DE69927476T2 - Halbleiteranordnung - Google Patents
Halbleiteranordnung Download PDFInfo
- Publication number
- DE69927476T2 DE69927476T2 DE69927476T DE69927476T DE69927476T2 DE 69927476 T2 DE69927476 T2 DE 69927476T2 DE 69927476 T DE69927476 T DE 69927476T DE 69927476 T DE69927476 T DE 69927476T DE 69927476 T2 DE69927476 T2 DE 69927476T2
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor device
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
- H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
- H01L27/0255—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using diodes as protective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
- H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
- H01L27/0259—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using bipolar transistors as protective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/07—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration the components having an active region in common
- H01L27/0705—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration the components having an active region in common comprising components of the field effect type
- H01L27/0727—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration the components having an active region in common comprising components of the field effect type in combination with diodes, or capacitors or resistors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Semiconductor Integrated Circuits (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP98201921 | 1998-06-09 | ||
PCT/IB1999/001006 WO1999065078A2 (en) | 1998-06-09 | 1999-06-03 | Semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69927476D1 DE69927476D1 (de) | 2005-11-03 |
DE69927476T2 true DE69927476T2 (de) | 2006-06-14 |
Family
ID=8233791
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69927476T Expired - Fee Related DE69927476T2 (de) | 1998-06-09 | 1999-06-03 | Halbleiteranordnung |
Country Status (7)
Country | Link |
---|---|
US (1) | US6229182B1 (de) |
EP (1) | EP1042807B1 (de) |
JP (1) | JP2002518831A (de) |
KR (1) | KR100626635B1 (de) |
DE (1) | DE69927476T2 (de) |
TW (1) | TW399337B (de) |
WO (1) | WO1999065078A2 (de) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3421005B2 (ja) * | 2000-08-11 | 2003-06-30 | シャープ株式会社 | 半導体装置の製造方法 |
US7186610B1 (en) * | 2004-08-13 | 2007-03-06 | Altera Corporation | ESD protection device for high performance IC |
US6858900B2 (en) * | 2001-10-08 | 2005-02-22 | Winbond Electronics Corp | ESD protection devices and methods to reduce trigger voltage |
US6952039B1 (en) * | 2002-03-12 | 2005-10-04 | National Semiconductor Corporation | ESD protection snapback structure for overvoltage self-protecting I/O cells |
JP4127007B2 (ja) * | 2002-09-30 | 2008-07-30 | ミツミ電機株式会社 | 半導体装置 |
JP2004296883A (ja) * | 2003-03-27 | 2004-10-21 | Sharp Corp | 半導体装置とその製造方法 |
US7482657B1 (en) | 2003-06-13 | 2009-01-27 | National Semiconductor Corporation | Balanced cells with fabrication mismatches that produce a unique number generator |
USRE43922E1 (en) * | 2003-06-13 | 2013-01-15 | National Semiconductor Corporation | Balanced cells with fabrication mismatches that produce a unique number generator |
JP4611066B2 (ja) * | 2004-04-13 | 2011-01-12 | 三菱電機株式会社 | アバランシェフォトダイオード |
JP4845410B2 (ja) * | 2005-03-31 | 2011-12-28 | 株式会社リコー | 半導体装置 |
JP4926468B2 (ja) * | 2005-12-07 | 2012-05-09 | ローム株式会社 | 静電破壊保護回路及びこれを備えた半導体集積回路装置 |
JP5849670B2 (ja) | 2011-12-09 | 2016-02-03 | セイコーエプソン株式会社 | 半導体装置 |
KR20200145955A (ko) | 2019-06-21 | 2020-12-31 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4100561A (en) * | 1976-05-24 | 1978-07-11 | Rca Corp. | Protective circuit for MOS devices |
JPS5489586A (en) * | 1977-12-27 | 1979-07-16 | Nec Corp | Mos type semiconductor device |
JPS63244874A (ja) * | 1987-03-31 | 1988-10-12 | Toshiba Corp | 入力保護回路 |
US4990976A (en) * | 1987-11-24 | 1991-02-05 | Nec Corporation | Semiconductor device including a field effect transistor having a protective diode between source and drain thereof |
FR2649830B1 (fr) * | 1989-07-13 | 1994-05-27 | Sgs Thomson Microelectronics | Structure de circuit integre cmos protege contre les decharges electrostatiques |
US5281841A (en) * | 1990-04-06 | 1994-01-25 | U.S. Philips Corporation | ESD protection element for CMOS integrated circuit |
EP0598146A1 (de) * | 1992-11-16 | 1994-05-25 | ALCATEL BELL Naamloze Vennootschap | Schutzanordnung gegen elektrostatische Entladungen |
US5430595A (en) * | 1993-10-15 | 1995-07-04 | Intel Corporation | Electrostatic discharge protection circuit |
EP0739542B1 (de) * | 1994-01-12 | 2002-05-02 | Atmel Corporation | Eingangs-/ausgangs-transistor mit optimierten schutz gegen esd |
US5455436A (en) * | 1994-05-19 | 1995-10-03 | Industrial Technology Research Institute | Protection circuit against electrostatic discharge using SCR structure |
US5440162A (en) * | 1994-07-26 | 1995-08-08 | Rockwell International Corporation | ESD protection for submicron CMOS circuits |
US5623156A (en) * | 1995-09-28 | 1997-04-22 | Cypress Semiconductor Corporation | Electrostatic discharge (ESD) protection circuit and structure for output drivers |
JPH09181267A (ja) * | 1995-10-31 | 1997-07-11 | Texas Instr Inc <Ti> | Esd保護回路 |
KR100200352B1 (ko) * | 1995-12-30 | 1999-06-15 | 윤종용 | 반도체 장치의 보호 소자 |
TW299495B (en) * | 1996-05-03 | 1997-03-01 | Winbond Electronics Corp | Electrostatic discharge protection circuit |
JPH11233641A (ja) * | 1998-02-10 | 1999-08-27 | Seiko Epson Corp | 半導体装置及び半導体装置の製造方法 |
-
1998
- 1998-12-02 TW TW087119970A patent/TW399337B/zh not_active IP Right Cessation
-
1999
- 1999-06-03 WO PCT/IB1999/001006 patent/WO1999065078A2/en active IP Right Grant
- 1999-06-03 DE DE69927476T patent/DE69927476T2/de not_active Expired - Fee Related
- 1999-06-03 KR KR1020007001257A patent/KR100626635B1/ko not_active IP Right Cessation
- 1999-06-03 JP JP2000553997A patent/JP2002518831A/ja active Pending
- 1999-06-03 EP EP99955563A patent/EP1042807B1/de not_active Expired - Lifetime
- 1999-06-07 US US09/326,894 patent/US6229182B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
KR100626635B1 (ko) | 2006-09-22 |
TW399337B (en) | 2000-07-21 |
KR20010022662A (ko) | 2001-03-26 |
WO1999065078A2 (en) | 1999-12-16 |
DE69927476D1 (de) | 2005-11-03 |
US6229182B1 (en) | 2001-05-08 |
EP1042807A2 (de) | 2000-10-11 |
JP2002518831A (ja) | 2002-06-25 |
EP1042807B1 (de) | 2005-09-28 |
WO1999065078A3 (en) | 2000-06-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8320 | Willingness to grant licences declared (paragraph 23) | ||
8328 | Change in the person/name/address of the agent |
Representative=s name: VOLMER, G., DIPL.-ING., PAT.-ANW., 52066 AACHEN |
|
8364 | No opposition during term of opposition | ||
8328 | Change in the person/name/address of the agent |
Representative=s name: EISENFUEHR, SPEISER & PARTNER, 10178 BERLIN |
|
8327 | Change in the person/name/address of the patent owner |
Owner name: NXP B.V., EINDHOVEN, NL |
|
8339 | Ceased/non-payment of the annual fee |