DE3573139D1 - Electroless copper plating bath and plating method using such bath - Google Patents

Electroless copper plating bath and plating method using such bath

Info

Publication number
DE3573139D1
DE3573139D1 DE8585105723T DE3573139T DE3573139D1 DE 3573139 D1 DE3573139 D1 DE 3573139D1 DE 8585105723 T DE8585105723 T DE 8585105723T DE 3573139 T DE3573139 T DE 3573139T DE 3573139 D1 DE3573139 D1 DE 3573139D1
Authority
DE
Germany
Prior art keywords
bath
plating
electroless copper
copper plating
plating method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8585105723T
Other languages
German (de)
Inventor
William Joseph Amelio
Peter Gerard Bartolotta
Voya Markovich
Ralph Elliott Parsons
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3573139D1 publication Critical patent/DE3573139D1/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
DE8585105723T 1984-05-17 1985-05-10 Electroless copper plating bath and plating method using such bath Expired DE3573139D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US61127884A 1984-05-17 1984-05-17

Publications (1)

Publication Number Publication Date
DE3573139D1 true DE3573139D1 (en) 1989-10-26

Family

ID=24448389

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8585105723T Expired DE3573139D1 (en) 1984-05-17 1985-05-10 Electroless copper plating bath and plating method using such bath

Country Status (3)

Country Link
EP (1) EP0164580B1 (en)
JP (1) JPS60245783A (en)
DE (1) DE3573139D1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4654126A (en) * 1985-10-07 1987-03-31 International Business Machines Corporation Process for determining the plating activity of an electroless plating bath
JPH0723539B2 (en) * 1986-11-06 1995-03-15 日本電装株式会社 Chemical copper plating solution and method for forming copper plating film using the same
AU579776B2 (en) * 1986-11-06 1988-12-08 Nippondenso Co. Ltd. Electroless copper plating solution and process for electrolessly plating copper
US4814009A (en) * 1986-11-14 1989-03-21 Nippondenso Co., Ltd. Electroless copper plating solution
JP2595319B2 (en) * 1988-07-20 1997-04-02 日本電装株式会社 Chemical copper plating solution and method for forming copper plating film using the same
JPH02161130A (en) * 1988-12-15 1990-06-21 Hino Motors Ltd Control device for turbo-charger
US5965211A (en) * 1989-12-29 1999-10-12 Nippondenso Co., Ltd. Electroless copper plating solution and process for formation of copper film
US8404035B2 (en) 2003-10-17 2013-03-26 Nippon Mining & Metals Co., Ltd. Electroless copper plating solution

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1530167A (en) * 1967-07-03 1968-06-21 Shipley Co Composition and process for the electroless chemical deposition of copper on objects with a catalytic surface
JPS5230131B2 (en) * 1973-07-11 1977-08-05
JPS5220339A (en) * 1975-08-08 1977-02-16 Hitachi Ltd Chemical copper plating solution

Also Published As

Publication number Publication date
EP0164580B1 (en) 1989-09-20
EP0164580A3 (en) 1986-12-30
EP0164580A2 (en) 1985-12-18
JPH0214430B2 (en) 1990-04-09
JPS60245783A (en) 1985-12-05

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee