DE69309144D1 - Härtbare Harzzusammensetzung - Google Patents

Härtbare Harzzusammensetzung

Info

Publication number
DE69309144D1
DE69309144D1 DE69309144T DE69309144T DE69309144D1 DE 69309144 D1 DE69309144 D1 DE 69309144D1 DE 69309144 T DE69309144 T DE 69309144T DE 69309144 T DE69309144 T DE 69309144T DE 69309144 D1 DE69309144 D1 DE 69309144D1
Authority
DE
Germany
Prior art keywords
resin composition
curable resin
curable
composition
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69309144T
Other languages
English (en)
Other versions
DE69309144T2 (de
Inventor
Yoshitsugu Morita
Noriyasu Yokoyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
Original Assignee
Dow Corning Toray Silicone Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Silicone Co Ltd filed Critical Dow Corning Toray Silicone Co Ltd
Publication of DE69309144D1 publication Critical patent/DE69309144D1/de
Application granted granted Critical
Publication of DE69309144T2 publication Critical patent/DE69309144T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • C08L83/06Polysiloxanes containing silicon bound to oxygen-containing groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22Di-epoxy compounds
    • C08G59/30Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/306Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00Compositions of unspecified macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/14Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DE69309144T 1992-04-21 1993-04-20 Härtbare Harzzusammensetzung Expired - Lifetime DE69309144T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12808192A JP3367964B2 (ja) 1992-04-21 1992-04-21 硬化性樹脂組成物

Publications (2)

Publication Number Publication Date
DE69309144D1 true DE69309144D1 (de) 1997-04-30
DE69309144T2 DE69309144T2 (de) 1997-07-31

Family

ID=14975947

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69309144T Expired - Lifetime DE69309144T2 (de) 1992-04-21 1993-04-20 Härtbare Harzzusammensetzung

Country Status (4)

Country Link
US (1) US5530075A (de)
EP (1) EP0567079B1 (de)
JP (1) JP3367964B2 (de)
DE (1) DE69309144T2 (de)

Families Citing this family (57)

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DE4328466C1 (de) * 1993-08-24 1995-04-13 Siemens Ag Siloxanhaltiges Gießharzsystem
US5405892A (en) * 1994-06-22 1995-04-11 Miles Inc. Melt-stable, pigmented polycarbonate composition
US5620825A (en) * 1995-03-23 1997-04-15 Agfa-Gevaert, N.V. Polysiloxane modified resins for toner
DE19523897C2 (de) * 1995-06-30 2002-10-24 Bosch Gmbh Robert Verwendung von Silicon-modifizierten Epoxidharzen als Vergußmassen für elektrotechnische oder elektronische Bauteile
JP3611383B2 (ja) * 1995-12-14 2005-01-19 住友ベークライト株式会社 電子部品封止用樹脂組成物
JPH1025417A (ja) * 1996-07-08 1998-01-27 Toray Dow Corning Silicone Co Ltd 硬化性液状組成物、その硬化物、および電子部品
DE19630319C1 (de) * 1996-07-26 1998-04-23 Siemens Ag Modifiziertes Epoxysiloxan Kondensat, Verfahren zu dessen Herstellung und dessen Einsatz als Low-Stress-Gießharz für die Elektronik und Elektrotechnik
US20100273011A1 (en) * 1996-12-20 2010-10-28 Bianxiao Zhong Silicone Composition, Silicone Adhesive, Coated and Laminated Substrates
JP4221545B2 (ja) * 2001-01-05 2009-02-12 信越化学工業株式会社 シリコーンゴム接着剤組成物並びにシリコーンゴムと熱可塑性樹脂との一体成形体及びその製造方法
KR100524433B1 (ko) * 2002-07-04 2005-10-26 주식회사 동우 이앤씨 건축사사무소 방수성 수지 조성물 및 그 제조방법
TWI345576B (en) 2003-11-07 2011-07-21 Dow Corning Toray Silicone Curable silicone composition and cured product thereof
EP1702938B1 (de) 2003-12-26 2008-09-24 Dow Corning Toray Co., Ltd. Härtbare silikonzusammensetzung und ihre verwendung als klebstoff
JP4664032B2 (ja) 2004-10-13 2011-04-06 東レ・ダウコーニング株式会社 シリルアルコキシメチルハライドの製造方法
EP1858981B1 (de) * 2005-02-16 2012-03-28 Dow Corning Corporation Verstärkte silikonharzfolie und herstellungsverfahren dafür
US8092910B2 (en) * 2005-02-16 2012-01-10 Dow Corning Toray Co., Ltd. Reinforced silicone resin film and method of preparing same
JP5166677B2 (ja) * 2005-03-15 2013-03-21 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
JP4931366B2 (ja) 2005-04-27 2012-05-16 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
JP5392805B2 (ja) * 2005-06-28 2014-01-22 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン樹脂組成物および光学部材
EP1910471B1 (de) * 2005-08-04 2012-06-06 Dow Corning Corporation Verstärkte silikonharzfolie und herstellungsverfahren dafür
WO2007044181A2 (en) 2005-10-05 2007-04-19 Dow Corning Corporation Coated substrates and methods for their preparation
US8912268B2 (en) * 2005-12-21 2014-12-16 Dow Corning Corporation Silicone resin film, method of preparing same, and nanomaterial-filled silicone composition
KR20140060557A (ko) * 2006-01-19 2014-05-20 다우 코닝 코포레이션 실리콘 수지 필름, 이의 제조방법, 및 나노물질로 충전된 실리콘 조성물
US8084097B2 (en) 2006-02-20 2011-12-27 Dow Corning Corporation Silicone resin film, method of preparing same, and nanomaterial-filled silicone composition
JP5285846B2 (ja) 2006-09-11 2013-09-11 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
JP5388409B2 (ja) * 2006-09-28 2014-01-15 東レ・ダウコーニング株式会社 硬化性シリコーン組成物およびその硬化物
CN101522838B (zh) * 2006-10-05 2012-07-04 陶氏康宁公司 有机硅树脂膜及其制备方法
JP5357046B2 (ja) * 2006-12-20 2013-12-04 ダウ・コーニング・コーポレイション 硬化シリコーン組成物で被覆またはラミネートされたガラス基板
KR101361593B1 (ko) * 2006-12-20 2014-02-21 다우 코닝 코포레이션 경화된 실리콘 수지 조성물의 다층으로 피복되거나 적층된 유리 기판
JP2010518226A (ja) * 2007-02-06 2010-05-27 ダウ・コーニング・コーポレイション シリコーン樹脂、シリコーン組成物、被覆基材、および補強シリコーン樹脂フィルム
WO2008103228A1 (en) * 2007-02-22 2008-08-28 Dow Corning Corporation Reinforced silicone resin films
EP2118203B1 (de) * 2007-02-22 2012-05-23 Dow Corning Corporation Verstärkte silikonharzfolie und verfahren zu ihrer herstellung
WO2008103226A1 (en) * 2007-02-22 2008-08-28 Dow Corning Corporation Reinforced silicone resin films
JP2010519381A (ja) * 2007-02-22 2010-06-03 ダウ コーニング コーポレーション 強化シリコーン樹脂フィルムおよびその調製方法
JP5250025B2 (ja) * 2007-05-01 2013-07-31 ダウ・コーニング・コーポレイション 強化シリコーン樹脂フィルム
WO2008134241A1 (en) * 2007-05-01 2008-11-06 Dow Corining Corporation Nanomaterial-filled silicone composition and reinforced silicone resin film
CN101939396B (zh) * 2007-09-19 2012-11-21 东丽株式会社 电子部件用粘合剂组合物及使用其的电子部件用粘合剂片材
JP5547369B2 (ja) * 2007-09-28 2014-07-09 東レ・ダウコーニング株式会社 硬化性液状エポキシ樹脂組成物およびその硬化物
JP2011500889A (ja) * 2007-10-12 2011-01-06 ダウ コーニング コーポレーション 強化シリコーン樹脂フィルムおよびナノ繊維充填シリコーン組成物
JP5485896B2 (ja) * 2007-10-12 2014-05-07 ダウ コーニング コーポレーション 酸化アルミニウム分散物およびこれを調製する方法
JP5422109B2 (ja) 2007-10-16 2014-02-19 東レ・ダウコーニング株式会社 硬化性シリコーン組成物およびその硬化物
EP2265674A1 (de) * 2008-03-04 2010-12-29 Dow Corning Corporation Silikonzusammensetzung, silikonklebstoff, beschichtete und laminierte substrate
JP2011518893A (ja) * 2008-03-04 2011-06-30 ダウ・コーニング・コーポレイション ボロシロキサン組成物、ボロシロキサン接着剤、塗装基板及び積層基板
JP5542805B2 (ja) * 2008-05-27 2014-07-09 ダウ・コーニング・コーポレイション 接着テープおよび合わせガラス
TW201004795A (en) * 2008-07-31 2010-02-01 Dow Corning Laminated glass
EP2638106A1 (de) 2010-11-09 2013-09-18 Dow Corning Corporation Anhand von organophosphorverbindungen weichgemachte hydrosilylierungsgehärtete silikonharze
TW201245352A (en) 2011-03-25 2012-11-16 Dow Corning Fluoro surface segregated monolayer coating
CN105670294B (zh) * 2011-05-04 2018-02-02 Lg化学株式会社 可固化组合物
WO2013077699A1 (ko) * 2011-11-25 2013-05-30 주식회사 엘지화학 경화성 조성물
TWI551653B (zh) * 2011-11-25 2016-10-01 Lg化學股份有限公司 可固化之組成物
TWI473840B (zh) * 2011-11-25 2015-02-21 Lg Chemical Ltd 製造有機聚矽氧烷的方法
EP2784129B1 (de) * 2011-11-25 2017-04-26 LG Chem, Ltd. Härtbare zusammensetzung
KR101493131B1 (ko) * 2011-11-25 2015-02-13 주식회사 엘지화학 오가노폴리실록산
CN103987785B (zh) * 2011-11-25 2017-03-29 Lg化学株式会社 可固化组合物
EP2836537B1 (de) * 2012-04-12 2016-12-28 Dow Corning Corporation Silikonpolyesterzusammensetzung
JP6416913B2 (ja) * 2013-12-23 2018-10-31 ダウ シリコーンズ コーポレーション Uv硬化性シリコーン組成物及び当該組成物を含有する防塵コーティング組成物
JP6681317B2 (ja) 2016-11-21 2020-04-15 信越化学工業株式会社 紫外線硬化型シリコーン組成物及び硬化皮膜形成方法
CN111574714B (zh) * 2020-05-15 2021-08-03 浙江新安化工集团股份有限公司 一种聚硅氧烷的连续化生产***及生产方法

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GB834326A (en) * 1956-10-29 1960-05-04 Midland Silicones Ltd Organosilicon compounds
JPS56136816A (en) * 1980-03-31 1981-10-26 Shin Etsu Chem Co Ltd Epoxy resin composition
JPS56145942A (en) * 1980-04-14 1981-11-13 Shin Etsu Chem Co Ltd Curable resin composition
US4370358A (en) * 1980-09-22 1983-01-25 General Electric Company Ultraviolet curable silicone adhesives
JPS6058425A (ja) * 1983-09-07 1985-04-04 Hitachi Chem Co Ltd エポキシ樹脂組成物
JPS61195129A (ja) * 1985-02-22 1986-08-29 Toray Silicone Co Ltd 有機けい素重合体の製造方法
JPS61225253A (ja) * 1985-03-29 1986-10-07 Toray Silicone Co Ltd 熱硬化性樹脂組成物
JPS6451467A (en) * 1987-08-21 1989-02-27 Toray Silicone Co Curable resin composition
JPH0791475B2 (ja) * 1988-02-29 1995-10-04 東レ・ダウコーニング・シリコーン株式会社 硬化性樹脂組成物
JP2630986B2 (ja) * 1988-05-18 1997-07-16 東レ・ダウコーニング・シリコーン株式会社 アルカリ可溶性オルガノポリシロキサン
JP2938158B2 (ja) * 1990-07-20 1999-08-23 住友ベークライト株式会社 半導体封止用エポキシ樹脂組成物
US5158991A (en) * 1990-08-24 1992-10-27 General Electric Company Epoxy-functionalized siloxane resin copolymers as controlled release additives
JPH0578450A (ja) * 1991-09-20 1993-03-30 Toshiba Silicone Co Ltd 電気・電子部品封止用樹脂組成物
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Also Published As

Publication number Publication date
EP0567079A1 (de) 1993-10-27
US5530075A (en) 1996-06-25
JPH05295084A (ja) 1993-11-09
EP0567079B1 (de) 1997-03-26
JP3367964B2 (ja) 2003-01-20
DE69309144T2 (de) 1997-07-31

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: KROHER, STROBEL RECHTS- UND PATENTANWAELTE, 80336

8328 Change in the person/name/address of the agent

Representative=s name: DR. SCHOEN & PARTNER, 80336 MUENCHEN