DE69614335T2 - Photopolymerisierbare, gefüllte Vinylesterharzmischung, Film und gehärtetes Produkt daraus - Google Patents
Photopolymerisierbare, gefüllte Vinylesterharzmischung, Film und gehärtetes Produkt darausInfo
- Publication number
- DE69614335T2 DE69614335T2 DE69614335T DE69614335T DE69614335T2 DE 69614335 T2 DE69614335 T2 DE 69614335T2 DE 69614335 T DE69614335 T DE 69614335T DE 69614335 T DE69614335 T DE 69614335T DE 69614335 T2 DE69614335 T2 DE 69614335T2
- Authority
- DE
- Germany
- Prior art keywords
- photopolymerizable
- film
- vinyl ester
- ester resin
- resin mixture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
- H01C17/06593—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the temporary binder
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
- C08F290/064—Polymers containing more than one epoxy group per molecule
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
- C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
- C08G59/1455—Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4292—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof together with monocarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/16—Solid spheres
- C08K7/18—Solid spheres inorganic
- C08K7/20—Glass
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C08L63/10—Epoxy resins modified by unsaturated compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
- H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
- H01J11/20—Constructional details
- H01J11/34—Vessels, containers or parts thereof, e.g. substrates
- H01J11/42—Fluorescent layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
- H01J9/241—Manufacture or joining of vessels, leading-in conductors or bases the vessel being for a flat panel display
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2329/00—Electron emission display panels, e.g. field emission display panels
- H01J2329/86—Vessels
- H01J2329/8625—Spacing members
- H01J2329/864—Spacing members characterised by the material
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Emergency Medicine (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Materials Engineering (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28819495 | 1995-10-11 | ||
JP31489095 | 1995-11-09 | ||
JP21596196A JP3681021B2 (ja) | 1995-10-11 | 1996-07-30 | 樹脂組成物、そのフィルム及びその硬化物 |
JP21596096A JPH1048815A (ja) | 1996-07-30 | 1996-07-30 | 樹脂組成物、そのフィルム及びその硬化物 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69614335D1 DE69614335D1 (de) | 2001-09-13 |
DE69614335T2 true DE69614335T2 (de) | 2001-11-22 |
Family
ID=27476754
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69614335T Expired - Fee Related DE69614335T2 (de) | 1995-10-11 | 1996-10-02 | Photopolymerisierbare, gefüllte Vinylesterharzmischung, Film und gehärtetes Produkt daraus |
Country Status (4)
Country | Link |
---|---|
US (1) | US5973034A (de) |
EP (1) | EP0768339B1 (de) |
KR (1) | KR100482253B1 (de) |
DE (1) | DE69614335T2 (de) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100383253B1 (ko) * | 1997-12-31 | 2003-08-14 | 고려화학 주식회사 | F.r.p 절연봉 인발성형용 비닐에스테르 수지와 이를 이용한인발성형품의 제조방법 |
KR20000015469A (ko) * | 1998-08-29 | 2000-03-15 | 박이순 | 광중합형 감광성 형광체 페이스트 조성물및 이를 이용한 형광막의 형성방법 |
CN1318915C (zh) * | 1999-07-12 | 2007-05-30 | 太阳油墨制造株式会社 | 碱显影型光固化性组合物及使用该组合物所得的烧成物图案 |
GB2360292B (en) | 2000-03-15 | 2002-04-03 | Murata Manufacturing Co | Photosensitive thick film composition and electronic device using the same |
KR100357902B1 (ko) * | 2000-05-27 | 2002-10-25 | 주식회사 큐시스 | 전기 전도성 마이크로겔 및 이의 제조방법 |
US7372127B2 (en) * | 2001-02-15 | 2008-05-13 | Integral Technologies, Inc. | Low cost and versatile resistors manufactured from conductive loaded resin-based materials |
US6989412B2 (en) | 2001-06-06 | 2006-01-24 | Henkel Corporation | Epoxy molding compounds containing phosphor and process for preparing such compositions |
KR100479317B1 (ko) * | 2001-12-31 | 2005-03-25 | 주식회사 디피아이 | 도금강판용 에멀젼 수지 및 이의 제조방법 |
US20040113127A1 (en) * | 2002-12-17 | 2004-06-17 | Min Gary Yonggang | Resistor compositions having a substantially neutral temperature coefficient of resistance and methods and compositions relating thereto |
TW200630447A (en) * | 2004-11-19 | 2006-09-01 | Showa Denko Kk | Resin cured film for flexible printed wiring board and production process thereof |
US7910022B2 (en) | 2006-09-15 | 2011-03-22 | Performance Indicator, Llc | Phosphorescent compositions for identification |
US20060159925A1 (en) | 2004-12-20 | 2006-07-20 | Satish Agrawal | High-intensity, persistent thermochromic compositions and objects, and methods for creating the same |
US7547894B2 (en) | 2006-09-15 | 2009-06-16 | Performance Indicator, L.L.C. | Phosphorescent compositions and methods for identification using the same |
US7842128B2 (en) | 2007-09-13 | 2010-11-30 | Performance Indicatior LLC | Tissue marking compositions |
US8039193B2 (en) | 2007-09-13 | 2011-10-18 | Performance Indicator Llc | Tissue markings and methods for reversibly marking tissue employing the same |
US7857997B2 (en) * | 2008-05-28 | 2010-12-28 | Bemis Company, Inc. | Conductive ink formulations |
US11203659B2 (en) | 2016-05-31 | 2021-12-21 | Showa Denko K. K. | Method for producing polyurethane, epoxy carboxylate composition, polyurethane, and polyurethane resin composition |
JP7419246B2 (ja) * | 2018-09-18 | 2024-01-22 | 日本化薬株式会社 | 反応性ポリカルボン酸樹脂混合物、それを用いた活性エネルギー線硬化型樹脂組成物およびその硬化物、並びに反応性エポキシカルボキシレート樹脂混合物 |
Family Cites Families (41)
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US3418295A (en) * | 1965-04-27 | 1968-12-24 | Du Pont | Polymers and their preparation |
US3980483A (en) * | 1972-04-24 | 1976-09-14 | Nippon Oil Seal Industry Co., Ltd. | Photocurable composition |
US4110184A (en) * | 1973-04-24 | 1978-08-29 | Imperial Chemical Industries Limited | Photocurable dental filling compositions |
GB1481131A (en) * | 1974-03-22 | 1977-07-27 | Nat Starch Chem Corp | Actinic radiation curable materials |
US4072592A (en) * | 1974-05-20 | 1978-02-07 | Mobil Oil Corporation | Radiation curable coating |
JPS5296690A (en) * | 1976-02-10 | 1977-08-13 | Dainippon Ink & Chem Inc | Rapidly curable photo-setting resin composition |
US4188449A (en) * | 1977-08-04 | 1980-02-12 | Eastman Kodak Company | Phosphorescent screens |
JPS5640329A (en) * | 1979-09-12 | 1981-04-16 | Sharp Corp | Control unit |
JPS5833905B2 (ja) * | 1979-11-14 | 1983-07-22 | タムラ化研株式会社 | 速硬化性電気素子用塗料組成物 |
JPS5849702A (ja) * | 1981-09-18 | 1983-03-24 | Matsushita Electric Works Ltd | 光硬化性樹脂組成物 |
GB2111072A (en) * | 1981-12-08 | 1983-06-29 | Johnson Matthey Plc | Ultra violet-curable ink or paint containing electrically conductive metal particles |
JPS60119546A (ja) * | 1983-12-02 | 1985-06-27 | Suriibondo:Kk | 活性エネルギ線硬化性ソルダマスキング剤組成物 |
JPS60208337A (ja) * | 1984-04-03 | 1985-10-19 | Mitsubishi Rayon Co Ltd | 耐摩耗性に優れた耐熱性樹脂成形品およびその製造法 |
