AU579776B2 - Electroless copper plating solution and process for electrolessly plating copper - Google Patents

Electroless copper plating solution and process for electrolessly plating copper

Info

Publication number: AU579776B2
Authority: AU; Australia
Prior art keywords: copper; plating; electrolessly; plating solution; electroless
Prior art date: 1986-11-06
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Ceased

Application number

AU80840/87A

Other versions

AU8084087A (en

Inventor

Futoshi Ishikawa

Nobumasa Isida

Junji Isikawa

Koji Kondo

Katuhiko Murakawa

Kaoru Nomoto

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Denso Corp

Original Assignee

NipponDenso Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1986-11-06

Filing date

1987-11-05

Publication date

1988-12-08

1987-10-30 Priority claimed from JP27349387A external-priority patent/JPH0723539B2/en

1987-11-05 Application filed by NipponDenso Co Ltd filed Critical NipponDenso Co Ltd

1988-05-26 Publication of AU8084087A publication Critical patent/AU8084087A/en

1988-12-08 Application granted granted Critical

1988-12-08 Publication of AU579776B2 publication Critical patent/AU579776B2/en

2007-11-05 Anticipated expiration legal-status Critical

Status Ceased legal-status Critical Current

Links

Classifications

- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents

AU80840/87A 1986-11-06 1987-11-05 Electroless copper plating solution and process for electrolessly plating copper Ceased AU579776B2 (en)

Applications Claiming Priority (6)

Application Number	Priority Date	Filing Date	Title
JP26261986		1986-11-06
JP30877986		1986-12-26
JP61-262619		1986-12-26
JP61-308779		1986-12-26
JP27349387A JPH0723539B2 (en)	1986-11-06	1987-10-30	Chemical copper plating solution and method for forming copper plating film using the same
JP62-273493		1987-10-30

Publications (2)

Publication Number	Publication Date
AU8084087A AU8084087A (en)	1988-05-26
AU579776B2 true AU579776B2 (en)	1988-12-08

Family

ID=27335148

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
AU80840/87A Ceased AU579776B2 (en)	1986-11-06	1987-11-05	Electroless copper plating solution and process for electrolessly plating copper

Country Status (2)

Country	Link
AU (1)	AU579776B2 (en)
DE (1)	DE3737778C2 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4301196A (en) *	1978-09-13	1981-11-17	Kollmorgen Technologies Corp.	Electroless copper deposition process having faster plating rates
EP0164580A2 (en) *	1984-05-17	1985-12-18	International Business Machines Corporation	Electroless copper plating bath and plating method using such bath
US4650691A (en) *	1983-09-28	1987-03-17	C. Uyemura & Co., Ltd.	Electroless copper plating bath and method

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3329512A (en) *	1966-04-04	1967-07-04	Shipley Co	Chemical deposition of copper and solutions therefor
DE1621352C3 (en) *	1967-02-03	1975-05-28	Schering Ag, 1000 Berlin Und 4619 Bergkamen	Stabilized alkaline copper bath for the electroless deposition of copper
US3793038A (en) *	1973-01-02	1974-02-19	Crown City Plating Co	Process for electroless plating

1987
- 1987-11-05 AU AU80840/87A patent/AU579776B2/en not_active Ceased
- 1987-11-06 DE DE3737778A patent/DE3737778C2/en not_active Expired - Fee Related

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4301196A (en) *	1978-09-13	1981-11-17	Kollmorgen Technologies Corp.	Electroless copper deposition process having faster plating rates
US4650691A (en) *	1983-09-28	1987-03-17	C. Uyemura & Co., Ltd.	Electroless copper plating bath and method
EP0164580A2 (en) *	1984-05-17	1985-12-18	International Business Machines Corporation	Electroless copper plating bath and plating method using such bath

Also Published As

Publication number	Publication date
DE3737778C2 (en)	1996-03-07
AU8084087A (en)	1988-05-26
DE3737778A1 (en)	1988-05-11

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Legal Events

Date	Code	Title	Description
2001-06-21	MK14	Patent ceased section 143(a) (annual fees not paid) or expired