TW201245352A

TW201245352A - Fluoro surface segregated monolayer coating

Info

Publication number: TW201245352A
Application number: TW101110316A
Authority: TW
Inventors: John Donald Blizzard; Randall Alan Siegel; William K Weidner
Original assignee: Dow Corning
Priority date: 2011-03-25
Filing date: 2012-03-23
Publication date: 2012-11-16
Also published as: WO2012135114A1

Abstract

Provided are coated substrates having a polymer substrate, an interfacial coating on the substrate, and an inorganic barrier coating on the interfacial coating. The interfacial coating is prepared by applying a fluorosilicon-modified polymer composition on the polymer substrate and curing the composition, wherein the fluorosilicon-modified polymer composition has a curable polymer composition and a fluorosilicon compound. Electronic packages having an electronic device, a coated substrate overlying the device, and an adhesive coating between and in contact with the coated substrate and the device are also provided. Methods of preparing coated substrates are also provided.

Description

201245352 六、發明說明：【發明所屬之技術領域】本發明係關於經塗佈基板，其包含聚合物基板、於該基板上之界面塗層及於該界面塗層上之無機障壁塗層，其中該界面塗層包含可固化聚合物組合物及氟矽化合物β本發明亦係關於電子封裝件（electr〇nic package)及製備經塗佈基板之方法。【先前技術】障壁塗層藉由保護敏感性材料免遭空氣、水分及環境污染物損害而在包括電子封裝、食品包裝及表面處理之廣泛範圍的應用中起重要作用。特定言之，障壁塗層常應用於電子裝置以保護敏感性電接點免遭環境中之各種氣體及液體損害。因此，此等塗層會增加許多消費型產品之可靠性及可用壽命。包含單層無機材料，諸如金屬氧化物或氮化物之障壁塗層在此項技術中為已知的。然而，此等塗層之脆性常過大以致不能在具有較高熱膨脹之材料，諸如聚合物基板上使用。歸因於基板與塗層之間的熱膨脹係數差異，在障壁層中會產生應力。熱誘導應力可導致障壁塗層破裂，藉此降低塗層之有效性及裝置之可靠性。一種降低障壁塗層中之石由劲游# 之皮裂形成之方法為沈積鄰近於障壁塗層之有機塗層。此等吝居涂爲、a 夕層塗層通吊包含無機材料及聚合物材料之交替層。舞而 _ .Λ . 、，、而就低表面能聚合物基板而言，先前技術有機塗層受限制，α；制，因為此等有機塗層通常不具有 I63288.doc 201245352 為凉·動能塗佈及黏著至低表面能聚合物基板所必要之表面特定言之水 ^ 持、續需要對空氣、水分及ί裒境成分，蒸氣及氧氣具有優越抗性的障壁塗層。【發明内容】一個實施例中，揭示—種經塗佈基板，其包含聚合物壁命居於該基板上之界面塗層及於該界面塗層上之無機障 2層。界面塗層係藉由於聚合物基板上塗復I矽改質聚合物組合物且固化該組合物加以製備。氟錢質聚合物也合物包含可固化聚合物組合物及氟矽化合物。在另一實施例中，揭示一種電子封裝件，其包含電子裝置上覆於該裝置之經塗佈基板及介於該經塗佈基板與該裝置之間且與其接觸的黏著塗層。經塗佈基板包含聚合物基板、於該基板上之界面塗層及於該界面塗層上之無機障壁塗層。界面塗層係藉由於聚合物基板上塗覆包含可固化聚合物組合物及氟矽化合物之氟矽改質聚合物組合物且固化該組合物加以製備。在另一實施例中，揭示一種製備經塗佈基板之方法。該方法包含於聚合物基板上形成界面塗層及於該界面塗層上形成無機障壁。界面塗層係藉由於基板上塗覆包含可固化聚合物組合物及氟矽化合物之氟矽改質聚合物組合物且固化該組合物’並於界面塗層上形成無機障壁塗層加以製備。根據本發明之此等及其他各種實施例之此等及其他特徵 I63288.doc 201245352 及優勢將馨於下文隨後提供之圖式、[實施方式]及申請專利範圍而變得更加顯而易知。【實施方式】熟練技術人員瞭解為簡單及清晰起見，對圖中之元件加以說明且其未必按比例繪製。舉例而言，圖中一些元件之尺寸相對於其他元件可經放大以及移除習知部件以幫助增進對本發明之各種實施例之理解。本發明之實施例係關於經塗佈基板、電子封裝件及製備經塗佈基板之方法。如圖丨中所示，在一個實施例中，提供一種經塗佈基板100，其包含聚合物基板11〇、於該基板 110上之界面塗層120及於該界面塗層12〇上之無機障壁塗層13〇。界面塗層120係藉由於聚合物基板110上塗覆氟矽改質聚合物組合物且固化該組合物加以製備。氟矽改質聚 &物 '.且β物包含可固化聚合物組合物及氟矽化合物。如本文所用’術语「於…上」係指直接接觸之位置。舉例而言’當界面塗層120係藉由於聚合物基板110上塗覆氟矽改質聚合物組合物加以製備時，該氟矽改質聚合物組合物與該聚合物基板110係直接接觸。在個態樣中，'經塗佈基板⑽包含聚合物基板110。聚口物基板110可為具有平坦、複雜或不規則輪廓之任何剛性或可撓性材料°基板110對於電磁波譜之可見區（約400 至約700㈣中之光可為透明或不透明的。聚。物基板U0之實例包括（但不限於）聚_，諸如聚乙稀、聚丙稀、聚苯乙稀、聚對苯二甲酸伸乙醋（PET)、聚 163288.doc 201245352 甲醛、聚乙烯萘、聚醚醚酮、聚曱基苯乙稀 (polyamethylstyrene)及聚萘二曱酸伸乙酯；氯碳化物聚合物’諸如聚（二）氣亞乙烯（p〇lyVinyladyne chloride);氧破化物聚合物，諸如聚四氟乙烯及聚氟乙烯；聚醯胺，諸如耐綸（Nylon)及聚鄰笨二甲醯胺；聚醯亞胺；聚酯，諸如聚 (甲基丙烯酸甲酯）；環氧樹脂；聚醚；聚碳酸酯；聚硬；及聚礙。在一個特定態樣中’聚合物基板n〇為氟碳化物聚合物。在另一態樣中’聚合物基板11()為聚四氟乙稀及/或聚氟乙烯及其組合。在另一態樣中’經塗佈基板1〇〇包含於基板11〇上之界面塗層120。界面塗層120係藉由於聚合物基板上塗覆包含可固化聚合物組合物及氟石夕化合物之氟石夕改質聚合物組合物及固化該組合物加以製備。界面塗層12〇可為包含一層聚矽氧樹脂固化產物之單層塗層'或包含兩層或兩層以上至少兩種不同聚矽氧樹脂固化產物之多層塗層，其中直接相鄰層包含不同固化產物（亦即固化產物具有不同組成及7或性質）。多層塗層通常包含2至7層、或者2至5層、或者2至3層。單層界面塗層之厚度通常為0.03至30 μιη、或者〇.丨至1〇 μιη、或者〇.丨至15 μη^多層界面塗層之厚度通常為〇〇6至 30 μηι、或者〇2至1〇 μπι、或者〇2至3 當界面塗層 120之厚度小於〇〇3 時，塗層12〇可變得不連續。當界面塗層120之厚度大於3〇 μΓη時，塗層12〇可展現黏著降低及/或破裂。 " 163288.doc 201245352 在-些實施例中，界面塗層120通常展現較高透明度。舉例而言，對於電磁波譜之可見區（約400至約700 nm)中一界面塗層120之透射百分比通常為至少9〇。/。、或者至少92°/。、或者至少94〇/〇。 _ 可固化聚合物組合物可為任何可固化組合物。在—個態 ’ 冑：，可固化聚合物組合物通常含有熱固性聚合物及其他成分，諸如有機溶劑、交聯劑及/或催化劑。熱固性聚合物可為均聚物或共聚物。此外，熱固性聚合物可為聚石夕氧聚合物或有機聚合物。如本文及下文所用，術語「熱固性聚合物」係指在加熱時不轉化成流體狀態之固化（亦即交聯）聚合物。包含熱固性聚合物之可固化聚合物組合物之實例包括 (但不限於）可固化聚矽氧組合物及可固化有機組合物。可固化聚矽氧組合物可為包含至少一種聚矽氧樹脂之任何可固化聚矽氧組合物。可固化聚矽氧組合物之實例包括（但不限於）矽氫化可固化聚矽氧組合物；縮合可固化聚矽氧組合物；輻射可固化聚矽氧組合物；及過氧化物可固化聚矽氧組合物。可固化有機組合物之實例包括（但不限於）可固化聚稀fe組合物’諸如聚乙烯及聚丙烯組合物；可固化聚醢胺組合物；可固化環氧樹脂組合物；可固化胺基樹脂組合物；可固化聚胺基曱酸酯組合物；可固化聚醯亞胺組合物，可固化聚醋組合物，及可固化丙烤酸系樹脂組合物。在一個特定態樣中，可固化有機組合物之水蒸氣穿透率小於 1x 10·1 g/m2。 163288.doc 201245352 可固化聚石夕氧組合物之聚矽氧樹脂可含有τ矽氧烷單元Τ及Q矽氧烷單元，或Τ及/或Q矽氧烷單元與14及/或]0 夕氧烷單元之組合。舉例而言，聚矽氧樹脂可為Τ樹脂、卩树月曰Μ丁樹脂、DT樹脂、MDT樹脂、MQ樹脂、DQ樹脂、MDQ樹脂、MTQ樹脂、DTQ樹脂或MDTQ樹脂。聚夕氧樹月曰通吊含有能夠在存在或不存在催化劑下反應以形成聚矽氧樹脂固化產物之矽鍵結反應性基團。矽鍵結反應性基團之實例包括（但不限於）-H、烯基 '炔基、_〇H ' 可水解基團、稀基_、丙_氧基㈣、經取代之丙稀酿氧基院基及經環氧基取代之有機基團。聚矽氧樹脂之重量平均分子量（Mw)通常為5〇〇至 1’_，〇〇〇、或者 1’_至100，_、或者 1 000至5〇〇〇〇、或者1’〇〇0至2〇,〇〇0'或者1，_至1〇，_，其中分子量係藉由採用折射率彳貞測H及聚苯乙烯標準物進行凝膠滲透層析加以測定。石夕氫化可IU化聚珍氧組合物通常包含具有每個分子平均至少兩個錢結稀基切鍵結氩原子之㈣氧樹脂；數量足以固化該聚石夕氧樹脂之有機石夕化合物，其甲該有機石夕化合物具有每個分子平均至少兩個能夠與該聚矽氧樹脂中之石夕鍵結烯基或錢結氫原子反應的錢結氫原子切鍵结烯基；及催化量之石夕氫化催化劑。包含石夕樹脂之適合石夕氫化可固化聚石夕氧組合物之實例包括p c T公開案第W 〇 /⑷川號及PCT公開案第wo 2008/103226號中所述者，該等公開案之内容據此以引用的方式併入本文中。 16328S.doc 201245352 在-個態樣中，石夕氫化可固化聚石夕氧組合物包含⑷具有式（心⑽心心队丄（R2Si〇3/2)y(Si〇4A⑴之聚石夕氧樹脂’其巾m㈣。烴基或^丨至Ci。經齒素取代之烴基’兩者均不含脂族不飽和度，各心立地為 R丨或烯基’ w為0至〇.95，父為〇至〇 95，丫為〇至（，z為。至 0.9，y+ζ為⑺丨至丨，且w+x+y+z=1，其限制條件為該聚矽氧樹脂具有每個分子平均至少兩個矽鍵結烯基；數量足以固化該聚石夕氧樹脂之具有每個分子平均至少兩個石夕鍵結氫原子之有機矽化合物；及（c)催化量之矽氫化催化劑。組分（A)為至少一種具有式（RlR22Si〇i/2)w (R22Si〇w)x (VSiOw^SiO4/2),⑴之聚矽氧樹脂，其中各…獨立地為 <^至(：1()烴基或(^至匚⑺經齒素取代之烴基，兩者均不含脂族不飽和度，各R獨立地為R1或稀基，评為〇至Ο.%，乂為〇至0.95，y為〇至1，2為〇至〇9，y+z為〇」至t，且 W+X+y + z=l，其限制條件為該聚矽氧樹脂具有每個分子平均至少兩個矽鍵結烯基。由R1表示之烴基及經鹵素取代之烴基不含脂族不飽和度且通常具有1至10個碳原子、或者1至6個碳原子。含有至乂、3個叙原子之非環狀烴基及經鹵素取代之烴基可具有分支或未分支結構。由Ri表示之烴基之實例包括（但不限於）院基’諸如甲基、乙基、丙基、1_甲基乙基、丁基、丨._曱基丙基、2-甲基丙基、1，1_二曱基乙基、戊基、丨_甲基丁基、1-乙基丙基、2-曱基丁基、3-曱基丁基、1，2-二曱基 163288,doc 201245352 丙基、2,2-二曱基丙基、己基、庚基、辛基、壬基及癸基；環烷基’諸如環戊基、環己基及甲基環已基；芳基，諸如苯基及萘基；烷芳基，諸如甲苯基及二甲苯基；及芳烧基，諸如笨甲基及苯乙基。由R1表示之經齒素取代之烴基之實例包括（但不限於）3,3,3-三氟丙基、3-氣丙基、氣苯基、二氣苯基' 2,2,2-三氟乙基、2,2,3,3-四氟丙基及 2,2,3,3,4,4,5,5·八氣戍基。由R表示之可相同或不同之烯基通常具有2至約1〇個碳原子、或者2至6個碳原子，且由（但不限於）乙烯基、烯丙基、丁烯基、己烯基及辛烯基例示。在聚矽氧樹脂之式⑴中，下標w、χ、丫及z為莫耳分數。下標w之值通常為〇至〇95、或者〇至〇 8 '或者〇至 0.2 ;下標X之值通常為〇至〇 95、或者〇至〇 8、或者〇至 0.8 至 1 0.5 ;下標y之值通常為、或者〇 3至！、或者〇…；下標z之值通常為〇至〇.9、或者、或者且纳和化之值通常為、或者〇.2h、或者、或者在聚矽氧樹脂令，通常至少5〇 m〇l%、或者至少 —、或者至少80 mol%之基團r2為烯二氧樹脂中，—基㈣為縣」定義為㈣氧= =婦基之莫耳數與樹脂中之基團 = 率乘以100。六吁数的聚碎氧樹脂诵會人士， (w/w)之石夕鍵結經基，如藉由、_ 163288.doc 201245352 所測定。適用作組分（A)之聚矽氧樹脂之實例包括（但不限於）具有下式之樹脂：（％河说0丨/2)。.25(1>脱〇3/2)() 75、（觀_〇|/2)心 (PhSiO3/2)0.75 ^ (ViMe2SiO1/2)0.25(MeSi〇3/2)0.25(phsi〇3/2)0.50 . (ViMe2Si01/2)0.l5(PhSi03/2)0.75(Si〇4/2)〇1^(Vi2MeSi〇i/2)〇i5 (VjMeAOwWPhSiO3/2)。·75，其中 Me 為甲基，％為乙烯基、Ph為苯基，且在圓括號外部之數值下標表示莫耳分數。此外，在前述式中，未指定單元之順序。組分（A)可為單一聚矽氧樹脂或包含兩種或兩種以上各自如上所述之不同聚矽氧樹脂之混合物。製備含有矽鍵結烯基之聚矽氧樹脂之方法在此項技術中為熟知的；許多此等樹脂可購得。此等樹脂通常藉由在有機溶劑，諸如曱苯中共水解氣矽烷前驅體之適當混合物加以製備。舉例而言’基本上由RiR22Si〇i/2單元及R2Si〇3" 單元組成之聚矽氧樹脂可藉由在甲苯中共水解具有式 WjiCl之化合物及具有式R2Sic丨3之化合物加以製備，其中R及R2係如以上所定義且例示。分離鹽酸水溶液及聚矽氧水解產物且水解產物用水洗滌以移除殘餘酸且在溫和縮合催化劑存在下加熱以「塑形（b〇dy)」樹脂來獲得必要黏度。必要時，樹脂可進一步在有機溶劑中用縮合催化劑處理以降低矽鍵結羥基之含量。或者，含有除氯基以外之可水解基團（諸如、_〇CH3、_〇c(〇)CH3、_N(CH3)2、 NHCOCH3及-SCH3)之矽烷可用作共水解反應中之起始物質。樹脂產物之性質視矽烷之類型、矽烷之莫耳比、縮合 163288.doc 201245352 程度及加工條件而定。之:Γ:::八至子少一種數量足以固化組分⑷之_樹脂 ;具有母個刀子平均至少兩個錢結氫原子的有機石夕化人物。 σ 有機石夕化合物具有每個分子平均至少兩個石夕鍵結氣々子、或者母個分子至少三個石夕鍵結氫原子。通常瞭解交聯在組分⑷中每個分子之平均烯基數與組分（Β)中每個分子之平均矽鍵結氫原子數的總和大於4時發生。有機石夕化合物可為有機氫㈣或有機氫⑪氧烧。有機氣矽烷可為早矽烷、二矽烷、三矽烷或聚矽烷。類似地有機氫石夕氧烧可為：魏院、三魏烧或聚㈣院。有機石夕化合物之結構可為直鍵、分支鍵、環狀或樹脂狀。環^ 及環矽氧烷通常具有3至12個矽原子、或者3至1〇個矽原子、或者3至4個矽原子。在非環狀聚矽烷及聚矽氧烷中，石夕鍵結氫原子可位於末位、側位或末位與側位兩處。有機氫矽烷之實例包括（但不限於）二苯基矽烷、2_氣乙基石夕烧雙[(對二甲基石夕烧基）苯基]醚、1，4-二甲基二矽烧基乙烷' Μ_雙（二甲基矽烷基）苯、1，3,5-參（二甲基矽烷基）笨、1，3,5-三甲基-^,5-三矽烷、聚（甲基亞矽烷基）伸苯基及聚（甲基亞矽烷基）亞甲基。有機虱石夕氧坑之實例包括（但不限於）1,1,3,3 -四甲基二石夕氧烧3 -四苯基二石夕氧烧、苯基參（二甲基石夕烧氧基）矽烷' 1，3,5-三甲基環三矽氧烷、三曱基矽烷氧基封端聚 (甲基氫石夕氧烷）、三甲基矽烷氧基封端聚（二甲基矽氧烷/ 163288.doc 201245352 曱基氫矽氧烷）、二甲基氫矽烷氧基封端聚（甲基氫矽氧烷）及基本上由HMe2SiO丨/2單元、Me3SiO丨/2單元及Si04/2單元組成之樹脂，其中Me為甲基。矽氫化可固化聚矽氧組合物之組分（C)為至少一種促進組分（A)與組分（B)之加成反應之矽氫化催化劑。矽氫化催化劑可為任何熟知石夕氫化催化劑，其包含始族金屬、含有翻族金屬之化合物或微膠囊化含有鉑族金屬之催化劑。鉑族金屬包括鉑、铑、釕、鈀、餓及銥。基於鉑在矽氫化反應中之向活性，銘族金屬較佳為|白。較佳矽氫化催化劑包括由willing在美國專利第3,419,593 號中揭示之氣鉑酸與某些含乙烯基有機矽氧烷之錯合物， 3亥專利據此以引用的方式併入本文中。一種此類型之較佳催化劑為氣翻酸與1，3-二乙烯基-丨，^，^四曱基二矽氧燒之反應產物。矽氫化催化劑亦可為包含鉑族金屬囊封於熱塑性樹脂中之微膠囊化含有鉑族金屬之催化劑。含有微膠囊化矽氫化催化劑之組合物在環境條件下持續延長時期，通常數月或數月以上穩定，又在高於熱塑性樹脂之熔點或軟化點之溫度下相對快速固化。微膠囊化矽氫化催化劑及其製備方法在此項技術中為熟知的，如美國專利第4,766，176號及其中引用之參考文獻，及美國專利第5,〇丨7,654號中所例示。組为（C)可為單一矽氫化催化劑或包含兩種或兩種以上在至少-個性質，諸如結構、形式、鉑族金屬、錯合配體及熱塑性樹脂方面不同之不同催化劑的混合物。 163288.doc •13· 201245352 組分（c)之濃度足以催化組分（A)與組分（B)之加成反應。通常，以組分（A)與（B)之組合重量計，組分（〇之濃度足以提供0.1至1000 ppm鉑族金屬、較佳1至5〇〇 ppm鉑族金屬、且更佳5至150 ppm鉑族金屬。鉑族金屬在〇1 ppm# 下之固化速率極為緩慢。使用1 〇〇〇 ppm以上之鉑族金屬不導致固化速率明顯增加，且因此為不經濟的。在另一態樣中，矽氫化可固化聚矽氧組合物包含（A，）具有式（R R 2Si01/2)w(R32Si〇2/2)x (R3Si〇3/2)y(Si〇4/2)z (II)之聚石夕氧樹脂’其中各R1獨立地為（：|至〇〗0烴基或（：|至（：1〇經鹵素取代之烴基’兩者均不含脂族不飽和度，各R3獨立地為 R1或-H，w為0至0.95，X為〇至0.95，y為〇至1，2為〇至 0.9 ’ y+z為0.1至1，且w+x+y+z=1，其限制條件為該聚矽氧樹脂具有每個分子平均至少兩個矽鍵結氫原子；（B，）數量足以固化該聚矽氧樹脂之具有每個分子平均至少兩個矽鍵結稀基之有機矽化合物；及（c)催化量之矽氫化催化劑。組分（A，）為至少一種具有式（RlR32Si〇w2)w (R32Si〇…）χ (R3si〇3/2)y(si〇4/2)z (Π)之聚矽氧樹脂，其中各汉丨獨立地為 (^至匸⑺烴基或C|至C|〇經鹵素取代之烴基，兩者均不含脂族不飽和度，各R3獨立地為…或#，你為〇至〇 95，χ為〇至 .95 y為〇至 1，Z為〇至 0.9，y+z為 0‘1至 1，且以+>(+^+2=1 其限制條件為該聚矽氧樹脂具有每個分子平均至少兩個鍵結氫原子。在式（11)中，R1、w、x、y、z及y+z係如以對於具有式（I)之聚矽氧樹脂所述且例示。 163288.doc 201245352 在聚石夕氧樹脂中，通常至少50 m〇l%、或者至少Μ 、或者至少8〇 m〇1%之基團r3為氫。術語「在聚矽氧樹脂中，mol%之基團r3為氫」定義為聚矽氧樹脂中之矽鍵結氫原子之莫耳數與樹脂中之基團R3之總莫耳數的比率乘以1 0 〇。聚石夕氧樹脂通常含有小於10% (w/w)、或者小於5% (w/w)、或者小於2% (w/w)之矽鍵結羥基，如藉由29以 NMR所測定。適用作組分（A，）之聚矽氧樹脂之實例包括（但不限於）具有下式之樹脂： (HMe2SiO]/2)0 25(PhSi〇3/2)〇.75 ^ (HMeSiO2/2)0.3(PhSi〇3/2)0 6 (MeSi〇3/2)0.1^(Me3Si01/2)0.1(H2Si02/2)0,(MeSi〇3/2)〇.4(PhSi〇3/2^ , 其中Me為甲基，Ph為苯基，且在圓括號外部之數值下標表示莫耳分數。此外，在前述式中，未指定單元之順序。組分（A’）可為單一聚矽氧樹脂或包含兩種或兩種以上各自如上所述之不同聚矽氧樹脂之混合物。製備含有矽鍵結氫原子之聚矽氧樹脂之方法在此項技術中為熟知的；許多此等樹脂可購得。聚矽氧樹脂通常藉由在有機溶劑，諸如甲苯中共水解氯矽烷前驅體之適當混合物加以製備。舉例而言，基本上由RiR32SiCh/2單元及 R SiO^2單元組成之聚矽氧樹脂可藉由在曱苯中共水解具有式RiR^SiCl之化合物及具有式R3sicl3之化合物加以製備，其中R】及R3係如以上所述且例示。分離鹽酸水溶液及聚矽氧水解產物且水解產物用水洗滌以移除殘餘酸且在溫 163288.doc 15 201245352 和非鹼性縮合催化劑存在下加熱以「塑形」樹脂來獲得必要黏度。必要時，樹脂可進一步在有機溶劑中用非鹼性縮合催化劑處理以降低矽鍵結羥基之含量。或者，含有除氣基以外之可水解基團（諸如_Br、_丨、_〇CH3、、 -Ν(Οΐ3)2、NHCOCH3及-SCH3)之矽烷可用作共水解反應中之起始物質。樹脂產物之性質視矽炫之類型、矽院之莫耳比、縮合程度及加工條件而定。組分（B')為至少一種數量足以固化組分（A，）之聚矽氧樹脂之具有每個分子平均至少兩個碎鍵結稀基的有機矽化合物。有機矽化合物含有每個分子平均至少兩個矽鍵結烯基、或者每個分子至少三個矽鍵結烯基。通常瞭解交聯在組分 (A·)中每個分子之平均矽鍵結氫原子數與組分（B，）中每個分子之平均矽鍵結烯基數的總和大於4時發生。有機矽化合物可為有機矽烷或有機矽氧烷。有機矽烷可為單矽烷、二矽烷、三矽烷或聚矽烷。類似地，有機碎氧烷可為二矽氧烷、三矽氧烷或聚矽氧烷。有機矽化合物之結構可為直鏈、分支鏈、環狀或樹脂狀。環矽烷及環碎氧烷通常具有3至12個矽原子、或者3至10個矽原子、或者3 至5個矽原子。在非環狀聚矽烷及聚矽氧烷中，矽鍵結稀基可位於末位、側位或末位與側位兩處。適用作組分（B')之有機矽烷之實例包括（但不限於）具有下式之石夕烧：Vi4Si、PhSiVi3、MeSiVi3、PhMeSiVi2、 Ph2SiVi2 及 PhSi(CH2CH=CH2)3，其中 Me為曱基、Ph 為苯基 -16· 163288.doc 201245352 且Vi為乙烯基。適用作組分（B’）之有機矽氧烷之實例包括（但不限於）具有下式之矽氧烷：PhSi(OSiMe2Vi)3、Si(OSiMe2Vi)4、201245352 VI. Description of the Invention: [Technical Field] The present invention relates to a coated substrate comprising a polymer substrate, an interfacial coating on the substrate, and an inorganic barrier coating on the interfacial coating, wherein The interfacial coating comprises a curable polymer composition and a fluoroquinone compound. The invention also relates to an electronic package (electr〇nic package) and a method of preparing a coated substrate. [Prior Art] Barrier coatings play an important role in a wide range of applications including electronic packaging, food packaging and surface treatment by protecting sensitive materials from air, moisture and environmental contaminants. In particular, barrier coatings are often used in electronic devices to protect sensitive electrical contacts from various gases and liquids in the environment. Therefore, these coatings increase the reliability and usable life of many consumer products. Barrier coatings comprising a single layer of inorganic material, such as a metal oxide or nitride, are known in the art. However, the brittleness of such coatings is often too large to be used on materials having higher thermal expansion, such as polymer substrates. Due to the difference in thermal expansion coefficient between the substrate and the coating, stress is generated in the barrier layer. Thermally induced stress can cause the barrier coating to rupture, thereby reducing the effectiveness of the coating and the reliability of the device. One method of reducing the formation of the skin in the barrier coating by the skin crack is to deposit an organic coating adjacent to the barrier coating. These coatings are coated with a layer of alternating inorganic and polymeric materials. In the case of low surface energy polymer substrates, the prior art organic coatings are limited, because these organic coatings usually do not have I63288.doc 201245352 for cooling and kinetic energy coating. The surface of the cloth and the surface necessary for adhesion to the low surface energy polymer substrate, in particular, requires a barrier coating that is superior to air, moisture and environmental components, steam and oxygen. SUMMARY OF THE INVENTION In one embodiment, a coated substrate comprising an interfacial coating on which a polymer wall resides on the substrate and an inorganic barrier layer on the interfacial coating are disclosed. The interfacial coating is prepared by coating a ruthenium polymer composition on a polymer substrate and curing the composition. The fluorogenic polymer composition comprises a curable polymer composition and a fluoroquinone compound. In another embodiment, an electronic package is disclosed that includes an electronic device overlying a coated substrate of the device and an adhesive coating between and in contact with the coated substrate and the device. The coated substrate comprises a polymer substrate, an interfacial coating on the substrate, and an inorganic barrier coating on the interfacial coating. The interfacial coating is prepared by coating a fluoroquinone-modified polymer composition comprising a curable polymer composition and a fluoroquinone compound on a polymer substrate and curing the composition. In another embodiment, a method of making a coated substrate is disclosed. The method includes forming an interfacial coating on a polymer substrate and forming an inorganic barrier on the interfacial coating. The interfacial coating is prepared by coating a fluoroquinone-modified polymer composition comprising a curable polymer composition and a fluoroquinone compound on a substrate and curing the composition' and forming an inorganic barrier coating on the interfacial coating. These and other features of the present invention and other various embodiments of the present invention will become more apparent from the following description of the drawings, the <RTIgt; [Embodiment] It will be apparent to those skilled in the art that, For example, the dimensions of some of the elements in the figures can be exaggerated and the components removed from the other elements to help improve the understanding of various embodiments of the invention. Embodiments of the present invention relate to coated substrates, electronic packages, and methods of making coated substrates. As shown in FIG. ,, in one embodiment, a coated substrate 100 comprising a polymer substrate 11 , an interfacial coating layer 120 on the substrate 110, and an inorganic layer on the interfacial coating layer 12 is provided. The barrier coating is 13 inches. The interfacial coating 120 is prepared by coating a fluorocarbon modified polymer composition on the polymer substrate 110 and curing the composition. Fluoroquinone modified poly &< and beta contains a curable polymer composition and a fluoroquinone compound. As used herein, the term "on" refers to the location of direct contact. For example, when the interfacial coating layer 120 is prepared by coating a fluoroquinone-modified polymer composition on the polymer substrate 110, the fluoroquinone-modified polymer composition is in direct contact with the polymer substrate 110. In one aspect, the coated substrate (10) comprises a polymer substrate 110. The slab substrate 110 can be any rigid or flexible material having a flat, complex or irregular profile. The substrate 110 can be transparent or opaque to the visible region of the electromagnetic spectrum (about 400 to about 700 (d). Examples of the substrate U0 include, but are not limited to, poly-, such as polyethylene, polypropylene, polystyrene, polyethylene terephthalate (PET), poly 163288.doc 201245352 formaldehyde, polyethylene naphthalene, Polyetheretherketone, polyamethylstyrene and poly(naphthalene diacetate); chlorocarbon polymer such as p〇ly Vinyladyne chloride; oxygen-breaking polymer , such as polytetrafluoroethylene and polyvinyl fluoride; polyamines, such as nylon (Nylon) and poly(o-mercaptoamine; polyimine; polyester, such as poly(methyl methacrylate); epoxy Resin; polyether; polycarbonate; polyhard; and barrier. In one particular aspect, 'polymer substrate n〇 is a fluorocarbon polymer. In another aspect, 'polymer substrate 11 () is a poly Tetrafluoroethylene and/or polyvinyl fluoride and combinations thereof. In another aspect The cloth substrate 1 〇〇 is included in the interface coating 120 on the substrate 11 . The interface coating 120 is formed by coating a fluorocarbon modified polymer composition comprising a curable polymer composition and a fluorite compound on the polymer substrate. And curing the composition to be prepared. The interfacial coating 12 can be a single layer coating comprising a layer of a polyoxyl resin cured product or a multilayer comprising two or more layers of at least two different polyanthracene resin cured products. A coating wherein the directly adjacent layers comprise different cured products (ie, the cured product has a different composition and 7 or properties). The multilayer coating typically comprises 2 to 7 layers, or 2 to 5 layers, or 2 to 3 layers. The thickness of the interfacial coating is usually from 0.03 to 30 μm, or from 〇.丨 to 1〇μιη, or from 〇.丨 to 15 μη. The thickness of the multilayer interface coating is usually 〇〇6 to 30 μηι, or 〇2 to 1〇. Ππι, or 〇2 to 3 When the thickness of the interfacial coating 120 is less than 〇〇3, the coating 12〇 may become discontinuous. When the thickness of the interfacial coating 120 is greater than 3〇μΓη, the coating 12〇 may exhibit adhesion. Reduced and / or broken. " 163288.do c 201245352 In some embodiments, the interfacial coating 120 generally exhibits a higher transparency. For example, the transmission percentage of an interfacial coating 120 in the visible region (about 400 to about 700 nm) of the electromagnetic spectrum is typically at least 9 〇, /, or at least 92 ° /, or at least 94 〇 / 。 _ curable polymer composition can be any curable composition. In the state of 胄:, curable polymer composition usually contains Thermosetting polymers and other ingredients such as organic solvents, crosslinking agents and/or catalysts. The thermosetting polymer can be a homopolymer or a copolymer. Further, the thermosetting polymer may be a polyoxo polymer or an organic polymer. As used herein and hereinafter, the term "thermosetting polymer" refers to a cured (i.e., crosslinked) polymer that does not convert to a fluid state upon heating. Examples of the curable polymer composition comprising a thermosetting polymer include, but are not limited to, a curable polydecene oxide composition and a curable organic composition. The curable polydecene oxide composition can be any curable polydecaneoxy composition comprising at least one polyoxynoxy resin. Examples of curable polydecaneoxy compositions include, but are not limited to, hydrazine hydride curable polydecane oxynitride compositions; condensation curable polydecane oxynitride compositions; radiation curable polydecane oxynitride compositions; and peroxide curable polypolymers Oxygenated composition. Examples of curable organic compositions include, but are not limited to, curable polyfefe compositions such as polyethylene and polypropylene compositions; curable polyamine compositions; curable epoxy resin compositions; curable amine groups A resin composition; a curable polyaminophthalate composition; a curable polyimine composition, a curable polyester composition, and a curable acrylic acid resin composition. In a particular aspect, the curable organic composition has a water vapor transmission rate of less than 1 x 10 · 1 g/m 2 . 163288.doc 201245352 The polyoxyxene resin of the curable polyoxo-oxygen composition may contain a τ oxane unit Τ and a Q methoxy olefin unit, or a hydrazine and/or a Q oxane unit with 14 and/or 0 a combination of oxyalkylene units. For example, the polyoxyxylene resin may be an anthracene resin, an eucalyptus resin, a DT resin, an MDT resin, an MQ resin, a DQ resin, an MDQ resin, an MTQ resin, a DTQ resin, or an MDTQ resin. The polyoxynium sulphate contains a ruthenium-bonding reactive group capable of reacting in the presence or absence of a catalyst to form a cured resin of the polyanthracene resin. Examples of hydrazine-bonded reactive groups include, but are not limited to, -H, alkenyl 'alkynyl, 〇H' hydrolyzable group, dilute _, propyl-oxy (tetra), substituted propylene oxide A base group and an organic group substituted with an epoxy group. The weight average molecular weight (Mw) of the polyoxyxene resin is usually 5 〇〇 to 1 _, 〇〇〇, or 1 _ to 100, _, or 1 000 to 5 〇〇〇〇, or 1 〇〇 0 To 2 〇, 〇〇0' or 1, _ to 1 〇, _, wherein the molecular weight is determined by gel permeation chromatography using refractive index spectrometry H and polystyrene standards. The xihua hydrogenated IU chemical polyoxygen composition generally comprises an (IV) oxy-resin having an average of at least two money per unit of sulphide-bonded argon atoms; and an organic cerium compound in an amount sufficient to cure the poly- oxime resin; The organic cerium compound has an average of at least two carbon-bonded hydrogen atom-cutting alkenyl groups per molecule capable of reacting with a sulfonate or a hydrogen atom in the polyfluorene oxide resin; and a catalytic amount Shixi hydrogenation catalyst. Examples of suitable shixi hydrogenated curable polyoxo-oxygen compositions comprising shixi resin include those described in pc T Publication No. W 〇/(4) Chuan and PCT Publication No. WO 2008/103226, such publications The contents are hereby incorporated by reference herein. 16328S.doc 201245352 In one aspect, the Shixi hydrogenated curable polyoxo oxygen composition comprises (4) a polysulfide resin having the formula (heart (10) core group 丄(R2Si〇3/2)y(Si〇4A(1) 'The towel m (4). Hydrocarbyl group or ^ 丨 to Ci. Hydrocarbon group substituted by dentate 'both are free of aliphatic unsaturation, each of which is R 丨 or alkenyl ' w is 0 to 〇.95, the father is 〇 to 〇95, 丫 is 〇 to (, z is. to 0.9, y+ζ is (7) 丨 to 丨, and w+x+y+z=1, the restriction condition is that the polyoxyl resin has each molecule An average of at least two fluorene-bonded alkenyl groups; an amount of an organic hydrazine compound having an amount of at least two anthracene-bonded hydrogen atoms per molecule; and (c) a catalytic amount of a hydrazine hydrogenation catalyst. Component (A) is at least one polyxanthene resin having the formula (RlR22Si〇i/2)w (R22Si〇w)x (VSiOw^SiO4/2), (1), wherein each ... is independently <^ to ( : 1 () hydrocarbon group or (^ to 匚 (7) dentate-substituted hydrocarbon group, both of which do not contain aliphatic unsaturation, each R is independently R1 or a rare group, and is rated as 〇 to Ο.%, 乂 is 〇 To 0.95, y is 〇 to 1, 2 is 〇 to 〇9 , y+z is 〇" to t, and W+X+y + z=l, with the proviso that the polyoxynoxy resin has an average of at least two fluorene-bonded alkenyl groups per molecule. The hydrocarbon group represented by R1 and The halogen-substituted hydrocarbon group does not contain aliphatic unsaturation and usually has 1 to 10 carbon atoms, or 1 to 6 carbon atoms. The acyclic hydrocarbon group containing hydrazine, 3 argon atoms, and the halogen-substituted hydrocarbon group may be used. Having a branched or unbranched structure. Examples of hydrocarbon groups represented by Ri include, but are not limited to, a hospital base such as methyl, ethyl, propyl, 1-methylethyl, butyl, decyl-propylpropyl , 2-methylpropyl, 1,1-didecylethyl, pentyl, hydrazine-methylbutyl, 1-ethylpropyl, 2-mercaptobutyl, 3-mercaptobutyl, 1 ,2-dimercapto 163288,doc 201245352 propyl, 2,2-dimercaptopropyl, hexyl, heptyl, octyl, decyl and decyl; cycloalkyl such as cyclopentyl, cyclohexyl and a cyclyl group; an aryl group such as a phenyl group and a naphthyl group; an alkylaryl group such as a tolyl group and a xylyl group; and an aryl group such as a methyl group and a phenethyl group, which are substituted by a dentate represented by R1. Examples of hydrocarbyl groups include (but Not limited to) 3,3,3-trifluoropropyl, 3-apropyl propyl, phenyl, diphenyl phenyl 2,2,2-trifluoroethyl, 2,2,3,3-tetrafluoro a propyl group and 2,2,3,3,4,4,5,5·8-octadecyl. The alkenyl group which may be the same or different by R usually has 2 to about 1 carbon atoms, or 2 to 6 a carbon atom, and is exemplified by, but not limited to, a vinyl group, an allyl group, a butenyl group, a hexenyl group, and an octenyl group. In the formula (1) of the polyoxyxylene resin, the subscripts w, χ, 丫, and z The value of the subscript w. The value of the subscript w is usually 〇 to 〇95, or 〇 to 〇8 ' or 〇 to 0.2; the value of the subscript X is usually from 〇 to 95, or from 〇 to 8, or from 〇 to 0.8. To 1 0.5 ; the value of the subscript y is usually, or 〇3 to! , or 〇...; The value of the subscript z is usually 〇 to 〇.9, or, and the value of the summation is usually, or 〇.2h, or, in the case of a polyoxyl resin, usually at least 5〇m 〇l%, or at least-, or at least 80 mol% of the group r2 is in the olefinic resin, the base (four) is defined as (iv) oxygen = = the molar number of the base group and the group in the resin = rate Multiply by 100. The six-pronged polyoxy-resin resin will be used by the person (w/w), which is determined by _ 163288.doc 201245352. Examples of the polyoxyxylene resin which is suitable as the component (A) include, but are not limited to, a resin having the following formula: (% river says 0 丨 / 2). .25 (1 > dislocation 3/2) () 75, (observation _ 〇 | / 2) heart (PhSiO3 / 2) 0.75 ^ (ViMe2SiO1/2) 0.25 (MeSi 〇 3 / 2) 0.25 (phsi 〇 3 / 2) 0.50 . (ViMe2Si01/2)0.l5(PhSi03/2)0.75(Si〇4/2)〇1^(Vi2MeSi〇i/2)〇i5 (VjMeAOwWPhSiO3/2). · 75, where Me is methyl, % is vinyl, Ph is phenyl, and the numerical subscript outside the parentheses indicates the mole fraction. Further, in the above formula, the order of the units is not specified. Component (A) may be a single polyoxynoxy resin or a mixture comprising two or more different polyfluorene oxide resins each as described above. Processes for preparing polyoxyxylene resins containing fluorenyl linkages are well known in the art; many such resins are commercially available. These resins are usually prepared by co-hydrolyzing a suitable mixture of gaseous decane precursors in an organic solvent such as toluene. For example, a polyoxynoxy resin consisting essentially of RiR22Si〇i/2 units and R2Si〇3" units can be prepared by cohydrolyzing a compound having the formula WjiCl and a compound having the formula R2Sic丨3 in toluene, wherein R And R2 is as defined above and exemplified. The aqueous hydrochloric acid solution and the polyhydrazine hydrolyzate are separated and the hydrolyzate is washed with water to remove residual acid and heated in the presence of a mild condensation catalyst to "shape" the resin to obtain the necessary viscosity. If necessary, the resin may be further treated with a condensation catalyst in an organic solvent to lower the content of the hydrazine-bonded hydroxyl group. Alternatively, a decane containing a hydrolyzable group other than a chlorine group such as _〇CH3, _〇c(〇)CH3, _N(CH3)2, NHCOCH3, and -SCH3 can be used as a starting point in the cohydrolysis reaction. substance. The nature of the resin product depends on the type of decane, the molar ratio of decane, the degree of condensation 163288.doc 201245352 and the processing conditions. Γ::: Eight to a small amount of a resin sufficient to cure the component (4); an organic stone with a mother knife averaging at least two money to form a hydrogen atom. The σ organic cerium compound has an average of at least two agglomerated gas enthalpies per molecule, or at least three agglomerated hydrogen atoms of the parent molecule. It is generally understood that cross-linking occurs when the sum of the average number of alkenyl groups per molecule in component (4) and the number of average fluorene-bonded hydrogen atoms per molecule in the component (Β) is greater than 4. The organic stone compound can be organic hydrogen (tetra) or organic hydrogen 11 oxygen. The organic gas decane may be early decane, dioxane, trioxane or polydecane. Similarly, there may be a machine of hydrogen stone oxythermal burning: Weiyuan, Sanwei or poly (four) hospitals. The structure of the organic compound can be a direct bond, a branch bond, a ring or a resin. The ring and the cycloxane usually have 3 to 12 germanium atoms, or 3 to 1 germanium atoms, or 3 to 4 germanium atoms. In the acyclic polydecane and the polyoxyalkylene, the hydrogen atom of the Shixi bond may be located at the last position, the lateral position or the last position and the lateral position. Examples of the organohydrogen decane include, but are not limited to, diphenyl decane, 2- methoxyethyl succinyl bis[(p-dimethyl sulphate) phenyl] ether, 1,4-dimethyl diterpenoid Ethyl ethane ' Μ bis (dimethyl decyl) benzene, 1,3,5- cis (dimethyl decyl) stupid, 1,3,5-trimethyl-^, 5-trioxane, poly (Methyl sulfinyl) extends phenyl and poly(methyl sulfinyl) methylene. Examples of organic vermiculite oxygen pits include, but are not limited to, 1,1,3,3-tetramethyldiazepine-oxygenated 3-tetraphenyldiazepine, phenyl ginseng (dimethyl sulphate) Alkoxy) decane' 1,3,5-trimethylcyclotrioxane, tridecyldecyloxy-terminated poly(methylhydroxetane), trimethyldecyloxy-terminated poly( Dimethyl oxirane / 163288.doc 201245352 mercaptohydroquinone), dimethylhydroquinoloxy terminated poly(methylhydrooxane) and substantially consisting of HMe2SiO丨/2 units, Me3SiO丨/ A resin consisting of 2 units and Si04/2 units, wherein Me is a methyl group. The component (C) of the hydrazine-curable poly-oxygen oxide composition is at least one hydrazine hydrogenation catalyst which promotes the addition reaction of the component (A) with the component (B). The hydrazine hydrogenation catalyst may be any well-known catalyst for the synthesis of a cerium containing a group metal, a compound containing a metalloid or a microencapsulated catalyst containing a platinum group metal. Platinum group metals include platinum, rhodium, ruthenium, palladium, starvation and ruthenium. Based on the activity of platinum in the rhodium hydrogenation reaction, the indium metal is preferably white. The preferred hydrogenation catalysts include the complexes of the gas platinum acid disclosed in U.S. Patent No. 3,419,593, the disclosure of which is incorporated herein by reference. A preferred catalyst of this type is the reaction product of a gas rotatory acid with a 1,3-divinyl-indole, hydrazine, hydrazine. The rhodium hydrogenation catalyst may also be a microencapsulated platinum group metal-containing catalyst comprising a platinum group metal encapsulated in a thermoplastic resin. The composition containing the microencapsulated hydrazine hydride catalyst is stable for a prolonged period of time under ambient conditions, usually for several months or more, and relatively rapidly solidified at a temperature above the melting or softening point of the thermoplastic resin. The microencapsulated ruthenium hydrogenation catalyst and its preparation are well known in the art, as exemplified in U.S. Patent No. 4,766,176, the disclosure of which is incorporated herein by reference. The group (C) may be a single hydrazine hydrogenation catalyst or a mixture comprising two or more different catalysts in at least one property such as a structure, a form, a platinum group metal, a mismatched ligand, and a thermoplastic resin. 163288.doc •13· 201245352 The concentration of component (c) is sufficient to catalyze the addition reaction of component (A) with component (B). Generally, the concentration of the component (the concentration of cerium is sufficient to provide 0.1 to 1000 ppm of a platinum group metal, preferably 1 to 5 〇〇 ppm of a platinum group metal, and more preferably 5 to 5 parts by weight of the combination of components (A) and (B) 150 ppm platinum group metal. The cure rate of platinum group metals at 〇1 ppm# is extremely slow. The use of platinum group metals above 1 〇〇〇ppm does not result in a significant increase in cure rate and is therefore uneconomical. In the sample, the hydrazine hydrogenated curable polydecane oxide composition comprises (A,) having the formula (RR 2Si01/2) w(R32Si〇2/2)x (R3Si〇3/2)y(Si〇4/2)z (II) The polyoxo resin wherein each R1 is independently (:|to 〇0 hydrocarbon group or (:| to (:1 卤素 halogen-substituted hydrocarbon group' both contain no aliphatic unsaturation, Each R3 is independently R1 or -H, w is 0 to 0.95, X is 〇 to 0.95, y is 〇 to 1, 2 is 〇 to 0.9 ' y+z is 0.1 to 1, and w+x+y+z =1, the restriction condition is that the polyoxyxene resin has an average of at least two hydrazine-bonded hydrogen atoms per molecule; (B,) the amount is sufficient to cure the poly-xanyloxy resin with an average of at least two 矽 bonds per molecule a dilute organic bismuth compound; (c) a catalytic amount of a hydrogenation catalyst. The component (A,) is at least one of the formula (RlR32Si〇w2)w (R32Si〇...)χ(R3si〇3/2)y(si〇4/2)z ( a polyxanthene resin, wherein each of the quinones is independently a hydrocarbon group of (^ to 匸(7) hydrocarbon group or C| to C| 〇, which is halogen-substituted, and both of which are free of aliphatic unsaturation, each R3 is independently ... or #, you are 〇 to 〇95, χ is 〇 to .95 y is 〇 to 1, Z is 〇 to 0.9, y+z is 0'1 to 1, and +>(+^+2= 1 The limiting condition is that the polyoxyxene resin has an average of at least two bonded hydrogen atoms per molecule. In the formula (11), R1, w, x, y, z, and y+z are as in the formula ( The polyoxyxyl resin of I) is described and exemplified. 163288.doc 201245352 In the polyoxin, usually at least 50 m〇l%, or at least Μ, or at least 8〇m〇1% of the group r3 is hydrogen The term "in the polyoxyxylene resin, the mol% of the group r3 is hydrogen" is defined as the ratio of the number of moles of the hydrazine-bonded hydrogen atom in the polyoxynene resin to the total number of moles of the group R3 in the resin. Multiply by 10 〇. Poly oxylate resin usually contains less than 10% (w/w), or small 5% (w/w), or less than 2% (w/w) of hydrazine-bonded hydroxyl groups, as determined by NMR by 29. Examples of polyoxyxylene resins suitable for use as component (A,) include (but It is not limited to a resin having the following formula: (HMe2SiO)/2)0 25(PhSi〇3/2)〇.75 ^ (HMeSiO2/2)0.3(PhSi〇3/2)0 6 (MeSi〇3/2) 0.1^(Me3Si01/2)0.1(H2Si02/2)0,(MeSi〇3/2)〇.4(PhSi〇3/2^ , where Me is a methyl group, Ph is a phenyl group, and is outside the parentheses The numerical subscript indicates the mole fraction. Further, in the above formula, the order of the units is not specified. The component (A') may be a single polyoxynoxy resin or a mixture comprising two or more different polyfluorene oxide resins each as described above. Processes for preparing polyfluorene oxide resins containing hydrazine-bonded hydrogen atoms are well known in the art; many such resins are commercially available. Polyoxyxylene resins are typically prepared by cohydrolyzing a suitable mixture of chlorodecane precursors in an organic solvent such as toluene. For example, a polyfluorene oxide resin consisting essentially of RiR32SiCh/2 unit and R SiO^2 unit can be prepared by cohydrolyzing a compound having the formula RiR^SiCl and a compound having the formula R3sicl3 in toluene, wherein R] And R3 are as described above and exemplified. The aqueous hydrochloric acid solution and the polyhydrazine hydrolyzate are separated and the hydrolyzate is washed with water to remove residual acid and heated to "shape" the resin to obtain the necessary viscosity in the presence of a temperature of 163288.doc 15 201245352 and a non-basic condensation catalyst. If necessary, the resin may be further treated with a non-alkaline condensing catalyst in an organic solvent to lower the content of hydrazine-bonded hydroxyl groups. Alternatively, a decane containing a hydrolyzable group other than a degassing group such as _Br, 丨, _〇CH3, -Ν(Οΐ3)2, NHCOCH3, and -SCH3 may be used as a starting material in the cohydrolysis reaction. . The nature of the resin product depends on the type of sputum, the molar ratio of the brothel, the degree of condensation, and the processing conditions. Component (B') is at least one organic ruthenium compound having a polysulfide resin in an amount sufficient to cure component (A,) having an average of at least two broken bonds per molecule. The organic ruthenium compound contains an average of at least two fluorene-bonded alkenyl groups per molecule, or at least three fluorene-bonded alkenyl groups per molecule. It is generally understood that cross-linking occurs when the sum of the average number of bonded hydrazine atoms per molecule in the component (A) and the number of average fluorene-bonded alkenes per molecule in the component (B,) is greater than 4. The organic hydrazine compound can be an organic decane or an organic decane. The organic decane may be monodecane, dioxane, trioxane or polydecane. Similarly, the organic ash can be a dioxane, a trioxane or a polyoxyalkylene. The structure of the organic hydrazine compound may be linear, branched, cyclic or resinous. Cyclodecane and cyclobronchane typically have from 3 to 12 germanium atoms, or from 3 to 10 germanium atoms, or from 3 to 5 germanium atoms. In the acyclic polydecane and polyoxyalkylene, the hydrazone-bonded rare groups may be located at the last, lateral or terminal and lateral positions. Examples of organic decanes suitable for use as component (B') include, but are not limited to, the following formula: Vi4Si, PhSiVi3, MeSiVi3, PhMeSiVi2, Ph2SiVi2, and PhSi(CH2CH=CH2)3, wherein Me is a fluorenyl group , Ph is phenyl-16· 163288.doc 201245352 and Vi is vinyl. Examples of the organic oxirane suitable for use as the component (B') include, but are not limited to, a siloxane having the following formula: PhSi (OSiMe2Vi) 3, Si (OSiMe2Vi) 4,

MeSi(〇SiMe2Vi)3及 Ph2Si(OSiMe2Vi)2，其中 Me為甲基、Ph 為苯基且Vi為乙烯基。組分（B’）可為單一有機矽化合物或包含兩種或兩種以上各自如上所述之不同有機矽化合物之混合物。舉例而言，組为（B )可為單一有機矽烧、兩種不同有機矽烷之混合物、單一有機矽氧烷、兩種不同有機矽氧烷之混合物或有機矽烷與有機矽氧烷之混合物。組分（B’）之濃度足以固化（交聯）組分（A，）之聚矽氧樹脂。組分（B')之精確量視所要固化程度而定，固化程度通常隨組分（B’）中矽鍵結烯基之莫耳數與組分（A，）中矽鍵結氫原子之莫耳數的比率增加而增加。組分（B,)之濃度通常足以提供組分（AI)中每莫耳矽鍵結氫原子0.4至2莫耳梦鍵結烯基、或者0.8至1.5莫耳石夕鍵結烯基、或者"至】」莫耳石夕鍵結烯基。製備含有石夕鍵結婦基之有機㈣及有機带氧烧之方法在此項技術中為熟知的；許多此等化合物可購得。組分（C)係如以上所述且例示。石夕氫化可固化聚石夕氧組合物可包含其他成分，其限制條為〆成刀不阻止聚矽氧組合物固化形成電子封裝件康之上述第一界面塗層11(^ Α 〇他戚刀之霄例包括（但不限於）矽氫化催化劑抑制劑，諸如 τ丞_3·戍烯_1-炔、3,5-二甲 I63288.doc 201245352 基·3·己烯炔、3,5_二曱基•己炔·3醇、丨乙炔基_1·環己醇、2-苯基-3-丁炔-2-醇、乙烯基環矽氧烷及三苯膦；黏著促進劑，諸如美國專利第4,〇87,585號及第5，194,649號中教示之黏著促進劑；染料；顏料；抗氧化劑；熱穩定劑，紫外線穩定劑；阻燃劑；流動控制添加劑；及稀釋劑’諸如有機溶劑及反應性稀釋劑。縮合可固化聚矽氧組合物通常包含具有每個分子平均至少兩個矽鍵結氫原子、羥基或可水解基團之聚矽氧樹脂及視情況存在之具有矽鍵結可水解基團之交聯劑及/或縮合催化劑。包含聚矽氧樹脂之適合縮合可固化聚矽氧組合物之實例包括PCT公開案第霤0 2007/145711號中所述者，該公開案之内容據此以引用的方式併入本文中。在一個態樣中，縮合可固化聚矽氧組合物包含具有式 (R4R52Si01/2)w(R52Si〇2/2)x (R5Si03/2)y(Si04/2)z 氧樹脂，其中各R4獨立地為（：1至（：|〇烴基或。至。^經齒素取代之烴基，各R5獨立地為R4、·Η、_〇H或可水解基團， w為〇至0.95，X為〇至ο.”，y為〇至i，z為〇至〇 9，y+z為 0‘1至1，且w + x + y + z=1，其限制條件為該聚矽氧樹脂具有每個分子平均至少兩個矽鍵結氫原子、羥基或可水解基團。在式（III)中，w、X、y、2及7 + 2係如以上對於具有式 (I)之聚矽氧樹脂所述且例示。由R表示之烴基及經！I素取代之烴基通常具有丨至10個碳原子、或者1至6個碳原子、或者丨至4個碳原子。含有至 ;3個碳原子之非環狀烴基及經齒素取代之烴基可具有分 • 18 · 163288.docMeSi(〇SiMe2Vi)3 and Ph2Si(OSiMe2Vi)2, wherein Me is a methyl group, Ph is a phenyl group and Vi is a vinyl group. Component (B') may be a single organic hydrazine compound or a mixture comprising two or more different organic hydrazine compounds each as described above. For example, the group (B) may be a single organic sinter, a mixture of two different organic decanes, a single organic oxane, a mixture of two different organic oxanes or a mixture of organic decane and an organic oxane. The concentration of component (B') is sufficient to cure (crosslink) the polyanthracene resin of component (A,). The exact amount of component (B') depends on the degree of curing desired, and the degree of curing generally depends on the molar number of the fluorenyl group in the component (B') and the hydrogen atom in the component (A,). The ratio of moles increases and increases. The concentration of component (B,) is usually sufficient to provide 0.4 to 2 moles of alkenyl groups per mole of hydrogen atoms in the component (AI), or 0.8 to 1.5 moles of alkenyl groups, or "To]" Moer Shi Xi key alkenyl. Processes for the preparation of organic (IV) and organic aerobic fires containing Shishi bonded women are well known in the art; many such compounds are commercially available. Component (C) is as described above and exemplified. The shixi hydrogenated curable polyoxo-oxygen composition may comprise other components, and the limiting strip is that the bismuth-forming knives do not prevent the poly-xyloxy composition from solidifying to form the first interface coating of the electronic package member (the 界面〇〇戚戚Examples include, but are not limited to, hydrazine hydride catalyst inhibitors such as τ丞_3·decene _1-alkyne, 3,5-dimethyl i63288.doc 201245352 3·hexene alkyne, 3,5_ Dimercapto-hexyne-3 alcohol, decynyl-1-oxacyclohexane, 2-phenyl-3-butyn-2-ol, vinylcyclodecane, and triphenylphosphine; adhesion promoters, such as Adhesive accelerators taught in U.S. Patent No. 4, pp. 87,585 and 5,194,649; dyes; pigments; antioxidants; heat stabilizers, UV stabilizers; flame retardants; flow control additives; Solvent and Reactive Diluent The condensation curable polyoxynoxy composition typically comprises a polyfluorene oxide resin having an average of at least two hydrazine-bonded hydrogen atoms, a hydroxyl group or a hydrolyzable group per molecule, and optionally has a hydrazone bond. a crosslinker capable of hydrolyzing a group and/or a condensation catalyst. Suitable for containing a polyoxyxylene resin Examples of condensed curable polydecaneoxy compositions include those described in PCT Publication No. 0 2007/145711, the disclosure of which is hereby incorporated by reference herein. The cured polyoxynoxy composition comprises an oxygen resin having the formula (R4R52Si01/2)w(R52Si〇2/2)x(R5Si03/2)y(Si04/2)z, wherein each R4 is independently (:1 to (: Or a hydrocarbyl group substituted by dentate, each R5 is independently R4, ·Η, _〇H or a hydrolyzable group, w is 〇 to 0.95, X is 〇 to ο.", y is 〇 to i, z is 〇 to 〇9, y+z is 0'1 to 1, and w + x + y + z=1, with the proviso that the polyoxyl resin has an average of at least two 每个 per molecule. A hydrogen atom, a hydroxyl group or a hydrolyzable group is bonded. In the formula (III), w, X, y, 2 and 7 + 2 are as described above and exemplified for the polyfluorene oxide compound of the formula (I). The hydrocarbon group substituted by R and the hydrocarbon group substituted by the ?I usually have 丨 to 10 carbon atoms, or 1 to 6 carbon atoms, or 丨 to 4 carbon atoms. The acyclic hydrocarbon group having up to 3 carbon atoms and The hydrocarbyl group substituted by dentate may have a fraction 18 · 163288.doc

201245352 支或未分支結構。烴基之實例包括（但不限於）烷基，諸如曱基、乙基、丙基、1-甲基乙基、丁基、丨_甲基丙基、2_ 曱基丙基、1，1-二曱基乙基、戊基、卜甲基丁基、1乙基丙基、2-曱基丁基、3-曱基丁基、二曱基丙基、2,2·二甲基丙基、己基、庚基、辛基、壬基及癸基；環烷基，諸如環戊基、環己基及甲基環己基；芳基，諸如苯基及萘基；烧芳基’諸如曱苯基及二曱苯基；芳烷基，諸如苯甲基及苯乙基；稀基，諸如乙稀基、烯丙基及丙稀基：芳基烯基，諸如苯乙烯基及苯烯丙基；及炔基，諸如乙炔基及丙炔基。經鹵素取代之烴基之實例包括（但不限於）3,3,3_三氟丙基、3-氣丙基、氣苯基、二氣苯基、2,2,2三氟乙基、2,2,3,3-四氟丙基及2,2,3,3,4,4,5,5-八氟戊基。如本文所用，術語r可水解基團」意謂在自室溫（約 23 士 2C)至100C之任何溫度下在存在或不存在催化劑下石夕鍵結基團與水在數分鐘（例如30分鐘）内反應以形成矽烷醇 (Si-OH)基團。由R5表示之可水解基團之實例包括（但不限於）-C1、-Br、-OR6、-OCH2CH2〇r6、CH3C(=〇)〇_、201245352 Branch or unbranched structure. Examples of hydrocarbyl groups include, but are not limited to, alkyl groups such as decyl, ethyl, propyl, 1-methylethyl, butyl, hydrazine-methylpropyl, 2-hydrazinopropyl, 1,1-di Mercaptoethyl, pentyl, methyl butyl, 1-ethyl propyl, 2-mercaptobutyl, 3-mercaptobutyl, dimethyl propyl, 2,2 dimethylpropyl, hexyl, Heptyl, octyl, decyl and decyl; cycloalkyl, such as cyclopentyl, cyclohexyl and methylcyclohexyl; aryl, such as phenyl and naphthyl; aryl aryl such as phenyl and hydrazine Phenyl; aralkyl, such as benzyl and phenethyl; dilute groups such as ethylene, allyl and propylene: arylalkenyl, such as styryl and phenylallyl; and alkynyl , such as ethynyl and propynyl. Examples of halogen-substituted hydrocarbon groups include, but are not limited to, 3,3,3-trifluoropropyl, 3-apropylpropyl, phenyl, diphenyl, 2,2,2-trifluoroethyl, 2 , 2,3,3-tetrafluoropropyl and 2,2,3,3,4,4,5,5-octafluoropentyl. As used herein, the term "hydrolyzable group" means at any temperature from room temperature (about 23 ± 2 C) to 100 C in the presence or absence of a catalyst, in the presence or absence of a catalyst, and in a few minutes (for example, 30 minutes). Internal reaction to form a stanol (Si-OH) group. Examples of the hydrolyzable group represented by R5 include, but are not limited to, -C1, -Br, -OR6, -OCH2CH2〇r6, CH3C(=〇)〇_,

Et(Me)C=N-0-、CH3C(=〇)n(CH3)-及-〇NH2，其申 R6為 C, 至Cs烴基或C i至cs經鹵素取代之烴基。由R6表示之烴基及經鹵素取代之烴基通常具有丨至8個碳原子、或者3至6個碳原子。含有至少3個碳原子之非環狀烴基及經㈣取代之烴基可具有分支或未分支結構。烴基之實例包括（但不限於）未分支及分支烷基，諸如甲基、乙基、丙基、1-甲基乙基、丁基]甲基丙基、2_曱基丙 I63288.doc •19· 201245352 基' 1，1-二甲乙基、戊基 '卜甲基丁基、丨·乙基丙基、2 甲基丁基、3 -甲基丁基、1，2 -二甲基丙基、2，2 -二曱基丙基、己基'庚基及辛基；環烷基，諸如環戊基、環己基及曱基環己基；苯基；烷芳基，諸如甲苯基及二曱笨基；芳烧基’諸如笨甲基及苯乙基；烯基，諸如乙烯基、烯丙基及丙婦基’芳基稀基’諸如苯乙稀基；及炔基，諸如乙块基及丙快基。經齒素取代之烴基之實例包括（但不限於）3,3,3-三氟丙基、3_氣丙基、氣苯基及二氣苯基。在聚矽氧樹脂中，通常至少10 mol% '或者至少5〇 mol%、或者至少8〇 m〇1%之基團R5為氩 '羥基或可水解基團。術S吾「在聚石夕氧樹脂中，m〇l%之基團R5為氫、羥基或可水解基團」定義為聚矽氧樹脂中矽鍵結氫、羥基或可水解基團之莫耳數與樹脂中基團R5之總莫耳數的比率乘以 100。具有式（III)之聚石夕氧樹脂之實例包括（但不限於）具有下式之樹脂：（MeSi03/2)n、（phSi〇3/2)n、（Me3SiO1/2)0.8(SiO4/2)0 2、 (MeSi〇3/2)〇.67(PhSi〇3/2)〇.33 ' (MeSi〇3/2)o.45(PhSi〇3/2)〇.4〇 (Ph2SiO2/2)0.1(PhMeSi〇2/2)0 〇5 , (PhSi03/2)〇.4(MeSi〇3/2)〇.45 (PhSiO3/2)01(PhMeSi〇2/2)。。5及（PhSi〇3/2)。4(MeSi〇3/2)〇 , (PhMeSi02/2)〇_5 ’其中―為甲基，ph為笨基，在圓括號外部之數值下標表示莫耳分數，且下標n的值使聚矽氧樹脂之重量平均分子量為5〇〇至1，〇〇〇,〇〇〇。此外，在前述式中，未指定單元之順序。縮合可固化聚矽氧組合物可包含單一聚矽氧樹脂或包含 163288.doc -20-Et(Me)C=N-0-, CH3C(=〇)n(CH3)- and -〇NH2, wherein R6 is C, to a Cs hydrocarbyl group or a hydrocarbyl group in which C1 to cs are halogen-substituted. The hydrocarbon group represented by R6 and the halogen-substituted hydrocarbon group usually have 丨 to 8 carbon atoms, or 3 to 6 carbon atoms. The acyclic hydrocarbon group having at least 3 carbon atoms and the (tetra)-substituted hydrocarbon group may have a branched or unbranched structure. Examples of hydrocarbyl groups include, but are not limited to, unbranched and branched alkyl groups such as methyl, ethyl, propyl, 1-methylethyl, butyl]methylpropyl, 2-mercaptopropene I63288.doc • 19· 201245352 ' ' 1,1-Diethylethyl, pentyl 'bu methyl butyl, hydrazine ethyl propyl, 2 methyl butyl, 3-methyl butyl, 1,2-dimethylpropyl, 2,2-dimercaptopropyl, hexylheptyl and octyl; cycloalkyl, such as cyclopentyl, cyclohexyl and decylcyclohexyl; phenyl; alkaryl, such as tolyl and diphenyl An aryl group such as a methyl and phenethyl group; an alkenyl group such as a vinyl group, an allyl group and a propyl group 'aryl aryl group such as a styrene group; and an alkynyl group such as an ethyl group and a propyl group Quick base. Examples of the hydrocarbyl group substituted by dentate include, but are not limited to, 3,3,3-trifluoropropyl, 3-propylpropyl, p-phenyl and diphenyl. In the polyoxyxylene resin, usually at least 10 mol% ' or at least 5 〇 mol%, or at least 8 〇 m 〇 1% of the group R5 is an argon 'hydroxyl group or a hydrolyzable group. In the polysulfide oxide resin, m〇l% of the group R5 is hydrogen, a hydroxyl group or a hydrolyzable group, which is defined as a bond of hydrogen, a hydroxyl group or a hydrolyzable group in the polyfluorene oxide resin. The ratio of the number of ears to the total number of moles of the group R5 in the resin is multiplied by 100. Examples of the polyoxin having the formula (III) include, but are not limited to, a resin having the formula: (MeSi03/2)n, (phSi〇3/2)n, (Me3SiO1/2)0.8 (SiO4/ 2) 0 2, (MeSi〇3/2)〇.67(PhSi〇3/2)〇.33 '(MeSi〇3/2)o.45(PhSi〇3/2)〇.4〇(Ph2SiO2/ 2) 0.1 (PhMeSi〇2/2)0 〇5 , (PhSi03/2)〇.4(MeSi〇3/2)〇.45 (PhSiO3/2)01 (PhMeSi〇2/2). . 5 and (PhSi〇3/2). 4(MeSi〇3/2)〇, (PhMeSi02/2)〇_5 'where ― is methyl, ph is stupid, the value subscript outside the parentheses indicates the mole fraction, and the value of the subscript n makes The polyoxyxene resin has a weight average molecular weight of 5 Å to 1, 〇〇〇, 〇〇〇. Further, in the above formula, the order of the units is not specified. The condensation curable polyoxynoxy composition may comprise a single polyoxyl resin or comprise 163288.doc -20-

201245352 兩種或兩種以上各自如上所述之不同聚矽氧樹脂之混合物。縮合可固化聚矽氧組合物可包含其他成分，其限制條件為該成分不阻止聚矽氧樹脂固化形成電子封裝件2〇〇之上述第一界面塗層110。其他成分之實例包括（但不限於）黏著促進劑；染料；顏料；抗氧化劑；熱穩定劑；紫外線穩定劑；阻燃劑；流動控制添加劑；有機溶劑；交聯劑及縮合催化劑。舉例而言’縮合可固化聚矽氧組合物可另外包含交聯劑及/或縮合催化劑。交聯劑可具有式R6qSiX4 q，其中R6gCi 至C8烴基或（：,至Cs經鹵素取代之烴基，X為可水解基團，且q為0或1。由R6表示之烴基及經鹵素取代之烴基係如以上所述且例示。此外’由X表示之可水解基團係如以上對於R5所述且例示。交聯劑之實例包括（但不限於）烷氧基矽烷，諸如201245352 A mixture of two or more different polyoxynoxy resins each as described above. The condensation curable polydecene oxide composition may comprise other ingredients, with the proviso that the composition does not prevent the polyoxymethylene resin from solidifying to form the first interfacial coating layer 110 on the electronic package. Examples of other ingredients include, but are not limited to, adhesion promoters; dyes; pigments; antioxidants; heat stabilizers; UV stabilizers; flame retardants; flow control additives; organic solvents; crosslinking agents and condensation catalysts. For example, the condensation-curable polydecaneoxy composition may additionally comprise a crosslinking agent and/or a condensation catalyst. The crosslinking agent may have the formula R6qSiX4 q, wherein R6gCi to C8 hydrocarbyl or (:, to Cs halogen-substituted hydrocarbyl group, X is a hydrolyzable group, and q is 0 or 1. Hydrocarbyl group represented by R6 and substituted by halogen The hydrocarbyl group is as described above and exemplified. Further, the hydrolyzable group represented by X is as described above and exemplified for R5. Examples of the crosslinking agent include, but are not limited to, alkoxydecane, such as

MeSi(OCH3)3、CH3Si(OCH2CH3)3、CH3Si(OCH2CH2CH3)3、 CH3Si[0(CH2)3CH3]3、CH3CH2Si(OCH2CH3)3、C6H5Si(OCH3)3、 C6H5CH2Si(OCH3)3、C6H5Si(OCH2CH3)3、CH2=CHSi(OCH3)3、 CH2 = CHCH2Si(OCH3)3、CF3CH2CH2Si(OCH3)3、 CH3Si(OCH2CH2OCH3)3、CF3CH2CH2Si(OCH2CH2OCH3)3、 CH2=CHSi(OCH2CH2OCH3)3、CH2=CHCH2Si(OCH2CH2OCH3)3、 C6H5Si(OCH2CH2OCH3)3、Si(OCH3)4、Si(OC2H5)4及Si(OC3H7)4 ; 有機乙醯氧基矽烷，諸如CH3Si(OCOCH3)3、CH3CH2Si (OCOCH3)3及CH2=CHSi(OCOCH3)3;有機亞胺基氧基矽烷， 163288.doc -21- 201245352 諸如CH3Si[0-N=C(CH3)CH2CH3]3、Si[0-N=C(CH3)CH2CH3]4 及CH2=CHSi[0-N=C(CH3)CH2CH3]3;有機乙醯胺基矽烷，諸如 CH3Si[NHC(=0)CH3]3 及 C6H5Si[NHC(=〇)CH3]3 ;胺基矽烷，諸如CH3Si[NH(s-C4H9)]3 及 CH3Si(NHC6H 丨丨）3 ;及有機胺基氧基矽烷。 • · · 交聯劑可為單一矽烷或兩種或兩種以上各自如上所述之不同矽烷之混合物。此外，製備三官能性矽烷及四官能性矽烷之方法在此項技術中為熟知的；許多此等矽烷可賭得。當存在時’聚石夕氧組合物中之交聯劑之浪度足以固化 (交聯）聚矽氧樹脂。交聯劑之精確量視所要固化程度而定’固化程度通常隨交聯劑中矽鍵結可水解基團之莫耳數與聚矽氧樹脂中矽鍵結氫原子 '羥基或可水解基團之莫耳數的比率增加而增加。通常，交聯劑之濃度足以提供聚矽氧樹脂中每莫耳矽鍵結氩原子、羥基或可水解基團0 2至4 莫耳矽鍵結可水解基團。交聯劑之最佳量可易於藉由常規實驗確定。如上所述，縮合可固化聚矽氧組合物可另外包含至少一種縮合催化劑》縮合催化劑可為通常用於促進矽鍵結羥基 (石夕院醇）基團縮合形成Si_〇_Si鍵之任何縮合催化劑。縮合催化劑之實例包括（但木限於）胺；及鉛、錫、鋅及鐵與羧酸之錯合物。特定言之，縮合催化劑可選自錫（II)及錫（IV) 化合物’諸如二月桂酸錫、二辛酸錫及四丁基錫；及鈦化合物，諸如四丁醇欽。 163288.doc •22· 201245352 當存在時，以聚矽氧樹脂之總重量計，縮合催化劑之濃度通常為0.1至10% (w/w)、或者〇5至5。/。（w/w)、或者1至 3% (w/w) 〇輪射可固4匕聚石夕氧組合物itf包含具有每個分子平均至少兩個碎鍵結㈣敏感性基團之聚碎氧樹脂及視情況存在之光引發劑。包含聚矽氧樹脂之適合輻射可固化聚矽氧組合物之實例包括PCT公開案第W0 2〇〇7/14571 1號中所述者，該公開案之内容據此以引用的方式併入本文中。在一個態樣中，輻射可固化聚矽氧組合物包含具有式 (R7R82Si01/2)w (R82Si〇2/2)x(R8si〇3/2)y(Si〇4/2)z (ιν)之聚矽氧樹脂固化產物，其中各尺7獨立地為烴基、。至 c10經函素取代之烴基或_0R6，其中R^C^C8烴基或q 至Cs經鹵素取代之烴基，各R8獨立地為R7、_H或輻射敏感性基團’ w為0至0.95，X為〇至0.95，y為0至1，2為〇至 0.9，y+ζ為0.1至1，aw+x+y+z=1，其限制條件為該聚矽氧樹脂具有每個分子平均至少兩個矽鍵結輻射敏感性基團。在式（IV)中’ R6、w、x、y、2及丫+2係如以上所述且例示。此外’由R7表示之烴基及經鹵素取代之烴基係如以上對於R4所述且例示。由R8表示之輻射敏感性基團之實例包括（但不限於）丙烯醯氧基烷基、經取代之丙烯醯氧基烷基、烯基醚基團、稀基及經環氧基取代之有機基團。如本文所用，術語「輕射敏感性基團」意謂基團在暴露於波長為150至8〇〇 nm之輕射時在自由基光引發劑或陽離子光引發劑存在下形成活性 I63288.doc •23· 201245352 物質’例如自由基或陽離子。由R8表示之丙烯醯氧基烷基之實例包括（但不限於）丙稀醯氧基甲&、2-丙烯醯氧基乙基、3_丙烯醯氧基丙基及扣丙烯醯氧基丁基。由R8表示之經取代之丙烯醯氧基烷基的實例包括（但不限於)曱基丙烯醯氧基曱基、2_曱基丙烯醯氧基乙基及3_曱基丙烯醯氧基丙基。由R表示之烯基醚基團之實例包括（但不限於）具有式 R9-〇-ch=cH2之乙烯基醚基團，其中R9為^至匕❶伸烴基或C1至C丨0經鹵素取代之伸烴基。由R9表示之伸烴基通常具有1至10個碳原子、或者1至6 個碳原子、或者1至4個碳原子。伸烴基之實例包括（但木限於）伸烷基，諸如亞甲基 '伸乙基、丙烷_丨，3_二基、2_ 曱基丙烷-1，3-二基'丁烷-丨’扣二基、丁烷一，、二基、戊烷_1，5-二基、戊烷-1，4-二基、己烷-1，6-二基、辛烷_丨，8_二基及癸烧-1,10-一基；伸環坑基，諸如環己炫> _ 1，‘二基；伸芳基，諸如伸苯基。經!|素取代之伸烴基之實例包括 (但不限於）一或多個氫原子已經鹵素，諸如氟、氣及溴置換之二價烴基，諸如_CH2CH2CF2cF2CH2CH2。由R8表示之烯基之實例包括（但不限於）乙烯基、歸丙基、丙烯基、丁烯基及己烯基。如本文所用，術語「經環氧基取代之有機基團」係指環氧基取代基氧原子直接連接於碳鏈或環系統之兩個相鄰碳原子之單價有機基團。由R8表示之經環氡基取代之有機基 163288.doc -24· 201245352 團的實例包括（但不限於）2,3-環氧基丙基、3,4-環氧基丁基、4,5-環氧基戊基、2-縮水甘油氧基乙基、3-縮水甘油氧基丙基、4-縮水甘油氧基丁基、2-(3,4-環氧基環己基）乙基、3-(3,4-環氧基環己基）丙基、2-(3,4-環氧基-3-曱基環己基）-2-曱基乙基、2-(2,3-環氧基環戊基）乙基及3-(2,3-環氧基環戊基）丙基。聚矽氧樹脂通常含有每個分子平均至少兩個矽鍵結輻射敏感性基團。在聚矽氧樹脂中，通常至少50 mol%、或者至少65 mol%、或者至少80 mol%之基團R8為輻射敏感性基團。術語「在聚矽氧樹脂中，mol%之基團R8為輻射敏感性基團」定義為聚矽氧樹脂中之矽鍵結輻射敏感性基團之莫耳數與樹脂中之基團R8之總莫耳數的比率乘以1〇〇。具有式（IV)之聚矽氧樹脂之實例包括（但不限於）具有下式之樹脂： (MeSi〇3/2)o.25(CH2=C(CH3)COO(CH2)3Si〇3/2)o.75 ' (MeSiO3/2)0 5(CH2=C(CH3)COO(CH2)3SiO3/2)0 5、 (MeSi〇3/2)o.67(CH2=C(CH3)COO(CH2)3Si〇3/2)〇.33 ' (PhSiO3/2)Q.25(CH2=C(CH3)COO(CH2)3SiO3/2)0.75、 (PhSi03/2)〇.5(CH2=C(CH3)COO(CH2)3Si03/2)〇.5、 (PhSi〇3/2)〇.67(CH2=C(CH3)COO(CH2)3Si〇3/2)〇.33 ' (MeSi〇3/2)〇.25(CH2=C(CH3)COO(CH2)3Si〇3/2)〇.72(Me3SiO"2)o.〇3、 (MeSiO3/2)0.5(CH2=C(CH3)COO(CH2)3SiO3/2)0.47(Me3SiO1/2)0 03、 (MeSi〇3/2)〇.67(CH2=C(CH3)COO(CH2)3Si〇3/2)〇,3〇(Me3Si〇i/2)o.〇3、 (MeSi〇3/2)o.67(CH2=CHCOO(CH2)3Si〇3/2)〇.33、 (PhSi03/2)〇.67(CH2=CHCOO(CH2)3Si03/2)〇.33、 163288.doc -25- 201245352 (MeSio3/2)0.33(C^^CHCH2OCH2CH2CH2SlO3/2)0.67 Ο (MeSi〇3/2)〇 67(qH2/CHCH2〇CH2CH2CH2Si〇3/2)〇 33 O 、 (MeSi〇3/2)〇 6(q^CHCH2〇CH2CH2CH2Si〇3/2)〇 3(Si〇4/2)〇」 o 、 (HSi〇3/2)〇 6(C^CHCH2〇CH2CH2CH2Si〇3/2)〇 4 〇、 (HSi03/2)〇.5(C^2/CHCH2OCH2CH2CH2Si03/2)〇.5 〇、 (HSi〇3/2)〇23(MeSi〇3/2)〇4(CH2^CHCH2〇CH2CH2CH2Si〇3/2)〇37MeSi(OCH3)3, CH3Si(OCH2CH3)3, CH3Si(OCH2CH2CH3)3, CH3Si[0(CH2)3CH3]3, CH3CH2Si(OCH2CH3)3, C6H5Si(OCH3)3, C6H5CH2Si(OCH3)3, C6H5Si(OCH2CH3) 3. CH2=CHSi(OCH3)3, CH2=CHCH2Si(OCH3)3, CF3CH2CH2Si(OCH3)3, CH3Si(OCH2CH2OCH3)3, CF3CH2CH2Si(OCH2CH2OCH3)3, CH2=CHSi(OCH2CH2OCH3)3, CH2=CHCH2Si(OCH2CH2OCH3) 3. C6H5Si(OCH2CH2OCH3)3, Si(OCH3)4, Si(OC2H5)4 and Si(OC3H7)4; organic ethoxylated decanes such as CH3Si(OCOCH3)3, CH3CH2Si(OCOCH3)3 and CH2=CHSi( OCOCH3)3; organic iminooxydecane, 163288.doc -21- 201245352 such as CH3Si[0-N=C(CH3)CH2CH3]3, Si[0-N=C(CH3)CH2CH3]4 and CH2= CHSi[0-N=C(CH3)CH2CH3]3; organic acetamino decane, such as CH3Si[NHC(=0)CH3]3 and C6H5Si[NHC(=〇)CH3]3; amino decane, such as CH3Si [NH(s-C4H9)]3 and CH3Si(NHC6H丨丨)3; and an organic aminooxydecane. • The crosslinker may be a single decane or a mixture of two or more different decanes each as described above. In addition, methods for preparing trifunctional decanes and tetrafunctional decanes are well known in the art; many such decanes are commercially available. When present, the degree of crosslinking of the cross-linking agent in the polyoxo-oxygen composition is sufficient to cure (cross-link) the polydecene oxide resin. The exact amount of the cross-linking agent depends on the degree of curing to be determined. 'The degree of curing usually depends on the molar number of the hydrolyzable group bonded to the ruthenium in the cross-linking agent and the hydrazine-bonded hydrogen atom 'hydroxyl group or hydrolyzable group in the polyfluorene oxide resin. The ratio of the number of moles increases and increases. Generally, the concentration of the cross-linking agent is sufficient to provide a argon-bonding argon atom, a hydroxyl group or a hydrolyzable group 0 2 to 4 moir bond-bondable hydrolyzable groups in the polyoxyl resin. The optimum amount of crosslinker can be readily determined by routine experimentation. As described above, the condensation curable polydecane oxide composition may additionally comprise at least one condensation catalyst. The condensation catalyst may be any of those commonly used to promote the condensation of a hydrazone-bonded hydroxyl group (the Sixiyuan alcohol) group to form a Si_〇-Si bond. Condensation catalyst. Examples of condensation catalysts include (but are limited to) amines; and lead, tin, zinc, and complexes of iron and carboxylic acid. Specifically, the condensation catalyst may be selected from the group consisting of tin (II) and tin (IV) compounds such as tin dilaurate, tin dioctoate and tetrabutyl tin; and titanium compounds such as tetrabutanol. 163288.doc •22· 201245352 When present, the concentration of the condensation catalyst is usually from 0.1 to 10% (w/w), or from 5 to 5, based on the total weight of the polyoxyxylene resin. /. (w/w), or 1 to 3% (w/w) 〇可可可可可匕匕 it it it it it it it it it it it it it it it it it it it it it it it it it it it it it it it it it it it Oxygen resin and photoinitiator as the case may be. Examples of suitable radiation curable polyoxo compositions comprising a polyoxyxylene resin include those described in PCT Publication No. WO 2 〇〇 7/14571, the disclosure of which is incorporated herein by reference. in. In one aspect, the radiation curable polydecene oxide composition comprises the formula (R7R82Si01/2)w (R82Si〇2/2)x(R8si〇3/2)y(Si〇4/2)z (ιν) The polyoxymethylene resin cured product, wherein each ruler 7 is independently a hydrocarbon group. a hydrocarbyl group substituted by a sucrose or a carbonyl group substituted by a halogen, wherein each R8 is independently R7, _H or a radiation-sensitive group 'w is from 0 to 0.95, X is 〇 to 0.95, y is 0 to 1, 2 is 〇 to 0.9, y+ζ is 0.1 to 1, and aw+x+y+z=1, the limitation is that the polyoxyl resin has an average per molecule. At least two oximes are bonded to the radiation sensitive group. In the formula (IV), 'R6, w, x, y, 2 and 丫+2 are as described above and exemplified. Further, the hydrocarbon group represented by R7 and the halogen-substituted hydrocarbon group are as exemplified above for R4. Examples of the radiation-sensitive group represented by R8 include, but are not limited to, an acryloxyalkyl group, a substituted acryloxyalkyl group, an alkenyl ether group, a dilute group, and an organic group substituted with an epoxy group. Group. As used herein, the term "light-sensitive group" means that the group forms an activity in the presence of a free-radical photoinitiator or a cationic photoinitiator upon exposure to light at a wavelength of 150 to 8 nm. I63288.doc •23· 201245352 Substances such as free radicals or cations. Examples of the acryloxyalkyl group represented by R8 include, but are not limited to, acrylonitrile methyl & 2-propenyloxyethyl, 3-propyleneoxypropyl, and propyleneoxyloxy Butyl. Examples of the substituted acryloxyalkyl group represented by R8 include, but are not limited to, mercaptopropenyloxycarbonyl, 2-mercaptopropenyloxyethyl, and 3-mercaptopropenyloxypropane base. Examples of the alkenyl ether group represented by R include, but are not limited to, a vinyl ether group having the formula R9-〇-ch=cH2, wherein R9 is a hydrocarbyl group or a C1 to C丨0 halogen group Substituting a hydrocarbon group. The extended hydrocarbon group represented by R9 usually has 1 to 10 carbon atoms, or 1 to 6 carbon atoms, or 1 to 4 carbon atoms. Examples of hydrocarbyl groups include (but are limited to) alkylene groups such as methylene 'extended ethyl, propane-indole, 3-diyl, 2-nonylpropane-1,3-diyl'butane-丨' buckle Dibasic, butane mono, diyl, pentane-1,5-diyl, pentane-1,4-diyl, hexane-1,6-diyl, octane-oxime, 8-diyl And calcined-1,10-yl; extended ring pit base, such as cyclohexanthene gt, _ 1, 'diyl; extended aryl, such as phenyl. Examples of the substituted hydrocarbon group include, but are not limited to, one or more hydrogen atoms which have been halogenated, such as fluorine, gas and bromine substituted divalent hydrocarbon groups such as _CH2CH2CF2cF2CH2CH2. Examples of the alkenyl group represented by R8 include, but are not limited to, a vinyl group, a propyl group, a propenyl group, a butenyl group, and a hexenyl group. As used herein, the term "epoxy-substituted organic group" refers to a monovalent organic group in which an epoxy substituent oxygen atom is directly attached to two adjacent carbon atoms of a carbon chain or ring system. Examples of the organocyclic group substituted by a cyclic fluorenyl group represented by R8 163288.doc -24·201245352 include, but are not limited to, 2,3-epoxypropyl, 3,4-epoxybutyl, 4, 5-epoxy pentyl, 2-glycidoxyethyl, 3-glycidoxypropyl, 4-glycidoxybutyl, 2-(3,4-epoxycyclohexyl)ethyl , 3-(3,4-epoxycyclohexyl)propyl, 2-(3,4-epoxy-3-indolylcyclohexyl)-2-indenylethyl, 2-(2,3- Epoxycyclopentyl)ethyl and 3-(2,3-epoxycyclopentyl)propyl. Polyoxyxylene resins typically contain an average of at least two fluorene-bonded radiation-sensitive groups per molecule. In the polyoxyxene resin, usually at least 50 mol%, or at least 65 mol%, or at least 80 mol% of the group R8 is a radiation-sensitive group. The term "in the polyoxyxylene resin, the mol% of the group R8 is a radiation-sensitive group" is defined as the number of moles of the fluorene-bonded radiation-sensitive group in the polyoxynoxy resin and the group R8 in the resin. The ratio of the total number of moles is multiplied by 1〇〇. Examples of the polyoxynoxy resin having the formula (IV) include, but are not limited to, a resin having the formula: (MeSi〇3/2)o.25 (CH2=C(CH3)COO(CH2)3Si〇3/2 )o.75 '(MeSiO3/2)0 5(CH2=C(CH3)COO(CH2)3SiO3/2)0 5, (MeSi〇3/2)o.67(CH2=C(CH3)COO(CH2 ) 3Si〇3/2)〇.33 '(PhSiO3/2)Q.25(CH2=C(CH3)COO(CH2)3SiO3/2)0.75, (PhSi03/2)〇.5(CH2=C(CH3) )COO(CH2)3Si03/2)〇.5, (PhSi〇3/2)〇.67(CH2=C(CH3)COO(CH2)3Si〇3/2)〇.33 ' (MeSi〇3/2 〇.25(CH2=C(CH3)COO(CH2)3Si〇3/2)〇.72(Me3SiO"2)o.〇3, (MeSiO3/2)0.5(CH2=C(CH3)COO(CH2) 3SiO3/2)0.47(Me3SiO1/2)0 03, (MeSi〇3/2)〇.67(CH2=C(CH3)COO(CH2)3Si〇3/2)〇, 3〇(Me3Si〇i/ 2) o.〇3, (MeSi〇3/2)o.67(CH2=CHCOO(CH2)3Si〇3/2)〇.33, (PhSi03/2)〇.67(CH2=CHCOO(CH2)3Si03 /2)〇.33, 163288.doc -25- 201245352 (MeSio3/2)0.33(C^^CHCH2OCH2CH2CH2SlO3/2)0.67 Ο (MeSi〇3/2)〇67(qH2/CHCH2〇CH2CH2CH2Si〇3/2) 〇33 O , (MeSi〇3/2)〇6(q^CHCH2〇CH2CH2CH2Si〇3/2)〇3(Si〇4/2)〇” o , (HSi〇3/2)〇6(C^CHCH2 〇CH2CH2CH2Si〇3/2)〇4 〇, (HSi03/2) .5 (C ^ 2 / CHCH2OCH2CH2CH2Si03 / 2) 〇.5 square, (HSi〇3 / 2) 〇23 (MeSi〇3 / 2) 〇4 (CH2 ^ CHCH2〇CH2CH2CH2Si〇3 / 2) 〇37

O f ^s^CH2CH2Si〇3/2) (MeSi〇3/2)〇 33\ /0.67 / /^CH2CH2Si〇3/2\ (MeSi〇3/2)〇 67\ /0.33O f ^s^CH2CH2Si〇3/2) (MeSi〇3/2)〇 33\ /0.67 / /^CH2CH2Si〇3/2\ (MeSi〇3/2)〇 67\ /0.33

/ (phSiO3/2)0.63(Me2ViSiOl/2)0.21 \ (MeSi〇3/2)Q.485(HSi〇3/2)0.485(ViSi〇3/2)0.03，其中Me為曱基，Ph為苯基，Vi為乙烯基，且在圓括號外部之數值下標表示莫耳分數。此外，在前述式中’未指定單元之順序。製備具有矽鍵結輻射敏感性基團之聚矽氧樹脂之方法在此項技術中為已知的。舉例而言，含有矽鍵結丙烯醯氧基烷基或經取代之丙烯醯氧基烷基之聚矽氧樹脂可藉由在酸 163288.doc 26- 201245352 性或鹼性催化劑存在下共水解丙烯醯氧基烷基烷氧基矽烷或經取代之丙烯醯氧基烷基烷氧基矽烷及烷氧基矽烷加以製備，如美國專利第5,738,976號及美國專利第5,959,〇38號中所例示。或者，此等樹脂可藉由共水解丙烯醯氧基烷基氯矽烷或經取代之丙烯醯氧基烷基氣矽烷及至少一種氯矽院來產生’如美國專利第4,568,566號中所教示。含有矽鍵結烯基醚基團之聚矽氧樹脂可藉由使烷氧基矽燒與水在酸性縮合催化劑存在下反應且隨後用經經基取代之乙稀基醚及轉酯催化劑處理反應混合物加以製備，如美國專利第5,861，467號中所述。簡言之，此方法包含以下步驟·⑴使⑷具有式RxSKOR1)4^之矽烧、（b)水及（c)酸性縮 s催化劑反應；（Π)自步驟（I)之混合物移除醇；（Η〗）中和步驟（II)之混合物；（IV)添加具有式HO-R2-〇_CH=ch226 烯基醚化合物；（V)添加轉酯催化劑至步驟（IV)之混合物中；及（VI)自步驟（V)之混合物移除揮發性組分；其中尺為具有1至20個碳原子之單價烴或鹵代烴基，Rl為具有1 i 8 個碳原子之單價烷基，r2為具有1至2〇個碳原子之二價烴或i代烴基，且X具有〇至3之值，其限制條件為水與烷氧基之莫耳比小於0.5。或者，含有烯基醚基團之聚矽氧樹脂可藉由使烷氧基矽烷、水及經羥基取代之乙烯基醚化合物在非酸性縮合催化劑存在下反應，且接著用轉醋催化劑處理反應混合物加以製備，如美國專利第5,824,761號中所述。簡言之，此方法包含⑴使（a)具有式RxSi(0Ri)4_xi矽烷、（b)水、（c)選自胺 163288.doc -27- 201245352 羧酸酯、重金屬缓酸鹽、異氰酸酯、矽醇化物、苯氧化物、硫醇鹽、CaO、BaO、u〇H、BuLi、胺及氫氧化錢之非酸性縮合催化劑、及（d)具有式h〇-R2-〇_ch=CH2之乙烯基醚化合物反應，·（II)自⑴之混合物移除醇；（111)中和（11) 之混合物；（IV)添加轉酯催化劑至（111)之混合物中；及（ν) 自（IV)之混合物移除揮發性組分；其中R為具有1至2〇個碳原子之單彳貝烴或鹵代煙基，r 1為具有1至8個碳原子之單價烷基，R2為具有1至20個碳原子之二價烴或鹵代烴基，且χ 具有0至3之值，其限制條件為水與烷氧基之莫耳比小於 0.5。含有石夕鍵結稀基之聚石夕氧樹脂可如以上對於具有式⑴之聚矽氧樹脂所述加以製備。含有石夕鍵結經環氧基取代之有機基團之聚矽氧樹脂可藉由在有機鈦酸酯催化劑存在下共水解環氧基官能性烧氧基矽烷及烷氧基矽烷加以製備，如美國專利第5,468,826號中所述。或者’含有石夕鍵結經環氧基取代之有機基團之聚石夕氧樹脂可藉由使含有妙鍵結氫原子之聚;g夕氧樹脂與環氧基官能性烯在矽氮化催化劑存在下反應加以製備，如美國專利第 6,831，145 號，第 5,310,843 號；第 5,530 075 號；第 5,283,309 號；第 5,468,827 號；第 5,486,588 號；及第 5,358,983號中所述。輻射可固化聚矽氧組合物可包含其他成分，其限制條件為彼等成分不阻止聚石夕氧樹脂固化形成電子封裝件2〇〇之上述第一界面塗層1 1 〇。其他成分之實例包括（但不限於）黏 163288.doc •28· 201245352 著促進劑；染料；顏料；抗氧化劑；熱穩定劑；阻燃劑；流動控制添加劑；填充劑，包括增容填充劑（extending filler)及補強填充劑；有機溶劑；交聯劑；及光引發劑。舉例而言，輻射可固化聚矽氧組合物可另外包含至少一種光引發劑。視聚珍氧樹脂中之韓射敏感性基團之性質而疋，光引發劑可為陽離子光引發劑或自由基光引發劑，舉例而έ，當樹脂含有烯基醚或經環氧基取代之有機基團時’料氧組合物可另外包含至少—種陽離子光引發劑。陽離子光引發劑可為能夠在暴露於波長為15〇至8〇〇 nm之輻射後引發聚矽氧樹脂固化（交聯）之任何陽離子光引發劑。陽離子光引發劑之實例包括（但不限於）鑌鹽、磺酸之二芳基鏘鹽、磺酸之三芳基錡鹽、自朋酸之二芳基錤鹽及酉朋酸之三芳基锍鹽。合適之鏽鹽包括具有選自Rl02l+ MXz-、Rl〇3 s+ MX〆、 R103 Se+ MXZ_、R】〇4 P+ MXzjR' N+ MXz-之式的鹽，其中各R1G獨立地為具有1至3 0個碳原子之烴基或經取代之烴基；Μ為選自過渡金屬、稀土金屬、鑭系金屬、類金屬、磷及硫之元素；X為鹵素（例如氯、溴、碘），且2具有使乘積ζ(Χ上之電何+ Μ之氧化數）=-1的值。烴基上之取代基之實例包括（但不限於）0^至（：8坑氧基、（：1至(：,6烷基、硕基、氯基、溴基、氰基、羧基、巯基及雜環芳族基團，諸如吡啶基、噻吩基及哌喃基。由Μ表示之金屬之實例包括（但不限於）過渡金屬，諸如Fe、Ti、Zr ' Sc、V、Cr及Μη ;鋼系金屬’諸如Pr及Nd ;其他金屬，諸如cs、sb、Sn、βί、 163288.doc -29- 201245352 A卜Ga及In ,類金屬，諸如^ As ;及？。式Μχ/表示非鹼性非親核陰離子。具有式ΜΧζ•之陰離子之實例包括（但不限於）BF4、PF6-、AsF6·、SbF6=、SbCl6·及 SnCl6·。鏽鹽之實例包含（但不限於）雙_二芳基錤鹽，諸如六氟砷酸雙（十二烷基苯基）錤、六氟銻酸雙（十二烷基笨基）鎭，及六氟銻酸二烷基笨基鐄。確酸之二芳基錤鹽之實例包括(但不限於）：全氟烷基磺酸之二芳基錤鹽，諸如全氟丁烷磺酸之二芳基鎭鹽、全氟乙烷磺酸之二芳基鎭鹽、全氟辛烷磺酸之二芳基錤鹽及三氟曱烷磺酸之二芳基錤鹽；及芳基磺酸之二芳基鐫鹽，諸如對曱苯續酸之二芳基㈣、十二烧基苯績酸之二芳基鎖鹽、苯磺酸之二芳基鐫鹽及3_硝基笨磺酸之二芳基錤鹽績酸之三芳基疏鹽之實例包括（但不限於）：全氣烧基項酸之三芳基錡鹽，諸如全氟丁烷磺酸之三芳基錶鹽、全氟乙烧確酸之三芳基㈣、全a辛糾酸之三芳基錄鹽及三氣曱烧確酸之三芳基疏鹽；㈣基續酸之三芳基疏鹽，諸如對甲苯4酸之三芳錢鹽、十：烧基料酸之三芳基疏鹽、苯磺酸之三芳基錡鹽及3-硝基苯磺酸之= 蝴酸之二芳基鎖鹽之實例包括(但不限於):=明酸之一方基鎭鹽。蝴酸三芳基錡鹽之實例包括（但不限於）全 i芳基蝴酸之三芳基疏鹽。綳酸之二芳基鋼鹽及_酸之三芳基銃鹽在此項技術中為熟知的，如歐洲專利申請案第π 0562922號中所例示。 ' 陽離子光引發劑可為單-陽離子光引發劑或包含兩種或 -30· 163288.doc/ (phSiO3/2)0.63(Me2ViSiOl/2)0.21 \(MeSi〇3/2)Q.485(HSi〇3/2)0.485(ViSi〇3/2)0.03, where Me is a fluorenyl group and Ph is a benzene group Base, Vi is a vinyl, and the numerical subscript outside the parentheses indicates the mole fraction. Further, in the above formula, the order of the units is not specified. Methods of preparing polyfluorene oxide resins having a fluorene-bonded radiation-sensitive group are known in the art. For example, a polyfluorene oxide resin containing a hydrazine-bonded acryloxyalkylene group or a substituted acryloxyalkyl group can be co-hydrolyzed by the presence of an acid 163288.doc 26-201245352 or a basic catalyst. The decyloxyalkyl alkoxy decane or the substituted acryloxyalkyl alkoxy decane and the alkoxy decane are prepared as exemplified in U.S. Patent No. 5,738,976 and U.S. Patent No. 5,959, the entire disclosure of which is incorporated herein. Alternatively, such resins can be produced by co-hydrolysis of a propylene oxyalkyl chloro decane or a substituted propylene oxyalkyl decane and at least one chloramphenicol as taught in U.S. Patent No. 4,568,566. The polyfluorene oxide resin having a fluorene-bonded alkenyl ether group can be reacted by reacting an alkoxy group with water in the presence of an acidic condensation catalyst and then treating the reaction with a vinyl group-substituted ethylene ether and a transesterification catalyst. The mixture is prepared as described in U.S. Patent No. 5,861,467. Briefly, the method comprises the following steps: (1) reacting (4) having the formula RxSKOR1)4^, (b) water and (c) acidic s catalyst; (Π) removing the alcohol from the mixture of step (I) (Η)) neutralizing the mixture of step (II); (IV) adding a compound having the formula HO-R2-〇_CH=ch226 alkenyl ether; (V) adding a transesterification catalyst to the mixture of step (IV); And (VI) removing the volatile component from the mixture of step (V); wherein the ruth is a monovalent hydrocarbon or a halogenated hydrocarbon group having 1 to 20 carbon atoms, and R1 is a monovalent alkyl group having 1 i 8 carbon atoms. R2 is a divalent hydrocarbon or i-hydrocarbon group having 1 to 2 carbon atoms, and X has a value of ruthenium to 3, with the proviso that the molar ratio of water to alkoxy group is less than 0.5. Alternatively, the polyoxynoxy resin containing an alkenyl ether group can be reacted by alkoxysilane, water and a vinyl ether compound substituted with a hydroxyl group in the presence of a non-acidic condensation catalyst, and then the reaction mixture is treated with a transacetal catalyst. It is prepared as described in U.S. Patent No. 5,824,761. Briefly, the method comprises (1) having (a) having the formula RxSi(0Ri)4_xioxane, (b) water, (c) being selected from the group consisting of amines 163288.doc -27-201245352 carboxylate, heavy metal buffer, isocyanate, a non-acidic condensation catalyst of a sterol compound, a phenoxide, a thiolate, a CaO, a BaO, a 〇H, a BuLi, an amine, and a hydrazine, and (d) having the formula h〇-R2-〇_ch=CH2 a vinyl ether compound reaction, (II) removing the alcohol from the mixture of (1); (111) neutralizing the mixture of (11); (IV) adding the transesterification catalyst to the mixture of (111); and (ν) self ( The mixture of IV) removes volatile components; wherein R is a monomolecular hydrocarbon or a halogenated nicotine group having 1 to 2 carbon atoms, and r 1 is a monovalent alkyl group having 1 to 8 carbon atoms, and R 2 is A divalent hydrocarbon or a halogenated hydrocarbon group having 1 to 20 carbon atoms, and ruthenium has a value of 0 to 3, with the proviso that the molar ratio of water to alkoxy group is less than 0.5. The polyoxo resin containing a stellate bond can be prepared as described above for the polyoxyxene resin of the formula (1). The polyoxynoxy resin containing an organic group substituted with an epoxy group can be prepared by cohydrolyzing an epoxy-functional alkoxydecane and an alkoxydecane in the presence of an organic titanate catalyst, such as U.S. Patent No. 5,468,826. Or a polycyloxy resin containing an organic group substituted with an epoxy group by an anthracene bond can be obtained by argon-depositing a hydrogen atom containing a wonderful bond; The reaction is carried out in the presence of a catalyst, as described in U.S. Patent Nos. 6,831,145, 5,310,843, 5,530,075, 5,283,309, 5,468,827, 5,486,588, and 5,358,983. The radiation curable polydecene oxide composition may comprise other components, with the proviso that the components do not prevent the polysulfide resin from solidifying to form the first interfacial coating 1 1 电子 of the electronic package 2 . Examples of other ingredients include, but are not limited to, 163288.doc • 28· 201245352 accelerators; dyes; pigments; antioxidants; heat stabilizers; flame retardants; flow control additives; fillers, including compatibilizing fillers ( Extending filler) and reinforcing filler; organic solvent; crosslinking agent; and photoinitiator. For example, the radiation curable polydecene oxide composition can additionally comprise at least one photoinitiator. Depending on the nature of the Korean-sensitive group in the polyoxyl resin, the photoinitiator can be a cationic photoinitiator or a free-radical photoinitiator, for example, when the resin contains an alkenyl ether or is substituted with an epoxy group. The organic oxygen group composition may additionally comprise at least one cationic photoinitiator. The cationic photoinitiator can be any cationic photoinitiator capable of initiating curing (crosslinking) of the polyoxyxylene resin upon exposure to radiation having a wavelength of from 15 Å to 8 Å. Examples of cationic photoinitiators include, but are not limited to, phosphonium salts, diarylsulfonium salts of sulfonic acids, triarylsulfonium salts of sulfonic acids, diarylsulfonium salts of captopic acid, and triarylsulfonium salts of capric acid. . Suitable rust salts include those having the formula selected from the group consisting of R1012 + MXz-, Rl 〇 3 s + MX 〆, R 103 Se + MXZ _, R 〇 4 P + MXzjR' N + MXz -, wherein each R 1 G independently has from 1 to 30 a hydrocarbon group or a substituted hydrocarbon group of a carbon atom; ruthenium is an element selected from the group consisting of a transition metal, a rare earth metal, a lanthanide metal, a metalloid, phosphorus, and sulfur; X is a halogen (e.g., chlorine, bromine, iodine), and 2 has a product ζ (ζ 之何何 + + 氧化氧化氧化氧化 = = = = = = = = = = = = = = Examples of the substituent on the hydrocarbon group include, but are not limited to, 0^ to (8 volts oxy, (1 to (:, 6 alkyl, phenyl, chloro, bromo, cyano, carboxy, fluorenyl, and Heterocyclic aromatic groups such as pyridyl, thienyl and piperidyl. Examples of metals represented by ruthenium include, but are not limited to, transition metals such as Fe, Ti, Zr' Sc, V, Cr, and Μ; Metals such as Pr and Nd; other metals such as cs, sb, Sn, βί, 163288.doc -29- 201245352 A Ga and In, metalloids such as ^ As ; and ?. Non-nucleophilic anions. Examples of anions having the formula include, but are not limited to, BF4, PF6-, AsF6·, SbF6=, SbCl6·, and SnCl6·. Examples of rust salts include, but are not limited to, bis-bis-aryl a base salt such as bis(dodecylphenyl)phosphonium hexafluoroarsenate, bis(dodecylphenyl)phosphonium hexafluoroantimonate, and dialkyl stupidium hexafluoroantimonate. Examples of the diarylsulfonium salt include, but are not limited to, diarylsulfonium salts of perfluoroalkylsulfonic acids, such as diarylsulfonium salts of perfluorobutanesulfonic acid, perfluoroethanesulfonic acid a diarylsulfonium salt, a diarylsulfonium salt of perfluorooctanesulfonic acid, and a diarylsulfonium salt of trifluorosulfonate; and a diarylsulfonium salt of an arylsulfonic acid, such as p-benzoic acid Diaryl (4), diaryl sulphonate of dodecylbenzene phthalic acid, diaryl sulfonium salt of benzene sulfonic acid and diaryl sulfonium salt of 3-nitro sulfonic acid Examples include, but are not limited to, triaryl sulfonium salts of all gas-burning base acids, triaryl sulfonates such as perfluorobutane sulfonic acid, triaryl (tetra) perfluoro ethanoic acid, all a octanoic acid a triaryl sulphate salt and a tris-sulfonium salt of a trisodium sulphate; (iv) a triaryl sulfonium salt of a carboxylic acid, such as a triaryl salt of p-toluene 4 acid, a triaryl salt of a base acid Examples of the triarylsulfonium salt of benzenesulfonic acid and 3-nitrobenzenesulfonic acid = the diaryl lock salt of the cyanate include, but are not limited to: = one of the salts of the acid, the triarylsulfonium salt Examples include, but are not limited to, triaryl sulfonium salts of all-aryl aryl acids. Diaryl sulphate salts of decanoic acid and triaryl sulfonium salts of y acid are well known in the art, as in European patent applications π 0562922 Illustrated in 'cationic photoinitiators may be a single - or a cationic photoinitiator comprising two or -30 · 163288.doc

201245352 兩種以上各自如上所述之不同陽離子光引發劑之混合物。以聚石夕氧樹脂之重量計，陽離子光引發齊丨丨之濃度通常為〇·01 至 2〇% (w/w)、或者 0.1 至 20% (W/W)、或者 n5%。當聚石夕氧樹脂含有丙賴氧基貌纟、經取代t丙稀酿氧基烷基，或烯基時，聚矽氧組合物可另外包含至少一種自由基光引發劑。自由基光引發劑可為能夠在暴露於波長為 1 50至800 nm之輻射後引發聚矽氧樹脂固化（交聯）之任何自由基光引發劑。自由基光引發劑之實例包括（但不限於）二苯甲酮；4,4,_ 雙（二甲胺基）二苯甲酮；鹵化二苯甲酮；苯乙酮；α·羥苯乙鲷；氯苯乙酮，諸如二氯苯乙酮及三氣苯乙酮；二烧氧基苯乙酮，諸如2,2-二乙氧基苯乙酮；α•羥基烷基苯酮，諸如2-經基-2-甲基-1-苯基-1-丙酮及1·羥基環己基笨基酮；α-胺基烷基苯酮，諸如2-甲基-4，-(甲硫基）-2-嗎啉基笨丙酮；安息香（benzoin);安息香醚，諸如安息香甲基喊、安息香乙基醚及安息香異丁基醚；二笨基乙二酮縮酮，諸如2,2-二甲氧基-2-苯基苯乙酮；醯基膦基氧化物，諸如二苯基（2,4,6-三甲基苯曱醯基）膦氧化物；氧雜蒽綱 (xanthone)衍生物；噻噸酮（thioxanthone)衍生物；g綱 (fluorenone)衍生物；苯基乙醛酸曱酯；萘乙酮；葱酿 (anthraquninone)衍生物；芳族化合物之磺醯氯；及酿基 α-氧亞胺基酮，諸如1-苯基-1，2-丙二酮_2-(〇-乙氧幾基）肟。自由基光引發劑亦可為聚石夕坑，諸如由West在美國專利 163288.doc -31 - 201245352 第4,260,780號（其據此以引用的方式併入本文中）中描述之苯基曱基聚矽烷；由Baney等人在美國專利第4,314 956號 (其據此以引用的方式併入本文中）中描述之胺化曱基聚石夕烷；Peterson等人在美國專利第4,276,424號（其據此以引用的方式併入本文中）中之甲基聚矽烷；及由”6以等人在美國專利第4,324,901號（其以引用的方式併入本文）中描述之聚笨乙稀石夕烧（polysilastyrene) 〇自由基光引發劑可為單一自由基光引發劑或包含兩種或兩種以上不同自由基光引發劑之混合物。以聚矽氧樹脂之重量計，自由基光引發劑之濃度通常為〇丨至2〇% (w/w)、或者 1 至 10% (w/w)。過氧化物可固化聚矽氧組合物通常包含具有矽鍵結不飽和基團之聚矽氧樹脂及有機過氧化物。包含聚矽氧樹脂之適合過氧化物可固化聚矽氧組合物之實例包括pCT公開案第WO 2007^457^號中所述者，該公開案之内容據此以引用的方式併入本文中。在一個態樣中，過氧化物可固化聚矽氧組合物包含具有式（RiR'SiOuO^R'SiOwh (RuSi〇3/2)y(Si〇42h(v)之聚矽氧樹脂，其中各R1獨立地為（^至匕。烴基或^至^^經鹵素取代之烴基，兩者均不含脂族不飽和度；各…,獨立地為R1 '烯基、炔基、丙烯醯氧基烷基或經取代之丙烯醯氧基烷基；w為〇至0.95，X為〇至ο.%，y為〇至！，2為〇至 0.9，y + z為0.1至1，且w+x+y+z=1 ;及有機過氧化物。在式（V)中，R1、w、X、y、2及丫 + 2係如以上對於具有式⑴之 163288.doc •32- 201245352 聚矽氧樹脂所述且例示。由R表不之可相同或不同之烯基通常具有2至約個碳原子、或者2至6個碳原子，且由(但不限於)乙稀基、稀丙基、丁烯基、己烯基及辛烯基例示。由R表不之可相同或不同之炔基通常具有2至約個碳原子、或者2至6個碳原子，且由（但不限於）乙块基、丙快基、丁炔基、己炔基及辛炔基例示。在聚石夕氧樹脂之-個態樣中，樹脂含有每個分子平均至少一個烯基或炔基。聚矽氧樹脂通常含有小於1〇% (w/w)、或者小於5% (w/w)、或者小於2% (w/w)之矽鍵結羥基，如藉由My NMR所測定。具有式（V)之聚矽氧樹脂之實例包括（但不限於）具有下式之樹脂： (Vi2MeSi01/2V25(PhSi〇3/2)Q75、（ViMe2Si〇i/2)G25(phSi〇3475、 (ViMe2SiO1/2)0.25(MeSi〇3/2)0,25(phSi〇3/2)0 50 , (ViMe2Si〇1^^ (PhSi〇3/2)〇.75(Si04/2)OI^(Vi2MeSi〇i/2)〇i5(ViMe2Si〇]/2)〇i (Phsic^k75，其中Me為曱基，vi為乙烯基、ph為苯基，且在圓括號外部之數值下標表示莫耳分數^此外，在前述式中，未指定單元之順序。聚矽氧樹脂可為單一聚矽氧樹脂或包含兩種或兩種以上各自如上所述之不同聚矽氧樹脂之混合物。製備具有矽鍵結烯基或矽鍵結炔基之聚矽氧樹脂之方法在此項技術中為熟知的；許多此等樹脂可購得。此等樹脂 163288.doc 03- 201245352 通常藉由在有機溶劑，諸如甲笨中共水解氣矽烷前驅體之適當混合物加以製備。舉例而言，基本上由RlRll2Si〇…單元及RHSiOw單元組成之聚矽氧樹脂可藉由在甲苯中共水解具有式WR1丨2SiC丨之化合物及具有式RuSic丨3之化合物加以製備中R丨及R1丨係如以上所定義且例示。分離鹽酸水溶液及聚矽氧水解產物且水解產物用水洗滌以移除殘餘酸且在溫和縮合催化劑存在下加熱以「塑形」樹脂來獲得必要黏度。必要時，樹脂可進一步在有機溶劑中用縮合催化劑處理以降低矽鍵結羥基之含量。或者，含有除氣基以外之可水解基團（諸如·Βγ、、·〇(：Η3、_〇c(〇)CH3、 •N(CH3)2、-NHCOCH3及-SCH3)之矽烷可用作共水解反應中之起始物質。樹脂產物之性質視矽烷之類型、矽烷之莫耳比、縮合程度及加工條件而定。有機過氧化物之實例包括二芳醯基過氧化物，諸如過氧化二-苯甲醯基、過氧化二對氣苯甲醯基及過氧化雙_2,4_ —氣苯甲醯基；二烷基過氧化物，諸如過氧化二-第三丁基及2,5·二曱基-2,5-二-(第三丁基過氧基）己炫；二芳院基過氧化物，諸如過氧化二異丙笨；院基芳烧基過氧化物，諸如過氧化第二丁基異丙苯及〗，4·雙（第三丁基過氧基異丙基）苯；及烷基芳酿基過氧化物，諸如過苯子酸第三丁酯、過乙酸第三丁酯及過辛酸第三丁酯。有機過氧化物可為單一過氧化物或包含兩種或兩種以上不同有機過氧化物之混合物。以聚矽氧樹脂之重量計，有機過氧化物之漠度通常為（M至5% (w/w)、或者〇.2至2% I63288.doc •34· 201245352 (W/W) 0 、本：明之過氧化物可固化聚石夕氧組合物可包含其他成分、、限制條件為彼等成分不阻止聚石夕氧組合物之聚石夕氧樹脂固化形成電子封裝件·之上述第-界面塗層110。其他成分之實例包括（但不限於）聚石夕氧橡膠，·多不飽和化合物；自由基引發劑，·有機溶劑；紫外線穩定劑；增感劑；㈣；阻燃劑’·抗氧化劑；填充劑，諸如補強填充劑、增谷填充劑及導電填充劑；及黏著促進劑。在一個態樣中，界面塗層120係藉由於聚合物基板川上塗覆包含可固化聚合物組合物及氟矽化合物之氟矽改質聚合物組合物及固化該組合物加以製備。氟石夕化合物可為含有至少原子、㈣分子平均至少鍵結貌氣基或石夕鍵結祕及每個分子平均至少—個單價氟碳化物基圏 4何化δ物，其中化合物之分子量為100至5000、或者 100至4500、或者10〇至4000、或者100至3000、或者1〇〇至 25〇〇、及或者1〇〇至_。氟矽化合物可為矽烷二石夕烷、聚矽&、矽氧烷、二矽氧烷或聚矽氧烷。此外，氟矽化口物可為單一氟矽化合物或包含兩種或兩種以上不同氟矽化合物之混合物。氟矽化合物之實例包括（但不限於）含氟烷氧基矽烷、含氟烷氧基矽酸酯及含氟溶膠_凝膠。在—個特定態樣中，氟矽化合物可為含氟烷氧基矽烷。在此特定態樣中，含氟烷氧基矽烷具有式（Rf(^)ySi(；〇i^2>4 (VI)’其中R12為CdC4烷基’ Rf為。】至(：8單價氟碳化物基團’ Q1為（^至（：8二價烴基，且7為i、2或3。 163288.doc •35* 201245352 由R12表示之烷基可具有分支或未分支結構。由R,2表示之烷基之實例包括（但不限於）甲基 '乙基、丙基、】甲基乙基、丁基、1-甲基丙基、2·曱基丙基及u•二甲基乙基。氟碳化物基團由用相等數目之氟原子置換烴分子之一或多個氫原子產生。由Rf表示之氟碳化物基團可具有分支、未分支或環狀結構。*Rf表示之單價氟碳化物基團之實例包括（但不限於）約25%至約1 〇〇%之氫原子已經用相等數目之氟原子置換的(：丨至(：8單價氟碳化物，由Rf表示之氟碳化物基團之實例包括（但不限於hdCh、、 -CH2CH2CH2CF(CF3)2、全敗曱基、全氣乙基、全氣乙稀基 (-cf=cf2)、全氟烯丙基（_CF2_CF=CF2)、全說丙基、全氟 -1-甲基乙基（異丙基）、全氟丁基、全氟i曱基丙基全氟-2·甲基丙基、全氟二曱基乙基（第三丁基）、全氟戊基、全氟-1-曱基丁基、全氟乙基丙基、全氟_2曱基丁基、全氟-3-甲基丁基、全氟^2·二曱基丙基、全氟_2,2_ 二曱基丙基、全氟己基、全氟庚基、全氟辛基、全氟環戊基、全氟環己基及全氟苯曱基。由Q1表不之二價烴基之實例可具有直鏈、分支或環狀結構及其組合，其中相鄰碳原子可由單鍵、雙鍵或參鍵連接。因此，由Q1表示之二價烴基可包括飽和二價烴與不飽和二價烴兩者。由Q1表示之二價烴基之實例包括（但不限於）曱烷二基（亞曱基，-CH2·)、乙烷_152_二基（伸乙基’ -ch2-ch2-)、伸乙烤基（_CH=CH_)、丙烧_13_二基（韻广 163288.doc201245352 A mixture of two or more different cationic photoinitiators, each as described above. The concentration of the cationic photoinitiated yttrium is usually 〇·01 to 2〇% (w/w), or 0.1 to 20% (W/W), or n5%, based on the weight of the polyoxin. When the polyoxyl resin contains a propyl lysine, a substituted propylene oxyalkyl group, or an alkenyl group, the polyoxymethylene composition may additionally comprise at least one free radical photoinitiator. The free radical photoinitiator can be any free radical photoinitiator capable of initiating curing (crosslinking) of the polyoxyxylene resin upon exposure to radiation having a wavelength of from 150 to 800 nm. Examples of free radical photoinitiators include, but are not limited to, benzophenone; 4,4,-bis(dimethylamino)benzophenone; halogenated benzophenone; acetophenone; alpha hydroxybenzene氯; chloroacetophenone, such as dichloroacetophenone and tri-o-acetophenone; di-oxy acetophenone, such as 2,2-diethoxyacetophenone; α-hydroxyalkylbenzophenone, such as 2-yl-2-methyl-1-phenyl-1-propanone and 1-hydroxycyclohexyl phenyl ketone; α-aminoalkyl benzophenone, such as 2-methyl-4,-(methylthio) -2- morpholinyl acetonide; benzoin; benzoin ether, such as benzoin methyl shrine, benzoin ethyl ether and benzoin isobutyl ether; di-p-ethylenedione ketal, such as 2,2- Methoxy-2-phenylacetophenone; mercaptophosphino oxide, such as diphenyl (2,4,6-trimethylphenylhydrazino)phosphine oxide; xanthone derived a thioxanthone derivative; a fluorenone derivative; a phenylglyoxylate; a naphthyl ethyl ketone; an onhtaquninone derivative; a sulfonium chloride of an aromatic compound; Alpha-oxyimino ketone, such as 1-phenyl-1,2-propanedione_2-( - several ethoxycarbonyl) oxime. The free radical photoinitiator can also be a polysulfide crater, such as those described in U.S. Patent No. 4,260, 780, the entire disclosure of which is incorporated herein by reference. The alkane-based polyoxane described in U.S. Patent No. 4,314,956, the disclosure of which is incorporated herein by reference in its entirety by U.S. Pat. Methyl polydecane, which is incorporated herein by reference; and the polystyrene stone described in U.S. Patent No. 4,324,901, the disclosure of which is incorporated herein by reference. (polysilastyrene) The 〇 radical photoinitiator can be a single free radical photoinitiator or a mixture comprising two or more different free radical photoinitiators. The concentration of the free radical photoinitiator is based on the weight of the polyoxyxylene resin. Usually 〇丨 to 2〇% (w/w), or 1 to 10% (w/w). The peroxide curable polydecane oxy-compound composition usually contains a polyfluorene oxide resin having a hydrazine-bonded unsaturated group. And organic peroxides. Examples of peroxide curable polyoxynoxy compositions include those described in the pCT publication No. WO 2007^457, the disclosure of which is incorporated herein by reference. The peroxide curable polydecene oxide composition comprises a polyfluorene oxide resin of the formula (RiR'SiOuO^R'SiOwh (RuSi〇3/2)y (Si〇42h(v), wherein each R1 is independently (^ To a hydrocarbon group or a halogen-substituted hydrocarbon group, both of which do not contain aliphatic unsaturation; each... independently of R1 'alkenyl, alkynyl, acryloxyalkyl or substituted Acryloxyalkyl; w is 〇 to 0.95, X is 〇 to ο.%, y is 〇 to !, 2 is 〇 to 0.9, y + z is 0.1 to 1, and w+x+y+z= And an organic peroxide. In the formula (V), R1, w, X, y, 2, and 丫+ 2 are as described above for the 163288.doc •32-201245352 polyoxyl resin having the formula (1) and Illustrative. Alkenyl groups which may be the same or different from R generally have from 2 to about carbon atoms, or from 2 to 6 carbon atoms, and are, but are not limited to, ethylene, propyl, butenyl, Hexyl and octenyl are exemplified. The same or different alkynyl groups typically have from 2 to about carbon atoms, or from 2 to 6 carbon atoms, and are exemplified by, but not limited to, ethyl, propyl, butynyl, hexynyl and octynyl groups. In one aspect of the polyoxyl resin, the resin contains an average of at least one alkenyl or alkynyl group per molecule. Polyoxyxylene resins typically contain less than 1% (w/w), or less than 5% (w) /w), or less than 2% (w/w) of the hydrazone bonded hydroxyl group, as determined by My NMR. Examples of the polyoxynoxy resin having the formula (V) include, but are not limited to, a resin having the formula: (Vi2MeSi01/2V25(PhSi〇3/2)Q75, (ViMe2Si〇i/2)G25 (phSi〇3475, (ViMe2SiO1/2) 0.25(MeSi〇3/2)0,25(phSi〇3/2)0 50 , (ViMe2Si〇1^^ (PhSi〇3/2)〇.75(Si04/2)OI^( Vi2MeSi〇i/2)〇i5(ViMe2Si〇]/2)〇i (Phsic^k75, where Me is a sulfhydryl group, vi is a vinyl group, ph is a phenyl group, and the numerical value subscript outside the parentheses indicates Mohr Fractions Further, in the above formula, the order of the units is not specified. The polyoxyxylene resin may be a single polyoxynoxy resin or a mixture comprising two or more different polyfluorene oxide resins each as described above. Methods of bonding an alkenyl group or a fluorene-bonded alkynyl group to a polyoxyl resin are well known in the art; many such resins are commercially available. These resins are generally employed in organic solvents, 163288.doc 03-201245352, Prepared by a suitable mixture of a gas phase precursor of a co-hydrolyzed gas, for example, a polyfluorene resin consisting essentially of RlRll2Si〇... units and RHSiOw units by co-watering in toluene A compound having the formula WR1丨2SiC丨 and a compound having the formula RuSic丨3 are prepared and R(R) and R1 are as defined above and exemplified. The aqueous hydrochloric acid solution and the polyhydrazine hydrolyzate are separated and the hydrolyzate is washed with water to remove the residue. The acid is heated in the presence of a mild condensation catalyst to "shape" the resin to obtain the necessary viscosity. If necessary, the resin may be further treated with a condensation catalyst in an organic solvent to reduce the content of the hydrazine-bonded hydroxyl group. The hydrolyzable group (such as Βγ, 〇 (: Η3, _〇c(〇)CH3, •N(CH3)2, -NHCOCH3, and -SCH3) can be used as a starting point in the cohydrolysis reaction. The nature of the resin product depends on the type of decane, the molar ratio of decane, the degree of condensation, and the processing conditions. Examples of organic peroxides include diaryl sulfhydryl peroxides, such as bis-benzhydryl peroxide, Di-p-benzoyl peroxide and peroxy-2,4-oxabenzhydryl; dialkyl peroxides such as di-tert-butyl peroxide and 2,5·didecyl-2 , 5-di-(t-butylperoxy)hexyl; difangyuan Peroxides, such as diisopropyl peroxide; aryl-based peroxides, such as dibutyl cumene peroxide and 〗 4, bis (tert-butylperoxy isopropyl) benzene And alkyl aryl-based peroxides, such as tert-butyl peroxybenzoate, tert-butyl peracetate and tert-butyl peroctoate. The organic peroxide can be a single peroxide or contain two or A mixture of two or more different organic peroxides. The organic peroxide has a degree of indifference (M to 5% (w/w), or 2. 2 to 2% I63288.doc • 34· 201245352 (W/W) 0 , based on the weight of the polyoxyxylene resin. The present invention relates to a peroxide-curable polyoxo-oxygen composition which may contain other components, and the limitation is that the components do not prevent the poly-stone oxide composition from solidifying to form an electronic package. Interfacial coating 110. Examples of other components include, but are not limited to, polysulfide rubber, polyunsaturated compounds; free radical initiators, organic solvents, ultraviolet stabilizers, sensitizers, (four), flame retardants Antioxidants; fillers such as reinforcing fillers, enriched fillers and conductive fillers; and adhesion promoters. In one aspect, the interfacial coating 120 is comprised of a curable polymer by polymer coating on the polymer substrate. The composition and the fluoroquinone compound fluoroquinone-modified polymer composition and the curing of the composition are prepared. The fluorite compound may be at least atomic, (4) molecular average at least bonded to the gas group or the stone bond secret and each On average, at least one unit price a carbide based 何4, wherein the molecular weight of the compound is from 100 to 5000, or from 100 to 4500, or from 10 to 4000, or from 100 to 3000, or from 1 to 25, and or from 1 to The fluoroquinone compound may be decane diazepine, polyfluorene & oxane, dioxane or polyoxyalkylene. In addition, the fluorinated oxime may be a single fluoroantimony compound or comprise two or two Mixtures of the above different fluoroantimony compounds. Examples of fluoroquinone compounds include, but are not limited to, fluoroalkoxydecane, fluoroalkoxy phthalate, and fluorine-containing sol-gel. In a specific aspect The fluoroquinone compound may be a fluorine-containing alkoxydecane. In this specific aspect, the fluorine-containing alkoxydecane has the formula (Rf(^)ySi(;〇i^2>4 (VI)' wherein R12 is CdC4 The alkyl 'Rf is .] to (: 8 monovalent fluorocarbon group 'Q1 is (^ to (: 8 divalent hydrocarbon group, and 7 is i, 2 or 3. 163288.doc • 35* 201245352 represented by R12 The alkyl group may have a branched or unbranched structure. Examples of the alkyl group represented by R, 2 include, but are not limited to, methyl 'ethyl, propyl, methyl methyl Butyl, 1-methylpropyl, 2,mercaptopropyl and u•dimethylethyl. A fluorocarbon group is produced by replacing one or more hydrogen atoms of a hydrocarbon molecule with an equal number of fluorine atoms. The fluorocarbon group represented by Rf may have a branched, unbranched or cyclic structure. *Rf represents an example of a monovalent fluorocarbon group including, but not limited to, about 25% to about 1% hydrogen atoms. Substituted with an equal number of fluorine atoms (: 丨 to (8 monovalent fluorocarbons, examples of fluorocarbon groups represented by Rf include (but are not limited to, hdCh, -CH2CH2CH2CF(CF3)2, fully unsubstituted thiol, All-gas ethyl, all-air ethylene (-cf=cf2), perfluoroallyl (_CF2_CF=CF2), all-propyl, perfluoro-1-methylethyl (isopropyl), perfluoro Butyl, perfluoro-mercaptopropylperfluoro-2-methylpropyl, perfluorodidecylethyl (t-butyl), perfluoropentyl, perfluoro-1-indenyl butyl, all Fluoroethyl propyl, perfluoro-2-mercaptobutyl, perfluoro-3-methylbutyl, perfluoro^2·dimercaptopropyl, perfluoro-2,2-diisopropylpropyl, perfluoro Hexyl, perfluoroheptyl, perfluorooctyl, perfluorocyclopentyl Perfluoro cyclohexyl, and Yue perfluorophenyl group. Examples of the divalent hydrocarbon group represented by Q1 may have a linear, branched or cyclic structure and a combination thereof, wherein adjacent carbon atoms may be bonded by a single bond, a double bond or a bond. Therefore, the divalent hydrocarbon group represented by Q1 may include both a saturated divalent hydrocarbon and an unsaturated divalent hydrocarbon. Examples of the divalent hydrocarbon group represented by Q1 include, but are not limited to, decanediyl (indenyl group, -CH2.), ethane _152_diyl (extended ethyl '-ch2-ch2-), and Baked base (_CH=CH_), C-burning _13_ two base (Yongguang 163288.doc

-36 - 201245352 CH2_CH2-)、丙烧-1，2-二基（_CH2_CH._CH3)、丁二基、戊二基、己二基、庚二基、辛二基、環戊烷_丨，2•二基、環戊烷-1，3-二基、環己烷-1，2·二基、環己烷·丨，3_二基、環己烷-1，4·二基、苯-1,2-二基、苯 _1>3·二基、苯 _丨，4_ 二基（1，4-伸苯基）及曱苯二基。由式（VI)表示之含氟烷氧基矽烷之實例包括（但不限 ^)F3CCF2CF2CF2CH2CH2Si(〇CH3)3 > F3CCH2CH2Si(OCH3)3 ' (CF3)2CFCH2CH2CH2Si(OCH3)3^F3CCF2CF2CF2CH2CH2Si(OCH3)3〇在另一態樣中，氟矽化合物可為含氟烷氧基矽酸酯。在此特定態樣中，含氟烷氧基矽酸酯具有式 [Si04/2]x[(R 0)aSi0(4-a)/2]y[(Rf0)bSi0(4.b)/2]z (VII)，其中 R3為(^至(：4烷基或氫，Rf為(:丨至C8單價氟碳化物基團，a 為1至3 ’ b為1至3 ’ X為2至500’ y為1至5〇，且z為1至5。由R13表示之烷基可具有分支或未分支結構。由Ri3表示之烷基之實例包括（但不限於）甲基、乙基、丙基、丨_甲基乙基、丁基、1-曱基丙基、2-甲基丙基及ι,ι·二甲基乙基。由Rf表示之敗碳化物基團可具有分支、未分支或環狀結構。由Rf表示之單價氟碳化物基團之實例係如以上所述且例示。含氟烷氧基矽酸酯亦可為藉由使如例如由Daudt等人在美國專利第2,672,182號中所述之有機聚矽氧烷樹脂與如以上所述且例示之具有式（VII)之含氟烷氧基矽酸酯反應所製備的共聚物。 163288.doc -37· 201245352 氟矽化合物烷氧基矽酸酯亦可為含氟溶膠_凝膠，其包含由使用預定量之水（c)及矽氧烷聚合催化劑（D)共水解及共縮合至少一種具有通式M^OR14)4之烷氧基官能性有機金屬化合物（A)及至少一種具有式（VI)之烷氧基矽烷化合物 (B)形成的反應產物。在一個態樣中’組分（A)具有通sMi(〇rm)4，其中^為金屬或類金屬，且R14為Ci至C4院基。組分（A)之由M1表示之金屬或類金屬的實例包括（但不限於）以及Ti。由表示之烷基可具有分支或未分支結構。由表示之烷基之實例包括（但不限於）曱基 '乙基、丙基、丨_曱基乙基、丁基、1-曱基丙基、2-甲基丙基及丨，1·二甲基乙基。組分（A)之烷氧基官能性有機金屬化合物之實例包括（但不限於）四乙氧基梦烧及鈦酸四丁 g旨。在另一態樣中，組分（B)具有如以上所述且例示之通式 (VI)。在另一態樣中，組分（C)為足以導致共聚合及共縮合而不使組分（B)膠凝或導致形成沈澱之預定量的水。在一個特定嘘樣中，共水解及共縮合係藉由首先摻合組分（八）與組分（B)且此後添加組分至摻合物中來進行。矽氧烷聚合催化劑可為通常用於水解及縮合烷氧基矽烷之任何催化劑。矽氧烷聚合催化劑之實例包括（但不限於）H2S04、HC104 '三氟曱烷磺酸 '丙烯酸、KOH、Na〇H 及含胺化合物。. 在一個特定態樣中，氟矽改質聚合物組合物係藉由一起 163288.doc-36 - 201245352 CH2_CH2-), propane-1,2-diyl (_CH2_CH._CH3), butyldiyl, pentanediyl, hexamethylene, heptadienyl, octyldiyl, cyclopentane 丨, 2 • Diyl, cyclopentane-1,3-diyl, cyclohexane-1,2·diyl, cyclohexane·hydrazine, 3—diyl, cyclohexane-1,4·diyl, benzene- 1,2-diyl, benzene_1>3.diyl, benzo-indole, 4-diyl (1,4-phenylene) and indolediyl. Examples of the fluorine-containing alkoxydecane represented by the formula (VI) include, but are not limited to, F3CCF2CF2CF2CH2CH2Si(〇CH3)3 > F3CCH2CH2Si(OCH3)3'(CF3)2CFCH2CH2CH2Si(OCH3)3^F3CCF2CF2CF2CH2CH2Si(OCH3)3 In another aspect, the fluoroquinone compound can be a fluoroalkoxy phthalate. In this particular aspect, the fluoroalkoxy phthalate has the formula [Si04/2]x[(R 0)aSi0(4-a)/2]y[(Rf0)bSi0(4.b)/2 ]z (VII), wherein R3 is (^ to (: 4 alkyl or hydrogen, Rf is (: 丨 to C8 monovalent fluorocarbon group, a is 1 to 3 'b is 1 to 3' X is 2 to 500' y is 1 to 5 Å, and z is 1 to 5. The alkyl group represented by R13 may have a branched or unbranched structure. Examples of the alkyl group represented by Ri3 include, but are not limited to, methyl, ethyl, Propyl, hydrazine-methylethyl, butyl, 1-mercaptopropyl, 2-methylpropyl and ι, ι dimethylethyl. The ruined carbide group represented by Rf may have a branch, Unbranched or cyclic structure. Examples of monovalent fluorocarbon groups represented by Rf are as described above and exemplified. The fluoroalkoxy phthalate may also be obtained by U.S. Patent No. 4, for example, by Daudt et al. a copolymer prepared by reacting an organopolysiloxane resin as described in No. 2,672,182 with a fluorine-containing alkoxyphthalic acid ester of the formula (VII) as described above and exemplified. 163288.doc -37· 201245352 Fluorine The hydrazine compound alkoxy phthalate may also be a fluororesin-gel, which comprises a predetermined amount of water (c) and a decane polymerization catalyst (D) co-hydrolyzed and co-condensed at least one alkoxy-functional organometallic compound (A) having the formula M^OR14)4 and at least one having the formula (VI) a reaction product formed by the alkoxydecane compound (B). In one aspect, the component (A) has a sMi(〇rm)4, wherein ^ is a metal or a metalloid, and R14 is a Ci to C4 Examples of the metal or metalloid represented by M1 of the component (A) include, but are not limited to, Ti. The alkyl group represented by the group may have a branched or unbranched structure. Examples of the alkyl group represented by Not limited to) fluorenyl 'ethyl, propyl, hydrazine-decylethyl, butyl, 1-mercaptopropyl, 2-methylpropyl and hydrazine, 1 dimethylethyl. Component (A Examples of the alkoxy-functional organometallic compound include, but are not limited to, tetraethoxy monoxide and tetrabutyl titanate. In another aspect, component (B) has the same as described above and Illustrative Formula (VI). In another aspect, component (C) is a pre-sufficient sufficient to cause copolymerization and co-condensation without gelling component (B) or causing precipitation. Quantitative water. In a particular sample, cohydrolysis and co-condensation are carried out by first blending component (VIII) with component (B) and thereafter adding the component to the blend. The catalyst may be any catalyst commonly used to hydrolyze and condense alkoxy decane. Examples of oxoxane polymerization catalysts include, but are not limited to, H2S04, HC104 'trifluoromethanesulfonic acid' acrylic acid, KOH, Na〇H and Amine compound. In a particular aspect, the fluoroquinone-modified polymer composition is used together by 163288.doc

S -38- 201245352 摻合可ϋ化聚合物組合物及氟⑪化合物加以製備。在另一態樣中，氟石夕改質聚合物組合物係藉由一起摻合可固化聚合物組合物及氟矽化合物以使可固化聚合物組合物及氟矽化合物形成混合物加以製備。在另—態樣中，彳固化聚合物組合物及氟矽化合物係以可固化聚合物組合物與氟矽：合物之重量比100/15至刪0.01一起摻合。在另一態樣中，可固化聚合物組合物及敗石夕化合物係以可固化聚合物組合物與氟矽化合物之重量比1〇〇/5至1〇〇/〇丨一起摻^。在另一態樣中，可固化聚合物組合物及氟矽化合物係以可固化聚合物組合物與氟矽化合物之重量比100/0.5一起摻合。在另一態樣中，氟矽改質聚合物組合物中之氟矽化合物之重量百分比為約10.0至約0 001 '或者約10 0至約〇、及或者約5.0至約〇. 1。在另一態樣中，氟矽改質聚合物組合物中之氟矽化合物之濃度為約〇·1重量％至約1〇重量。/〇、或者約0，1重量％至約8.0重量％、及或者約〇 4重量％至約 5.0重量％。在一個特定態樣中’界面塗層120係藉由於聚合物基板 110上塗覆氟矽改質聚合物組合物及固化該組合物加以製備。可使用習知印刷方法，諸如喷墨印刷（ink jet printing)、網版印刷（screen printing)、模版印刷…印川 printing)、膠版印刷術（f丨exography)、平版印刷術 (lithography)、凹板印刷（gravure printing)、軟平版印刷術、靜電印刷術（xerography)、蓋印（imprinting)(壓印 163288.doc -39- 201245352 (embossing))、微分配（microdispensing)、摩擦轉移印刷 (friction transfer printing)、雷射轉移印刷（laser transfer printing)及熱轉移印刷（thermal transfer printing)於聚合物基板110上塗覆氟矽改質聚合物組合物。所選特定方法將視若干因素，包括聚矽氧組合物之流變學、所要塗層厚度、塗覆溫度及所要解析度而定。視塗覆於聚合物基板11〇上之可固化聚矽氧組合物之類型而定，界面塗層120可藉由使界面塗層12〇暴露於環境溫度、高溫、水分或輻射加以固化。舉例而言，當塗覆於聚合物基板110上之可固化聚矽氧組合物為矽氫化可固化聚矽氧組合物時，矽樹脂可藉由在常壓下將樹脂自室溫（約 23±2t )加熱至2501、或者自室溫加熱至2〇(rc、或者自至溫加熱至1 50°C之溫度加以固化。加熱樹脂持續足以固化（父聯）聚矽氧樹脂之時長。舉例而言，樹脂通常在至 2 0 0 C溫度下加熱〇. 1至3小時之時間。在一個態樣中，界面塗層12〇係藉由於聚合物基板11〇上塗覆包含可固化聚合物組合物及I矽化合物之氟矽改質聚合物組合物及固化該組合物加以製備。當塗覆於聚合物基板i 1〇上之聚矽氧組合物為縮合可固化聚矽氧組合物時’固化聚矽氧樹脂之條件視樹脂中之矽鍵結基團的性質而定。舉例而言，當聚石夕氧樹脂含有石夕鍵 ^基時’聚矽氧樹脂可藉由加熱而固化(亦即交聯)。舉例而言，聚矽氧樹脂通常可藉由在5〇至25吖溫度下加執1 至小時之時期而固化。當縮合可固化聚石夕氧組合物包含 163288.doc 201245352 縮合催化劑時，聚矽氧樹脂通常可在較低溫度，例如室溫 (約23±2°C )至20(TC下固化。當聚矽氧樹脂含有矽鍵結氫原子時，聚矽氧樹脂可藉由在100至45〇t之溫度下使薄膜暴露於水分或氧氣〇丨至2〇小時之時期而固化。當縮合可固化聚矽氧組合物含有縮合催化劑時’聚矽氧樹脂通常可在較低溫度，例如室溫（約 23 土 2。(：）至 400。〇下固化。另外，當聚矽氧樹脂含有矽鍵結可水解基團時，聚矽氧樹脂可藉由在室溫（約23±2。〇至250t、或者100至2〇〇。(：之溫度下使薄膜暴露於水分1至!00小時之時期而固化。舉例而言，聚矽氧樹脂可通常藉由在約室溫（約23±2艺）至 150°C之溫度下使薄膜暴露於观相對濕度q 5至72小時之時期而固化。固化可藉由施加熱量、暴露於高濕度及/或添加縮合催化劑至組合物中來加速。當塗覆於第-聚合物基板11〇上之聚矽氧組合物為輻射可固化聚矽氧組合物時’聚矽氧樹脂可藉由使薄膜暴露於電子束加以固化。通常，力口速電塵為約〇1至⑽Μ，真空為約10至I 〇·3 pa，雷士也从λ 電子机為約0.0001至i安培（ampere)，且功率自約(Μ瓦（w叫變化至！千瓦。劑量通常為約戰庫命（繼⑽—㈣)/平方公分至⑽庫余/平方公分、或者約1至I 0庫侖/平方公公。視電壓而定’暴露時間通常為約 10秒至1小時。自ώ其*田聚夕氧組合物另外包含上述陽離子光引發劑或 "㈣㈣氧樹脂可藉由使薄膜暴露於劑量 I63288.doc -41 - 201245352 足以固化(交聯)聚矽氧樹脂之波長為150至_ nm、或者 200至400 nm的輻射加以固化。光源通常為中壓汞弧燈。轄射=量通常為mW '或者5〇至5〇〇 —。此外’在暴露於輻射期間或之後，薄膜可經外部加熱以增強固化之速率及/或程度。當塗覆於聚合物基板11G上之;^氧組合物為過氧化物可固化聚石夕氧組合物時，聚石夕氧樹脂可藉由在室溫（約 23±2 C )至18(TC之溫度下加熱薄膜〇⑽至i ^、時之時期加以固化。在另一態樣令，經塗佈基板100包含於界面塗層120上之無機障壁塗層130 〇在一個特定態樣中，無機障壁塗層⑽ 可為包含對於水蒸氣（水分）渗透性較低之無機材料的任何障壁塗層。無機材料可為電導體、非導體或半導體。無機障壁塗層130對於電磁波譜之可見區（約彻至約_ nm)中之光為透明或不透明的。對於電磁波譜之可見區中之光，透明無機障壁塗層13〇之透射百分比通常為至少 30%、或者至少60%、或者至少8〇%。夕無機材料之實例包括（但不限於）金屬，諸如鋁、鈣、鎂、錄及金；金屬合金’諸如紹鎖合金、銀鎮合金、鐘鋁合金、銦鎖合金及鋁鈣合金；氧化物，諸如二氧化矽、氧化銘、氧化綱、氧化鈦⑽、氧化鎖' 氧化鈹、氧化鎂、氧化錫（II)、氣化錫（IV)、氧化姻氧化寧)、氧化辞'氧化叫㈣二：：： 4、氧化棚、氧化錯㈤及氧域；混合氧化物，諸如氧 -42· 163288.docS-38-201245352 is prepared by blending a deuteratable polymer composition and a fluorine 11 compound. In another aspect, the fluorite-modified polymer composition is prepared by blending a curable polymer composition and a fluoroquinone compound together to form a mixture of the curable polymer composition and the fluoroquinone compound. In another aspect, the hydrazine-cured polymer composition and the fluoroquinone compound are blended in a weight ratio of the curable polymer composition to the fluoroquinone compound of from 100/15 to 1.00. In another aspect, the curable polymer composition and the ruthenium compound are blended in a weight ratio of the curable polymer composition to the fluoroquinone compound of from 1 /5 to 1 Torr. In another aspect, the curable polymer composition and the fluoroquinone compound are blended together in a weight ratio of the curable polymer composition to the fluoroquinone compound of 100/0.5. In another aspect, the weight percent of the fluoroquinone compound in the fluoroquinone-modified polymer composition is from about 10.0 to about 0 001 'or from about 10 0 to about 〇, and or from about 5.0 to about 0.1. In another aspect, the concentration of the fluoroquinone compound in the fluoroquinone-modified polymer composition is from about 1% by weight to about 1% by weight. /〇, or from about 0,1% by weight to about 8.0% by weight, and or from about 重量4% by weight to about 5.0% by weight. In one particular aspect, the interfacial coating 120 is prepared by coating a fluoroquinone-modified polymer composition on the polymer substrate 110 and curing the composition. Conventional printing methods such as ink jet printing, screen printing, stencil printing, inkjet printing, offset printing, lithography, concave can be used. Gravure printing, soft lithography, xerography, imprinting (embossing 163288.doc -39- 201245352 (embossing)), microdispensing, friction transfer printing (friction) A fluoroquinone-modified polymer composition is coated on the polymer substrate 110 by transfer printing, laser transfer printing, and thermal transfer printing. The particular method chosen will depend on several factors, including the rheology of the polyoxyl composition, the desired coating thickness, the coating temperature, and the resolution desired. Depending on the type of curable polyoxynoxy composition applied to the polymer substrate 11, the interfacial coating 120 can be cured by exposing the interfacial coating 12 to ambient temperature, elevated temperature, moisture or radiation. For example, when the curable polyoxynoxy composition coated on the polymer substrate 110 is a hydrazine hydrogenated curable polydecane oxide composition, the oxime resin can be used from room temperature (about 23± at normal pressure). 2t) heating to 2501, or heating from room temperature to 2 Torr (rc, or from temperature to 550 ° C to cure) heating the resin for a period of time sufficient to cure (parent) polyoxyl resin. The resin is usually heated at a temperature of up to 200 ° C for a period of from 1 to 3 hours. In one aspect, the interfacial coating 12 is coated by a polymer substrate 11 comprising a curable polymer composition. And a fluoroquinone-modified polymer composition of the I oxime compound and curing the composition. When the poly-xonium oxide composition coated on the polymer substrate i 1 为 is a condensation-curable poly-xyloxy composition, it is cured. The conditions of the polyoxyxene resin depend on the nature of the hydrazine-bonding group in the resin. For example, when the poly-stone oxide resin contains a stellite-based group, the poly-xyloxy resin can be cured by heating (also That is, cross-linking.) For example, polyoxynoxy resin can usually be used at 5〇 Curing at a temperature of 25 Torr for a period of 1 to an hour. When the condensation curable polyoxo oxygen composition comprises 163288.doc 201245352 condensation catalyst, the polyoxynoxy resin can usually be at a lower temperature, such as room temperature (about 23 ±2 ° C) to 20 (cured under TC. When the polyoxynoxy resin contains a hydrazine-bonded hydrogen atom, the polyoxyl resin can expose the film to moisture or oxygen by a temperature of 100 to 45 Torr. Curing to a period of 2 hours. When the condensation curable polyoxynoxy composition contains a condensation catalyst, the polyoxyxene resin can usually be at a lower temperature, such as room temperature (about 23 Å 2. (:) to 400. 〇 Further, when the polyoxynoxy resin contains a hydrazine-bonded hydrolyzable group, the polyoxynoxy resin can be used at room temperature (about 23 ± 2 〇 to 250 t, or 100 to 2 〇〇. The film is cured by exposing the film to moisture for a period of from 0 to 00 hours. For example, the polyoxyxene resin can be typically exposed to the film at a temperature of from about room temperature (about 23 ± 2 Å) to 150 ° C. Curing at a relative humidity of 5 to 72 hours. Curing can be performed by applying heat High humidity and/or addition of a condensation catalyst to the composition to accelerate. When the polyoxynoxy composition coated on the first polymer substrate 11 is a radiation curable polyoxyl composition, the polyoxyl resin can be borrowed. It is cured by exposing the film to an electron beam. Typically, the power of the electric dust is about 至1 to (10) Μ, the vacuum is about 10 to I 〇·3 pa, and the NVC is also about 0.0001 to i amp from the λ machine. ), and the power is about (the w w change to! kW. The dose is usually about the battle cell life (following (10) - (four)) / square centimeters to (10) storage / square centimeters, or about 1 to I 0 coulomb / square The public servant's exposure time is usually about 10 seconds to 1 hour. The composition of the above-mentioned cationic photoinitiator or "(iv)(iv) oxy-resin can be sufficient to cure (cross-link) the wavelength of the polyoxyl resin by exposing the film to a dose of I63288.doc -41 - 201245352 Curing is performed for radiation of 150 to _ nm, or 200 to 400 nm. The light source is usually a medium pressure mercury arc lamp. The arbitrage = amount is usually mW 'or 5 〇 to 5 〇〇 -. Further, the film may be externally heated to increase the rate and/or extent of curing during or after exposure to radiation. When the oxygen composition applied to the polymer substrate 11G is a peroxide curable polyoxime composition, the polyoxo resin can be used at room temperature (about 23 ± 2 C) to 18 ( The film is cured by heating the film 〇(10) to i^ at a temperature of TC. In another aspect, the coated substrate 100 is contained in the inorganic barrier coating 130 on the interface coating 120 in a specific aspect. The inorganic barrier coating (10) may be any barrier coating comprising an inorganic material having a low permeability to water vapor (moisture). The inorganic material may be an electrical conductor, a non-conductor or a semiconductor. The inorganic barrier coating 130 is visible to the electromagnetic spectrum. The light in the region (about to about _ nm) is transparent or opaque. For light in the visible region of the electromagnetic spectrum, the transmission percentage of the transparent inorganic barrier coating 13 通常 is usually at least 30%, or at least 60%, or At least 8 %. Examples of inorganic materials include, but are not limited to, metals such as aluminum, calcium, magnesium, gold and gold; metal alloys such as shackle alloy, silver alloy, clock aluminum alloy, indium lock alloy and aluminum Calcium alloy; oxide, such as dioxide矽, 氧化, oxidation, titanium oxide (10), oxidized lock 铍铍铍, magnesium oxide, tin oxide (II), vaporized tin (IV), oxidized oxidized Ning), oxidation word 'oxidation called (four) two::: 4, oxidation shed, oxidation error (five) and oxygen domain; mixed oxides, such as oxygen -42 · 163288.doc

201245352 化銦錫（ITO)、氧化銦鋅（IZO)及氧化銦鈽；氮化物，諸如氮化妙、氮化欽、氮化銘、氮化姻（III)及氮化鎵；混合氮化物，諸如氮化鋁矽；氮氧化物，諸如氮氧化石夕、氮氧化銘及氮氧化棚，碳化物’堵如碳化♦、碳化铭、碳化棚及碳化鈣；碳氧化物’諸如碳氧化矽；混合氮氧化物，諸如氮氧化銘碎及氮氧化欽石夕；氟化物，諸如氟化鎮及氟化崔弓；及氮碳化物，諸如氮碳化石夕。形成無機障壁塗層130之方法在此項技術中為熟知的。舉例而言，無機障壁塗層130可使用化學氣相沈積技術，諸如熱化學氣相沈積、電漿增強化學氣相沈積、光化學氣相沈積、電子迴旋加速器共振（elect_ cyCl〇tr()n resonance)、感應耦合電漿（inductively coupled plasm£〇、磁約束電漿（magnetically confined Plasma)及喷射氣相沈積；及物理氣相沈積技術，諸如RF濺鍍（RF spuUering)、原子層沈積及DC磁控濺鍍（DC magnetron sputtering)加以沈積。如圖1中所示，無機障壁塗層13〇可為包含無機材料之單層塗層。或者，如圖2中所示，無機障壁塗層13〇可為包含兩層（130、140)或兩層以上至少兩種不同無機材料之多層塗層，其中直接相鄰層包含不同無機材料（亦即具有不同組成及/或性質之無機材料）。當單層塗層中之無機材料層 i a兩種或兩種以上元素（例如TiN)時，則該層可為梯度層，其中該層之組成隨厚度而變化。類似地，當多層塗層中之至v層無機材料包含兩種或兩種以上元素時，該層 I63288.doc •43· 201245352 可為梯度層。多層塗層通常包含2至7層、或者2至5層、< 者2至3層。單層無機障壁塗層130之厚度通常為〇.〇3至3 μηι、或者 0.1至1 μιη、或者0.2至0.8 μιη。多層無機障壁塗層13〇、 140之厚度通常為〇.〇6至5 μηι、或者〇.1至3 μπι、或者〇2至 2.5 μιη。當無機障壁塗層130之厚度小於〇〇3 4爪時，塗層之水分滲透性對於一些應用而言可能過高。當無機障壁塗層130之厚度大於5 μηι時，無機障壁塗層13〇可能易破裂。如圖3中所示，在一個特定態樣中，經塗佈基板1〇〇可另外包含於無機障壁塗層130上之至少兩個（展示三個）交替無機障壁150及界面16〇塗層，其中各交替界面塗層16〇包含含有可固化聚合物組合物及氟矽化合物之聚合物組合物的固化產物。交替無機障壁150及交替界面16〇塗層係如以上對於經塗佈基板1〇〇之第一態樣之無機障壁13〇及界面12〇塗層所述。如圖4中所示，在另一態樣中，經塗佈基板1〇〇可另外包含於無機障壁塗層130上之另一界面塗層17〇，其中該另一界面塗層170包含含有可固化聚合物組合物及氟矽化合物之聚合物組合物之固化產物。另一界面塗層i 7〇係如上所述。在另一態樣中，如圖5中所示，本發明係關於一種電子封裝件200。在一個特定態樣中，電子封裝件2〇〇包含電子裝置210、上覆於該裝置21〇之經塗佈基板1〇〇及介於該經塗佈基板100與該裝置21〇之間且與其接觸的黏著塗層 I63288.doc •44· 201245352 如本文所用’術語「上覆於」係指間接接觸之位置及/或直接接觸之位置。舉例而言，在電子封裝件2㈧包含電子裝置210、上霜於兮驻se ^ 1 Λ 上榎於該裝置210之經塗佈基板i 〇〇及介於 I呈塗佈基板100之間且與其接觸之黏著塗層咖的一個特疋心樣中，忒電子裝置210與該經塗佈基板100係間接接觸。在此特定態樣中，經塗佈基板100可用作蓋板及/或帽蓋以保4敏感性電子裝置21 〇免遭水分及其他環境污染物損害。經塗佈基板100係如上所述且通常包含聚合物基板 110於該基板11 0上之界面塗層120及於該界面塗層120上之無機障壁塗層130，其中該界面塗層120係藉由於該聚合物基板110上塗覆氟矽改質聚合物組合物及氟矽且固化該組合物加以製備。在一個態樣中，電子封裝件200包含含有電接點（未圖示）之電子裝置210。在一個特定態樣中，電子裝置21〇可為離散裝置（discrete device)或積體電路。電子裝置21〇具有接受並傳輸電信號之電接點。在積體電路之情況下，電接點或結合墊（bond pad)(亦即I/O終端）通常位於裝置周邊上。視電路之複雜性而定，每個積體電路之結合墊之數目可在約4個至約2,000個之範圍内。結合墊由導電金屬，通常鋁、銅或其合金製得。離散裝置之實例包括（但不限於）二極體，諸如PIN二極體、電歷參考一極體、變容二極體、突崩二極體 (Avalanche diodes)、DIAC、甘恩（Gunn)二極體、階躍恢復 163288.doc •45· 201245352 (Snap)二極體、IMPATT二極體、隧道二極體、齊納（Zener) 二極體 '正常（p-n)二極體及肖特基（Shottky)二極體；電晶體，諸如雙極電晶體，包括絕緣閘雙極電晶體（IGBT)及達寧敦（Darlington)電晶體及場效電晶體（FET)，包括金屬氧化物半導體FET(MOSFET)、接面FET(JFET)、金屬半導體 FET(MESFET)、有機FET、高電子遷移率電晶體（HEMT) 及薄膜電晶體（TFT)，包括有機場效電晶體；閘流體，例如DIAC、TRIAC、矽控制整流器（SCR)、分佈式緩衝閘關閉（DB-GTO)閘流體、閘關閉（GTO)閘流體、MOFSET控制閘流體（MCT)、經改質陽極閘關閉（MA-GTO)閘流體、靜電感應閘流體（SITh)及場控制閘流體（FCTh);變阻器；電阻器；容電器（condenser);電容器（capacitor);熱阻體；及光電子裝置，諸如光電二極體、太陽電池（例如CIGS太陽電池及有機光電電池）、光電晶體、光電倍增器、光積體電路（IOC)元件、光依賴電阻器、雷射二極體、發光二極體（LED)及有機發光二極體（OLED)，包括小分子 OLED(SM-OLED)及聚合物發光二極體（PLED)。積體電路之實例包括（但不限於）單片積體電路，諸如記憶體1C，包括RAM(隨機存取記憶體）（包括DRAM及SRAM) 及ROM(只讀記憶體）；邏輯電路；類比積體電路；混合積體電路，包括薄膜混合1C及厚膜混合1C ;薄膜電池；太陽電池及燃料電池。在另一態樣中，電子封裝件2〇〇包含上覆於電子裝置210 之經塗佈基板100。在一個特定態樣中’經塗佈基板100係 163288.doc • 46· 201245352 如以上所述且例示。更特定言之，經塗佈基板】〇〇包含聚合物基板110;於該基板1丨0上之界面塗層120，其中該界面塗層120係藉由於該聚合物基板110上塗覆包含可固化聚合物組合物及氟矽化合物之氟矽改質聚合物組合物且固化該組合物加以製備；及於該界面塗層12〇上之無機障壁塗層 130。無機障壁塗層130係處於界面塗層12〇上且界面塗層12〇係處於聚合物基板110上在電子裝置21〇上方之區域中。通常，在電子裝置210上方之區域略微大於裝置21〇之尺寸。舉例而言，電子裝置21〇上方之區域通常比裝置21〇之尺寸大105至11〇%、或者大11〇至12〇0/〇。在另一態樣中，電子封裝件2〇〇包含介於經塗佈基板1〇〇與裝置210之間且與其接觸之黏著塗層22〇。在一個態樣中，黏著塗層220之厚度通常為〇.〇〇1至625 μπι、更通常〇」至375 μπι、最通常25至25〇 μηΐβ黏著塗層22〇係由黏著組合物形成。舉例而言，黏著組合物可包含多官能性丙烯酸 S曰及引發劑。通常’黏著組合物不含有機矽化合物，諸如上述障壁組合物中之有機矽化合物。點著組合物之多官能性丙稀酸3旨通常選自脂族丙稀酸胺基甲酸醋、芳族丙烯酸胺基甲酸酿、環氧基官能性丙烯酸 …烯酸伸異丁醋及其組合之群。在某些態樣中，多官能性丙烯酸酯為脂族’為脂族两烯酸胺基甲酸酯，諸如脂族二丙稀酸胺基甲酸醋。此時多官能性丙稀酸酿通常為此項技術中稱為「預聚合物（pre-p〇lymer)」之多官能性丙稀 163288.doc -47- 201245352 酸醋。預聚合物通常為寡聚物，其係藉由使兩種或兩種以上組分反應而形成，因此預聚合物具有在預聚合物中保持未反應之過量官能基。應瞭解多官能性丙烯酸醋可為單體或可為聚合物。此外，彡官能性丙稀酸料包含不同類型之多官能性丙烯酸s旨之摻合物。乡生丙稀酸醋之推合物可包含單體、寡聚及/或聚合多官能性丙烯酸酯之任何組合。當多官能性丙烯酸酯為脂族丙烯酸胺基甲酸酯時，脂族丙烯酸胺基曱酸醋通常藉由使異氰酸酯與多元醇反應而形成，因此由其形成之脂族丙稀酸胺基甲酸酯具有至少兩個選自丙烯醯氧基官能基、甲基丙烯醯氧基官能基及其組合之g貪(^基。異氛酸醋及多元醇之至少一者具有至少一個丙烯醯氧基官能基及/或曱基丙烯醯氧基官能基及其組合。異氰酸酯及多元醇中之至少一者具有至少一個丙烯醯氧基官能基及/或曱基丙烯醯氧基官能基，其保留在由使異氰酸酯與多元醇反應形成之脂族丙烯酸胺基甲酸酯中。如由術語「脂族」所指定，脂族丙稀酸胺基甲酸酯不含芳族基團。適於本發明目的之多官能性丙烯酸酯的一實例為201245352 Indium Tin (ITO), Indium Zinc Oxide (IZO) and Indium Oxide; Nitride, such as nitriding, nitriding, nitriding, nitriding (III) and gallium nitride; mixed nitride, Such as aluminum arsenide; nitrogen oxides, such as nitrogen oxynitride, nitrogen oxides and nitrogen oxide sheds, carbides such as carbonization ♦ carbonization, carbonization sheds and calcium carbide; carbon oxides such as cerium oxide; Mixed nitrogen oxides, such as nitrogen oxides and nitrogen oxides; fluorides, such as fluorinated and fluorinated; and nitrogen carbides, such as nitrogen carbide. Methods of forming inorganic barrier coatings 130 are well known in the art. For example, the inorganic barrier coating 130 may use chemical vapor deposition techniques such as thermal chemical vapor deposition, plasma enhanced chemical vapor deposition, photochemical vapor deposition, and electron cyclotron resonance (elect_cyCl〇tr()n Resonance), inductively coupled plasm, magnetically confined plasma, and physical vapor deposition, such as RF spuUering, atomic layer deposition, and DC Deposited by DC magnetron sputtering. As shown in Fig. 1, the inorganic barrier coating 13 can be a single layer coating containing an inorganic material. Alternatively, as shown in Fig. 2, the inorganic barrier coating 13 The tantalum may be a multilayer coating comprising two layers (130, 140) or two or more layers of at least two different inorganic materials, wherein the directly adjacent layers comprise different inorganic materials (i.e., inorganic materials having different compositions and/or properties). When the inorganic material layer ia in the single layer coating has two or more elements (for example, TiN), the layer may be a gradient layer, wherein the composition of the layer varies with thickness. Similarly, When the v-layer inorganic material in the multi-layer coating contains two or more elements, the layer I63288.doc •43· 201245352 may be a gradient layer. The multi-layer coating usually comprises 2 to 7 layers, or 2 to 5 layers, < 2 to 3. The thickness of the single-layer inorganic barrier coating 130 is usually 〇. 3 to 3 μηι, or 0.1 to 1 μηη, or 0.2 to 0.8 μηη. Thickness of the multilayer inorganic barrier coating 13〇, 140 Usually 〇.〇6 to 5 μηι, or 〇.1 to 3 μπι, or 〇2 to 2.5 μηη. When the thickness of the inorganic barrier coating 130 is less than 〇〇3 4 claws, the moisture permeability of the coating is for some applications. It may be too high. When the thickness of the inorganic barrier coating 130 is greater than 5 μm, the inorganic barrier coating 13 may be easily broken. As shown in Fig. 3, in a specific aspect, the coated substrate 1〇〇 At least two (showing three) alternating inorganic barrier 150 and interface 16 〇 coatings may be additionally included on the inorganic barrier coating 130, wherein each alternating interface coating 16 〇 comprises a curable polymer composition and a fluoroquinone compound Cured product of the polymer composition. Alternating inorganic barrier 150 and alternating interface 16 〇 coating is as described above for the first barrier of the coated substrate 1 无机 and the interface 12 〇 coating. As shown in Figure 4, in another aspect The coated substrate 1 may additionally comprise another interface coating 17 on the inorganic barrier coating 130, wherein the further interfacial coating 170 comprises a polymerization comprising a curable polymer composition and a fluoroquinone compound. a cured product of the composition. Another interfacial coating i 7 is as described above. In another aspect, as shown in Figure 5, the present invention is directed to an electronic package 200. In one specific aspect, the electronic package 2 includes an electronic device 210, a coated substrate 1 上 overlying the device 21, and between the coated substrate 100 and the device 21 Adhesive coating in contact with it I63288.doc •44· 201245352 As used herein, the term 'overlying' refers to the location of indirect contact and/or the location of direct contact. For example, in the electronic package 2 (8), the electronic device 210, the upper surface of the device, the coated substrate i of the device 210, and the coated substrate 100 are disposed between and In a special feature of the adhesive coated coffee contact, the electronic device 210 is in indirect contact with the coated substrate 100. In this particular aspect, the coated substrate 100 can be used as a cover and/or cap to protect the sensitive electronic device 21 from moisture and other environmental contaminants. The coated substrate 100 is as described above and generally includes an interface coating 120 of the polymer substrate 110 on the substrate 110 and an inorganic barrier coating 130 on the interface coating 120, wherein the interface coating 120 is The fluoroquinone-modified polymer composition and fluoroquinone are coated on the polymer substrate 110 and the composition is cured. In one aspect, electronic package 200 includes an electronic device 210 that includes electrical contacts (not shown). In one particular aspect, electronic device 21A can be a discrete device or an integrated circuit. The electronic device 21 has an electrical contact that receives and transmits an electrical signal. In the case of integrated circuits, electrical contacts or bond pads (i.e., I/O terminals) are typically located on the periphery of the device. Depending on the complexity of the circuit, the number of bond pads for each integrated circuit can range from about 4 to about 2,000. The bond pads are made of a conductive metal, typically aluminum, copper or alloys thereof. Examples of discrete devices include, but are not limited to, diodes such as PIN diodes, electrical reference ones, varactors, Avalanche diodes, DIAC, Gunn Diode, step recovery 163288.doc •45· 201245352 (Snap) diode, IMPATT diode, tunnel diode, Zener diode 'normal' pn) diode and SCHOTT Shottky diodes; transistors, such as bipolar transistors, including insulated gate bipolar transistors (IGBTs) and Darlington transistors and field effect transistors (FETs), including metal oxide semiconductors FET (MOSFET), junction FET (JFET), metal semiconductor FET (MESFET), organic FET, high electron mobility transistor (HEMT), and thin film transistor (TFT), including an airport effect transistor; thyristor, for example DIAC, TRIAC, 矽 Controlled Rectifier (SCR), Distributed Buffer Closed (DB-GTO) Gate Fluid, Gate Closed (GTO) Gate Fluid, MOFSET Control Gate Fluid (MCT), Modified Anode Gate Closed (MA-GTO ) thyristor fluid, electrostatic induction thyristor fluid (SITh) and field control thyristor fluid (FCTh); varistor; Resistor; condenser; capacitor; thermal resistance; and optoelectronic devices, such as photodiodes, solar cells (such as CIGS solar cells and organic photovoltaic cells), optoelectronic crystals, photomultipliers, optical products Body circuit (IOC) components, light-dependent resistors, laser diodes, light-emitting diodes (LEDs), and organic light-emitting diodes (OLEDs), including small-molecule OLEDs (SM-OLEDs) and polymer light-emitting diodes Body (PLED). Examples of integrated circuits include, but are not limited to, monolithic integrated circuits, such as memory 1C, including RAM (random access memory) (including DRAM and SRAM) and ROM (read only memory); logic circuits; analogy Integrated circuit; mixed integrated circuit, including film mixing 1C and thick film mixing 1C; thin film battery; solar cell and fuel cell. In another aspect, the electronic package 2 includes a coated substrate 100 overlying the electronic device 210. In one particular aspect, the coated substrate 100 is 163288.doc • 46·201245352 as described above and exemplified. More specifically, the coated substrate comprises a polymer substrate 110; an interfacial coating 120 on the substrate 100, wherein the interfacial coating 120 is curable by coating on the polymer substrate 110. The polymer composition and the fluoroquinone modified fluoroquinone modified polymer composition are prepared by curing the composition; and the inorganic barrier coating 130 on the interface coating 12 . The inorganic barrier coating 130 is on the interfacial coating 12 and the interfacial coating 12 is on the polymer substrate 110 in the region above the electronic device 21A. Typically, the area above the electronic device 210 is slightly larger than the size of the device 21A. For example, the area above the electronic device 21 is typically 105 to 11% larger than the size of the device 21, or 11 to 12 〇 0/〇. In another aspect, the electronic package 2A includes an adhesive coating 22 between the coated substrate 1A and the device 210. In one aspect, the thickness of the adhesive coating 220 is typically from 〇1 to 625 μπι, more typically from 375 to 375 μπι, and most typically from 25 to 25 μηηβ. The adhesion coating 22 is formed from an adhesive composition. For example, the adhesive composition can comprise a polyfunctional acrylic acid hydrazine and an initiator. Typically, the adhesive composition is free of organic germanium compounds, such as the organic germanium compounds of the above barrier compositions. The polyfunctional acrylic acid 3 to which the composition is applied is generally selected from the group consisting of aliphatic acrylic acid urethane carboxylic acid, aromatic acrylic acid carboxylic acid brewing, epoxy functional acrylic acid olefinic acid isobutyl vinegar, and combinations thereof. Group. In some aspects, the multi-functional acrylate is an aliphatic 'aliphatic acid urethane, such as an aliphatic diacrylic acid urethane. At this time, the polyfunctional acrylic acid is usually referred to as "pre-p〇lymer" polyfunctional propylene 163288.doc -47- 201245352 vinegar. The prepolymer is usually an oligomer which is formed by reacting two or more components, and thus the prepolymer has an excess of functional groups which remain unreacted in the prepolymer. It should be understood that the polyfunctional acrylic vinegar may be a monomer or may be a polymer. In addition, the hydrazine functional acrylic acid comprises a blend of different types of polyfunctional acrylic acid. The push for the acrylic acid vinegar may comprise any combination of monomeric, oligomeric and/or polymeric polyfunctional acrylates. When the polyfunctional acrylate is an aliphatic urethane urethane, the aliphatic acrylamide phthalic acid vinegar is usually formed by reacting an isocyanate with a polyhydric alcohol, and thus an aliphatic acrylamide group formed therefrom The acid ester has at least two selected from the group consisting of an acryloxy functional group, a methacryloxy functional group, and a combination thereof. At least one of the oleic acid and the polyol has at least one propylene oxide. a functional group and/or a mercaptopropenyloxy functional group, and combinations thereof. At least one of the isocyanate and the polyhydric alcohol has at least one acryloxy functional group and/or a mercapto acryloxy functional group, which is retained In an aliphatic urethane urethane formed by reacting an isocyanate with a polyol. The aliphatic urethane amide does not contain an aromatic group as specified by the term "aliphatic". An example of a polyfunctional acrylate for the purpose of the invention is

Ebecryl® 230，可自 Cytec Industries，Inc.，West Paterson， NJ購得。適於本發明目的之多官能性丙烯酸酯的另一實例為異戊四醇四丙稀酸酯。如上所述’黏著組合物另外包含引發劑。引發劑可為此項技術中已知之任何引發劑。在某些態樣中，引發劑包含光引發劑。光引發劑在此項技術中為已知的且在吸收通常紫外光谱（亦即300至400 nm)中之光時進行光反應。光反 163288.doc -48·Ebecryl® 230, available from Cytec Industries, Inc., West Paterson, NJ. Another example of a polyfunctional acrylate suitable for the purposes of the present invention is isovalera tetrapropionate. As mentioned above, the adhesive composition additionally contains an initiator. The initiator can be any initiator known in the art. In some aspects, the initiator comprises a photoinitiator. Photoinitiators are known in the art and undergo photoreaction while absorbing light in the usual ultraviolet spectrum (i.e., 300 to 400 nm). Light anti-163288.doc -48·

201245352 應通常形成活性物質，其可引發或催化進一步化學反應。通常，光反應引發聚合或聚縮合反應。因此，當本發明之黏著組合物包括光引發劑時，黏著可撓性障壁薄膜可藉由向由其形成之黏著層施加紫外線輻射加以固化。如圖5中所示，在一個特定態樣中，電子封裝件2〇〇包含電子裝置210、上覆於該裝置21〇之經塗佈基板1〇〇及介於該經塗佈基板1〇〇與該裝置21〇之間且與其接觸的黏著塗層 220。在此特定態樣中’經塗佈基板ι〇〇上覆於裝置2〗〇，因此聚合物基板11〇係處於黏著塗層22〇上，界面塗層12〇係處於基板110上且無機障壁塗層13〇係處於界面塗層12〇上。在另一態樣中，如圖ό中所示，電子封裝件200包含電子裝置210、上覆於該裝置21〇之經塗佈基板ι〇〇及介於該經塗佈基板100與該裝置21〇之間且與其接觸的黏著塗層 220 °在此特定態樣中’經塗佈基板ι〇〇上覆於裝置2ι〇，因此無機障壁塗層130係處於黏著塗層220上，界面塗層 120係處於無機障壁塗層13〇上，且聚合物基板u〇係處於界面塗層120上。在另一態樣中’電子封裝件2〇〇包含電子裝置21〇、上覆於該裝置210之經塗佈基板ι〇〇及介於該經塗佈基板1〇〇之間且與其接觸的黏著塗層22〇。在此特定態樣中，無機障壁塗層130可為包含兩層（13〇、14〇)或兩層以上至少兩種不同無機材料之多層塗層，其中直接相鄰層包含不同無機材料（亦即具有不同組成及/或性質之無機材料）。在另一態樣 I63288.doc •49- 201245352 中’經塗佈基板100可另外包含於無機障壁塗層13〇上之至少兩個（展示三個）交替無機障壁150及界面160塗層，其中各交替界面塗層160包含含有可固化聚合物組合物及氟矽化合物之聚合物組合物的固化產物。在另一態樣中，經塗佈基板100可另外包含於無機障壁塗層130上之另一界面塗層170，其中該另一界面塗層17〇包含含有可固化聚合物組合物及氟矽化合物之聚合物組合物之固化產物。在另一實施例中，提供一種製備經塗佈基板1 〇〇之方法。該方法包含於聚合物基板11〇上形成界面塗層12〇，其中該界面塗層120係藉由於該基板110上塗覆包含可固化聚合物組合物及氟矽化合物之氟矽改質聚合物組合物且固化該組合物加以製備；及於該界面塗層120上形成無機障壁塗層130。製備本發明之經塗佈基板1〇〇之方法可使用習知設備及技術以及易得聚矽氧組合物進行。舉例而言，無機障壁塗層130可使用化學氣相沈積技術及物理氣相沈積技術加以沈積。此外，界面塗層120可使用塗覆並固化聚矽氧組合物之習知方法形成。此外本發明方法可按比例放大至高產量製造過程。在一個態樣中，該方法包含於聚合物基板11〇上形成界面塗層120〇聚合物基板n〇係如以上所述且例示。在另一態樣中，該方法包含於聚合物基板〖1〇上形成界面塗層 120，其中該界面塗層120係藉由於該基板11〇上塗覆包含可固化聚合物組合物及氟矽化合物之氟矽改質聚合物組合 I63288.doc •50- 201245352 物且固化該組合物加以製備。界面塗層120係如以上所述且例示加以製備。在另一態樣中，經塗佈基板1 00係藉由於界面塗層120上形成無機障壁塗層13〇加以製備。無機障壁塗層1 3 0係如以上所述且例示。實例呈現下列實例以較佳說明本發明之經塗佈基板之各種實施例’但不應視為限制在隨附申請專利範圍中限定之本發明。下列方法及材料用於實例中：實例1 於四氟乙烯（ethylene tetrafluorine)薄膜上之丙烯酸胺基严潑鎊芥面塗屬。製備脂族丙烯酸胺基甲酸酯塗料與氟矽化合物之混合物。更特定言之，由Sartomer Company (Exton，PA)供應之以商標CN3 100銷售的具有羥基官能基之丙烯酸酯寡聚物與氟矽化合物混合。藉由混合CN3 100與由 Dow Corning Corporation(Midland，MI)供應之以商標 Dow Coming® B-3958銷售之F3CCF2CF2CF2CH2CH2Si(OMe)3 及 / 或由 Dow Corning Corporation(Mid〖and，MI)供應之以商標 Dow Corning® Z-9030銷售之 F3CCH2CH2Si(OMe)3來製備脂族丙烯酸胺基曱酸酯塗料。添加由Ciba Specialty201245352 should generally form an active substance that can initiate or catalyze further chemical reactions. Typically, the photoreaction initiates a polymerization or polycondensation reaction. Therefore, when the adhesive composition of the present invention comprises a photoinitiator, the adhesive flexible barrier film can be cured by applying ultraviolet radiation to the adhesive layer formed therefrom. As shown in FIG. 5, in a specific aspect, the electronic package 2 includes an electronic device 210, a coated substrate 1 overlying the device 21, and a coated substrate 1 An adhesive coating 220 between and in contact with the device 21A. In this particular aspect, 'the coated substrate ι is overlaid on the device 2', so that the polymer substrate 11 is on the adhesive coating 22, and the interfacial coating 12 is on the substrate 110 and the inorganic barrier The coating 13 is on the interface coating 12〇. In another aspect, as shown in FIG. ,, the electronic package 200 includes an electronic device 210, a coated substrate ι overlying the device 21, and the coated substrate 100 and the device. The adhesive coating 220 ° between and in contact with the 21 在 in this particular aspect 'the coated substrate ι is overlaid on the device 2 ι , so the inorganic barrier coating 130 is on the adhesive coating 220, the interface coating The layer 120 is on the inorganic barrier coating 13 and the polymer substrate is on the interfacial coating 120. In another aspect, the electronic package 2 includes an electronic device 21 , a coated substrate ι overlying the device 210 , and a contact between and in contact with the coated substrate 1 . Adhesive coating 22 〇. In this particular aspect, the inorganic barrier coating 130 can be a multilayer coating comprising two layers (13 Å, 14 Å) or two or more layers of at least two different inorganic materials, wherein the directly adjacent layers comprise different inorganic materials (also That is, inorganic materials having different compositions and/or properties). In another aspect, I63288.doc •49-201245352, the coated substrate 100 may additionally comprise at least two (showing three) alternating inorganic barrier 150 and interface 160 coatings on the inorganic barrier coating 13〇, wherein Each alternating interfacial coating 160 comprises a cured product of a polymer composition comprising a curable polymer composition and a fluoroquinone compound. In another aspect, the coated substrate 100 can additionally comprise another interfacial coating 170 on the inorganic barrier coating 130, wherein the further interfacial coating 17 comprises a curable polymer composition and a fluoroquinone A cured product of a polymer composition of a compound. In another embodiment, a method of preparing a coated substrate 1 提供 is provided. The method comprises forming an interfacial coating layer 12 on a polymer substrate 11 by coating a fluoroquinone-modified polymer combination comprising a curable polymer composition and a fluoroantimony compound on the substrate 110. And curing the composition to prepare; and forming an inorganic barrier coating 130 on the interfacial coating 120. The method of preparing the coated substrate 1 of the present invention can be carried out using conventional equipment and techniques as well as readily available polyoxynitride compositions. For example, the inorganic barrier coating 130 can be deposited using chemical vapor deposition techniques and physical vapor deposition techniques. Additionally, the interfacial coating 120 can be formed using conventional methods of coating and curing the polyoxynoxy composition. Furthermore, the process of the invention can be scaled up to a high throughput manufacturing process. In one aspect, the method includes forming an interface coating 120 on the polymer substrate 11A. The polymer substrate is as described above and exemplified. In another aspect, the method comprises forming an interfacial coating 120 on a polymer substrate, wherein the interfacial coating 120 is formed by coating the substrate 11 with a curable polymer composition and a fluorochemical compound. The fluoroquinone-modified polymer combination I63288.doc • 50- 201245352 was used and the composition was cured to prepare. Interfacial coating 120 is prepared as described above and exemplified. In another aspect, the coated substrate 100 is prepared by forming an inorganic barrier coating 13 on the interfacial coating 120. The inorganic barrier coating 1 30 is as described above and exemplified. EXAMPLES The following examples are presented to better illustrate various embodiments of the coated substrates of the present invention', but are not to be construed as limiting the invention as defined in the appended claims. The following methods and materials were used in the examples: Example 1 Amino acid based on an ethylene tetrafluorine film. A mixture of an aliphatic urethane urethane coating and a fluoroindole compound is prepared. More specifically, a hydroxy functional acrylate oligomer sold by Sartomer Company (Exton, PA) under the trademark CN3 100 is mixed with a fluoroquinone compound. By mixing CN3 100 with F3CCF2CF2CF2CH2CH2Si(OMe)3 sold by Dow Corning Corporation (Midland, MI) under the trademark Dow Coming® B-3958 and/or by Dow Corning Corporation (Mid 〖and, MI) F3CCH2CH2Si(OMe)3 sold by Dow Corning® Z-9030 to prepare an aliphatic urethane phthalate coating. Added by Ciba Specialty

Chemicals(Tarrytown，NY)供應之以商標 DarocurTM CN-2022銷售之光引發劑。r>arocurTM CN-2022為一種用於引Chemicals (Tarrytown, NY) supplies the photoinitiator sold under the trademark DarocurTM CN-2022. r>arocurTM CN-2022 is a kind of introduction

發自由基聚合反應之高效液體固化劑，其包含IrgacureTM 819及80%〇31*〇(^1/1^1173。亦製備包含脂族丙烯酸胺基甲酸酯塗料而不添加氟矽化合物之對照樣品。更特定言之， 163288.doc 201245352 製備包含CN3100而不添加氟矽化合物之對照樣品。使用12號Meyer™桿將調配物^mD〇wCorning®B- 3958、Dow Corning® Z-9030、DarocurTM CN-2022 及 / 或 CN3 100及其組合）塗覆於乙稀四氟乙稀（「etfe」）薄膜。以約1000 mj/cm2能量固化調配物。測試調配物之表面能、表面均一性、黏著性及濕潤性。A high-efficiency liquid curing agent for radical polymerization, which comprises IrgacureTM 819 and 80% 〇31*〇(^1/1^1173. A control containing an aliphatic urethane urethane coating without adding a fluoroquinone compound is also prepared. Samples. More specifically, 163288.doc 201245352 Prepare a control sample containing CN3100 without the addition of a fluoroquinone compound. Formulations using a No. 12 MeyerTM rod ^mD〇wCorning® B-3958, Dow Corning® Z-9030, DarocurTM CN-2022 and / or CN3 100 and combinations thereof are applied to a film of ethylene tetrafluoroethylene ("etfe"). The formulation is cured with an energy of about 1000 mj/cm2. The surface energy, surface uniformity, adhesion and wettability of the formulations were tested.

經由視訊接觸角分析測定表面能。更詳言之藉由量測塗覆於ETFE薄膜之固化調配物與分配於固化調配物上之水及一峨甲烧之間的接觸角測定表面能。使用由AWSurface energy was determined by visual contact angle analysis. More specifically, the surface energy was determined by measuring the contact angle between the cured formulation applied to the ETFE film and the water and a sputum burn assigned to the cured formulation. Used by AW

Products，Inc_(Billerica，μα)供應之 VCA 0ptim_ 角儀測定接觸角。VCA Optima測角儀捕捉靜態或動態液滴影像且測定接觸角量測之基礎之切線。資料及影像儲存於電腦中。使用供Wind〇wsTM使用之VCA Optima XE軟體來分析資料及影像》定性評估表面均一性。更特定言之，藉由觀測塗覆於 ETFE薄膜之固化調配物之外觀來目視確定表面均一性。亦使用用以確定摩擦抗性之指耐摩測試（finger rub以州定性評估黏著性。更特定言之，#由在塗覆於咖㈣膜之固化調配物上摩檫中指10次以逐步形成磨損來評估黏著性。接著評估固化調配物之外觀。詳言之，評估固化調配物之外觀以確定固化調配物是否自ETFE薄膜剝落。亦定性評估塗料濕潤性。更特定言之，在固化之前及之後藉由_覆於ETFE薄膜之調配物之外觀進行目視觀測來確定塗層濕潤性。 163288.doc -52· is 201245352 結果展示於下表1中。ETFE薄膜之動態表面能為約18.6 達因（dyne)/平方公分。對於欲產生之濕m生，具有高表面能之動態表面必須由表面能接近或低於動態表面之液體覆蓋。、’°果如表I中所示，添加氟矽化合物使經固化塗層之表面能降低多達14達因/平方公分。另外，氧石夕化合物改良表面均ί生、黏著性及塗層濕潤性，因此經固化塗層保持黏著於ETFE薄膜’從而降低界面層塗層中之表面缺陷。另夕卜氟石夕化合物#由增加對塗料磨損及剝落之抗性來改良界面塗層之強度。志 Ϊ - 對照 1 ~ 2 1 Δ 7 〇 lINJlUU(g) DarocurIM CN-2022fe) 10.0_ 0.5 --~~—_ 10.0 10.0 10.0 / 10.0 〇 10.0 0.5 0.5 0.5 0.5 0.5 Dow Corning® B-3958(g) 0.1 0.5 1.0 Dow Corning® Z-9030f^ 「 ~ _ - 0.1 0.5 表面能(達因 /平方公分） 35.6 37.6 21.8 31.2 28.7 表面均一性不良，嚴重收縮均一擴散，在表面上成珠均一擴散，在表面上成珠極佳，略微混濁不良，嚴重收縮較小不連續性黏著性極其不良，易剝落，嚴重分層 ------ 良好黏著，在中壓下剝落不良黏著，在中壓下剝落極佳不良黏著，在中壓下剝落良好黏著，在中壓下剝落 ------- 塗層濕潤性 ——---- 不良 ---^ 均一擴散均一擴散極佳不良極佳濕潤性實例2 163288.doc -53· 201245352 於ETFE上之f基丙烯酸酯界面塗層。製備ψ基丙烯酸酯塗料與含氟化合物之混合物。更特定言之，製備由Dow Corning Corporation(Midland，MI)供應之以商標 Dow Corning® WL-7154銷售的包含（苯基SiO3/2)0.67(曱基丙烯酸酯Si03/2)〇.33之甲基丙稀酸酯塗料與Dow Corning® B-3958 或Dow Corning® Z-9030之混合物。亦製備包含Dow Corning® WL-7154 而不添加 Dow Corning® B-3958 及 Dow Corning® Z-9030之對照樣品。使用12號Meyer™桿將調配物 (Φ Dow Corning® B-3958 ' Dow Corning® Z-9030 及 / 或 Dow Corning® WL-7154及其組合）塗覆於ETFE薄膜。以約 1000 mJ/cm2能量固化調配物。如先前所述測試調配物之表面能、表面均一性、黏著性及濕潤性。結果展示於下表Π中。，结采。如表II中所示，添加氟矽化合物改良表面均一性、黏著性及塗層濕潤性，因此經固化塗層保持黏著於 ETFE薄膜，從而降低界面層塗層中之表面缺陷。表II 對照 3 4 2A 9 10 Dow Corning® WL-7154(g) 10.0 10.0 10.0 10.0 10.0 10.0 Dow Corning® B-3958(r) 0.1 0.5 1.0 Dow Corning® Z-9030(r) 0.1 0.5 表面能(達因 /平方公分） 24 20.2 25.4 23.5 表面均一性不良，嚴重收縮透明塗層，均一塗層分層塗層分層 163288.doc •54· 201245352 黏著性極其不良黏著，在輕度指壓下易剝落塗層分層，不黏著塗層分層’不黏著極佳不黏著不黏著塗層濕潤性不良極佳 ---- 實例3 於ETFE上之環氧基及f基丙婦駿醋界面塗層。製谓壤氧基塗料及甲基丙烯酸酯塗料與含氟化合物之混合物。更特定言之’製備由 Dow Corning Corp0ration(MidUnd，MI)The VCA 0ptim_ angle meter supplied by Products, Inc. (Billerica, μα) measures the contact angle. The VCA Optima goniometer captures static or dynamic droplet images and determines the tangent to the basis of the contact angle measurement. The data and images are stored on your computer. Use the VCA Optima XE software for Wind〇wsTM to analyze data and images. Qualitatively evaluate surface uniformity. More specifically, surface uniformity was visually determined by observing the appearance of the cured formulation applied to the ETFE film. The finger rub resistance test was also used to determine the friction resistance (finger rub was evaluated by the state to determine the adhesion. More specifically, # by the middle of the curing formulation applied to the coffee (4) film, the middle finger was formed 10 times to gradually form wear. The adhesion was evaluated. The appearance of the cured formulation was then evaluated. In particular, the appearance of the cured formulation was evaluated to determine if the cured formulation had peeled off from the ETFE film. The wettability of the coating was also qualitatively evaluated. More specifically, before curing and The wettability of the coating was then determined by visual observation of the appearance of the formulation overlaid on the ETFE film. 163288.doc -52· is 201245352 The results are shown in Table 1. The dynamic surface energy of the ETFE film is about 18.6 dyne. (dyne) / square centimeter. For the wet mass to be produced, the dynamic surface with high surface energy must be covered by liquid with surface energy close to or lower than the dynamic surface. , '° Fruit as shown in Table I, add fluoroquinone The compound reduces the surface energy of the cured coating by up to 14 dynes/cm 2 . In addition, the Oxygen compound improves surface adhesion, adhesion and coating wetting, so the cured coating is protected. Adhesive to ETFE film' to reduce surface defects in the interface layer coating. In addition, Fluorite Compound # improves the strength of the interface coating by increasing the resistance to coating wear and peeling. Zhi Zhi - Control 1 ~ 2 1 Δ 7 〇lINJlUU(g) DarocurIM CN-2022fe) 10.0_ 0.5 --~~—_ 10.0 10.0 10.0 / 10.0 〇10.0 0.5 0.5 0.5 0.5 0.5 Dow Corning® B-3958(g) 0.1 0.5 1.0 Dow Corning® Z -9030f^ " ~ _ - 0.1 0.5 Surface energy (dynes / cm ^ 2 ) 35.6 37.6 21.8 31.2 28.7 Poor surface homogeneity, uniform shrinkage of uniform shrinkage, uniform diffusion of beads on the surface, excellent beading on the surface, slightly Poor opacity, severe shrinkage, small discontinuity, extremely poor adhesion, easy flaking, severe stratification ------ good adhesion, poor adhesion at medium pressure, excellent adhesion at medium pressure, in the middle Debonding is good adhesion, peeling off under medium pressure ------- Coating wettability---- Bad---^ Uniform diffusion Uniform diffusion Excellent bad Excellent wettability Example 2 163288.doc - 53· 20124535 2 f-based acrylate interfacial coating on ETFE. Preparation of a mixture of thiol acrylate coatings and fluorochemicals. More specifically, the Dow Corning® WL- is supplied by Dow Corning Corporation (Midland, MI). A mixture of a methyl acrylate coating of (phenyl SiO3/2) 0.67 (mercapto acrylate Si03/2) 〇.33 and a mixture of Dow Corning® B-3958 or Dow Corning® Z-9030 is commercially available from 7154. Control samples containing Dow Corning® WL-7154 without Dow Corning® B-3958 and Dow Corning® Z-9030 were also prepared. The formulation (Φ Dow Corning® B-3958 'Dow Corning® Z-9030 and/or Dow Corning® WL-7154 and combinations thereof) was applied to the ETFE film using a No. 12 MeyerTM rod. The formulation is cured at an energy of about 1000 mJ/cm2. The surface energy, surface uniformity, adhesion and wettability of the formulations were tested as previously described. The results are shown in the table below. , knot mining. As shown in Table II, the addition of a fluoroquinone compound improves surface uniformity, adhesion, and coating wettability, so that the cured coating remains adhered to the ETFE film, thereby reducing surface defects in the interface layer coating. Table II Control 3 4 2A 9 10 Dow Corning® WL-7154(g) 10.0 10.0 10.0 10.0 10.0 10.0 Dow Corning® B-3958(r) 0.1 0.5 1.0 Dow Corning® Z-9030(r) 0.1 0.5 Surface Energy (Da Cause / square centimeter) 24 20.2 25.4 23.5 Poor surface uniformity, severe shrinkage of clear coating, uniform coating layered coating layer 163288.doc •54· 201245352 Adhesive extremely poor adhesion, easy to peel under mild finger pressure Layering of the coating, non-adhesive coating layering 'no adhesion, excellent adhesion, no adhesion, no coating adhesion, poor wettability---- Example 3 epoxy group on ETFE and f-based propyl vinegar interface coating . A mixture of a oxy-based coating and a methacrylate coating with a fluorochemical. More specifically, 'prepared by Dow Corning Corp0ration (MidUnd, MI)

供應之以商標Dow Corning® PHEEP銷售的包含（苯基 SiO：3/2)〇.67(環氧基Si〇3/2)〇.33之環氧基塗料及包含丙二醇單甲基醚乙酸酯（「PGMEA」）之曱基丙烯酸酯塗料。組合 Dow Corning® PHEEP及 PGMEA且與 Dow Corning® B-3958 或 Dow Corning® Z-9030 混合。添加由 Pfaltz & Bauer (Waterbury，CT)供應之以商標Pfaltz & Bauer T17775銷售的包含50%六氟銻酸三芳基銕鹽於碳酸伸丙酯中之溶液的光引發劑。亦製備包含Dow Corning® PHEEP及PGMEA而不添加 Dow Corning® B-3958 及 Dow Corning® Z-9030 之對照樣品。使用12號Meyer™桿將調配物（亦即Dow Corning® PHEEP、PGMEA、Dow Corning® B-3958、Dow Corning® Ζ·9030及/或 Dow Corning® WL-7154及其組合）塗覆於ETFE 薄膜。以約1000 mJ/cm2能量固化調配物。如先前所述測試調配物之表面能、表面均一性、黏著性及濕潤性。結果展示於下表III中。 .#肩。如表III中所示’添加氟矽化合物改良表面均一性、黏著性及塗層濕潤性’因此經固化界面塗層保持黏著於ETFE薄膜，從而降低界面層塗層中之表面缺陷。 163288.doc -55- 201245352 表III 對照 5 6 11 12 Dow Corning® PHEEP(g) 10.0 10.0 10.0 10.0 10.0 PGMEA(g) 2.0 2.0 2.0 2.0 2.0 Pfaltz & Bauer T17775催化劑 (g) 0.1 0.1 0.1 0.1 0.1 Dow Corning® B-3958(r) 0.1 0.5 Dow Corning® Z-9030(g) 0.1 0.5 表面能(達因/平方公分） 26.4 24.6 31.4 29.6 表面均一性不良，嚴重收縮不良，但均一塗料均勻擴散，但最終成珠極佳極佳表面均一性黏著性極其不良黏著，在輕度指壓下易剝落不良黏著，在輕度指壓下易剝落良好黏著，在輕度指壓下易剝落不良黏著，在輕度指壓下易剝落極佳，但在老化時有一些分層跡象塗層濕潤性不良良好塗料保持均勻擴散，但最終成珠均一，無塗層缺陷極佳表面均一性實例4 於E：TF五J:之·#面塗層。製備脂族丙烯酸胺基曱酸酯塗料與含氟化合物之混合物。更特定言之，製備特徵在於具有高伸長、良好化學抗性及羥基官能基之低黏度寡聚物 CN3100及甲基丙烯酸酯塗料Dow Corning® WL-7154與含氟化合物之混合物。更特定言之，脂族丙烯酸胺基甲酸酯塗料及甲基丙烯酸酯塗料與由Dow Corning Corporation (Midland, MI)供應之以商標 Dow Corning® DC-2607銷售之含氟烷氧基矽酸酯混合。亦製備包含CN3 100或Dow Corning® WL-7154 而不添加 Dow Corning® DC-2607之對 163288.doc •56- Γδ 201245352 照樣品。使用12號Meyer™桿將調配物（亦即CN3 i 〇〇、d〇wEpoxy based coatings containing (phenyl SiO: 3/2) 〇.67 (epoxy Si〇3/2) 〇.33 and propylene glycol monomethyl ether acetate sold under the trademark Dow Corning® PHEEP A mercapto acrylate coating of an ester ("PGMEA"). Combine Dow Corning® PHEEP and PGMEA with Dow Corning® B-3958 or Dow Corning® Z-9030. A photoinitiator, supplied by Pfaltz & Bauer (Waterbury, CT) under the trademark Pfaltz & Bauer T17775, containing a solution of 50% triarylsulfonium hexafluoroantimonate in propyl carbonate. Control samples containing Dow Corning® PHEEP and PGMEA without Dow Corning® B-3958 and Dow Corning® Z-9030 were also prepared. Apply Formulations (ie Dow Corning® PHEEP, PGMEA, Dow Corning® B-3958, Dow Corning® Ζ·9030 and/or Dow Corning® WL-7154 and combinations thereof) to ETFE Film using a No. 12 MeyerTM rod . The formulation is cured with an energy of about 1000 mJ/cm2. The surface energy, surface uniformity, adhesion and wettability of the formulations were tested as previously described. The results are shown in Table III below. .#shoulder. As shown in Table III, the addition of a fluoroquinone compound improves surface uniformity, adhesion, and coating wettability. Thus, the cured interfacial coating remains adhered to the ETFE film, thereby reducing surface defects in the interfacial layer coating. 163288.doc -55- 201245352 Table III Control 5 6 11 12 Dow Corning® PHEEP(g) 10.0 10.0 10.0 10.0 10.0 PGMEA(g) 2.0 2.0 2.0 2.0 2.0 Pfaltz & Bauer T17775 Catalyst (g) 0.1 0.1 0.1 0.1 0.1 Dow Corning® B-3958(r) 0.1 0.5 Dow Corning® Z-9030(g) 0.1 0.5 Surface energy (dynes/cm 2 ) 26.4 24.6 31.4 29.6 Poor surface homogeneity, poor shrinkage, but uniform diffusion of uniform coating, but Ultimately, excellent excellent surface adhesion, extremely poor adhesion, easy to peel off under mild finger pressure, easy to peel off under mild finger pressure, good adhesion, easy to peel off under mild finger pressure, in the adhesion It is excellent for easy peeling under mild finger pressure, but there are some delamination signs during aging. The coating has poor wettability. The coating maintains uniform diffusion, but the final bead is uniform. No coating defects. Excellent surface uniformity. Example 4: TF five J: · #面coat. A mixture of an aliphatic acrylamide phthalate coating and a fluorochemical is prepared. More specifically, the preparation is characterized by a low viscosity oligomer of high elongation, good chemical resistance and hydroxyl functionality, CN3100 and a mixture of methacrylate coating Dow Corning® WL-7154 and a fluorine-containing compound. More specifically, aliphatic urethane urethane coatings and methacrylate coatings and fluoroalkoxy phthalates sold by Dow Corning Corporation (Midland, MI) under the trademark Dow Corning® DC-2607 mixing. A pair of 163288.doc •56- Γδ 201245352 samples containing CN3 100 or Dow Corning® WL-7154 without adding Dow Corning® DC-2607 was also prepared. Formulations using a No. 12 MeyerTM rod (ie CN3 i 〇〇, d〇w

Coming® WL-7154及 / 或 Dow Corning® dC-2607 及其組合）塗覆於ETFE薄膜。以約looo mj/cm2能量固化調配物。如先前所述測試調配物之表面能、表面均一性、黏著性及塗層濕潤性。結果展示於下表IV中。 .结求。如表IV中所示，添加含氟烷氧基矽酸酯至兩種脂族胺基曱酸酯塗料中顯著改良表面均一性、黏著性及塗層濕潤性，因此經固化塗層保持黏著於ETFE薄膜，從而降低界面塗層中之表面缺陷。另外，界面塗層之強度係藉由增加對磨損及剝落之抗性而得以改良。 — 表IV 5 3 6 5 CN-3100(g) 20 20 Darocur,lv,CN- 2022(g) 1 1 Dow Corning® WL-7154(s) 20 20 uow Corning® DC-2607fs) 1 1 表面均一性不良，嚴重收縮透明，均一不良，嚴重收縮透明，均一黏著性極其不良，易剝落，嚴重分層極佳極其不良黏著，在輕度指壓下易剝落極佳塗層濕潤性不良極佳不良極佳及限定本發明之目的’應注意術語「約」及旦貫質上」在本文中用於表示可歸於任何定量比較、值、 =測或其他表示形式之固有不確定度。術語「約」及「實貝」亦在本文中用於表示定量表示形式可自所述參考值 163288.doc •57· 201245352 變化而不導致所論述標的物之基本功能發生變化的程度β 以上描述及圖式應僅視為說明達成本發明之特徵及優勢之例示性實施例。可在不脫離本發明之目的及範疇之情況下對所述特徵及步驟作出修改及替換。因此，本發明不應視為受上述描述及圖式限制，而是僅受隨附申請專利範圍之範疇限制。【圖式簡單說明】圖1描述根據本發明之一實施例之經塗佈基板的剖視圖；圖2描述根據本發明之一實施例於界面塗層上另外包含另一無機障壁塗層的經塗佈基板之剖視圖；圖3描述根據本發明之一實施例於界面塗層上另外包含至少兩個交替無機障壁及界面塗層的經塗佈基板之剖視圖4彳田述根據本發明之一實施例於無機障壁塗層上另外包含另一界面塗層的經塗佈基板之剖視圖；圖5据述根據本發明之一實施例之電子封裝件的剖視圖6描述根據本發明之一實施例之電子封裝件圖其中6亥電子封裝件包含於至少一電子裝置上之區域中之第二無機障壁塗層上的第二界面塗層，及於該第土層及。玄第—無機障壁塗層之未由該第二界面任何部分上的第三無機障壁塗層。盾覆盘之【主要元件符號說明】 I63288.doc •58· 201245352 100 110 120 130 140 150 160 170 200 210 220 經塗佈基板聚合物基板/第一界面塗層/第一聚合物基板界面塗層無機障壁塗層無機障壁塗層無機障壁塗層界面塗層界面塗層 * 電子封裝件電子裝置黏著塗層 163288.doc -59-Coming® WL-7154 and / or Dow Corning® dC-2607 and combinations thereof are applied to ETFE films. The formulation is cured with an energy of about looo mj/cm2. The surface energy, surface uniformity, adhesion, and coating wettability of the formulations were tested as previously described. The results are shown in Table IV below. . As shown in Table IV, the addition of fluoroalkoxy phthalate to two aliphatic amine phthalate coatings significantly improved surface uniformity, adhesion and coating wettability, so the cured coating remains adhered to ETFE film to reduce surface defects in the interface coating. In addition, the strength of the interfacial coating is improved by increasing resistance to abrasion and spalling. — Table IV 5 3 6 5 CN-3100(g) 20 20 Darocur, lv, CN-2022(g) 1 1 Dow Corning® WL-7154(s) 20 20 uow Corning® DC-2607fs) 1 1 Surface homogeneity Poor, severe shrinkage and transparency, uniformity, severe shrinkage and transparency, uniform adhesion is extremely poor, easy to peel off, severe delamination is excellent, extremely poor adhesion, easy to peel under mild finger pressure, excellent coating, poor wettability, excellent bad electrode It is intended that the term "about" and "perme" are used herein to mean the inherent uncertainty that can be attributed to any quantitative comparison, value, measurement, or other representation. The terms "about" and "real" are also used herein to mean that the quantitative representation can vary from the reference value 163288.doc •57·201245352 without causing a change in the basic function of the subject matter being discussed. The drawings are to be considered in all respects as illustrative illustrative embodiments Modifications and substitutions of the features and steps may be made without departing from the spirit and scope of the invention. Therefore, the invention is not to be considered as limited by the foregoing description and the drawings, but only by the scope of the accompanying claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 depicts a cross-sectional view of a coated substrate in accordance with an embodiment of the present invention; FIG. 2 depicts a coated additional coating of another inorganic barrier coating on an interfacial coating in accordance with an embodiment of the present invention. 3 is a cross-sectional view of a coated substrate additionally comprising at least two alternating inorganic barriers and interfacial coatings on an interfacial coating according to an embodiment of the invention. FIG. 3 is an embodiment of the present invention. A cross-sectional view of a coated substrate additionally comprising another interfacial coating on the inorganic barrier coating; FIG. 5 is a cross-sectional view 6 of an electronic package in accordance with an embodiment of the present invention, depicting an electronic package in accordance with an embodiment of the present invention In the figure, the 6H electronic package includes a second interfacial coating on the second inorganic barrier coating in the region on at least one electronic device, and the second layer. The smectic-inorganic barrier coating is not coated by a third inorganic barrier on any portion of the second interface. [Main component symbol description] of shield plate I63288.doc •58· 201245352 100 110 120 130 140 150 160 170 200 210 220 coated substrate polymer substrate / first interface coating / first polymer substrate interface coating Inorganic barrier coating inorganic barrier coating inorganic barrier coating interface coating interface coating * electronic package electronic device adhesive coating 163288.doc -59-

Claims

201245352 七、申請專利範圍·· 1 · 一種經塗佈基板，其包含： 5^合物基板；於該基板上之界面塗層，其中該界面塗層係藉由於該聚合物基板上塗覆包含可固化聚合物組合物及氟矽化合物之氟矽改質聚合物組合物且固化該組合物加以製備；及於該界面塗層上之無機障壁塗層。 2·如請求項1之經塗佈基板’其中該聚合物基板係選自聚稀烴、氣碳化物聚合物、氟碳化物聚合物、聚醯胺..聚醯亞胺、聚酯、環氧樹脂、聚醚、聚碳酸酯、聚砜及聚鍵職。 3 ·如請求項1之經塗佈基板，其中該聚合物基板為氟碳化物聚合物。 4.如請求項1之經塗佈基板，其中該可固化聚合物組合物為選自矽氫化可固化組合物、縮合可固化聚矽氧組合物、輻射可固化聚矽氧組合物及過氧化物可固化聚矽氧組合物之可固化聚矽氧組合物，或選自可固化聚烯烴組合物、可固化聚醯胺組合物、可固化環氧樹脂組合物、可固化胺基樹脂組合物、可固化聚胺基曱酸酯組合物、可固化聚醯亞胺組合物、可固化聚酯組合物及可固化丙烯酸系樹脂組合物之可固化有機組合物。 5·如請求項1之經塗佈基板，其中該氟矽化合物包含具有下式之含氟燒氧基砂烧： (RfQ丨)ySi(OR12)4.y， 163288.doc 201245352 其中Rf為(^至匚8單價氟碳化物基圑， Q1為ci至c8二價烴基， R為〇：|至c4二價烴基，且 y為1、2或3。 6. 如請求項1之經塗佈基板，其中該氟矽化合物包含具有下式之含氟统氧基矽酸酯： [Si〇4/2]x[(R130)aSiO(4.a)/2]y[(Rf〇)bsi〇(4.b)/2]z > 其中R13為(^至(：4烷基或氫， Rf為(^至心單價氟碳化物基團， a為1至3， b為1至3， X為2至500， y為1至50，且 z為1至5。 7. 如請求項6之經塗佈基板，其中該含氟烷氧基矽酸§旨包含藉由使有機聚矽氧烷樹脂與含氟烷氧基矽酸酯反應所製備之共聚物。 8. 如請求項1之經塗佈基板’其中該氟矽化合物包含由使用預定量之水及矽氧烷聚合催化劑共水解及共縮合至少一種院氧基官能性有機金屬化合物及至少一種烷氧基石夕烷所形成的反應產物。 9 _如請求項1之經塗佈基板，其中該無機障壁塗層包含單層無機材料塗層或包含至少兩層之至少兩種不同無機材料之多層塗層。 163288.doc 201245352 ι〇. —種電子封裝件，其包含：電子裝置；上覆於該裝置之經塗佈基板，其中該經塗佈基板包含聚合物基板；於該基板上之界面塗層，纟中該界面塗層係藉由於該聚合物基板上塗覆包含可固化聚合物組合物及氟矽化合物之氟矽改質聚合物組合物且固化該組合物加以製備’及於該界面塗層上之無機障壁塗層；及介於該經塗佈基板與該裝置之間且與其接觸之黏著塗層0 11·如請求項10之電子封裝件，其中該電子裝置為選自二極體、電晶體、閘流體、變阻器、電阻器、容電器 (condenser)、電容器（capacit〇r)、熱阻體及光電子裝置之離散裝置’或選自單片積體電路、邏輯電路、類比積體電路、混合積體電路、薄膜電池、太陽電池及燃料電池之積體電路。 1 2.如請求項丨〇之電子封裝件，其中該氟矽化合物包含具有下式之含氟烷氧基矽烷： (RfQ')ySi(〇R12)4.y , 其中1^為（：1至（：8單價氟碳化物基團，。為^至^二價烴基，為(^至^二價烴基，且 y為1、2或3。 1 3.如請求項丨〇之電子封裝件，其中該氟矽化合物包含具有下式之含氟烷氧基矽酸酯： 163288.doc 201245352 [Sl〇4/2]x[(R130)aSi〇(4.a)/2]y[(Rf〇)bSio(4 b)/2]z，其中R13為<^至（：4烷基或氫， Rf為（：丨至匚8單價氟碳化物基團， a為1至3， b為1至3， X為2至500， y為1至50，且 z為1至5。 14.如請求項10之電子封裝件，並 1干其中忒氟矽化合物包含由使用預定量之水及錢燒聚合催化劑共水解及共縮合至少 -種烧氧基官能性有機金屬化合物及至少—種院氧基石夕烧所形成的反應產物。 163288.doc Λ201245352 VII. Patent Application Range·· 1 · A coated substrate comprising: a 5^ compound substrate; an interface coating on the substrate, wherein the interface coating is formed by coating the polymer substrate And curing the polymer composition and the fluoroquinone compound fluoroquinone-modified polymer composition and curing the composition; and the inorganic barrier coating on the interface coating. 2. The coated substrate of claim 1, wherein the polymer substrate is selected from the group consisting of a polyolefin, a gas carbide polymer, a fluorocarbon polymer, a polyamine, a polyimine, a polyester, and a ring. Oxygen resin, polyether, polycarbonate, polysulfone and poly bonding. 3. The coated substrate of claim 1, wherein the polymer substrate is a fluorocarbon polymer. 4. The coated substrate of claim 1, wherein the curable polymer composition is selected from the group consisting of hydrazine hydride curable compositions, condensation curable polydecane oxynitride compositions, radiation curable polydecane oxynitride compositions, and peroxidation A curable polyoxynoxy composition of the curable polyoxyn composition, or selected from the group consisting of a curable polyolefin composition, a curable polyamine composition, a curable epoxy resin composition, a curable amine-based resin composition A curable organic composition of a curable polyaminophthalate composition, a curable polyimide composition, a curable polyester composition, and a curable acrylic resin composition. 5. The coated substrate of claim 1, wherein the fluoroquinone compound comprises a fluorine-containing alkoxylate having the formula: (RfQ丨)ySi(OR12)4.y, 163288.doc 201245352 wherein Rf is ( ^至匚8 单价 fluorocarbon 圑, Q1 is ci to c8 divalent hydrocarbon, R is 〇:| to c4 divalent hydrocarbon, and y is 1, 2 or 3. 6. Coated as claimed in claim 1. a substrate, wherein the fluoroquinone compound comprises a fluorine-containing oxyphthalate having the formula: [Si〇4/2]x[(R130)aSiO(4.a)/2]y[(Rf〇)bsi〇 (4.b)/2]z > wherein R13 is (^ to (: 4 alkyl or hydrogen, Rf is (^ to the core monovalent fluorocarbon group, a is 1 to 3, b is 1 to 3, X is from 2 to 500, y is from 1 to 50, and z is from 1 to 5. 7. The coated substrate of claim 6, wherein the fluoroalkoxydecanoic acid § comprises Copolymer prepared by reacting an alkane resin with a fluorine-containing alkoxy decanoate 8. The coated substrate of claim 1 wherein the fluoroquinone compound comprises co-hydrolysis by using a predetermined amount of water and a decane polymerization catalyst And co-condensing at least one of the electrophilic organometallic compounds and at least one alkane The reaction product formed by the base stone. The coated substrate of claim 1, wherein the inorganic barrier coating comprises a single layer of inorganic material coating or a multilayer coating comprising at least two layers of at least two different inorganic materials. 163288.doc 201245352 ι〇. An electronic package comprising: an electronic device; a coated substrate overlying the device, wherein the coated substrate comprises a polymer substrate; an interfacial coating on the substrate The interfacial coating is prepared by coating a fluoroquinone-modified polymer composition comprising a curable polymer composition and a fluoroquinone compound on the polymer substrate and curing the composition. An inorganic barrier coating; and an adhesive coating between the coated substrate and the device. The electronic device of claim 10, wherein the electronic device is selected from the group consisting of Discrete devices for transistors, thyristors, varistors, resistors, condensers, capacitors, thermal resistors, and optoelectronic devices' or selected from monolithic integrated circuits, logic An integrated circuit of a circuit, an analog integrated circuit, a hybrid integrated circuit, a thin film battery, a solar cell, and a fuel cell. 1 2. The electronic package of claim 1, wherein the fluoroantimony compound comprises a fluorine having the following formula Alkoxy decane: (RfQ') ySi(〇R12)4.y, wherein 1^ is (:1 to (:8 monovalent fluorocarbon group, which is ^ to ^ divalent hydrocarbon group, is (^ to ^ A divalent hydrocarbon group, and y is 1, 2 or 3. 1 3. The electronic package of claim 1, wherein the fluoroquinone compound comprises a fluoroalkoxy phthalate having the formula: 163288.doc 201245352 [Sl〇4/2]x[(R130)aSi〇 (4.a)/2]y[(Rf〇)bSio(4 b)/2]z, wherein R13 is <^ to (:4 alkyl or hydrogen, and Rf is (:丨 to 匚8 monovalent fluorocarbonization) a group of groups, a being 1 to 3, b being 1 to 3, X being 2 to 500, y being 1 to 50, and z being 1 to 5. 14. The electronic package of claim 10, and 1 The fluorinated fluorene compound comprises a reaction product formed by cohydrolysis and co-condensation of at least one alkoxy-functional organometallic compound and at least a compound of alkoxylate using a predetermined amount of water and a calcination polymerization catalyst. 163288.doc Λ