JPS6159447A (ja) * | 1984-08-31 | 1986-03-26 | Sony Corp | 感光性樹脂組成物 |
JPS61243869A (ja) * | 1985-04-19 | 1986-10-30 | Taiyo Ink Seizo Kk | レジストインキ組成物 |
GB8602402D0 (en) * | 1986-01-31 | 1986-03-05 | Sericol Group Ltd | Coating compositions |
JPH0826118B2 (ja) * | 1987-06-16 | 1996-03-13 | 日本化薬株式会社 | 樹脂組成物及びソルダ−レジスト樹脂組成物 |
JPS6462375A (en) * | 1987-09-02 | 1989-03-08 | Arakawa Chem Ind | Liquid photosolder resist ink composition of alkali development type |
JPH0268A (ja) * | 1987-11-13 | 1990-01-05 | Toshiba Corp | ソルダ−レジスト組成物 |
JPH01141908A (ja) * | 1987-11-30 | 1989-06-02 | Dainippon Ink & Chem Inc | 活性エネルギー線硬化性樹脂組成物 |
JPH0717737B2 (ja) * | 1987-11-30 | 1995-03-01 | 太陽インキ製造株式会社 | 感光性熱硬化性樹脂組成物及びソルダーレジストパターン形成方法 |
US5215863A (en) * | 1987-12-18 | 1993-06-01 | Nippon Kayaku Kabushiki Kaisha | Resin composition and solder resist composition |
JPH01161038A (ja) * | 1987-12-18 | 1989-06-23 | Nippon Kayaku Co Ltd | 樹脂組成物及びソルダーレジスト樹脂組成物 |
GB8804044D0 (en) * | 1988-02-22 | 1988-03-23 | Coates Brothers Plc | Coating compositions |
JPH0823694B2 (ja) * | 1988-08-04 | 1996-03-06 | 富士写真フイルム株式会社 | 液状感光性樹脂組成物 |
JPH07103213B2 (ja) * | 1988-10-04 | 1995-11-08 | 日本化薬株式会社 | 不飽和基含有ポリカルボン酸樹脂を含む樹脂組成物及びソルダーレジスト樹脂組成物 |
JPH0823695B2 (ja) * | 1988-12-27 | 1996-03-06 | タムラ化研株式会社 | 感光性樹脂組成物 |
JP2668276B2 (ja) * | 1990-01-30 | 1997-10-27 | 富士写真フイルム株式会社 | 感光性樹脂組成物 |
JPH03247678A (ja) * | 1990-02-27 | 1991-11-05 | Nippon Kayaku Co Ltd | 乾式平版印刷インキ及びその硬化物 |
JP2862313B2 (ja) * | 1990-02-28 | 1999-03-03 | 山栄化学株式会社 | ソルダーレジストインキ組成物及びその硬化物 |
DE4025687A1 (de) * | 1990-08-14 | 1992-02-20 | Ruetgerswerke Ag | Durch strahlung vernetzbare bindemittelgemische |
US5218061A (en) * | 1990-09-17 | 1993-06-08 | Nippon Kayaku Kabushiki Kaisha | Partially post-glycidylated epoxy resin, epoxy resin composition and cured product thereof |
JP2938960B2 (ja) * | 1990-11-01 | 1999-08-25 | 互応化学工業株式会社 | 液状レジストインク組成物 |
CA2055833C (en) * | 1990-11-20 | 2001-04-24 | Katsue Nishikawa | Preparation of unsaturated epoxy ester resin and carboxylated unsaturated epoxy ester resin and photosensitive composition comprising the same |
JP2764480B2 (ja) * | 1991-05-17 | 1998-06-11 | 日本化薬株式会社 | カラーフィルター用光重合組成物 |
JP2868189B2 (ja) * | 1991-07-25 | 1999-03-10 | 日本化薬株式会社 | 樹脂組成物及び硬化物 |
JP2868190B2 (ja) * | 1991-07-29 | 1999-03-10 | 日本化薬株式会社 | 樹脂組成物、ソルダーレジスト樹脂組成物及びこれらの硬化物 |
JP3329877B2 (ja) * | 1993-03-02 | 2002-09-30 | 互応化学工業株式会社 | プリント回路基板製造用レジストインク組成物、それを用いたレジスト膜及びプリント回路基板 |
JP2877659B2 (ja) * | 1993-05-10 | 1999-03-31 | 日本化薬株式会社 | レジストインキ組成物及びその硬化物 |
DE4316401A1 (de) * | 1993-05-17 | 1994-11-24 | Ruetgerswerke Ag | Durch Strahlung vernetzbare und thermisch nachhärtbare Bindemittel |
JPH07286032A (ja) * | 1994-04-20 | 1995-10-31 | Nippon Kayaku Co Ltd | 導体ペースト組成物及びその硬化物 |
-
1996
- 1996-09-30 US US08/722,302 patent/US5973034A/en not_active Expired - Fee Related
- 1996-10-02 EP EP96115759A patent/EP0768339B1/de not_active Expired - Lifetime
- 1996-10-02 DE DE69614335T patent/DE69614335T2/de not_active Expired - Fee Related
- 1996-10-11 KR KR1019960045801A patent/KR100482253B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR970021136A (ko) | 1997-05-28 |
EP0768339A3 (de) | 1997-06-11 |
EP0768339B1 (de) | 2001-08-08 |
KR100482253B1 (ko) | 2005-06-23 |
DE69614335D1 (de) | 2001-09-13 |
EP0768339A2 (de) | 1997-04-16 |
US5973034A (en) | 1999-10-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |