DE68929104D1 - Integrierte Halbleiterschaltung - Google Patents
Integrierte HalbleiterschaltungInfo
- Publication number
- DE68929104D1 DE68929104D1 DE68929104T DE68929104T DE68929104D1 DE 68929104 D1 DE68929104 D1 DE 68929104D1 DE 68929104 T DE68929104 T DE 68929104T DE 68929104 T DE68929104 T DE 68929104T DE 68929104 D1 DE68929104 D1 DE 68929104D1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor circuit
- integrated semiconductor
- integrated
- circuit
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/528—Geometry or layout of the interconnection structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/528—Geometry or layout of the interconnection structure
- H01L23/5286—Arrangements of power or ground buses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/585—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries comprising conductive layers or plates or strips or rods or rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6605—High-frequency electrical connections
- H01L2223/6616—Vertical connections, e.g. vias
- H01L2223/6622—Coaxial feed-throughs in active or passive substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Integrated Circuits (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63202199A JPH0628286B2 (ja) | 1988-08-12 | 1988-08-12 | リニア半導体集積回路 |
JP63235829A JP2752098B2 (ja) | 1988-09-20 | 1988-09-20 | 半導体集積回路 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE68929104D1 true DE68929104D1 (de) | 2000-01-05 |
DE68929104T2 DE68929104T2 (de) | 2000-07-13 |
Family
ID=26513234
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE68929104T Expired - Lifetime DE68929104T2 (de) | 1988-08-12 | 1989-08-07 | Integrierte Halbleiterschaltung |
Country Status (4)
Country | Link |
---|---|
US (1) | US5160997A (de) |
EP (1) | EP0354512B1 (de) |
KR (1) | KR920005863B1 (de) |
DE (1) | DE68929104T2 (de) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3027990B2 (ja) * | 1991-03-18 | 2000-04-04 | 富士通株式会社 | 半導体装置の製造方法 |
JPH05136125A (ja) * | 1991-11-14 | 1993-06-01 | Hitachi Ltd | クロツク配線及びクロツク配線を有する半導体集積回路装置 |
IT1272933B (it) * | 1994-01-28 | 1997-07-01 | Fujitsu Ltd | Dispositivo a circuito integrato di semiconduttore |
JPH09232435A (ja) * | 1996-02-22 | 1997-09-05 | Oki Electric Ind Co Ltd | 半導体集積回路 |
US5748547A (en) * | 1996-05-24 | 1998-05-05 | Shau; Jeng-Jye | High performance semiconductor memory devices having multiple dimension bit lines |
US5811882A (en) * | 1996-09-24 | 1998-09-22 | Philips Electronics North America Corporation | On-chip shielding coaxial conductors for mixed-signal IC |
JP3501620B2 (ja) * | 1997-05-26 | 2004-03-02 | 株式会社 沖マイクロデザイン | 半導体集積回路 |
US6584596B2 (en) | 2001-09-24 | 2003-06-24 | International Business Machines Corporation | Method of designing a voltage partitioned solder-bump package |
US6657285B1 (en) * | 2002-07-08 | 2003-12-02 | Alcor Micro, Corp. | Semiconductor anti-interference band for integrated circuit |
JP4141881B2 (ja) * | 2003-04-04 | 2008-08-27 | シャープ株式会社 | 集積回路 |
JP6338045B2 (ja) | 2013-10-30 | 2018-06-06 | セイコーエプソン株式会社 | 物理量検出装置用回路、物理量検出装置、電子機器及び移動体 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3769108A (en) * | 1971-12-03 | 1973-10-30 | Bell Telephone Labor Inc | Manufacture of beam-crossovers for integrated circuits |
US3769180A (en) * | 1971-12-29 | 1973-10-30 | O Gedde | Process for electrolytically coloring previously anodized aluminum using alternating current |
JPS57195480A (en) * | 1981-05-26 | 1982-12-01 | Hikozou Katayama | Transparent dice |
JPS5844743A (ja) * | 1981-09-10 | 1983-03-15 | Fujitsu Ltd | 半導体集積回路 |
JPS5844742A (ja) * | 1981-09-10 | 1983-03-15 | Fujitsu Ltd | 半導体集積回路装置 |
JPS5984542A (ja) * | 1982-11-08 | 1984-05-16 | Nec Corp | 高周波半導体集積回路 |
JPS601843A (ja) * | 1983-06-17 | 1985-01-08 | Sanyo Electric Co Ltd | 半導体集積回路 |
JPS6035537A (ja) * | 1983-08-08 | 1985-02-23 | Nec Corp | 半導体集積回路 |
JPS6074455A (ja) * | 1983-09-29 | 1985-04-26 | Fujitsu Ltd | マスタスライス集積回路 |
JPS60154644A (ja) * | 1984-01-25 | 1985-08-14 | Hitachi Ltd | 半導体装置 |
JPS60165752A (ja) * | 1984-02-08 | 1985-08-28 | Nec Corp | 半導体集積回路 |
JPS61119060A (ja) * | 1984-11-14 | 1986-06-06 | Toshiba Corp | 半導体集積回路の信号伝送路 |
JPS6212147A (ja) * | 1985-07-10 | 1987-01-21 | Hitachi Ltd | マスタ−スライス方式の半導体装置 |
JPS6344742A (ja) * | 1986-08-12 | 1988-02-25 | Fujitsu Ltd | 半導体装置 |
US5050238A (en) * | 1988-07-12 | 1991-09-17 | Sanyo Electric Co., Ltd. | Shielded front end receiver circuit with IF amplifier on an IC |
-
1989
- 1989-08-05 KR KR1019890011249A patent/KR920005863B1/ko not_active IP Right Cessation
- 1989-08-07 DE DE68929104T patent/DE68929104T2/de not_active Expired - Lifetime
- 1989-08-07 EP EP89114561A patent/EP0354512B1/de not_active Expired - Lifetime
-
1991
- 1991-04-11 US US07/684,471 patent/US5160997A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0354512B1 (de) | 1999-12-01 |
EP0354512A2 (de) | 1990-02-14 |
EP0354512A3 (de) | 1991-08-14 |
KR900004000A (ko) | 1990-03-27 |
KR920005863B1 (ko) | 1992-07-23 |
DE68929104T2 (de) | 2000-07-13 |
US5160997A (en) | 1992-11-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |