GB8503104D0 - Electroless copper plating - Google Patents

Electroless copper plating

Info

Publication number
GB8503104D0
GB8503104D0 GB858503104A GB8503104A GB8503104D0 GB 8503104 D0 GB8503104 D0 GB 8503104D0 GB 858503104 A GB858503104 A GB 858503104A GB 8503104 A GB8503104 A GB 8503104A GB 8503104 D0 GB8503104 D0 GB 8503104D0
Authority
GB
United Kingdom
Prior art keywords
copper plating
electroless copper
electroless
plating
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB858503104A
Other versions
GB2154250A (en
GB2154250B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OMI International Corp
Original Assignee
OMI International Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OMI International Corp filed Critical OMI International Corp
Publication of GB8503104D0 publication Critical patent/GB8503104D0/en
Publication of GB2154250A publication Critical patent/GB2154250A/en
Application granted granted Critical
Publication of GB2154250B publication Critical patent/GB2154250B/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde
GB08503104A 1984-02-17 1985-02-07 Complexing agent for electroless copper plating Expired GB2154250B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US57947284A 1984-02-17 1984-02-17

Publications (3)

Publication Number Publication Date
GB8503104D0 true GB8503104D0 (en) 1985-03-13
GB2154250A GB2154250A (en) 1985-09-04
GB2154250B GB2154250B (en) 1987-06-03

Family

ID=24317039

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08503104A Expired GB2154250B (en) 1984-02-17 1985-02-07 Complexing agent for electroless copper plating

Country Status (5)

Country Link
JP (1) JPS60194081A (en)
CA (1) CA1248705A (en)
DE (1) DE3504150A1 (en)
FR (1) FR2559788B1 (en)
GB (1) GB2154250B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013204107A (en) * 2012-03-29 2013-10-07 Kanto Gakuin Electroless plating method and wiring board

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3383224A (en) * 1965-11-09 1968-05-14 Shipley Co Electroless copper deposition
GB1195217A (en) * 1967-10-04 1970-06-17 Technograph Ltd Electroless Copper Plating.
US3992211A (en) * 1968-07-15 1976-11-16 Trans-Metals Corporation Electroless plating composition
US4265943A (en) * 1978-11-27 1981-05-05 Macdermid Incorporated Method and composition for continuous electroless copper deposition using a hypophosphite reducing agent in the presence of cobalt or nickel ions
CA1184359A (en) * 1981-10-23 1985-03-26 Donald A. Arcilesi Metallic impurity control for electroless copper plating

Also Published As

Publication number Publication date
FR2559788B1 (en) 1991-08-16
FR2559788A1 (en) 1985-08-23
CA1248705A (en) 1989-01-17
JPS60194081A (en) 1985-10-02
DE3504150C2 (en) 1987-08-13
JPH0218387B2 (en) 1990-04-25
DE3504150A1 (en) 1985-10-17
GB2154250A (en) 1985-09-04
GB2154250B (en) 1987-06-03

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19930207