DE69131647T2 - Verfahren zur bilderzeugung - Google Patents

Verfahren zur bilderzeugung

Info

Publication number
DE69131647T2
DE69131647T2 DE69131647T DE69131647T DE69131647T2 DE 69131647 T2 DE69131647 T2 DE 69131647T2 DE 69131647 T DE69131647 T DE 69131647T DE 69131647 T DE69131647 T DE 69131647T DE 69131647 T2 DE69131647 T2 DE 69131647T2
Authority
DE
Germany
Prior art keywords
layer
photocurable material
radiation
circuit board
portions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69131647T
Other languages
English (en)
Other versions
DE69131647D1 (de
Inventor
Nicholas Ivory
Wrenford Thatcher
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Coates Brothers and Co Ltd
Original Assignee
Coates Brothers and Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB909014325A external-priority patent/GB9014325D0/en
Priority claimed from GB919106561A external-priority patent/GB9106561D0/en
Application filed by Coates Brothers and Co Ltd filed Critical Coates Brothers and Co Ltd
Publication of DE69131647D1 publication Critical patent/DE69131647D1/de
Application granted granted Critical
Publication of DE69131647T2 publication Critical patent/DE69131647T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/016—Diazonium salts or compounds
    • G03F7/021—Macromolecular diazonium compounds; Macromolecular additives, e.g. binders
    • G03F7/0212—Macromolecular diazonium compounds; Macromolecular additives, e.g. binders characterised by the polymeric binder or the macromolecular additives other than the diazo resins or the polymeric diazonium compounds
    • G03F7/0215—Natural gums; Proteins, e.g. gelatins; Macromolecular carbohydrates, e.g. cellulose; Polyvinyl alcohol and derivatives thereof, e.g. polyvinylacetals
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Magnetic Resonance Imaging Apparatus (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • Materials For Photolithography (AREA)
DE69131647T 1990-06-27 1991-06-27 Verfahren zur bilderzeugung Expired - Fee Related DE69131647T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB909014325A GB9014325D0 (en) 1990-06-27 1990-06-27 Image-forming process
GB919106561A GB9106561D0 (en) 1991-03-27 1991-03-27 Image-forming process
PCT/GB1991/001046 WO1992000552A1 (en) 1990-06-27 1991-06-27 Image-forming process

Publications (2)

Publication Number Publication Date
DE69131647D1 DE69131647D1 (de) 1999-10-28
DE69131647T2 true DE69131647T2 (de) 2000-05-18

Family

ID=26297254

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69131647T Expired - Fee Related DE69131647T2 (de) 1990-06-27 1991-06-27 Verfahren zur bilderzeugung

Country Status (7)

Country Link
US (2) US5556735A (de)
EP (1) EP0536272B1 (de)
JP (1) JP3071462B2 (de)
KR (1) KR100187942B1 (de)
AT (1) ATE185000T1 (de)
DE (1) DE69131647T2 (de)
WO (1) WO1992000552A1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2269385A (en) * 1992-07-14 1994-02-09 Coates Brothers Plc Coating compositions
JP2718901B2 (ja) * 1994-10-31 1998-02-25 ローム株式会社 半導体装置の製造方法
US5512607A (en) * 1995-06-06 1996-04-30 W. R. Grace & Co.-Conn. Unsaturated epoxy ester with quaternary ammonium and phosphate groups
WO1996041240A1 (en) * 1995-06-07 1996-12-19 W.R. Grace & Co.-Conn. Water photoresist emulsions and methods of preparation thereof
EP0791857B1 (de) * 1996-02-26 2000-11-15 Agfa-Gevaert N.V. Bildaufzeichnungselement, das eine Zweiphasenbeschichtung mit einer dispergierten hydrophoben photopolymerisierbaren Phase enthält
JP3771714B2 (ja) * 1998-05-12 2006-04-26 互応化学工業株式会社 感光性樹脂組成物及びプリント配線板製造用フォトソルダーレジストインク
EP1145607B1 (de) * 1998-12-22 2011-10-12 Huntsman Advanced Materials (Switzerland) GmbH Herstellung von photoresistbeschichtungen
US6555592B2 (en) * 2001-02-27 2003-04-29 Advance Materials Corporation Photothermosetting composition comprising acrylated epoxy resin
KR100407292B1 (ko) * 2001-05-11 2003-11-28 박영곤 피가공물체 표면처리방법
EP1631610B1 (de) 2003-06-12 2013-03-13 Valspar Sourcing, Inc. Reaktive verdünnungsmittel enthaltende beschichtungszusammensetzungen und verfahren
KR101020164B1 (ko) 2003-07-17 2011-03-08 허니웰 인터내셔날 인코포레이티드 진보된 마이크로전자적 응용을 위한 평탄화 막, 및 이를제조하기 위한 장치 및 방법
US20080223530A1 (en) * 2007-03-13 2008-09-18 Vincent Grosso Shade cover attachment for blind

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB665649A (en) * 1949-04-01 1952-01-30 Autotype Company Ltd Improvements in photographic films and processes for producing stencils therewith
GB719084A (en) * 1951-10-15 1954-11-24 Nat Res Dev Electro-forming metal grids
AU4509872A (en) * 1971-08-02 1974-01-31 Rca Corp Making a viewing screen for an apertured-mask cathode-ray tube
JPS5220225B2 (de) * 1973-07-25 1977-06-02
US4154614A (en) * 1975-07-02 1979-05-15 Nippon Paint Co., Ltd. Photosensitive diazo composition with graft copolymer for use in printing screen
US4186069A (en) * 1978-01-30 1980-01-29 Richardson Graphics Company Photopolymerizable latex systems
EP0030213A1 (de) * 1979-11-29 1981-06-10 Ciba-Geigy Ag Durch Licht vernetzbare Schicht auf Druckformen und Verfahren zur Herstellung von Offset-Druckplatten
EP0083835A3 (de) * 1982-01-12 1984-03-07 Autotype International Limited Stabilisierung von Diazoharzsensibilisatoren
US4592816A (en) * 1984-09-26 1986-06-03 Rohm And Haas Company Electrophoretic deposition process
GB2202858A (en) * 1987-03-26 1988-10-05 Sericol Group Ltd Photopolymerisable compositions for producing screen printing stencils
GB2213487B (en) * 1987-12-08 1992-01-08 Kansai Paint Co Ltd Method of forming a cured coating film
GB8804044D0 (en) * 1988-02-22 1988-03-23 Coates Brothers Plc Coating compositions

Also Published As

Publication number Publication date
ATE185000T1 (de) 1999-10-15
US5750291A (en) 1998-05-12
EP0536272B1 (de) 1999-09-22
WO1992000552A1 (en) 1992-01-09
JP3071462B2 (ja) 2000-07-31
KR100187942B1 (ko) 1999-06-01
US5556735A (en) 1996-09-17
DE69131647D1 (de) 1999-10-28
EP0536272A1 (de) 1993-04-14
KR930701771A (ko) 1993-06-12
JPH05509175A (ja) 1993-12-16

Similar Documents

Publication Publication Date Title
DE69131647D1 (de) Verfahren zur bilderzeugung
GB1473194A (en) Positive working resist masks
MY106633A (en) Positive acting photoresists and method of producing same.
WO1999001796A3 (en) Pattern-forming methods
ATE7823T1 (de) Entwickler und verfahren zum entwickeln strahlenempfindlicher platten unter verwendung derselben.
MY140694A (en) Pattern forming method and treating agent therefor
US5134056A (en) Method for applying a solder resist layer to a printed circuit board
DE3853283D1 (de) Zusammensetzungen für aufzeichnungsmaterialien.
GB1151532A (en) Photomechanical production of Bimetallic Printing Plates
US3415648A (en) Pva etch masking process
KR910009126A (ko) 금속 패턴(pattern)의 제조방법
US20050181313A1 (en) Method for forming openings in a substrate using a packing and unpacking process
GB1387350A (en) Method of preparing a photoresist pattern upon a metal surface
ATE47631T1 (de) Verfahren zum herstellen von photoresiststrukturen.
US5162194A (en) Method of providing a printed circuit board with a cover coat
JPH0353587A (ja) レジストパターンの形成方法
KR960001894A (ko) 레지스트 패턴의 형성방법과 그 방법에 쓰이는 산성 수용성 재료 조성물
JPS56140342A (en) Image forming composition and formation of resist image
JP2964533B2 (ja) レジストパターンの形成方法
JP2687616B2 (ja) プリント配線板の製造方法
JP2551117B2 (ja) レジストパターン形成方法
Blum et al. A Study Of The Dissolution Kinetics Of A Positive Photoresist Using Organic Acids To Simulate Exposed Photoactive Compounds
JPS5932911B2 (ja) プリント配線板の製造方法
JPS5942997B2 (ja) プリント板製造における耐エツチング皮膜の形成方法
JPH09312459A (ja) スルーホールを有するプリント基板の製造方法

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee