DE68907017T2 - Photoempfindliche vorrichtung mit signalverstaerkung im bereich der photoempfindlichen punkte. - Google Patents

Photoempfindliche vorrichtung mit signalverstaerkung im bereich der photoempfindlichen punkte.

Info

Publication number
DE68907017T2
DE68907017T2 DE8989402865T DE68907017T DE68907017T2 DE 68907017 T2 DE68907017 T2 DE 68907017T2 DE 8989402865 T DE8989402865 T DE 8989402865T DE 68907017 T DE68907017 T DE 68907017T DE 68907017 T2 DE68907017 T2 DE 68907017T2
Authority
DE
Germany
Prior art keywords
photo sensitive
area
signal enhancement
points
sensitive device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8989402865T
Other languages
English (en)
Other versions
DE68907017D1 (de
Inventor
Jean-Luc Berger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Publication of DE68907017D1 publication Critical patent/DE68907017D1/de
Application granted granted Critical
Publication of DE68907017T2 publication Critical patent/DE68907017T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14665Imagers using a photoconductor layer
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/14609Pixel-elements with integrated switching, control, storage or amplification elements
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/76Addressed sensors, e.g. MOS or CMOS sensors

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
DE8989402865T 1988-10-25 1989-10-17 Photoempfindliche vorrichtung mit signalverstaerkung im bereich der photoempfindlichen punkte. Expired - Fee Related DE68907017T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8813913A FR2638286B1 (fr) 1988-10-25 1988-10-25 Dispositif photosensible du type a amplification du signal au niveau des points photosensibles

Publications (2)

Publication Number Publication Date
DE68907017D1 DE68907017D1 (de) 1993-07-15
DE68907017T2 true DE68907017T2 (de) 1993-09-23

Family

ID=9371244

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8989402865T Expired - Fee Related DE68907017T2 (de) 1988-10-25 1989-10-17 Photoempfindliche vorrichtung mit signalverstaerkung im bereich der photoempfindlichen punkte.

Country Status (5)

Country Link
US (1) US4980546A (de)
EP (1) EP0367650B1 (de)
JP (1) JP2844733B2 (de)
DE (1) DE68907017T2 (de)
FR (1) FR2638286B1 (de)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5004903A (en) * 1989-03-31 1991-04-02 Nippon Steel Corporation Contact type image sensor device with specific capacitance ratio
JPH03119855A (ja) * 1989-10-02 1991-05-22 Nippon Steel Corp 密着型イメージセンサ
US5107103A (en) * 1990-01-26 1992-04-21 Carnegie-Mellon University Integrated circuit having at least a sensor and a processor thereon
JP2875844B2 (ja) * 1990-03-27 1999-03-31 キヤノン株式会社 薄膜トランジスタ型光センサの駆動方法及び駆動装置
US5153420A (en) * 1990-11-28 1992-10-06 Xerox Corporation Timing independent pixel-scale light sensing apparatus
US5182446A (en) * 1991-10-03 1993-01-26 Texas Instruments Incorporated Circuit with reset noise cancellation
CN1148454A (zh) * 1994-05-19 1997-04-23 宝丽来公司 具有有源像素的cmos成像阵列
GB2289983B (en) * 1994-06-01 1996-10-16 Simage Oy Imaging devices,systems and methods
US6035013A (en) * 1994-06-01 2000-03-07 Simage O.Y. Radiographic imaging devices, systems and methods
DE69535864D1 (de) * 1994-06-01 2008-11-27 Ipl Intellectual Property Lice Vorrichtungen, Systeme und Methoden zur Aufnahme von Bildern
US5818052A (en) * 1996-04-18 1998-10-06 Loral Fairchild Corp. Low light level solid state image sensor
US6037643A (en) * 1998-02-17 2000-03-14 Hewlett-Packard Company Photocell layout for high-speed optical navigation microchips
US5986391A (en) * 1998-03-09 1999-11-16 Feldman Technology Corporation Transparent electrodes
JP3601053B2 (ja) 1999-04-22 2004-12-15 日本電気株式会社 固体撮像装置
DE10007689A1 (de) * 2000-02-19 2001-08-23 Bosch Gmbh Robert Schaltungsanordnung eines Video-Sensor-Chips
FR2824664A1 (fr) * 2001-05-09 2002-11-15 St Microelectronics Sa Photodetecteur cmos comportant une photodiode en silicium amorphe
US6864555B2 (en) * 2001-09-04 2005-03-08 Eugene Robert Worley Photo detector methods to reduce the disabling effects of displacement current in opto-couplers
DE60134143D1 (de) 2001-10-16 2008-07-03 Suisse Electronique Microtech Photodetektor mit grossem Dynamikbereich und erhöhtem Arbeitstemperaturbereich
WO2005107242A1 (en) * 2004-04-30 2005-11-10 Philips Intellectual Property & Standards Gmbh X-ray examination apparatus and radiation detector
USRE47382E1 (en) * 2005-07-18 2019-05-07 Xenogenic Development Limited Liability Company Back-to-back metal/semiconductor/metal (MSM) Schottky diode
KR100689841B1 (ko) * 2006-02-13 2007-03-08 삼성전자주식회사 반도체 제조장치용 레벨링 알고리듬 및 관련된 장치
JP2008017288A (ja) * 2006-07-07 2008-01-24 Rohm Co Ltd 光電変換回路及びこれを用いた固体撮像装置
KR100851494B1 (ko) * 2007-05-14 2008-08-08 매그나칩 반도체 유한회사 수직적으로 집적된 세트 및 리셋 다이오드를 갖는 cmos이미지 센서를 위한 소형 픽셀
US7564022B1 (en) * 2008-02-29 2009-07-21 Caeleste Cvba Method and device for time-gating the sensitivity of an imager structure
JP2017168812A (ja) * 2016-03-10 2017-09-21 パナソニックIpマネジメント株式会社 撮像装置
JP6892577B2 (ja) * 2017-04-28 2021-06-23 天馬微電子有限公司 イメージセンサ及びセンサ装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5738073A (en) * 1980-08-20 1982-03-02 Hitachi Ltd Solid-state image sensor
JPS5868966A (ja) * 1981-10-21 1983-04-25 Canon Inc 固体光電変換装置
FR2549328B1 (fr) * 1983-06-14 1985-11-08 Thomson Csf Dispositif photosensible a l'etat solide
JPS6058779A (ja) * 1983-09-09 1985-04-04 Olympus Optical Co Ltd 固体撮像装置
GB2186146B (en) * 1984-04-16 1988-06-22 Secr Defence Thermal detector
US4731610A (en) * 1986-01-21 1988-03-15 Ovonic Imaging Systems, Inc. Balanced drive electronic matrix system and method of operating the same
FR2605166B1 (fr) * 1986-10-09 1989-02-10 Thomson Csf Dispositif photosensible a l'etat solide, procede de lecture et procede de fabrication

Also Published As

Publication number Publication date
DE68907017D1 (de) 1993-07-15
EP0367650A1 (de) 1990-05-09
FR2638286A1 (fr) 1990-04-27
US4980546A (en) 1990-12-25
JP2844733B2 (ja) 1999-01-06
EP0367650B1 (de) 1993-06-09
JPH02165674A (ja) 1990-06-26
FR2638286B1 (fr) 1990-12-07

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee