JPS5220339A - Chemical copper plating solution - Google Patents
Chemical copper plating solutionInfo
- Publication number
- JPS5220339A JPS5220339A JP9576875A JP9576875A JPS5220339A JP S5220339 A JPS5220339 A JP S5220339A JP 9576875 A JP9576875 A JP 9576875A JP 9576875 A JP9576875 A JP 9576875A JP S5220339 A JPS5220339 A JP S5220339A
- Authority
- JP
- Japan
- Prior art keywords
- plating solution
- copper plating
- chemical copper
- chemical
- solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9576875A JPS5220339A (en) | 1975-08-08 | 1975-08-08 | Chemical copper plating solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9576875A JPS5220339A (en) | 1975-08-08 | 1975-08-08 | Chemical copper plating solution |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5220339A true JPS5220339A (en) | 1977-02-16 |
Family
ID=14146655
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9576875A Pending JPS5220339A (en) | 1975-08-08 | 1975-08-08 | Chemical copper plating solution |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5220339A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5779166A (en) * | 1980-09-05 | 1982-05-18 | Philips Nv | Method for forming copper alloy layer and pattern on substrate and article made by said method |
| JPS58133365A (en) * | 1982-02-01 | 1983-08-09 | Hitachi Chem Co Ltd | Electroless copper plating liquid |
| JPS59116366A (en) * | 1982-12-24 | 1984-07-05 | Hitachi Ltd | Chemical copper plating solution |
| EP0164580A2 (en) * | 1984-05-17 | 1985-12-18 | International Business Machines Corporation | Electroless copper plating bath and plating method using such bath |
| JPS612386A (en) * | 1984-06-15 | 1986-01-08 | 株式会社日立製作所 | Method of producing printed circuit board |
| US6831009B2 (en) | 2000-10-03 | 2004-12-14 | Hitachi, Ltd. | Wiring substrate and an electroless copper plating solution for providing interlayer connections |
| JP2009536987A (en) * | 2006-05-11 | 2009-10-22 | ラム リサーチ コーポレーション | Plating solution for electroless deposition of copper |
| JP2009542911A (en) * | 2006-06-28 | 2009-12-03 | ラム リサーチ コーポレイション | Plating solution for electroless deposition of copper |
| JP2011231382A (en) * | 2010-04-28 | 2011-11-17 | Nagoya Plating Co Ltd | Plating liquid for polymer fiber, method for plating polymer fiber using the same, and method for producing the same |
-
1975
- 1975-08-08 JP JP9576875A patent/JPS5220339A/en active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5779166A (en) * | 1980-09-05 | 1982-05-18 | Philips Nv | Method for forming copper alloy layer and pattern on substrate and article made by said method |
| JPS58133365A (en) * | 1982-02-01 | 1983-08-09 | Hitachi Chem Co Ltd | Electroless copper plating liquid |
| JPH0416550B2 (en) * | 1982-02-01 | 1992-03-24 | Hitachi Chemical Co Ltd | |
| JPS6337187B2 (en) * | 1982-12-24 | 1988-07-25 | Hitachi Ltd | |
| JPS59116366A (en) * | 1982-12-24 | 1984-07-05 | Hitachi Ltd | Chemical copper plating solution |
| EP0164580A2 (en) * | 1984-05-17 | 1985-12-18 | International Business Machines Corporation | Electroless copper plating bath and plating method using such bath |
| JPS612386A (en) * | 1984-06-15 | 1986-01-08 | 株式会社日立製作所 | Method of producing printed circuit board |
| US6831009B2 (en) | 2000-10-03 | 2004-12-14 | Hitachi, Ltd. | Wiring substrate and an electroless copper plating solution for providing interlayer connections |
| US6989329B2 (en) | 2000-10-03 | 2006-01-24 | Hitachi, Ltd. | Method of manufacturing a wiring substrate and an electroless copper plating solution for providing interlayer connections |
| JP2009536987A (en) * | 2006-05-11 | 2009-10-22 | ラム リサーチ コーポレーション | Plating solution for electroless deposition of copper |
| JP2009542911A (en) * | 2006-06-28 | 2009-12-03 | ラム リサーチ コーポレイション | Plating solution for electroless deposition of copper |
| JP4686635B2 (en) * | 2006-06-28 | 2011-05-25 | ラム リサーチ コーポレイション | Plating solution for electroless deposition of copper |
| JP2011231382A (en) * | 2010-04-28 | 2011-11-17 | Nagoya Plating Co Ltd | Plating liquid for polymer fiber, method for plating polymer fiber using the same, and method for producing the same |
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