

Ralph Elliott Parsons

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

International Business Machines Corp

Original Assignee

International Business Machines Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1984-05-17

Filing date

1985-05-10

Publication date

1986-12-30

1985-05-10 Application filed by International Business Machines Corp filed Critical International Business Machines Corp

1985-12-18 Publication of EP0164580A2 publication Critical patent/EP0164580A2/en

1986-12-30 Publication of EP0164580A3 publication Critical patent/EP0164580A3/en

1989-09-20 Application granted granted Critical

1989-09-20 Publication of EP0164580B1 publication Critical patent/EP0164580B1/en

Status Expired legal-status Critical Current

Links

Classifications

- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents

EP19850105723 1984-05-17 1985-05-10 Electroless copper plating bath and plating method using such bath Expired EP0164580B1 (en)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
US61127884A	1984-05-17	1984-05-17
US611278		1996-03-19

Publications (3)

Publication Number	Publication Date
EP0164580A2 EP0164580A2 (en)	1985-12-18
EP0164580A3 true EP0164580A3 (en)	1986-12-30
EP0164580B1 EP0164580B1 (en)	1989-09-20

Family

ID=24448389

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP19850105723 Expired EP0164580B1 (en)	1984-05-17	1985-05-10	Electroless copper plating bath and plating method using such bath

Country Status (3)

Country	Link
EP (1)	EP0164580B1 (en)
JP (1)	JPS60245783A (en)
DE (1)	DE3573139D1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4654126A (en) *	1985-10-07	1987-03-31	International Business Machines Corporation	Process for determining the plating activity of an electroless plating bath
JPH0723539B2 (en) *	1986-11-06	1995-03-15	日本電装株式会社	Chemical copper plating solution and method for forming copper plating film using the same
AU579776B2 (en) *	1986-11-06	1988-12-08	Nippondenso Co. Ltd.	Electroless copper plating solution and process for electrolessly plating copper
US4814009A (en) *	1986-11-14	1989-03-21	Nippondenso Co., Ltd.	Electroless copper plating solution
JP2595319B2 (en) *	1988-07-20	1997-04-02	日本電装株式会社	Chemical copper plating solution and method for forming copper plating film using the same
JPH02161130A (en) *	1988-12-15	1990-06-21	Hino Motors Ltd	Control device for turbo-charger
US5965211A (en) *	1989-12-29	1999-10-12	Nippondenso Co., Ltd.	Electroless copper plating solution and process for formation of copper film
US8404035B2 (en)	2003-10-17	2013-03-26	Nippon Mining & Metals Co., Ltd.	Electroless copper plating solution

Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
FR1530167A (en) *	1967-07-03	1968-06-21	Shipley Co	Composition and process for the electroless chemical deposition of copper on objects with a catalytic surface

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5230131B2 (en) *	1973-07-11	1977-08-05
JPS5220339A (en) *	1975-08-08	1977-02-16	Hitachi Ltd	Chemical copper plating solution

1985
- 1985-01-14 JP JP340985A patent/JPS60245783A/en active Granted
- 1985-05-10 DE DE8585105723T patent/DE3573139D1/en not_active Expired
- 1985-05-10 EP EP19850105723 patent/EP0164580B1/en not_active Expired

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
FR1530167A (en) *	1967-07-03	1968-06-21	Shipley Co	Composition and process for the electroless chemical deposition of copper on objects with a catalytic surface

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
CHEMICAL ABSTRACTS, vol. 87, 1977, page 277, abstract no. 10159u, Columbus, Ohio, US; & JP-A-52 020 339 (HITACHI LTD.) 16-02-1977 *
METAL FINISHING ABSTRACTS, vol. 18, no. 1, 1976, page 18, right-hand column A, Electroless copper; & JP-A-50 026 730 (HITACHI K.K.) (19-03-1975) *

Also Published As

Publication number	Publication date
EP0164580B1 (en)	1989-09-20
EP0164580A2 (en)	1985-12-18
JPH0214430B2 (en)	1990-04-09
DE3573139D1 (en)	1989-10-26
JPS60245783A (en)	1985-12-05

Legal Events

Date	Code	Title	Description
1985-10-18	PUAI	Public reference made under article 153(3) epc to a published international application that has entered the european phase	Free format text: ORIGINAL CODE: 0009012
1985-12-18	AK	Designated contracting states	Designated state(s): DE FR GB
1986-05-28	17P	Request for examination filed	Effective date: 19860325
1986-11-11	PUAL	Search report despatched	Free format text: ORIGINAL CODE: 0009013
1986-12-30	AK	Designated contracting states	Kind code of ref document: A3 Designated state(s): DE FR GB
1988-03-09	17Q	First examination report despatched	Effective date: 19880122
1989-08-05	GRAA	(expected) grant	Free format text: ORIGINAL CODE: 0009210
1989-09-20	AK	Designated contracting states	Kind code of ref document: B1 Designated state(s): DE FR GB
1989-10-26	REF	Corresponds to:	Ref document number: 3573139 Country of ref document: DE Date of ref document: 19891026
1989-11-17	ET	Fr: translation filed
1990-07-12	PLBE	No opposition filed within time limit	Free format text: ORIGINAL CODE: 0009261
1990-07-12	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT
1990-08-29	26N	No opposition filed
1992-04-09	PGFP	Annual fee paid to national office [announced via postgrant information from national office to epo]	Ref country code: GB Payment date: 19920409 Year of fee payment: 8
1992-04-27	PGFP	Annual fee paid to national office [announced via postgrant information from national office to epo]	Ref country code: FR Payment date: 19920427 Year of fee payment: 8
1992-05-23	PGFP	Annual fee paid to national office [announced via postgrant information from national office to epo]	Ref country code: DE Payment date: 19920523 Year of fee payment: 8
1993-05-10	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: GB Effective date: 19930510
1994-01-05	GBPC	Gb: european patent ceased through non-payment of renewal fee	Effective date: 19930510
1994-01-31	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: FR Effective date: 19940131
1994-02-01	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: DE Effective date: 19940201
1994-03-25	REG	Reference to a national code	Ref country code: FR Ref legal event code: ST

Publication	Publication Date	Title
EP0196232A3 (en)	1987-04-01	Plating bath and method for electroplating tin and/or lead
DE3474043D1 (en)	1988-10-20	Electroless copper plating bath and method
GB2266318B (en)	1995-09-13	Electroless plating solution and plating method
GB8513501D0 (en)	1985-07-03	Copper electroplating
GB8531356D0 (en)	1986-02-05	Copper plating
DE3473890D1 (en)	1988-10-13	Electroless copper plating solution
DE3467187D1 (en)	1987-12-10	Electroless copper plating solution
IL84401A0 (en)	1988-04-29	Copper bath for electroless plating having excess counter-cation and process using same
GB2160897B (en)	1987-03-25	Electroless plating solution
DE3573139D1 (en)	1989-10-26	Electroless copper plating bath and plating method using such bath
GB9223122D0 (en)	1992-12-16	Cyanide-free copper plating bath and process
GB2163779B (en)	1988-09-14	Cr-alloy plating bath
DE3662278D1 (en)	1989-04-13	Apparatus and method for monitoring electroless metall plating baths
DE3473303D1 (en)	1988-09-15	Electrolytic copper plating
JPS5729593A (en)	1982-02-17	Cobalt-zinc alloy electroplating bath composition and plating method
GB2133040B (en)	1987-02-04	Copper plating bath process and anode therefore
GB8414871D0 (en)	1984-07-18	Gold plating baths
GB8921796D0 (en)	1989-11-08	Electroless gold plating bath and method of using the same
GB2114159B (en)	1986-02-12	Method and bath for the electroless plating of gold
GB2133041B (en)	1986-01-22	Palladium electroplating bath
GB2100758B (en)	1985-10-02	Method for chemical copper plating and bath to perform the method
GB8503104D0 (en)	1985-03-13	Electroless copper plating
GB2153386B (en)	1987-08-26	Gold alloy plating bath
ZA834937B (en)	1984-03-28	Edtp-containing electroless copper baths
DE3464505D1 (en)	1987-08-06	Tin-lead alloy plating bath