DE69739242D1 - Halbleitervorrichtung - Google Patents
HalbleitervorrichtungInfo
- Publication number
- DE69739242D1 DE69739242D1 DE69739242T DE69739242T DE69739242D1 DE 69739242 D1 DE69739242 D1 DE 69739242D1 DE 69739242 T DE69739242 T DE 69739242T DE 69739242 T DE69739242 T DE 69739242T DE 69739242 D1 DE69739242 D1 DE 69739242D1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor device
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/107—Substrate region of field-effect devices
- H01L29/1075—Substrate region of field-effect devices of field-effect transistors
- H01L29/1079—Substrate region of field-effect devices of field-effect transistors with insulated gate
- H01L29/1087—Substrate region of field-effect devices of field-effect transistors with insulated gate characterised by the contact structure of the substrate region, e.g. for controlling or preventing bipolar effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
- H01L27/088—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
- H01L27/092—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7831—Field effect transistors with field effect produced by an insulated gate with multiple gate structure
- H01L29/7832—Field effect transistors with field effect produced by an insulated gate with multiple gate structure the structure comprising a MOS gate and at least one non-MOS gate, e.g. JFET or MESFET gate
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Thin Film Transistor (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8324465A JPH10163342A (ja) | 1996-12-04 | 1996-12-04 | 半導体装置 |
PCT/JP1997/004344 WO1998025307A1 (en) | 1996-12-04 | 1997-11-27 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
DE69739242D1 true DE69739242D1 (de) | 2009-03-19 |
Family
ID=18166125
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69739242T Expired - Lifetime DE69739242D1 (de) | 1996-12-04 | 1997-11-27 | Halbleitervorrichtung |
Country Status (7)
Country | Link |
---|---|
US (1) | US6288429B1 (de) |
EP (1) | EP0951071B1 (de) |
JP (1) | JPH10163342A (de) |
KR (1) | KR100294039B1 (de) |
DE (1) | DE69739242D1 (de) |
TW (1) | TW365017B (de) |
WO (1) | WO1998025307A1 (de) |
Families Citing this family (70)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4837154B2 (ja) | 1997-05-30 | 2011-12-14 | シャープ株式会社 | 半導体装置およびその駆動方法 |
US6172405B1 (en) | 1998-07-17 | 2001-01-09 | Sharp Kabushiki Kaisha | Semiconductor device and production process therefore |
AU2001286895A1 (en) | 2000-08-29 | 2002-03-13 | Boise State University | Damascene double gated transistors and related manufacturing methods |
JP3950294B2 (ja) * | 2000-11-16 | 2007-07-25 | シャープ株式会社 | 半導体装置 |
JP2002237575A (ja) * | 2001-02-08 | 2002-08-23 | Sharp Corp | 半導体装置及びその製造方法 |
EP1378943A4 (de) * | 2001-04-12 | 2008-04-02 | Matsushita Electric Ind Co Ltd | Halbleiterbauelement und verfahren zu seiner herstellung |
JP2003332582A (ja) | 2002-05-13 | 2003-11-21 | Toshiba Corp | 半導体装置及びその製造方法 |
JP4791686B2 (ja) * | 2003-06-05 | 2011-10-12 | シャープ株式会社 | 動的閾値動作トランジスタ |
JP4533099B2 (ja) * | 2004-11-17 | 2010-08-25 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
US8421121B2 (en) * | 2007-04-18 | 2013-04-16 | Northrop Grumman Systems Corporation | Antimonide-based compound semiconductor with titanium tungsten stack |
US9105715B2 (en) * | 2009-04-30 | 2015-08-11 | Mitsubishi Electric Corporation | Semiconductor device and method for manufacturing the same |
US8421162B2 (en) | 2009-09-30 | 2013-04-16 | Suvolta, Inc. | Advanced transistors with punch through suppression |
US8273617B2 (en) | 2009-09-30 | 2012-09-25 | Suvolta, Inc. | Electronic devices and systems, and methods for making and using the same |
WO2011062789A1 (en) * | 2009-11-17 | 2011-05-26 | Suvolta, Inc. | Electronic devices and systems,and methods for making and using the same |
US8530286B2 (en) | 2010-04-12 | 2013-09-10 | Suvolta, Inc. | Low power semiconductor transistor structure and method of fabrication thereof |
US8569128B2 (en) | 2010-06-21 | 2013-10-29 | Suvolta, Inc. | Semiconductor structure and method of fabrication thereof with mixed metal types |
US8759872B2 (en) | 2010-06-22 | 2014-06-24 | Suvolta, Inc. | Transistor with threshold voltage set notch and method of fabrication thereof |
US8377783B2 (en) | 2010-09-30 | 2013-02-19 | Suvolta, Inc. | Method for reducing punch-through in a transistor device |
US8404551B2 (en) | 2010-12-03 | 2013-03-26 | Suvolta, Inc. | Source/drain extension control for advanced transistors |
US8461875B1 (en) | 2011-02-18 | 2013-06-11 | Suvolta, Inc. | Digital circuits having improved transistors, and methods therefor |
US8525271B2 (en) | 2011-03-03 | 2013-09-03 | Suvolta, Inc. | Semiconductor structure with improved channel stack and method for fabrication thereof |
US8400219B2 (en) | 2011-03-24 | 2013-03-19 | Suvolta, Inc. | Analog circuits having improved transistors, and methods therefor |
US8748270B1 (en) | 2011-03-30 | 2014-06-10 | Suvolta, Inc. | Process for manufacturing an improved analog transistor |
US8796048B1 (en) | 2011-05-11 | 2014-08-05 | Suvolta, Inc. | Monitoring and measurement of thin film layers |
US8999861B1 (en) | 2011-05-11 | 2015-04-07 | Suvolta, Inc. | Semiconductor structure with substitutional boron and method for fabrication thereof |
US8811068B1 (en) | 2011-05-13 | 2014-08-19 | Suvolta, Inc. | Integrated circuit devices and methods |
US8569156B1 (en) | 2011-05-16 | 2013-10-29 | Suvolta, Inc. | Reducing or eliminating pre-amorphization in transistor manufacture |
US8735987B1 (en) | 2011-06-06 | 2014-05-27 | Suvolta, Inc. | CMOS gate stack structures and processes |
US8995204B2 (en) | 2011-06-23 | 2015-03-31 | Suvolta, Inc. | Circuit devices and methods having adjustable transistor body bias |
US8629016B1 (en) | 2011-07-26 | 2014-01-14 | Suvolta, Inc. | Multiple transistor types formed in a common epitaxial layer by differential out-diffusion from a doped underlayer |
KR101891373B1 (ko) | 2011-08-05 | 2018-08-24 | 엠아이이 후지쯔 세미컨덕터 리미티드 | 핀 구조물을 갖는 반도체 디바이스 및 그 제조 방법 |
US8748986B1 (en) | 2011-08-05 | 2014-06-10 | Suvolta, Inc. | Electronic device with controlled threshold voltage |
US8614128B1 (en) | 2011-08-23 | 2013-12-24 | Suvolta, Inc. | CMOS structures and processes based on selective thinning |
US8645878B1 (en) | 2011-08-23 | 2014-02-04 | Suvolta, Inc. | Porting a circuit design from a first semiconductor process to a second semiconductor process |
US8713511B1 (en) | 2011-09-16 | 2014-04-29 | Suvolta, Inc. | Tools and methods for yield-aware semiconductor manufacturing process target generation |
JP5742631B2 (ja) * | 2011-09-28 | 2015-07-01 | 富士通セミコンダクター株式会社 | 半導体装置の製造方法 |
US9236466B1 (en) | 2011-10-07 | 2016-01-12 | Mie Fujitsu Semiconductor Limited | Analog circuits having improved insulated gate transistors, and methods therefor |
US8895327B1 (en) | 2011-12-09 | 2014-11-25 | Suvolta, Inc. | Tipless transistors, short-tip transistors, and methods and circuits therefor |
US8819603B1 (en) | 2011-12-15 | 2014-08-26 | Suvolta, Inc. | Memory circuits and methods of making and designing the same |
US8883600B1 (en) | 2011-12-22 | 2014-11-11 | Suvolta, Inc. | Transistor having reduced junction leakage and methods of forming thereof |
US8599623B1 (en) | 2011-12-23 | 2013-12-03 | Suvolta, Inc. | Circuits and methods for measuring circuit elements in an integrated circuit device |
US8970289B1 (en) | 2012-01-23 | 2015-03-03 | Suvolta, Inc. | Circuits and devices for generating bi-directional body bias voltages, and methods therefor |
US8877619B1 (en) | 2012-01-23 | 2014-11-04 | Suvolta, Inc. | Process for manufacture of integrated circuits with different channel doping transistor architectures and devices therefrom |
US9093550B1 (en) | 2012-01-31 | 2015-07-28 | Mie Fujitsu Semiconductor Limited | Integrated circuits having a plurality of high-K metal gate FETs with various combinations of channel foundation structure and gate stack structure and methods of making same |
US9406567B1 (en) | 2012-02-28 | 2016-08-02 | Mie Fujitsu Semiconductor Limited | Method for fabricating multiple transistor devices on a substrate with varying threshold voltages |
US8863064B1 (en) | 2012-03-23 | 2014-10-14 | Suvolta, Inc. | SRAM cell layout structure and devices therefrom |
US9299698B2 (en) | 2012-06-27 | 2016-03-29 | Mie Fujitsu Semiconductor Limited | Semiconductor structure with multiple transistors having various threshold voltages |
JP2014013792A (ja) * | 2012-07-03 | 2014-01-23 | Fujitsu Semiconductor Ltd | 半導体装置およびその製造方法 |
US8637955B1 (en) | 2012-08-31 | 2014-01-28 | Suvolta, Inc. | Semiconductor structure with reduced junction leakage and method of fabrication thereof |
US9112057B1 (en) | 2012-09-18 | 2015-08-18 | Mie Fujitsu Semiconductor Limited | Semiconductor devices with dopant migration suppression and method of fabrication thereof |
US9041126B2 (en) | 2012-09-21 | 2015-05-26 | Mie Fujitsu Semiconductor Limited | Deeply depleted MOS transistors having a screening layer and methods thereof |
WO2014071049A2 (en) | 2012-10-31 | 2014-05-08 | Suvolta, Inc. | Dram-type device with low variation transistor peripheral circuits, and related methods |
US8816754B1 (en) | 2012-11-02 | 2014-08-26 | Suvolta, Inc. | Body bias circuits and methods |
US9093997B1 (en) | 2012-11-15 | 2015-07-28 | Mie Fujitsu Semiconductor Limited | Slew based process and bias monitors and related methods |
US9070477B1 (en) | 2012-12-12 | 2015-06-30 | Mie Fujitsu Semiconductor Limited | Bit interleaved low voltage static random access memory (SRAM) and related methods |
US9112484B1 (en) | 2012-12-20 | 2015-08-18 | Mie Fujitsu Semiconductor Limited | Integrated circuit process and bias monitors and related methods |
US9268885B1 (en) | 2013-02-28 | 2016-02-23 | Mie Fujitsu Semiconductor Limited | Integrated circuit device methods and models with predicted device metric variations |
US8994415B1 (en) | 2013-03-01 | 2015-03-31 | Suvolta, Inc. | Multiple VDD clock buffer |
US8988153B1 (en) | 2013-03-09 | 2015-03-24 | Suvolta, Inc. | Ring oscillator with NMOS or PMOS variation insensitivity |
US9299801B1 (en) | 2013-03-14 | 2016-03-29 | Mie Fujitsu Semiconductor Limited | Method for fabricating a transistor device with a tuned dopant profile |
US9112495B1 (en) | 2013-03-15 | 2015-08-18 | Mie Fujitsu Semiconductor Limited | Integrated circuit device body bias circuits and methods |
US9449967B1 (en) | 2013-03-15 | 2016-09-20 | Fujitsu Semiconductor Limited | Transistor array structure |
JP6123462B2 (ja) * | 2013-04-30 | 2017-05-10 | 富士通セミコンダクター株式会社 | 半導体装置及び半導体装置の製造方法 |
US9478571B1 (en) | 2013-05-24 | 2016-10-25 | Mie Fujitsu Semiconductor Limited | Buried channel deeply depleted channel transistor |
US8976575B1 (en) | 2013-08-29 | 2015-03-10 | Suvolta, Inc. | SRAM performance monitor |
US9710006B2 (en) | 2014-07-25 | 2017-07-18 | Mie Fujitsu Semiconductor Limited | Power up body bias circuits and methods |
US9319013B2 (en) | 2014-08-19 | 2016-04-19 | Mie Fujitsu Semiconductor Limited | Operational amplifier input offset correction with transistor threshold voltage adjustment |
KR101666753B1 (ko) * | 2015-06-18 | 2016-10-14 | 주식회사 동부하이텍 | 고비저항 기판 상에 형성된 반도체 소자 및 무선 주파수 모듈 |
KR101666752B1 (ko) | 2015-06-18 | 2016-10-14 | 주식회사 동부하이텍 | 고비저항 기판 상에 형성된 반도체 소자 및 무선 주파수 모듈 |
KR101692625B1 (ko) | 2015-06-18 | 2017-01-03 | 주식회사 동부하이텍 | 고비저항 기판 상에 형성된 반도체 소자 및 무선 주파수 모듈 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4264857A (en) | 1978-06-30 | 1981-04-28 | International Business Machines Corporation | Constant voltage threshold device |
US4605377A (en) * | 1984-06-21 | 1986-08-12 | Outboard Marine Corporation | Manual lift means for marine propulsion device |
JP2658027B2 (ja) * | 1986-11-21 | 1997-09-30 | セイコーエプソン株式会社 | 半導体装置の製造方法 |
JP2864863B2 (ja) * | 1992-04-23 | 1999-03-08 | 日本電気株式会社 | 半導体集積回路装置およびその製造方法 |
JPH0653422A (ja) * | 1992-07-28 | 1994-02-25 | Hitachi Ltd | 半導体集積回路装置及びその製造方法 |
JP3381281B2 (ja) * | 1992-10-31 | 2003-02-24 | ソニー株式会社 | 半導体装置 |
JPH07335837A (ja) * | 1994-06-03 | 1995-12-22 | Hitachi Ltd | 半導体装置および論理回路 |
US5559368A (en) | 1994-08-30 | 1996-09-24 | The Regents Of The University Of California | Dynamic threshold voltage mosfet having gate to body connection for ultra-low voltage operation |
EP0751573A1 (de) * | 1995-06-30 | 1997-01-02 | STMicroelectronics S.r.l. | Integrierte Leistungsschaltung und Verfahren zur Herstellung derselben |
US5985709A (en) * | 1996-04-16 | 1999-11-16 | United Microelectronics Corp. | Process for fabricating a triple-well structure for semiconductor integrated circuit devices |
US5914547A (en) * | 1997-11-21 | 1999-06-22 | Magnetek, Inc. | Auxiliary bearing assembly for reduction of unwanted shaft voltages in an electric motor |
-
1996
- 1996-12-04 JP JP8324465A patent/JPH10163342A/ja not_active Withdrawn
-
1997
- 1997-11-27 US US09/319,517 patent/US6288429B1/en not_active Expired - Lifetime
- 1997-11-27 DE DE69739242T patent/DE69739242D1/de not_active Expired - Lifetime
- 1997-11-27 EP EP97913464A patent/EP0951071B1/de not_active Expired - Lifetime
- 1997-11-27 WO PCT/JP1997/004344 patent/WO1998025307A1/ja active IP Right Grant
- 1997-11-29 TW TW086117984A patent/TW365017B/zh not_active IP Right Cessation
-
1999
- 1999-06-04 KR KR1019997004952A patent/KR100294039B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR100294039B1 (ko) | 2001-06-15 |
EP0951071B1 (de) | 2009-02-04 |
EP0951071A1 (de) | 1999-10-20 |
JPH10163342A (ja) | 1998-06-19 |
TW365017B (en) | 1999-07-21 |
WO1998025307A1 (en) | 1998-06-11 |
US6288429B1 (en) | 2001-09-11 |
KR20000057396A (ko) | 2000-09-15 |
EP0951071A4 (de) | 2001-03-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |